Ferrite beads...2 Parts number Legend...2 Competitor Cross...3 Reliability and Test Condition Derating Curve...5. Soldering...

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1 Table of Contents The 15 to 186 series ranger of Miniature Ferrite beads contains the very latest in multi layer ferrite beads technology, thus providing the ultimate in performance demanded by today's high Speed EMI noise filtering products. The ferrite beads are in an industry standard size and footprint. Ferrite beads Parts number Legend Competitor Cross eliability and Test Condition Derating Curve Product Specifications Soldering Lead Free Solder re-flow Solder Iron Solder Volume Packaging Information eel Dimension Qty/reel Tearing Off Force Application Notes Ferrite Bead EMI Suppressor Single Type - 15FB, 21FE, 42FB, 63FB & 85FB Series Single GHz Type - 42HFB & 63HFB Series Array Type - 126FBA Series Power Type - 63PFB, 85PFB, 126PFB, & 186PFB Series WC76.F (12/17) i

2 CHIP FEITE BEADS 1. Ferrite Beads It is known as absorptive beads, is more lossy and make good power filter networks because they are designed to absorb high-frequency noise currents and dissipate it as heat. These beads have high impedance over wide highfrequency bands, making them ideal as low-pass noise filters. Structure Application Vcc FEQUENCY (MHz) = (ohm) = eal Part (resistance) = imaginary Part (inductance) Ferrite Bead Ferrite Bead + - Chipchoke Common Mode Noise suppression 2. Parts Number Legend PE-21 FB 121 S T A PACKAGE STYLE COE MATEIAL TOLEANCE * PACKAGE Enhanced FB = Ferrite Bead 121=12 Ω J = ±5% T = Tape & eel A = Alternative 15, 21, HFB = High Frequency Ferrite Bead S = ±25% 42, 63, PFB = High Current Ferrite Bead = not apply 85, AFB=Automotive Ferrite Bead FBA = Frequency Bead Array * There is no tolerance option for these products. 2 WC76.F (12/17)

3 CHIP FEITE BEADS 3. Competitor Cross ITEM Pulse TAIYO YUDEN TDK MUATA Ferrite Bead Single FB Series BK & FBM Series MM Series BLMxxAG Series BLMxxBD Series BLMxxA Series Ferrite Bead Array FBA Series BKxxxx4S Series MA Series BLA Series GHz Ferrite Beads Single HFB Series FBMH Series MM15-E Series BLMxxH Series Power Ferrite Bead Single PFB Series BLMxxPG Series 4. eliability and Test Condition Item Performance Test Condition Series No. Operating Temperature Transportation Storage Temperature PE-15FB/21FB/42FB/63FB/85FB/42HFB/63HFB/ 126FBA -4 ~+15 C (Including self-temperature rise) -4 ~+125 C () efer to standard electrical characteristics list Agilent4291 Inductance (Ls) Q Factor DC esistance ated Current AgilentE4991 Agilent4287 Agilent16192 Agilent4338 DC Power Supply Over ated Current requirements Temperature ise ated Current < 1A T 2 C Max 1. Applied the allowed DC current Test ated Current 1A T 2 C Max 2. Temperature measured by digital surface thermometer esistance to Appearance: No damage Preheat: 15 C, 6sec Soldering Heat : Within ±15% of initial value Solder: Sn99.5%-Cu.5% Inductance: Within ±1% of initial value Solder temperature: 26±5 C Q: Shall not exceed the specification value. Flux for lead free: osin.9.5% DC: Shall not exceed the specification value. 26 C Preheating Dipping Natural Cooling Temperature ramp/immersion and immersion rate: 25±6 mm/s Dip time: 1±1sec. Depth: completely cover the termination. 15 C 6 second 1 1. second WC76.F (12/17) 3

