Maxim MAX3940E Electro-Absorption Modulator Structural Analysis
|
|
- Sherman Goodman
- 5 years ago
- Views:
Transcription
1 May 23, 2006 Maxim MAX3940E Electro-Absorption Modulator Structural Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology, please call Sales at Chipworks Richmond Road, Suite 500, Ottawa, ON K2H 5B7, Canada Tel: Fax:
2 Some of the information in this report may be covered by patents, mask and/or copyright protection. This report should not be taken as an inducement to infringe on these rights Chipworks Incorporated This report is provided exclusively for the use of the purchasing organization. It can be freely copied and distributed within the purchasing organization, conditional upon the accompanying Chipworks accreditation remaining attached. Distribution of the entire report outside of the purchasing organization is strictly forbidden. The use of portions of the document for the support of the purchasing organization's corporate interest (e.g., licensing or marketing activities) is permitted, as defined by the fair use provisions of the copyright act. Accreditation to Chipworks must be attached to any portion of the reproduced information.
3 Structural Analysis Table of Contents 1 Overview 1.1 List of Figures 1.2 List of Tables 1.3 Introduction 1.4 Major Findings 2 Device Overview 2.1 Die 2.2 Die Features 3 Process 3.1 Passivation 3.2 Metallization 3.3 Intermetal Dielectrics and PMD 3.4 Vias and Contacts 3.5 MOS Transistors and Poly 3.6 Vertical NPN Heterojunction Bipolar Transistors 3.7 Lateral PNP Transistors 3.8 Diode-Like Structure 3.9 Resistors, Capacitors and Inductors 3.10 Isolation 3.11 Top Silicon Layer and Handle Wafer 4 Materials Analysis 4.1 SIMS Analysis 4.2 SRP Analysis 4.3 EDS Analysis 5 Critical Dimensions 5.1 Horizontal Dimensions 5.2 Vertical Dimensions Report Evaluation
4 Overview Overview 1.1 List of Figures 2 Device Overview Annotated Die Photograph Die Markings Die Corner Die Edge Minimum Pitch Bondpads Left Bondpad Edge Right Bondpad Edge 3 Process General View of MAX3940 Process Die Edge Seal Si 3 N 4 Passivation Minimum Width Metal Minimum Pitch Metal Minimum Pitch Metal Additional Layer on Metal Minimum Pitch Metal Inter-Metal Dielectrics IMD 1 Through IMD IMD IMD IMD Pre-Metal Dielectric PMD Over Poly 2 and STI Minimum Pitch Via 3 s Via Via 2 and MIM Capacitor Minimum Pitch Via 2 s and Via 1 s Stacked Via 2 and Via Contacts to Poly Contacts to Diffusion
5 Overview NMOS Transistor Gate Poly and S/D Diffusion Double Poly Capacitor Multi-Emitter Vertical NPN Transistor Poly-Emitter Contact Vertical NPN Transistor Emitter Contact Delineated With a Glass Etch Lateral PNP Transistor N+ Base Contact Polycide Emitter Contact Silicided Collector Contact Plan-View of Diode-Like-Device Diode-Like Device Central Contact Outer Ring Contact Plan-View of the Diffusion and TiSi 2 Resistors Plan-View of Metal Film Resistors SEM Cross-Section of a Metal Film Resistor SEM Cross-Section of a Diffusion Resistor Ti Silicide Resistor Double Poly Capacitors Edge of Double Poly Capacitor MOS Capacitor Optical Plan-View of the Center Tapped Inductor SEM Cross-Section of the Inductor Poly Over STI Deep Trench Isolation
6 Overview Materials Analysis FESEM Cross-Section Through Dielectrics SIMS Profile of Dielectric Layers Pattern and Field Regions on Die Spreading Resistance Profile Through a Pattern Region Spreading Resistance Profile Through a Field Region EDS Spectrum of Metal EDS Spectrum of Metal EDS Spectrum of Metal EDS Spectrum of Metal EDS Spectrum of the Metal 2 Cap Layer EDS Spectrum of a Silicide 5 Critical Dimensions 5.1 Horizontal Dimensions 5.2 Vertical Dimensions 1.2 List of Tables Metallization Vertical Dimensions Metallization Horizontal Dimensions Via and Contact Dimensions
Texas Instruments BQ29330 Battery Protection AFE from BQ20Z95DBT
Texas Instruments BQ29330 Battery Protection AFE from BQ20Z95DBT Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor
More informationFreescale MRF6P3300H RF Power Field Effect Transistor Process Review
