FERROXCUBE DATA SHEET. SMD common mode chokes EMI-suppression products. Supersedes data of September Sep 01

Transcription

1 FERROXCUBE DATA SHEET Supersedes data of September Sep 01

2 SMD COMMON MODE CHOKES FOR EMI-SUPPRESSION General data ITEM Strip material Solderability Taping method SPECIFICATION copper (Cu), tin (Sn) plated IEC , Part 2, Test Ta, method 1 IEC , EIA A and EIA Grades, parameters and type numbers GRADE Z typ (1) (Ω) at f (MHz) TYPE NUMBER CMS2-5.6/3/4.8 mass 0.3 g 4S CMS2-5.6/3/4.8-4S CMS2-5.6/3/8.9 mass 0.6 g 4S CMS2-5.6/3/8.9-4S GRADE Z typ (1) (Ω) at f (MHz) CMS4-11/3/4.8 mass 0.6 g 4S CMS4-11/3/4.8-4S2 inner channel S outer channel CMS4-11/3/8.9 mass 1.1 g 4S CMS4-11/3/8.9-4S2 inner channel S outer channel Note 1. Typical values, Z min is 20%. DC resistance <0.6 mω. TYPE NUMBER Mechanical data >5 > ±0.3 >1.1 > ± ± max max. CBW ±0.2 a. CMS2-5.6/3/8.9 (side view). b. CMS2-5.6/3/4.8 (side view). Front view (a and b). Fig.1 CMS2-5.6/3/4.8 and CMS2-5.6/3/ Sep

3 >5 > ±0.3 >1.1 > ± ±0.07 handbook, handbook, full pagewidth halfpage 3.04 max max. CBW ±0.3 a. CMS4-11/3/8.9 (side view). b. CMS4-11/3/4.8 (side view). Front view (a and b). Fig.2 CMS4-11/3/4.8 and CMS4-11/3/8.9. Recommended dimensions of solder lands MBG MBG064 Dimensions of solder lands are based on a solder paste layer thickness of approximately 200 µm ( 0.7 mg solder paste per mm 2 ). Fig.3 Solder lands for reflow soldering of CMS2-5.6/3/4.8. Fig.4 Solder lands for wave soldering of CMS2-5.6/3/ Sep

4 CBW291 CBW292 Dimensions of solder lands are based on a solder paste layer thickness of approximately 200 µm ( 0.7 mg solder paste per mm 2 ). Fig.5 Solder lands for reflow soldering of CMS2-5.6/3/8.9. Fig.6 Solder lands for wave soldering of CMS2-5.6/3/ MBG MBG066 Dimensions of solder lands are based on a solder paste layer thickness of approximately 200 µm ( 0.7 mg solder paste per mm 2 ). Fig.7 Solder lands for reflow soldering of CMS4-11/3/4.8. Fig.8 Solder lands for wave soldering of CMS4-11/3/ Sep

5 CBW289 CBW290 Dimensions of solder lands are based on a solder paste layer thickness of approximately 200 µm ( 0.7 mg solder paste per mm 2 ). Fig.9 Solder lands for reflow soldering of CMS4-11/3/8.9. Fig.10 Solder lands for wave soldering of CMS4-11/3/ Sep

6 Soldering profiles Temp in o C Preheat 480 sec max Soldering sec o C 217 o C max 200 o C 3 o C/s max 6 o C/s max min 150 o C sec sec 25 o C MFP129 Time in sec Fig.11 Reflow soldering. 300 T ( C) s 235 C to 260 C second wave MLA first wave 5 K/s K/s 2 K/s C to 130 C forced cooling 50 2 K/s t (s) 250 Typical values (solid line). Process limits (dotted lines). Fig.12 Double wave soldering Sep

7 BLISTER TAPE AND REEL DIMENSIONS handbook, full pagewidth K 0 T D 0 P 0 P 2 E cover tape F W B0 A 0 D 1 MEA613-1 P 1 direction of unreeling For dimensions see Table 1. Fig.13 Blister tape. Table 1 Physical dimensions of blister tape see Fig.13 DIMENSIONS (mm) SIZE CMS2-5.6/3/4.8 CMS2-5.6/3/8.9 CMS2-5.6/3/8.9 CMS4-11/3/8.9 A B K T W E F D D P P P Sep

8 handbook, full pagewidth W N A W 1 MSA284 For dimensions see Table 2. Fig.14 Reel. Table 2 Reel dimensions see Fig.14 DIMENSIONS (mm) SIZE A N W 1 W ± ± ± Sep

9 DATA SHEET STATUS DEFINITIONS DATA SHEET STATUS Preliminary specification PRODUCT STATUS Development DEFINITIONS This data sheet contains preliminary data. Ferroxcube reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Product specification Production This data sheet contains final specifications. Ferroxcube reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. DISCLAIMER Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Ferroxcube customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Ferroxcube for any damages resulting from such application. PRODUCT STATUS DEFINITIONS STATUS INDICATION DEFINITION Prototype Design-in Preferred Support These are products that have been made as development samples for the purposes of technical evaluation only. The data for these types is provisional and is subject to change. These products are recommended for new designs. These products are recommended for use in current designs and are available via our sales channels. These products are not recommended for new designs and may not be available through all of our sales channels. Customers are advised to check for availability Sep