4 CHIP FEITE BEADS 4. eliability and Test Condition Item Performance Test Condition Solderability More than 95% of the terminal electrode should be covered with solder Preheat: 15 C, 6sec 245 C 15 C Preheating Dipping Natural Cooling 6 second 4 1. second Solder: Sn99.5%-Cu.5% Solder temperature: 245±5 C Flux for lead free: osin.9.5% Depth: completely cover the termination. Dip time: 4±1sec. Terminal strength Appearance: No damage. Preconditioning: un through I reflow for 2 times. (IPC/JEDEC : within±15% of initial value J-STD-2D Classification eflow Profiles) Inductance: within±1% of initial value Q: Shall not exceed the specification value. Component mounted on a PCB apply a force (>85:1kg<=8 DC: Shall not exceed the specification value. 5:.5kg) to the side of a device being tested. This force shall be applied for 6 +1 econds. Also the force shall be applied gradually as not to shock the component being tested. Bending Appearance: No damage. Shall be mounted on a F4 substrate of the : within ±1% of initial value Following dimensions: >=85:4x1x1.2mm Inductance: within ±1% of initial value <85:4x1x.8mm Q: Shall not exceed the specification value Bending depth: >=85:1.2mm DC: Shall not exceed the specification value Duration of 1 sec for a min. Vibration Test Appearance: No damage. Preconditioning: un through I reflow for 2 times. (IPC/JEDEC J-STD-2D Classification ~ ~ eflow Profiles) : within ±15% of initial value Oscillation Frequency: 1 2K 1Hz for 2 minutes Inductance: within ±1% of initial value Equipment: Vibration checker Q: Shall not exceed the specification value Total Amplitude: 1.52mm ±1% DC: within ±15% of initial value and shall not exceed the specification value Testing Time: 12 hours (2 minutes 12 cycles each of 3 orientations). Shock Appearance: No damage. Test condition: : within ±15% of initial value Type Peak Normal Velocity Inductance: within ±1% of initial value Value duration Wave change Q: Shall not exceed the specification value (g s) (D) (ms) form (Vi)ft/sec DC: within ±15% of initial value and shall not exceed the SMD 1,5.5 Half-sine 15.4 specification value Lead 1 6 Half-sine WC76.F (12/17)

5 CHIP FEITE BEADS Life Test Appearance: No damage. Preconditioning: un through I reflow for 2 times. (IPC/JEDEC Load Humidity : within ±15% of initial value Inductance: within ±1% of initial value J-STD-2D Classification eflow Profiles) Temperature: 125±2 C(bead), Q: Shall not exceed the specification value 85±2 C(inductor) DC: within ±15% of initial value and shall not exceed the specification value Applied current: rated current Duration: 1±12hrs. Measured at room temperature after placing for 24±2 hrs. Preconditioning: un through I reflow for 2 times. (IPC/JEDEC J-STD-2D Classification eflow Profiles) Humidity: 85±2%.H. Temperature: 85±2 C Duration: 1hrs Min. with 1% rated current. Measured at room temperature after placing for 24±2 hrs. Thermal Shock Appearance: no damage Preconditioning: un through I reflow for 2 times. (IPC/JEDEC : within ±15% of initial value Inductance: within ±1% of initial value J-STD-2D Classification eflow Profiles) Condition for 1 cycle Q: Shall not exceed the specification value Step1: -4±2 C 3±5 min. DC: Shall not exceed the specification value Step2: 25±2 C 3±.5 min. Step3: +15±2 C 3±5 min. Number of cycles: 5 Insulation I>1GΩ Chip Inductor Only esistance Measured at room temperature after placing for 24±2 hrs. Test Voltage: 1±1%V for 3Sec 5. **Derating Curve For the ferrite chip bead which withstanding current over 1.5A, as operating temperature over 85 C, the derating current information is necessary to consider. For the detail derating of current, please refer to the Derated Current vs. perating Temperature curve. Wave 6. Soldering Mildly activated rosin fluxes are preferred. The termination are suitable for re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Note. If wave soldering is used, there will be some risk. e-flow soldering temperatures below 24 degrees, there will be non-wetting risk. WC76.F (12/17) 5