August 4, 2006 Freescale MRF6P3300H RF Power Field Effect Transistor Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor
More informationAgilent 2AZ1A CMOS Image Sensor Process Review
October 13, 2006 Agilent 2AZ1A CMOS Image Sensor Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology,
More informationAptina MT9P111 5 Megapixel, 1/4 Inch Optical Format, System-on-Chip (SoC) CMOS Image Sensor
Aptina MT9P111 5 Megapixel, 1/4 Inch Optical Format, System-on-Chip (SoC) CMOS Image Sensor Imager Process Review For comments, questions, or more information about this report, or for any additional technical
More informationSanDisk uch2j, TWDS2M, and uch32005 Memory Controllers
SanDisk uch2j, TWDS2M, and uch32005 Memory Controllers Process Comparative Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor
More informationPanasonic DMC-GH Mp, 4.4 µm Pixel Size LiveMOS Image Sensor from Panasonic LUMIX DMC-GH1 Micro Four Thirds Digital Interchangeable Lens Camera
Panasonic DMC-GH1 12.1 Mp, 4.4 µm Pixel Size LiveMOS Image Sensor from Panasonic LUMIX DMC-GH1 Micro Four Thirds Digital Interchangeable Lens Camera Imager Process Review For comments, questions, or more
More informationTexas Instruments ISO7220A Capacitor Type Digital Isolator
Texas Instruments ISO7220A Process Review 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Process Review Some of the information in this report may be covered
More informationTexas Instruments S W Digital Micromirror Device
Texas Instruments S1076-6318W MEMS Process Review with Supplementary TEM Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor
More informationSTMicroelectronics LSM303DLH 3-Axis Accelerometer and 3-Axis Honeywell Magnetometer Sensor
STMicroelectronics LSM303DLH 3-Axis Accelerometer and 3-Axis Honeywell Magnetometer Sensor MEMS Process Review For comments, questions, or more information about this report, or for any additional technical
More informationTexas Instruments Sitara XAM3715CBC Application Processor 45 nm UMC Low Power Process
Texas Instruments Sitara XAM3715CBC Application Processor Structural Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor
More informationSonion TC100Z21A DigiSiMic Silicon Condensor Microphone MEMS Process Review
November 8, 2006 Sonion TC100Z21A DigiSiMic Silicon Condensor Microphone MEMS Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning
More informationTexas Instruments M Digital Micromirror Device (DMD)
Texas Instruments 1910-612M Digital Micromirror Device (DMD) MEMS Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor
More informationPowerDsine/Freescale
April 25, 2005 PowerDsine/Freescale PD64004 4 Channel Power-Over-Ethernet (POE) Manager Process Review For questions, comments, or more information about this report, or for any additional technical needs
More informationXilinx XC5VLX50 FPGA UMC 65 nm Process
Xilinx XC5VLX50 FPGA UMC 65 nm Process Structural Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor and electronics
More informationFoveon FX17-78-F13D Mp, 7.8 µm Pixel Size CIS from Sigma DP1 Compact Digital Camera 0.18 µm Dongbu Process
Foveon FX17-78-F13D-07 14.1 Mp, 7.8 µm Pixel Size CIS from Sigma DP1 Compact Digital Camera 0.18 µm Dongbu Process Imager Process Review For comments, questions, or more information about this report,
More informationSamsung K4B1G0846F-HCF8 1 Gbit DDR3 SDRAM 48 nm CMOS DRAM Process
Samsung K4B1G0846F-HCF8 48 nm CMOS DRAM Process Structural Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor and electronics
More informationTexas Instruments THS7530PWP Gain Amplifier Structural Analysis
March 1, 2005 Texas Instruments THS7530PWP Gain Amplifier Structural Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor
More informationBroadcom BCM43224KMLG Baseband/MAC/Radio All-in-One Die SMIC 65 nm Process
Broadcom BCM43224KMLG Baseband/MAC/Radio All-in-One Die SMIC 65 nm Process Structural Analysis 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Structural Analysis
More informationCypress CY7C PVC USB 2.0 Integrated Microcontroller Process Analysis
