CHIP LC FILTERS. Features. Applications. Ordering Information. Shape and Dimensions LC J T (1) (2) (3) (4) (5)

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1 CHIP LC FILTERS Features 1. Newly developed for prominent EMI attenuation at high speed signal line. 2. Terminal electrode has excellent solder heat resistance. Applications 1. High resolution video signal lines, 2. EMI countermeasure for clock signal lines. Ordering Information LC 300 J T (1) (2) (3) (4) (5) (1) Series LC : Chip LC filter (2) Diminsions The first two digits : length(mm) The last two digits : width(mm) (3) Cutoff frequency The first two digit are significant. The last digits is the number of zeros followin (4) Termination J : Nickel barrier (5) Packing B : Bulk Pack T : Tape & Reel (' 178mm [ 7 inches ]) L : Tape & Reel (' 254mm [ 10 inches ]) Shape and Dimensions Type L W T C'ß(max.) C'(max.) LC 0.2 [ ] [ ] 0.2 [.0308] 0.4 [.016] [inches] 0.5 [.020] 40

2 Specifications Part No. Cutoff Frequency 20dB Attenuation Frequency range DC Resistance Rated Current Rated Voltage LC300 LC500 LC101 LC151 30MHz 50MHz 100MHz 150MHz MHz MHz MHz MHz 800 mmax. 300 ma max. 10 Vdc max. PATENT PENDING Attemuation vs Frequency Characteristics Attenuation Measuring Circuit Equivalent circuit 41

3 RELIABILITY AND TEST CONDITIONS CHIP EMI SUPPRESSION FILTERS AND CHIP LC FILTERS ITEM Operating temp. range Storage temp. & humidity range Resistance to solder heat Solderability Reflow soldering REQUIREMENTS 55 ~ max., 70% RH max. 1. No damage such as cracks should be caused in chip element. 2. More than 75% of the terminal electrode shall be covered with new solder. 3. Inductance change : within 5% 4. Capacitance change ; within 30% 1. More than 90% of the terminal electrode shall be covered with new solder. 3. Capacitance change ; within 30% 1. More than 50% of the terminal electrode shall be covered with new solder. S1 ª S2 ª ª T S1,S2 ˆT*0.5 TEST CONDITION at packing condition Preheat temperature : 100 to 150 Preheat time : 1min. Solder temperature : Dipping time : sec. Preheat temperature : 100 to 150 Preheat time : 1min. Solder temperature : Dipping time : 3 1sec. Preheat temperature : 150 Preheat time : 1min. Solder temperature : 230 Soldering time: 10 sec. max. (Reflow soldering profile) Tensile strength (Terminal strength) 1. No mechanical damage W2 W1 W2 2.5 unit:kgf (W1,W2) W1 Adhension of terminal electrode (Flexure strength) a b c d e W 1. No mechanical damage unit: mm (a,b,c,d,e), Kgf (W) ª c a mm ª d b e W RO.5 64

4 CHIP EMI SUPPRESSION FILTERS AND CHIP LC FILTERS ITEM Body strength (Bending strength) REQUIREMENTS 1. The body shall not be damaged by forces applied on the right. TEST CONDITION mm W RO.5 Drop d W No mechanical damage unit: mm (d), Kgf (W) T d Drop 10 times on a concrete floor from a height of 91cm. Vibration 1. No mechanical damage Frequency : 10~55~10Hz Amplitude : 1.52 mm Direction and time : X,Y,Z directions for 1 hours Thermal shock (Temperature cycle) 1. No mechanical damage 3. Capacitance change : within 30% 4. Insulation resistance(between 1 and 2) : 30 min. Step min. Step min. Number of cycle : 100 times Heat load resistance 1. No mechanical damage 3. Capacitance change : within 30% 4. Insulation resistance(between 1 and 2) : 30 min. Temperature : 85 2 Applied voltage : rated voltage (between and Ł) Applied current : rated current (between and Ø) Time : 1,000 hours Measured at room ambient temperature after placing for 24 hours Low temp. resistance 1. No mechanical damage 3. Capacitance change : within 30% 4. Insulation resistance(between 1 and 2) : 30 min. Temperature : 40 5 Time : 1,000 hours Measured at room ambient temperature after placing for 24 hours Humidity resistance 1. No mechanical damage 3. Capacitance change : within 30% 4. Insulation resistance(between 1 and 2) : 30 min. Temperature : 40 2 Humidity : 90~95% RH Time : 500 hours Measured at room ambient temperature after placing for 24 hours Humidity load resistance 1. No mechanical damage 3. Capacitance change : within 30% 4. Insulation resistance(between 1 and 2) : 30 min. Temperature : 85 2 Applied voltage : rated voltage (between and Ł) Applied current : rated current (between and Ø) Time : 1,000 hours Measured at room ambient temperature after placing for 24 hours Ø ŁGND 65