6 CHIP FEITE BEADS 6.1 Lead Free Solder re-flow ecommended temperature profiles for lead free re-flow soldering in Figure 1. eflow times: 3 times max tp (245 C / 2~4s.) Pre-heating Soldering Natural Cooling TP (26 C / 1s max.) TEMPEATUE ( C) ~18s 6~15s 48s max. TIME( sec.) Figure Solder Iron 35 Pre-heating Soldering Natural Cooling Within 4~5s TEMPEATUE ( C) 15 Over 6s Gradual Cooling TIME( sec.) Figure 2 (1 time max) Products attachment with a soldering iron is discouraged due to the inherent process control limitations. If a soldering iron must be employed the following precautions are recommended. For Iron Soldering in Figure 2. Preheat circuit and products to 15 C 35 C tip temperature (max) 6.3 Solder Volume Never contact the ceramic with the iron flip 1.mm tip diameter (max) Use a 2 watt soldering iron with tip diameter of 1.mm Limited soldering time to 4~5sec Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in the right side: Minimum fillet height = soldering thickness + 25% product height 6 WC76.F (12/17)

7 CHIP FEITE BEADS 7. Packaging Information 7.1 eel Dimension A 2.5 D B C 12 7"x8mm 7"x12mm Type A(mm) B(mm) C(mm) D(mm) 7 x8mm 1.±1.5 5 or more 13±.2 178±2 7.2 Qty/reel Chip Size Chip/eel eel Diameter PE-15FB x 8mm PE-21FB x 8mm PE-42HFB x 8mm PE-42FB x 8mm PE-63FB x 8mm PE-63HFB x 8mm PE-63PFB x 8mm PE-85FB x 8mm PE-85AFB x 8mm PE-85PFB x 8mm PE-126FHA x 8mm PE-126PFB x 8mm PE-186PFB x 8mm 7.3 Tearing Off Force The force for tearing off cover tape is 15 to 6 grams in the arrow direction under the following conditions. oom Temp. (C) oom Humidity (%) oom atm (hpa) ~ ~ ~ Tearing Speed mm/min WC76.F (12/17) 7

8 CHIP FEITE BEADS Application Notice *Storage Conditions To maintain the solder ability of terminal electrodes: 1. Products meet IPC/JEDEC J-STD-2D standard-msl, level Temperature and humidity conditions: Less than 4 C and 6% H. 3. ecommended products should be used within 12 months from the time of delivery. 4. The packaging material should be kept where no chlorine or sulfur exists in the air. * Transportation 1. Products should be handled with care to avoid damage or contamination from perspiration and skin oils. 2. The use of tweezers or vacuum pick up is strongly recommended for individual components. 3. Bulk handling should ensure that abrasion and mechanical shock are minimized. 8 WC76.F (12/17)

9 FEITE BEAD EMI SUPPESSO SINGLE TYPE - FB SEIES FO GENEAL SIGNAL LINE Signal Line EMI Suppression Monolithic inorganic material contstruction Various impedance and frequency application Industry Standard package Part Number Electrical 25 C Tolerance Test Frequency (MHz) DC esistance max. ated Current (ma) max. PE-15FB1JT 1 ±5Ω PE-15FB7ST 7 ±25% PE-15FB121ST 12 ±25% PE-15FB75STA 75 ±25% PE-15FB121STA 12 ±25% PE-21FB22ST 22 ±25% PE-21FB33ST 33 ±25% PE-42FB1T PE-42FB121ST 12 ±25% PE-42FB61ST 6 ±25% PE-42FB12ST 1 ±25% PE-63FB121ST 12 ±25% PE-63FB221ST 22 ±25% PE-63FB61ST 6 ±25% PE-63FB12ST 1 ±25% PE-85FB121ST 12 ±25% PE-85FB61ST 6 ±25% PE-85FB12ST 1 ±25% PE-15FB/PE-FB B Mechanicals Application T A W Y SUGGESTED LAND PATTEN Unit: mm WC76.F (12/17) 9

