Automotive grade Dual winding, high power density shielded drum core power inductors

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1 Supersedes September 07 Dual winding, high power density shielded drum core power inductors Product features AEC-Q00 qualified Dual winding inductors that can be used as a single inductor, SEPIC, Flyback, or other coupled inductor/transformer applications (: turns ratio) Windings can be connected in series or parallel, offering a wide range of inductance and current ratings 00 Vac isolation between windings.5 mm x.5 mm x 8.0 mm surface mount package Mechanical secure mounting for high shock and vibration environments Ferrite core material Moisture Sensitivity Level (MSL): Applications Body electronics o Headlamps, tail lamps and interior lighting o Heating Ventilation and Air Conditioning controllers (HVAC) o Doors, window lift and seat control Advanced driver assistance systems o Adaptive cruise control (ACC) o Collision avoidance system o Car black box system Infotainment and cluster electronics o Audio subsystem: head unit and trunk amp o Digital instrument cluster o In-Vehicle Infotainment (IVI) and navigation Chassis and safety electronics o Electronic Stability Control system (ESC) o Electric parking brake o Electronic Power Steering (EPS) Engine and powertrain systems o Diesel/gasoline engine management o Powertrain Control Module (PCM)/ Engine Control Unit (ECU) o Transmission Control Unit (TCU) Environmental Data Storage temperature range (Component): -0 C to +65 C Operating temperature range: -0 C to +65 C (ambient plus self-temperature rise) Solder reflow temperature: J-STD-00 (latest revision) compliant Pb HALOGEN HF FREE

2 Product specifications Part Number 6 OCL ±5% (μh) I rms Parallel Ratings DCR (Ω) DCR C (Typ.) (Max.) K-Factor 5 OCL ±5% (μh) I rms Series Ratings DCR +0 C (Typ.) DCR +0 C (Max.) K-Factor 5-00-R R R R R Open Circuit Inductance (OCL) Test Parameters: 00 khz, 0.5 V rms, 0.0 Adc. I rms : DC current for an approximate temperature rise of 0 C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed +65 C under worst case operating conditions verified in the end application.. : Peak current for approximately 0% rolloff at +5 C.. : Peak current for approximately 0% rolloff at +5 C. 5. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * I. Bp-p:(Gauss), K: (K-factor from table), L: (Inductance in µh), I (Peak-to-peak ripple current in Amps). 6. Part Number Definition: DRAQxxx-xxx-R - DRAQxxx = Product code and size - xxx= Inductance value in uh, R = decimal point, If no R is present then rd digit equals number of zeros. - -R suffix = RoHS compliant Dimensions - mm Top view Recommended pad layout Front view Schematic Bottom view L L L L L L Dual Inductor Series Mode Parallel Mode Part Marking:, ### = inductance value in µh, R = decimal point; if no R is present, then rd digit equals number of zeros wwllyy = Date code, R = revision level All soldering surfaces to be coplanar within 0.0 millimeters Tolerances are ± 0. millimeters unless stated otherwise. Do not route traces or vias underneath the inductor *Special Characteristic epoxy protrusion or any flashing from the plastic on the header/base can be below the terminal surface and must not exceed 0.08 mm beyond the bottom surface of the terminal.

3 Packaging information - mm -xxx wwllyy R Supplied in tape and reel packaging, 50 parts per diameter reel. Temperature rise vs. total loss Temp. Rise( C) Total Loss (W)

4 Core loss vs. Bp-p 0 MHz 500kHz 00kHz 00kHz 00kHz Core Loss (W) ,0 00 Bp-p (Gauss) Inductance characteristics 0% % of OCL vs. % of Isat % of OCL 0% 00% 90% 80% 70% 60% 50% 0% 0% 0% 0% - 0 C + 5 C +8 5 C + 5 C 0% 0% 0% 0% 0% 0% 50% 60% 70% 80% 90% 00% 0% 0% 0% 0% % of

5 Solder reflow profile T P Max. Ramp Up Rate = C/s Max. Ramp Down Rate = 6 C/s t P T C -5 C Table - Standard SnPb Solder (T c ) Package Thickness mm <50 mm 50 T L Preheat t <.5mm) 5 C 0 C.5mm 0 C 0 C Temperature T smax T smin ts Table - Lead (Pb) Free Solder (T c ) Package Thickness mm <50 mm mm >000 <.6mm 60 C 60 C 60 C.6.5mm 60 C 50 C 5 C >.5mm 50 C 5 C 5 C 5 C Time 5 C to Peak Time Reference JDEC J-STD-00 Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak Temperature min. (T smin ) 00 C 50 C Temperature max. (T smax ) 50 C 00 C Time (T smin to T smax ) (t s ) 60-0 Seconds 60-0 Seconds Average ramp up rate T smax to T p C/ Second Max. C/ Second Max. Liquidous temperature (Tl) Time at liquidous (t L ) 8 C Seconds Peak package body temperature (T P )* Table Table 7 C Seconds Time (t p )** within 5 C of the specified classification temperature (T c ) 0 Seconds** 0 Seconds** Average ramp-down rate (T p to T smax ) 6 C/ Second Max. 6 C/ Second Max. Time 5 C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (T p ) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (t p ) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 000 Eaton Boulevard Cleveland, OH United States 08 Eaton All Rights Reserved Printed in USA Publication No. 7 BU-MC708 January 08 Eaton is a registered trademark. All other trademarks are property of their respective owners.

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