Frequency-Domain Characterization of Power Distribution Networks
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1 Frequency-Domain Characterization of Power Distribution Networks Istvan Novak Jason R. Miller ARTECH H O U S E BOSTON LONDON artechhouse.com
2 Preface Acknowledgments xi xv CHAPTER 1 Introduction Evolution of Power Distribution Networks The Importance of Frequency Domain The Impedance Matrix Size of the Matrix When Time-Domain Characterization Is Useful If and When Time-Domain Response Is Needed The Characterization Process The Modeling Process 10 References 11 CHAPTER 2 Simulation Methods and Tools Spreadsheet Calculations SPICE AC MATLAB Field Solvers Classifications Convergence Sources of Simulation Inaccuracies 25 References 41 CHAPTER 3 Characterization and Modeling of Vias Introduction Via Partial Inductance Via Loop Inductance Measurement Correlation Via Arrays Measuring Via Arrays Modeling Via Arrays 60
3 VIII Parameterizing Via Arrays Via Array Summary Points 65 References 65 CHAPTER 4 Characterization and Modeling of Planes and Laminates Introduction Analytical Plane Models Analytical Models for Rectangular Plane Shapes Analytical Plane Models for Arbitrary Plane Shapes Transmission-Line Models Transmission-Line Grid Models for Rectangular Plane Shapes Transmission-Line Grid Models for Arbitrary Plane Shapes Transmission Matrix Model for Arbitrary Plane Shapes Effect of Plane Parameters on Seif- and Transfer Impedances Impact of Dielectric Thickness with Regulär Conductors Impact of Plane Thickness Parallel Plane Pairs Impact of Dielectric Constant and Dielectric Losses Run Time Versus Number of Cells Characterization of Plane and Laminate Parameters DC Resistance of Planes Measuring DC Resistance of Planes Effect of Perforations on DC Plane Resistance Simulating DC Voltage Drop and Effective Plane Resistance Characterization of Mid- and High-Frequency Plane Parameters 102 References 120 CHAPTER 5 Impedance Measurements Basics Selecting the Measurement Concept for PDN Impedance The Importance of Two-Port Connections Seif- and Transfer Impedance Transforming Measured S-Parameters Measuring Self-Impedance with Magnitude \Z\ « Measuring Arbitrary Self-Impedance Values Measuring Large Impedance Values Measuring Arbitrary Transfer-Impedance Values Measuring Transfer Ratios Extracting Component Parameters from Measured Data Extracting Capacitance Extracting Equivalent Series Resistance Extracting Inductance Estimating Inductance and Capacitance for Compensations Fixture Compensation, Port Extension, and De-Embedding 154 References 158
4 IX CHAPTER6 Connections and Calibrations Port Connections Fixtures TestVias Using Component Pads or Component Bodies as Test Points Location of Test Points Probes, Connectors, and Cables Soldered Connections Homemade Probes Wafer Probes Probe and DUT Holders and Probe Stations Cables Calibrations VNA Calibrations in the Low-Frequency Range VNA Calibrations in the Mid-Frequency Range VNA Calibrations in the High-Frequency Range Stability and Accuracy of Measurements Response Drift with Time Instrumentation Settings Probe Placement Quality of Probe and DUT Connections 192 References 195 CHAPTER 7 Measurements: Practical Details Making the Proper Connections Eliminating Cable-Braid-Loop Error at Low Frequencies Examples of Correct Connections Measuring Low Impedances at High Frequencies Making the Proper Measurements Multiple Measurements, Multiple Instruments Averaging, Smoothing, and Bandwidth Background Noise, Noise Floor Repeatability of Data System Measurements Measurements of Powered Boards 227 References 228 Characterization and Modeling of Bypass Capacitors Simple C-R-L Models and Spreadsheet Correlations Wideband Characterization Impact of Geometry on Electrical Parameters How to Define ESL Impact of Body Geometry on ESL of MLCC ESR and ESL of Very Tall Capacitors 242
5 X Impact of Vertical MLCC Mounting on ESL and ESR Impact of Special Geometries on ESL and ESR Uniqueness of Parameters Effect of Other Variables on Capacitor Parameters Effect of DC and AC Bias Voltage and Piezo Effect Effect of Environmental Variables Multicomponent C-R-L Models Multicomponent Models for Bulk Capacitors Multicomponent Models for Ceramic Capacitors Black-Box Model The Building Blocks Modeling of Capacitance Versus Frequency Modeling of Inductance Versus Frequency Modeling of Resistance (ESR) Versus Frequency Bedspring Capacitor Model Causal Slow-Wave Model The Unit-Cell Model The Lossy Transmission-Line Model Correlations 290 References 294 CHAPTER 9 Characterization and Modeling of Inductors, DC4DC Converters, and Systems Characterization and Modeling of Inductors Lossy Ferrite Inductors Low-Loss Ferrite Inductors Linear Inductor Models Frequency-Dependent Inductor Models Characterization and Modeling of Power Converters Small-Signal Output Impedance of DC-DC Converters Black-Box Modeling of Output Impedance Modeling and Characterizing Systems Return Path and Rail Coupling in Flip-Chip BGA Package Core and DIMM Memory Rails with Various Populations Detailed Characterization on High-Speed Supply Rail 321 References 326 About the Authors 327 Index 329
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