BAS16J. 1. Product profile. Single high-speed switching diode. 1.1 General description. 1.2 Features. 1.3 Applications. 1.4 Quick reference data

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1 Rev March 2007 Product data sheet 1. Product profile 1.1 General description, encapsulated in a SOD323F (SC-90) very small and flat lead Surface-Mounted Device (SMD) plastic package. 1.2 Features High switching speed: t rr 4ns Low leakage current Repetitive peak reverse voltage: V RRM 100 V Excellent coplanarity and improved thermal behavior Low capacitance: C d 1.5 pf Reverse voltage: V R 100 V Very small and flat lead SMD plastic package 1.3 Applications High-speed switching General-purpose switching Voltage clamping Reverse polarity protection 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit I F forward current [1] ma I R reverse current V R = 75 V µa V R reverse voltage V t rr reverse recovery time [2] ns [1] Pulse test: t p 300 µs; δ [2] When switched from I F = 10 ma to I R = 10 ma; R L = 100 Ω; measured at I R = 1 ma.

2 2. Pinning information Table 2. Pinning Pin Description Simplified outline Symbol 1 cathode [1] 2 anode 1 2 sym Ordering information [1] The marking bar indicates the cathode. 4. Marking Table 3. Ordering information Type number Package Name Description Version SC-90 plastic surface-mounted package; 2 leads SOD323F Table 4. Marking codes Type number Marking code AR _1 Product data sheet Rev March of 10

3 5. Limiting values 6. Thermal characteristics Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit V RRM repetitive peak reverse V voltage V R reverse voltage V I F forward current [1] ma I FRM I FSM repetitive peak forward current non-repetitive peak forward current t p 0.5 ms; δ 0.25 square wave [2] ma t p = 100 µs A t p =1ms - 2 A t p =10ms A P tot total power dissipation T amb 25 C [3][4] mw T j junction temperature C T amb ambient temperature C T stg storage temperature C [1] Pulse test: t p 300 µs; δ [2] T j =25 C prior to surge. [3] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for cathode 1 cm 2. [4] Reflow soldering is the only recommended soldering method. Table 6. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit R th(j-a) thermal resistance from in free air [1][2] K/W junction to ambient R th(j-sp) thermal resistance from junction to solder point [3] K/W [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm 2. [2] Reflow soldering is the only recommended soldering method. [3] Soldering point of cathode tab. _1 Product data sheet Rev March of 10

4 7. Characteristics Table 7. Characteristics T amb =25 C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit V F forward voltage [1] I F = 1 ma mv I F = 10 ma mv I F =50mA V I F = 150 ma V I R reverse current V R =25V na V R =75V µa V R =25V; T j = 150 C µa V R =75V; T j = 150 C µa C d diode capacitance V R = 0 V; f = 1 MHz pf t rr reverse recovery time [2] ns V FR forward recovery voltage [3] V [1] Pulse test: t p 300 µs; δ [2] When switched from I F = 10 ma to I R = 10 ma; R L = 100 Ω; measured at I R = 1 ma. [3] When switched from I F = 10 ma; t r =20ns. _1 Product data sheet Rev March of 10

5 300 mbg aaa308 I F (ma) 200 (1) (2) (3) I FSM (A) V 2 F (V) t p (ms) Fig 1. (1) T amb = 150 C; typical values (2) T amb =25 C; typical values (3) T amb =25 C; maximum values Forward current as a function of forward voltage Fig 2. Based on square wave currents. T j =25 C; prior to surge Non-repetitive peak forward current as a function of pulse duration; maximum values 10 5 mga mbg446 I R (na) C d (pf) 10 4 (1) (2) 0.4 (3) T j ( C) V R (V) Fig 3. (1) V R = 75 V; maximum values (2) V R = 75 V; typical values (3) V R = 25 V; typical values Reverse current as a function of junction temperature Fig 4. f = 1 MHz; T amb =25 C Diode capacitance as a function of reverse voltage; typical values _1 Product data sheet Rev March of 10

6 8. Test information R S = 50 Ω I F D.U.T. SAMPLING OSCILLOSCOPE t r t p t 10 % + I F trr t V = V R + I F R S R i = 50 Ω mga881 V R 90 % input signal output signal (1) (1) I R =1mA Input signal: reverse pulse rise time t r = 0.6 ns; reverse voltage pulse duration t p = 100 ns; duty cycle δ = 0.05 Oscilloscope: rise time t r = 0.35 ns Fig 5. Reverse recovery time test circuit and waveforms I 1 kω 450 Ω I 90 % V R S = 50 Ω D.U.T. OSCILLOSCOPE R i = 50 Ω VFR 10 % t r t p t t input signal output signal mga882 Fig 6. Input signal: forward pulse rise time t r = 20 ns; forward current pulse duration t p 100 ns; duty cycle δ Forward recovery voltage test circuit and waveforms _1 Product data sheet Rev March of 10

7 9. Package outline Dimensions in mm Fig 7. Package outline SOD323F (SC-90) 10. Packing information 11. Soldering Table 8. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code. [1] Type number Package Description Packing quantity SOD323F 4 mm pitch, 8 mm tape and reel [1] For further information and the availability of packing methods, see Section solder lands solder resist occupied area 0.50 (2 ) 001aab169 solder paste Fig 8. Reflow soldering is the only recommended soldering method. Dimensions in mm Reflow soldering footprint SOD323F (SC-90) _1 Product data sheet Rev March of 10

8 12. Revision history Table 9. Revision history Document ID Release date Data sheet status Change notice Supersedes _ Product data sheet - - _1 Product data sheet Rev March of 10

9 13. Legal information 13.1 Data sheet status Document status [1][2] Product status [3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term short data sheet is explained in section Definitions. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL Definitions Draft The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail Disclaimers General Information in this document is believed to be accurate and reliable. However, does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a product can reasonably be expected to result in personal injury, death or severe property or environmental damage. accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer s own risk. Applications Applications that are described herein for any of these products are for illustrative purposes only. makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale products are sold subject to the general terms and conditions of commercial sale, as published at including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For additional information, please visit: For sales office addresses, send an to: salesaddresses@nxp.com _1 Product data sheet Rev March of 10

10 15. Contents 1 Product profile General description Features Applications Quick reference data Pinning information Ordering information Marking Limiting values Thermal characteristics Characteristics Test information Package outline Packing information Soldering Revision history Legal information Data sheet status Definitions Disclaimers Trademarks Contact information Contents Please be aware that important notices concerning this document and the product(s) described herein, have been included in section Legal information. For more information, please visit: For sales office addresses, please send an to: salesaddresses@nxp.com Date of release: 8 March 2007 Document identifier: _1

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