Sonion TC100Z21A DigiSiMic Silicon Condensor Microphone MEMS Process Review
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1 November 8, 2006 Sonion TC100Z21A DigiSiMic Silicon Condensor Microphone MEMS Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology, please call Sales at Chipworks Richmond Road, Suite 500, Ottawa, ON K2H 5B7, Canada Tel: Fax:
2 Some of the information is this report may be covered by patents, mask and/or copyright protection. This report should not be taken as an inducement to infringe on these rights Chipworks Incorporated This report is provided exclusively for the use of the purchasing organization. It can be freely copied and distributed within the purchasing organization, conditional upon the accompanying Chipworks accreditation remaining attached. Distribution of the entire report outside of the purchasing organization is strictly forbidden. The use of portions of the document for the support of the purchasing organization s corporate interest (e.g., licensing or marketing activities) is permitted, as defined by the fair use provisions of the copyright act. Accreditation to Chipworks must be attached to any portion of the reproduced information.
3 MEMS Process Review Table of Contents 1 Overview 1.1 List of Figures 1.2 List of Tables 1.3 Company Profile 1.4 Introduction 1.5 Device Summary 1.6 Process Summary 2 TC100Z21A Microphone Assembly Overview 2.1 TC100Z21A Microphone Assembly 2.2 MEMS Microphone Die Overview 2.3 TT3040A ASIC Die Overview 2.4 Silicon Chip Carrier Die Overview 3 MEMS Microphone Process Analysis 3.1 MEMS Microphone Overview 4 TT3040A ASIC Basic Device Analysis 4.1 TT3040A Overview 4.2 Observed Critical Dimensions 4.3 Process Analysis 5 Silicon Chip Carrier Basic Device Analysis 5.1 Silicon Chip Carrier Overview 5.2 Silicon Chip Carrier Cross Sectional Analysis 5.3 Silicon Chip Carrier Tilt View Analysis 6 Critical Dimensions 7 Statement of Measurement Uncertainty 8 References Report Evaluation
4 Overview Overview 1.1 List of Figures 2 TC100Z21A Microphone Assembly Overview TC100Z21A Package Top TC100Z21A Plan View Package X-Ray TC100Z21A Side View Package X-Ray TC100Z21A Microphone Assembly Top TC100Z21A Microphone Assembly Top View (SEM) TC100Z21A Microphone Assembly Tilt View (SEM) TC100Z21A Microphone Assembly Bottom MEMS Microphone Die MEMS Microphone Die (SEM) TT3040A Die Photograph TT3040A Die Marking TT3040A Die Corner and Bond Pad Silicon Chip Carrier Top Silicon Chip Carrier Bottom 3 MEMS Microphone Process Analysis MEMS Microphone Die Overview Etched Cavity Detail of Cavity Sidewall MEMS Microphone Bottom Plate Overview Edge of Bottom Plate Tilt View Edge of Bottom Plate Plan View Detail of Poly 2 Bottom Plate MEMS Microphone Top Plate Contact (Tilt View) MEMS Microphone Top Plate Contact (Plan View) MEMS Microphone Bottom Plate Contact (Tilt View) MEMS Microphone Bottom Plate Contact (Plan View) MEMS Microphone Cross-Section Overview Substrate and Cavity Edge Left Side Solder Ring Left Side Bottom Plate Anchor Left Side Detail of Bottom Plate Anchor Left Side Cavity Edge Right Side Cavity Edge Right Side, Top Plate Contact Cavity Edge Right Side, Detail of Top Plate Contact
5 Overview TT3040A ASIC Basic Device Analysis TT3040A General Device Structure Bond Pad Minimum Pitch Metal Double Poly Capacitor Minimum Pitch Poly Minimum Gate Length NMOS Transistors 5 Silicon Chip Carrier Basic Device Analysis Silicon Chip Carrier Overview Chip Carrier Top Edge Edge of Bond Pad Metal Contact and Dielectrics Through Die Vias Top Side Contact to Through Die Vias Bottom Side Contact to Through Die Vias Chip Carrier Cavity (Tilt View) Contact to MEMS Microphone Die Top Plate Contact (Tilt View) Contact to MEMS Microphone Die Bottom Plate Contact (Tilt View)
6 Overview List of Tables 1 Overview MEMS Microphone Die Summary TT3040A ASIC Die Summary Silicon Chip Carrier Summary MEMS Microphone Process Summary TT3040A ASIC Process Summary Silicon Chip Carrier Process Summary 2 TC100Z21A Microphone Assembly Overview TC100Z21A Dimensions MEMS Microphone Die Dimensions TT3040A Die and Bond Pad Dimensions Bond Pad Dimensions 3 MEMS Microphone Process Analysis MEMS Microphone Die Critical Dimensions 4 TT3040A ASIC Basic Device Analysis TT3040A ASIC Observed Minimum Dimensions 5 Silicon Chip Carrier Basic Device Analysis Silicon Chip Carrier Critical Dimensions 6 Critical Dimensions TC100Z21A Dimensions MEMS Microphone Die Dimensions TT3040A Die and Bond Pad Dimensions Bond Pad Dimensions MEMS Microphone Die Critical Dimensions TT3040A ASIC Observed Minimum Dimensions Silicon Chip Carrier Critical Dimensions
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