Automotive Chip Choke EMI Suppression for CAN-Bus Networks 2-Line Common Mode Chokes

Transcription

1 Part Number PE-20ACCXXXSTS Common Mode Impedance (0MHZ) Min Meets AEC-Q200 Requirements Suppression of common mode noise without attenuating the signal Magnetically shielded versions for lower Rdc and higher current Supports CAN-Bus, A2B and other IVN high speed differential signal lines (LVDS) Electrical 25 C - Operating Temperature -0 C to +25 C Typ Inductance (uh) Standard Tolerance RDC (Ω Max) IDC (A MAX) Isolation Resistance (MΩ) Min PE-20ACC0STS /-30% PE-20ACC220STS /-30% PE-20ACC50STS /-30% PE-20ACC0STS /-30% PE-82ACCXXXSTS PE-82ACC0STS /-30% PE-82ACC220STS /-30% PE-82ACC50STS /-30% PE-82ACC0STS /-30% Rated Voltage (V) Max PE-20ACCXXXSTS Mechanical Schematic 3.2± MAX ±0.2 view from PCB ± ± ± ± Networking.PulseElectronics.com W77.F (05/8) All Units in mm

2 PE-82ACCXXXSTS Mechanical Schematic.5± MAX 2 view from PCB 3 3.2± ± ± ± ± PE-20ACCXXXSTS Impedance Curve 0000 PE-20ACC0STS PE-20ACC220STS Normal Mode Normal Mode Networking.PulseElectronics.com W77.F (05/8) All Units in mm

3 PE-20ACCXXXSTS Impedance Curve PE-20ACC50STS PE-20ACC0STS Normal Mode Normal Mode 0000, 00000, PE-20ACC0STS Impedance vs Frequency Temp vs DC Current 00,000 0,000, ,000 0, Networking.PulseElectronics.com W77.F (05/8) All Units in mm

4 PE-82ACC0STS Impedance vs Frequency Temp vs DC Current 0,000, , PE-82ACC220STS 0,00, , Networking.PulseElectronics.com W77.F (05/8)

5 PE-82ACC50STS Impedance vs Frequency Temp vs DC Current 00,00 7 0, , PE-82ACC0STS 00,00 0,00, , Networking.PulseElectronics.com W77.F (05/8)

6 Reliability Test Item Reference documents Test Condition Test Specification. High Temperature Exposure MIL-STD-202 Method 08. Temperature: 25 C 2. Time: 000 hours 2. Temperature Cycling JESD22 Method JA-0 3. Biased Humidity Test MIL-STD-202 Method 03. Operational Life MIL-PRF-27. Temperature: 0 C~25 C 2. Number of cycles: 000 cycle 3.Dwell time: 30 minutes. Temperature: 85±5 C 2. Time: 000 hours 3. Humidity: 85±5% RH. Temperature: 25 C 2. Time: 000 hours 3. Apply rated current 5. External Visual MIL-STD-883 Method 2009 Inspect product construction, marking and workmanship 6. Physical Dimensions JESD22 Method JB-00 Verify physical dimensions to the applicable product detail specification 7. Resistance to solvents MIL-STD-202 Method Vibration Test MIL-STD-202 Method Resistance to Soldering Heat Test MIL-STD-202 Method 20 Immerse into solvent for 3±0.5 minutes & brush 0 times for their cycles.. Frequency and Amplified: Hz,.5mm 2. Direction: X, Y, Z 3. Test duration: 2 hours for each direction, 6 hours in total. Temperature: 250±5 C 2. Time: (temp. 27 C) 60~50 Second 3. IR reflow times: 3 times. No mechanical and electrical damage. No mechanical and electrical damage. No mechanical and electrical damage. No mechanical and electrical damage Per product specification standard Per product specification standard. No body change in appearance 2. No marking blurred. 3. Inductance shall not change more than ±30%. No mechanical and electrical damage. No mechanical and electrical damage 0. Rated Current MIL-STD-202 Method 330 Apply rated current for 5 seconds.. No mechanical and electrical damage. Temperature Rise MIL-PRF-27 Apply rated current for 0 minutes.. No mechanical and electrical damage 2. Over load MIL-PRF-27 Apply twice as rated current for 5 minutes.. No mechanical and electrical damage 3. Solderability Test J-STD-002. Bakeing in pre-testing: 55±5 C / 6Hours±30min. 2. Peak temperature: 20±5 C 3. Time: (temp. 27 C) 60~50 Second. IR reflow times: time. Electrical Characterization User Spec.. Operating temperature:-0 C~25 C 2. Room Temperature: 25 C 5. Withstanding Voltage Test MIL-STD-202 Method 20. DV: 500V 2. Time: minute 6. Drop JESD22-B Package & Drop down from m. In angle ridge & 2 surfaces orientation 7. Terminal Strength Test JIS-C-629. Apply push force to samples mounted on PCB. 2. Force of.8 kg for 60± seconds. The terminal shall be at least 95% covered with fresh solder.. No mechanical and electrical damage. During the test no breakdown. 2. The characteristic is normal after test.. No case deformation or change in appearance. After test, inductors shall be on mechanical damge. 6 Networking.PulseElectronics.com W77.F (05/8)

7 Tape and Reel Specifications Reel Dimensions (mm) Tape Dimensions (mm) Series Parts per Reel A B C D E W P P2 P3 H T 20 ACC ACC III. Description: a. Ferrite drum core construction b. Magnetically shielded c. Enameled copper wire: H class d. Product weight: 0.5g (ref.) e. Moisture sensitivity Level f. Products comply with RoHS requirements g. Halogen Free available Recommended Solder Heat Resistance Profile IV. General specification: a. Storage temp: -0 Cto+25 C b. Operating temp: -0 Cto+25 C (Temp. rise included) c. Resistance to solder heat: 250 C 0 secs. For More Information Pulse Worldwide Headquarters 2220 World Trade Drive San Diego, CA 9228 U.S.A. Tel: Fax: Pulse Europe Humboldtstrasse 32 Leinfelden-Echterdingen D-7077 Germany Tel: Fax: Pulse China - Shenzhen B708, Shenzhen Academy of Aerospace Technology Bldg. The 0th Keji South Road Nanshan District Shenzen, PR China Tel: Fax: Pulse South China F, No., Xiyuan Road Zhongli District Taoyuan City Taiwan (R.O.C) Tel: Fax: Pulse Asia 3 Fraser Street 028 DUO Tower Singapore Tel: Fax: Pulse India No., 5th Main Rd. Ground Floor, Opp to Cha Cha Park, Jauamahal Extension, Bangalore , India Tel: Pulse Japan Yebisu Garden Place Tower 23F Ebisu, Shibuya-Ku Tokyo Japan Tel: Performance warranty of products offered on this data sheet is limited to the parameters specified. Data is subject to change without notice. Other brand and product names mentioned herein may be trademarks or registered trademarks of their respective owners. Copyright, 208. Pulse Electronics, Inc. All rights reserved. 7 Networking.PulseElectronics.com W77.F (05/8)