10 FEITE BEAD EMI SUPPESSO SINGLE TYPE - FB SEIES FO GENEAL SIGNAL LINE Dimension: Imperial Size A B W T Y All units in mm 15.4±.2.1±.4/.3.2±.2.2±.2.5~.7.15~.2.2~ ±.3.15±.5.3±.3.3±.3.8.2~.3.25~ ±.15.25±.1.5±.15.5± ~1.6.5~.6.4~ ±.15.3±.2.8±.15.8± (+.3, -.1).5± ±.2.85±.2 Frequency Characteristics (Typical) PE-15FB1JT PE-15FB7ST PE-15FB121ST PE-15FB75ST PE-15FB121ST PE-21FB22ST PE-21FB33ST PE-42FB1ST PE-42FB121ST WC76.F (12/17)

11 FEITE BEAD EMI SUPPESSO SINGLE TYPE - FB SEIES FO GENEAL SIGNAL LINE Frequency Characteristics (Typical) PE-42FB61ST PE-42FB12ST PE-63FB121ST PE-63FB221ST PE-63FB61ST PE-63FB12ST PE-85FB121ST PE-85FB61ST PE-85FB12ST WC76.F (12/17) 11

12 FEITE BEAD EMI SUPPESSO SINGLE TYPE FO HIGH FEQUENCY APPLICATION Signal Line EMI Suppression Monolithic inorganic material construction Various impedance and frequency application High Frequency Giga Hz Application Industry Standard package Part Number Tolerance Electrical 25 C Test Frequency (MHz) 1GHz mini DC esistance max. ated Current (ma) max. PE-42HFB221ST 22 ±25% PE-42HFB61ST 6 ±25% PE-42HFB12ST 1 ±25% PE-42HFB12STA 1 ±25% PE-42HFB152ST 15 ±25% PE-42HFB182ST 18 ±25% PE-63HFB61ST 6 ±25% PE-63HFB12ST 1 ±25% PE-HFB B Mechanical PCB LAYOUT A W T N Y SUGGESTED LAND PATTEN Unit: mm Dimension: Imperial Size A B W T Y 42 1.±.15.25±.1.5±.15.5± ±.15.3±.2.8±.15.85± All units in mm 12 WC76.F (12/17)

13 FEITE BEAD EMI SUPPESSO SINGLE TYPE FO HIGH FEQUENCY APPLICATION Frequency Characteristics (Typical) PE-42HFB221ST PE-42HFB61ST PE-42HFB12ST PE-42HFB12STA PE-42HFB152ST PE-42HFB182ST PE-63HFB61ST PE-63HFB12ST WC76.F (12/17) 13

14 FEITE BEAD EMI SUPPESSO FOU IN ONE AAY TYPE FO SIGNAL LINE APPLICATION Signal Line EMI Suppression Combines four single type designs to support high density applications Various impedance and frequency application Industry Standard package Part Number Electrical 25 C Tolerance Test Frequency (MHz) DC esistance max. ated Current (ma) max. PE-126FBA3ST 3 ±25% PE-126FBA6ST 6 ±25% PE-126FBA121ST 12 ±25% PE-126FBA31ST 3 ±25% PE-126FBA61ST 6 ±25% PE-126FBA12ST 1 ±25% PE-126FBA Mechanical Application Unit: mm SUGGESTED LAND PATTEN Schematic 14 WC76.F (12/17)

15 FEITE BEAD EMI SUPPESSO FOU IN ONE AAY TYPE FO SIGNAL LINE APPLICATION Frequency Characteristics (Typical) PE-126FBA3STA PE-126FBA6STA PE-126FBA121STA PE-126FBA31STA PE-126FBA61ST 16 PE-126FBA12ST WC76.F (12/17) 15

