RClamp1821Z. Ultra Small RailClamp 1-Line ESD protection. PROTECTION PRODUCTS - Z-Pak TM Description. Features. Mechanical Characteristics

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1 PROECION PRODUCS - Z-Pak M Description RailClamp S arrays are ultra low capacitance ESD protection devices designed to protect high speed data interfaces. hey are designed to replace 00 size multilayer varistors (MLs) in portable applications such as cell phones, notebook computers, and other portable electronics. his device offers desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. RClamp 8Z has a maximum capacitance of only 0.8pF. his allows it to be used on circuits operating in excess of 3GHz without signal attenuation. RClamp8Z is in a -pin SLP0603PX3B package. It measures 0.6 x 0.3 mm with a nominal height of only 0.mm. Leads are finished with lead-free NiAu. Each device will protect one line operating at 8 volts. It gives the designer the flexibility to protect single lines in applications where arrays are not practical. he combination of small size and high ESD surge capability makes them ideal for use in portable applications such as cellular phones, digital cameras, and MP3 players. RClamp8Z Ultra Small RailClamp -Line ESD protection Features High ESD withstand oltage: +/-k (Contact), +/-8k (Air) per IEC Able to withstand over 000 ESD strikes per IEC Level 4 Ultra-small 00 package age Protects one data or power line Low reverse current: <na typical (R=8) Working voltage: +/- 8 Low capacitance: 0.8pF Maximum Solid-state silicon-avalanche technology Mechanical Characteristics SLP0603PX3B package Pb-Free, Halogen Free, RoHS/WEEE Compliant Nominal Dimensions: 0.6 x 0.3 x 0. mm Lead Finish: NiAu Marking : Marking code + dot matrix date code Packaging : ape and Reel Applications Cellular Handsets & Accessories Near Field Communication (NFC) lines RF signal lines FM Antenna Digital Lines USB Bus Nominal Dimensions Schematic BSC SLP0603PX3B (Bottom iew) Revision /7/04

2 PROECION PRODUCS Absolute Maximum Rating Rating Symbol alue Units Peak Pulse Power (tp = 8/0μs) M aximum Peak Pulse Current ( tp = 8/0μs) P pk 8 Watts I pp. Amps ESD per IEC (Air) SD per IEC (Contact) E ESD +/- 8 +/- k Operating emperature J - to + C Storage emperature SG to +0 - C Electrical Characteristics (= o C) Parameter Symbol Conditions Minimum ypical Maximum Units Reverse Stand-Off oltage WM R in to or to P 8 Reverse Breakdown oltage B I t = ma Pin to or to R 0 4 Reverse Leakage Current I R RWM = 8, = C Pin to or to Clamping oltage C I PP =.A, tp = 8/0μs Pin to or to ESD Clamping oltage C IPP = 4A, tlp = 0./00ns ESD Clamping oltage C IPP = 6A, tlp = 0./00ns 0 na 34 48, 3 Dynamic Resistance R tp = 00n s. Ohms D Junction Capacitance C j R = 0, f = MHz pf Notes )ESD gun return path connected to ESD ground reference plane. )ransmission Line Pulse est (LP) Settings: t p = 00ns, t r = 0.ns, I LP and LP averaging window: t = 70ns to t = 90ns. 3) Dynamic resistance calculated from I LP = 4A to I LP = 6A 03 Semtech Corporation

3 PROECION PRODUCS ypical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse ime Clamping oltage vs. Peak Pulse Current (tp=8/0us) Peak Pulse Power - P PP (kw) A = O C DR Pulse Duration - tp (µs) Clamping oltage - C () Waveform Parameters: tr = 8μs td = 0μs Peak Pulse Current - I pp (A) Junction Capacitance vs. Reverse oltage LP Characteristic Capacitance - C j (pf) LP Current (A) 0 0 ransmission Line Pulse est (LP) Settings: t p = 00ns, t r = 0.ns, I LP and LP averaging window: t = 70ns to t = 90ns 0.0 f = MHz Reverse oltage - R () LP oltage () ESD Clamping (+8k Contact per IEC ) ESD Clamping (-8k Contact per IEC ) Measured with 0 Ohm scope input impedance, GHz bandwidth. Corrected for 0 Ohm, 40dB attenuator. ESD gun return path connected to ESD ground plane oltage () oltage () Measured with 0 Ohm scope input impedance, GHz bandwidth. Corrected for 0 Ohm, 40dB attenuator. ESD gun return path connected to ESD ground plane ime (ns) ime (ns) 03 Semtech Corporation 3

4 PROECION PRODUCS ypical Characteristics ypical Insertion Loss S CH S LOG 6 db / REF 0 db : db 800 MHz 0 db -6 db - db -8 db -4 db 3 4 : db 900 MHz 3: db.8 GHz 4: db. GHz : db.7 GHz - db -36 db -4 db -48 db MHz 0 MHz 00 MHz GHz 3 GHz SAR. 0 MHz SOP MHz Applications Information Assembly Guidelines he small size of this device means that some care must be taken during the mounting process to insure reliable solder joint. he table below provides Semtech's recommended assembly guidelines for mounting this device. he figure at the right details Semtech s recommended aperture based on the below recommendations. Note that these are only recommendations and should serve only as a starting point for design since there are many factors that affect the assembly process. he exact manufacturing parameters will require some experimentation to get the desired solder application Stencil Opening Land Pad 0.0 Assembly Solder Parameter Stencil Design Recommendation Laser cut, Electro-polishe d Aperture shape Rectangular with rounded corners S older Stencil hickness 0.00 mm (0.004") All Dimensions are in mm. Land Pad. Stencil opening Component Recommended Stencil Design Solder Paste ype ype 4 size sphere or smaller Solder Reflow Profile Per JEDEC J-SD-00 PCB PCB Solder Pad Design Pad Finish Non-Solder mask defined OSP OR NiAu 03 Semtech Corporation 4

5 PROECION PRODUCS Outline Drawing - SLP0603PX3B aaa C A A D OP IEW B E A C SEAING PLANE DIMENSIONS DIM MILLIMEERS MIN NOM MAX A A b D E e 0.40 BSC L N aaa 0.08 bbb 0.0 e e/ bbb bxn C A B xl BOOM IEW NOES:. CONROLLING DIMENSIONS ARE IN MILLIMEERS (ANGLES IN DEGREES ). Land Pattern - SLP0603PX3B (C) G Z DIMENSIONS DIM MILLIMEERS C (0.4) G 0.7 X 0.70 Y 0.0 Z 0.67 Y X NOES:. CONROLLING DIMENSIONS ARE IN MILLIMEERS (ANGLES IN DEGREES).. HIS LAND PAERN IS FOR REFERENCE PURPOSES ONLY. CONSUL YOUR MANUFACURING GROUP O ENSURE YOUR COMPANY'S MANUFACURING GUIDELINES ARE ME. 03 Semtech Corporation

6 PROECION PRODUCS Marking Code Ordering Information Part Number Qty per Reel Reel Size RClamp8Z.N 0,000 7 Inch Notes: RailClamp and RClamp are trademarks of Semtech Corporation Notes: )Dots represent date code matrix and Pin location Carrier ape Specification Bo Ko Ao Device Orientation in ape A0 B0 K /-0.0 mm 0.7 +/-0.0 mm 0.9 +/-0.0 mm Note: All dimensions in mm unless otherwise specified PIN Location (owards Sprocket Holes) 03 Semtech Corporation 6

7 PROECION PRODUCS Contact Information Semtech Corporation Protection Products Division 00 Flynn Rd., Camarillo, CA 9 Phone: (80)498- FAX (80) Semtech Corporation 7