Multi-channel Silicon ESD Flow-Through Arrays

Transcription

1 Product Overview T Connectivity s Silicon S arrays help to protect electronic circuits against damage from lectrostatic ischarge (S), surge and cable discharge events.

2 The Silicon S (SS) arrays help provide protection and improve reliability of electronics in applications including but not limited to consumer, portable and mobile electronics. The multi-channel SS flow-through arrays have industry leading ultra-low capacitance of 0.20pF with low insertion loss which help protect high-speed data signals. The SS arrays provide robust S protection with an industry-leading 20kV contact and air discharge rating per the IC standard. The ultra-low capacitance SS arrays enable signal integrity for today s highest-speed interfaces including USB 3.0/2.0, HMI, est, isplayport, and Thunderbolt. T offers four- and six- channel miniature arrays which are up to 85% smaller than common multi-channel arrays to fit into space constrained applications. T s ultra-small packages have lower parasitic impedance which reduces insertion loss at high frequencies compared to larger size packaged devices. The four- and six-channel arrays, with 0.31mm package height, have a 50% lower profile than other package options in the market. ll of T s KY FTURS Low Capacitance 0.20pF (typ, 200fF) Low leakage current 5V (typ) Low clamping voltage +9.20/-0.80V (tp=8x20µs, Ipp=2) S 20kV contact and air discharge per IC Surge 2 (tp=8x20µs) per IC Small size and low profile XFN rray packages 0.31mm height RoHS Complaint, Pb and Halogen Free (refers to: Br 900ppm, Cl 900ppm, Br+Cl 1500ppm) SS arrays are in flow-through design packages which allow for matched impedance PCB trace routing essential for high speed signal integrity. PPLICTIONS Consumer, mobile and portable electronics Tablet PC and external storage with high speed interfaces Ultra-high speed data lines USB 3.0/2.0, HMI 1.3/1.4, isplayport interface, Thunderbolt interface (Light Peak), V-by-One HS, and LVS interface pplications requiring high S performance in small FN packages BNFITS Industry-leading lowest capacitance; provides lowest insertion loss for high speed data signals Provides S protection up to 20kV contact and air discharge per IC Industry s smallest footprint and lowest profile multi-channel S arrays helps to optimize board space Flow-through and single connection design helps routing PCB matched impedance high speed data lines Helps protect electronic circuits against damage from lectrostatic ischarge (S), lightning and cable discharge events ssist equipment to pass IC , level 4 testing

3 VIC LCTRICL CHRCTRISTICS evice Maximum Ratings IC , level 4 (S withstand) Temperature Peak Current (tp=8x20µs) Multi-Channel rrays Contact (kv) ir (kv) Operating ( C) Storage ( C) Ipp () SS0402Q2UG (2-ch) SS0802Q4UG (4-ch) SS1004Q4UG (4-ch) to to SS1103Q6UG (6-ch) Caution: Stress exceeding evice Maximum Ratings may damage the device. Prolong exposure to stresses above the Recommended Operating Conditions may affect device reliability. evice lectrical T = 25 C Input Capacitance (1) Breakdown Voltage (typ) Reverse Leakage Current (typ) Clamping Voltage (typ) Multi-Channel rrays Typical (pf) Maximun (pf) V I t = 1m (V) I V RWM = 5.0V (n) V Ipp = 2.0 (V) SS0402Q2UG (2-ch) SS0802Q4UG (4-ch) SS1004Q4UG (4-ch) / / SS1103Q6UG (6-ch) Vr = 0V, f = 3GHz, I/O to VIC IV CHRCTRISTICS N OPRTION SS Multi-channel rray IV One-channel in Multi-channel SS rray 1.0 Current (m) Connector S -V Strike path S +V Strike path pplication Circuitry Voltage (V) Helps protect against damage from V S strikes to 20kV contact & air discharge. If the signal voltage goes below -0.8V or above +9.0V the S device turns on and shunts to.

4 SS MULTI-CHNNL RRY SCHMTIC N PIN CONFIGURTION SS Multi-channel rrays Schematic 4-channel 6-channel 2-channel CH1 CH2 CH3 CH4 CH5 CH6 SS Multi-channel Flow-Through rray Pinout G G 3 G ch ch Standard rray 4 3 G ch Miniature rray G ch Miniature rray RCOMMN PPLICTION CONFIGURTIONS USB 3.0 using a 4-ch rray and 2-ch rray USB 3.0 using a 6-ch rray USB 3.0 Connector USB 3.0 Connector USB 3.0 Controller USB 3.0 IC Controller IC USB Connector SSTX- SSTX- SSTX+ SSTX+ SSRX- SSRX- SSRX+ SSRX SSTX- SSTX- SSTX+ SSTX+ SSRX- SSRX- SSRX+ SSRX+ USB 3.0 Controller USB 3.0 IC Controller IC HMI using 4-ch rrays Thunderbolt using 4-ch rrays HMI Connector HMI Connector Clock_N Clock_P ata0_n ata0_p ata1_n ata1_p ata2_n ata2_p HMI Host Controller IC IC Thunderbolt Connector ML_Lane3_N ML_Lane3_P ML_Lane2_N ML_Lane2_P ML_Lane1_N ML_Lane1_P ML_Lane0_N ML_Lane0_P Thunderbolt Host Controller IC

5 INSRTION LOSS IGRMS Multi-Channel SS rrays S21 Insertion Loss (db) Frequency (GHz) pplication Bit Rate (GHz) Insertion Loss (db) HMI 1.4 (1080P) isplayport HMI 1.4 (max spec)* USB est Thunderbolt * evices are HMI 4K / QuadH resolutions (4096 x 2160) ready MTRIL information RoHS Compliant LV Compliant Halogen Free* Pb-Free irective 2000/53/C Compliant irective 2002/95/C Compliant HF Pb * Halogen Free refers to: Br 900ppm, Cl 900ppm, Br+Cl 1500ppm. SS devices meet MSL-1 Requirements FN case epoxy meets UL 94 V-0