5 PACKING STANDARD QUANTITY Type Q flty(pcs) REMARKS ,000 10, ,000 BULK CASSETTE 10,000 4,000 4mm pitch 8, ,000 7,000 3,000 7,000 3,000 1,500 1, mm 254mm REEL DIMENSION unit:mm R j178 j254 Type 0603, 1005, 1608,, Array 4516, 4532, 5750 j1 0.5 j2 W W[mm] ] more than 50 less than 1.5 unit:mm TAPING DIMENSION / 8mm wide Embossing Tape unit:mm Sprocket hole j Chip cavity B A P T Ko PRODUCT Type A 0.1 B 0.1 P 0.1 Ko 0.1 T(max.) CHIP BEADS CHIP BEADS ARRAY CHIP FERRITE INDUCTOR CHIP EMI SUPPRESSION FILTER CHIP EMI FILTER ARRAY CHIP LC FILTER CHIP COMMON MODE FILTER CHIP FEEDTHRU CHIP VARISTOR CHIP VARISTOR ARRAY CHIP SURGE ABSORBER

6 Paper Tape unit:mm Sprocket hole j Chip cavity B A P 0.1 T 0.05 PRODUCT Type A 0.1 B 0.1 P 0.1 T(max.) MICRO INDUCTOR CHIP BEADS CHIP INDUCTOR CHIP VARISTOR CHIP SURGE ARRAY TAPING DIMENSION / 12mm wide Embossing Tape unit:mm Sprocket hole j Chip cavity B A P T Ko PRODUCT Type A 0.1 B 0.1 P 0.1 Ko 0.1 T(max.) CHIP BEADS CHIP FEEDTHRU

7 1005 BULK CASSETTE DIMENSION Unit:mm Slider Shutter Connecting Port TOP TAPE STRENGTH The force for tearing off top tape is 20 to 70 grams in the arrow direction. Top tape 165 to 180 Embossing tape TAPING MATERIAL Embossed Tape Paper Tape Top tape Top tape Paper tape Plastic/thermally activated adhesive Embossment Bottom tape Sprocket hole Embossed carrier Chip cavity LEADER AND BLANK PORTION Blank Portions Chip Cavity Blank Portions Leader 10 to 20 pitches 20 to 40 pitches 210mm to 250mm Drawing direction The pitch holes shift within mm for cumulative 10 pitches. 83

8 LAND PATTERN DESIGN BEAD, INDUCTOR, VARISTOR, SURGE ABSORBER ARRAY SIZE a b c Land pattern Land pattern <3 array> <4 array> SIZE array a b c d 3 array 4 array EMI SUPPRESSION FILTER, LC FILTER, FEEDTHRU CAPACITOR e f Land pattern f Land pattern < size> <, 4516 size> SIZE a b c d e f

9 LAND PATTERN DESIGN COMMON MODE FILTER, VARISTOR ARRAY SIZE POLE(Array) a b c d 2 POLE 2 Array 2 POLE 2 Array ÆEMI FILTER ARRAY Land pattern e SIZE POLE(Array) a b c d e 4 Array

10 SOLDERING PROFILE REFLOW SOLERING PROFILE preheating 100 sec. max. soldering 10 sec. max. cooling 60 sec. min sec. max. 60 sec. min. FLOW SOLDERING PROFILE preheating 100 sec. max. dipping 10 sec. max. cooling 60 sec. min sec. min. MANUAL SOLDERING 300 solder iron max. 30W T 200 /0.5 sec. Tc soldering 2 sec. max. Diameter of solder iron 1.2 mm max. 86