March 12, 2004 Cypress CY7C68013-56PVC USB 2.0 Integrated Microcontroller Process Analysis Introduction... Page 1 List of Figures... Page 2 Device Summary... Page 6 Device Identification Package and Assembly
More informationInvenSense IDG-300 Dual-Axis Angular Rate Gyroscope Sensor
InvenSense IDG-300 Dual-Axis Angular Rate Gyroscope Sensor MEMS Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor
More informationNVE IL715-3E GMR Type Digital Isolator (30457J Die Markings) 0.50 µm CMOS Process
NVE IL715-3E GMR Type Digital Isolator (30457J Die Markings) 0.50 µm CMOS Process Process Analysis 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Process Analysis
More informationBosch Sensortec BMP180 Pressure Sensor
Bosch Sensortec BMP180 MEMS Process Review 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com MEMS Process Review Some of the information in this report may be
More informationCMOSIS CMV Mp, 5.5 µm Pixel Pitch High-Speed Pipelined Global Shutter CMOS Image Sensor with Correlated Double Sampling
CMOSIS CMV4000 4 Mp, 5.5 µm Pixel Pitch High-Speed Pipelined Global Shutter CMOS Image Sensor with Correlated Double Sampling Imager Process Review 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada
More informationSTMicroelectronics LIS3L02AE 3-Axis Accelerometer. MEMS Process Review
3-Axis Accelerometer For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology, please call Sales at Chipworks. 3685 Richmond
More informationToshiba HEK3 0.3 Mp VGA CMOS Image Sensor 0.13 µm Toshiba Process
Toshiba HEK3 0.3 Mp VGA CMOS Image Sensor 0.13 µm Toshiba Process Through Silicon Via Process Review For comments, questions, or more information about this report, or for any additional technical needs
More informationSilicon Storage Technology SST39VF800A 8 Mbit Multi-Purpose Flash Memory Structural Analysis
February 23, 2005 Silicon Storage Technology SST39VF800A 8 Mbit Multi-Purpose Flash Memory Structural Analysis For questions, comments, or more information about this report, or for any additional technical
More informationPowerchip Semiconductor Corporation A3R12E3GEF G6E 635BLC4M 512 Megabit DDR2 SDRAM Structural Analysis
February 23, 2007 Powerchip Semiconductor Corporation A3R12E3GEF G6E 635BLC4M Structural Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning
More informationSony IMX118CQT 18.5 Mp, 1.25 µm Pixel Pitch Back Illuminated CIS from the Sony DSC-WX100 Camera
18.5 Mp, 1.25 µm Pixel Pitch Back Illuminated CIS from the Sony DSC-WX100 Camera Imager Process Review 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Imager
More informationMicron MT66R7072A10AB5ZZW 1 Gbit Phase Change Memory 45 nm BiCMOS PCM Process
Micron MT66R7072A10AB5ZZW 45 nm BiCMOS PCM Process Process Review 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Process Review Some of the information in
More informationIntel Xeon E3-1230V2 CPU Ivy Bridge Tri-Gate 22 nm Process
Intel Xeon E3-1230V2 CPU Structural Analysis 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Structural Analysis Some of the information in this report may
More informationRockchip RK3188 Mobile Application Processor GF 28 nm SLP Gate First HKMG CMOS Process
Rockchip RK3188 Mobile Application Processor GF 28 nm SLP Gate First HKMG CMOS Process Process Review FEOL Analysis 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com
More informationAKM AK8973 and AK Axis Electronic Compass
AKM AK8973 and AK8974 Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor and electronics technology, please call
More informationSamsung S5K3BAFB 2 Megapixel CMOS Image Sensor 0.13 µm Copper CMOS Process Process Review Report
October 13, 2006 Samsung S5K3BAFB 2 Megapixel CMOS Image Sensor 0.13 µm Copper CMOS Process Process Review Report (with Optional TEM Analysis) For comments, questions, or more information about this report,
More informationAnalog Devices AD7658 Analog to Digital Converter icmos Process Technology Process Review
November 1, 2005 Analog Devices AD7658 Analog to Digital Converter icmos Process Technology Process Review For comments, questions, or more information about this report, or for any additional technical