16 FEITE BEAD EMI SUPPESSO SINGLE TYPE FO POWE LINE APPLICATION Power Line EMI Suppression Monolithic inorganic material construction Various impedance and frequency application Industry Standard package Part Number Electrical 25 C Tolerance Test Frequency (MHz) DC esistance max. ated Current (ma) max. PE-63PFB121ST 12 ±25% PE-63PFB181ST 18 ±25% PE-63PFB221ST 22 ±25% PE-63PFB471ST 47 ±25% PE-63PFB6ST 6 ±25% PE-85PFB121ST 12 ±25% PE-85PFB221ST 22 ±25% PE-85PFB331ST 33 ±25% PE-85PFB6ST 6 ±25% PE-126PFB121ST 12 ±25% PE-126PFB5ST 5 ±25% PE-126PFB61ST 6 ±25% PE-186PFB6ST 6 ±25% PE-186PFB72ST 72 ±25% PE-PFB B Mechanical T PCB LAYOUT A W N Y Unit: mm SUGGESTED LAND PATTEN Imperial Size A B W T Y ±.15.3±.2.8±.15.85± (+.3, -.1).5± ±.2.85± ±.2.5±.3 1.6±.2.85± ±.2.5±.3 1.6±.2 1.6± All units in mm 16 WC76.F (12/17)

17 FEITE BEAD EMI SUPPESSO SINGLE TYPE FO POWE LINE APPLICATION Frequency Characteristics (Typical) PE-63PFB121ST PE-63PFB181ST PE-63PFB221ST PE-63PFB6ST PE-63PFB471ST PE-85PFB121ST PE-85PFB221ST PE-85PFB331ST PE-85PFB6ST PE-186PFB6ST PE-126PFB121ST PE-186PFB72ST PE-126PFB5ST PE-126PFB61ST WC76.F (12/17) 17

18 FEITE BEAD EMI SUPPESSO SINGLE TYPE FO POWE LINE APPLICATION Power Line EMI Suppression Monolithic inorganic material construction Various impedance and frequency application Industry Standard package Part Number Electrical 25 C Tolerance Test Frequency (MHz) DC esistance max. ated Current (ma) max. PE-85AFB3ST 3 ±25% PE-85AFB331ST 33 ±25% PE-AFB B T Mechanical PCB LAYOUT A W N Unit: mm Y SUGGESTED LAND PATTEN Imperial Size A B W T Y ±.15.3±.2.8±.15.85± (+.3, -.1).5± ±.2.85± ±.2.5±.3 1.6±.2.85± ±.2.5±.3 1.6±.2 1.6± All units in mm Frequency Characteristics (Typical) PE-85AFB3ST PE-85AFB331ST For More Information Pulse Worldwide Headquarters 1222 World Trade Drive San Diego, CA U.S.A. Tel: Fax: Pulse Europe Einsteinstrasse 1 D-7183 Herrenberg Germany Tel: Fax: Pulse China Headquarters B42, Shenzhen Academy of Aerospace Technology Bldg. 1th Kejinan oad High-Tech one Nanshan District Shenzen, P China Tel: Fax: Pulse North China oom 274/275 Super Ocean Finance Ctr. 267 Yan An oad West Shanghai 2336 China Tel: Fax: Pulse South Asia 135 Joo Seng oad #3-2 PM Industrial Bldg. Singapore Tel: Fax: Pulse North Asia 3F, No. 198 hongyuan oad hongli City Taoyuan County 32 Taiwan. O. C. Tel: Fax: (Pulse) Fax: (FE) Performance warranty of products offered on this data sheet is limited to the parameters specified. Data is subject to change without notice. Other brand and product names mentioned herein may be trademarks or registered trademarks of their respective owners. Copyright, 217. Pulse Electronics, Inc. All rights reserved. WC76.F (12/17) 17