6 ye iagrams USB3.0 ye iagrams 5.0Gb/s, 1000mV differential, CPO Compliant Test Pattern Without SS evice With SS evice isplayport ye iagrams 2.7Gb/s, 800mV differential, PRBS7 Compliant Test Pattern, SSC enabled Without SS evice With SS evice HMI ye iagrams 3.4Gb/s, 990mV differential, TMS ata Without SS evice With SS evice

7 VIC IMNSION SS0402Q2UG : 2-ch 0402 Size rray 3 SS0402Q2UG Millimeters Inches N VIW 1 PIN 1 I CTHO BN SI VIW 1 TOP VIW SI VIW 2 BOTTOM VIW K e2 b 2 L1 3 e1 1 L2 L2 im Min Nom Max Min Nom Max ref ref K L L N VIW 2 1 b e BSC BSC e BSC BSC SS1004Q4UG : 4-ch Flow-Through Standard rray SS1004Q4UG Millimeters Inches N VIW-1 im Min Nom Max Min Nom Max PIN 1 3 L x N 8x b ref ref. R x b1 e 6 5 e b b SI VIW-1 TOP VIW 1 SI VIW-2 BOTTOM VIW 2x R 7 PLCS L e 0.50 BSC BSC e BSC BSC N N VIW-2 R BSC BSC R BSC BSC * Pin 1 dot is laser marked. Radius and location within the pin 1 terminal.

8 evice imension CONT d SS0802Q4UG : 4-ch Flow-Through Miniature rray SS0802Q4UG N VIW 1 Millimeters Inches 3 PIN 1 OT* 1 e2 im Min Nom Max Min Nom Max b1 Gnd L1 4 e ref ref b x N e b b SI VIW 1 TOP VIW SI VIW 2 BOTTOM VIW 1 N VIW 2 L x N L2 L L L BSC BSC e 0.40 BSC BSC e BSC BSC e BSC BSC N 4 4 SS1103Q6UG : 6-ch Flow-Through Miniature rray SS1103Q6UG N VIW 1 PIN 1 OT* 1 e2 Millimeters Inches im Min Nom Max Min Nom Max b1 Gnd 2 3 L1 e1 5 b x N ref ref b SI VIW 1 TOP VIW SI VIW 2 BOTTOM VIW 1 N VIW 2 e L x N L2 4 b L L L BSC BSC e 0.40 BSC BSC e BSC BSC e BSC BSC N 6 6 * Pin 1 dot is laser marked. Radius and location within the pin 1 terminal.

9 RCOMMN LNING P LYOUT SS0402Q2UG : 2-ch 0402 Size rray SS Landing Pad Layout 3 Pin 2-ch 0402 Size rray Symbol Millimeters Inches F B B C F x C SS1004Q4UG : 4-ch Flow-Through Standard rray 2X F 2X F SS Landing Pad Layout 10 Pin 4-ch Standard FT rray 2X F1 2X F1 Symbol Millimeters Inches B 2X 1 4X G B 1 4X G B C X 8X X C 8X C Recommended lternate F F G 0.50 BSC BSC 1.00 BSC BSC

10 RCOMMN LNING P LYOUT CONT d SS0802Q4UG : 4-ch Flow-Through Miniature rray F F1 F1 SS Landing Pad Layout 5 Pin 4-ch Miniature FT rray Symbol Millimeters Inches B C B x F x C F 2x G F G 0.40 BSC BSC 0.45 BSC BSC SS1103Q6UG : 6-ch Flow-Through Miniature rray F F1 F1 SS Landing Pad Layout 7 Pin 6-ch Miniature FT rray Symbol Millimeters Inches B C B F F G 0.40 BSC BSC 3x F 6x 4x G 0.45 BSC BSC 6x C

11 FOR MOR INFORMTION T Circuit Protection 308 Constitution rive Menlo Park, C US Tel : (800) , (650) Fax : (650) (Chinese) (Japanese) Brazil Tel : Fax : UK / ire / Benelux / Israel South frica / Nordic / Baltic / Others Tel : Fax : Germany / ustria / Switzerland / astern urope / Russia Tel : Fax : France / Italy / Iberia / Greece / Turkey Tel : Fax : Japan Tel : Fax : Korea Tel : Fax : Taiwan Tel : x 211 Fax : China, Hong Kong Tel : Fax : China, Beijing Tel : x Fax : China, Shanghai Tel : Fax : China, Shenzhen / Guangzhou Tel : Fax : Singapore / Indonesia Tel : Fax : Thailand / Malaysia / Vietnam Tel : Fax : ustralia / Philippines Tel : Fax : India Tel : Mobile : Part numbers in this brochure are RoHS Compliant*, unless marked otherwise. *as defined Tyco lectronics Corporation, a T Connectivity Ltd. Company. ll Rights Reserved. RCP /2012 T Connectivity and T connectivity (logo) are trademarks. Other logos, product and/or company names might be trademarks of their respective owners. ll information, including illustrations, is believed to be accurate and reliable. Users, however, should independently evaluate the suitability companies ( T ) makes no warranties as to the accuracy or completeness of the information, and disclaims any liability regarding its use. T only obligations are those in the T Standard Terms and Conditions of Sale and in no case will T be liable for any incidental, indirect, as components in nuclear facility applications, aerospace, or in critical life support devices or systems.