More informationMicrochip PIC18F4320-I/ML Enhanced Flash Microcontroller Structural Analysis
March 13, 2006 Microchip PIC18F4320-I/ML Enhanced Flash Microcontroller Structural Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning
More informationIBM POWER7 Server 46J6702 IBM 45 nm Dual Stress Liner SOI CMOS Process with edram
IBM POWER7 Server 46J6702 IBM 45 nm Dual Stress Liner SOI CMOS Process with edram Front End Process Analysis 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com
More informationAkustica AKU2000 MEMS Microphone. MEMS Process Review
Akustica AKU2000 MEMS Microphone MEMS Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology, please call
More informationNanya elixir N2TU51280AF-37B 512 Mbit DDR2 SDRAM Structural Analysis
September 20, 2005 Nanya elixir N2TU51280AF-37B 512 Mbit DDR2 SDRAM Structural Analysis For questions, comments, or more information about this report, or for any additional technical needs concerning
More informationSamsung K9F2G08U0M-YCB0 2Gbit NAND Flash Device Structural Analysis
April 4, 2006 Samsung K9F2G08U0M-YCB0 2Gbit NAND Flash Device Structural Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor
More informationLSI Logic LSI53C1030 PCI-X to Dual Channel Ultra320 SCSI Controller 0.18 µm CMOS Process
LSI Logic LSI53C13 PCI-X to Dual Channel Ultra32 SCSI Controller.18 µm CMOS Process Structural Analysis For comments, questions, or more information about this report, or for any additional technical needs
More informationVolterra VT1115MF PWM Controller Chip
Process Review with Supplementary TEM Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology, please call Sales
More informationMatrix Semiconductor One Time Programmable Memory
December 22, 2004 Matrix Semiconductor 11247-01-99 One Time Programmable Memory Structural Analysis For questions, comments, or more information about this report, or for any additional technical needs
More informationPeregrine Semiconductor PE4268 SP6T RF UltraCMOS TM Switch Structural Analysis
September 21, 2005 Peregrine Semiconductor PE4268 Structural Analysis For questions, comments, or more information about this report, or for any additional technical needs concerning semiconductor technology,
More informationSony IMX145 8 Mp, 1.4 µm Pixel Pitch Back Illuminated (BSI) CMOS Image Sensor from the Apple iphone 4S Smartphone
Sony IMX145 8 Mp, 1.4 µm Pixel Pitch Back Illuminated (BSI) CMOS Image Sensor from the Apple iphone 4S Smartphone Imager Process Review 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414
More informationSamsung K4H510838C-UCCC 512Mbit DDR SDRAM Structural Analysis
July 26, 2005 Samsung K4H510838C-UCCC 512Mbit DDR SDRAM Structural Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor
More informationSpansion S29GL512N11TAI Mbit MirrorBit TM Flash Memory Structural Analysis
March 5, 2007 Spansion S29GL512N11TAI02 512 Mbit MirrorBit TM Flash Memory Structural Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning
More informationAltera 5SGXEA7K2F40C2ES Stratix V TSMC 28 nm HP Gate Last HKMG CMOS Process
Altera 5SGXEA7K2F40C2ES Stratix V TSMC 28 nm HP Gate Last HKMG CMOS Process Process Review FEOL Analysis 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Process
More informationnvidia GeForce FX 5700 Ultra (NV36) Graphics Processor Structural Analysis
nvidia GeForce FX 5700 Ultra (NV36) Graphics Processor Structural Analysis For questions, comments, or more information about this report, or for any additional technical needs concerning semiconductor
More informationMotorola MPXV5004G Integrated Pressure Sensor Structural Analysis
December 21, 2004 Motorola MPXV5004G Integrated Pressure Sensor Structural Analysis For questions, comments, or more information about this report, or for any additional technical needs concerning semiconductor
More informationSony IMX Mp, 4.8 µm Pixel Size APS-C (DX Format) CMOS Image Sensor from Nikon D7000. Module 5: Substrate Dopant Analysis
Sony IMX071 16.2 Mp, 4.8 µm Pixel Size APS-C (DX Format) CMOS Image Sensor from Nikon D7000 Module 5: Substrate Dopant Analysis Sony IMX071 16.2 Mp, 4.8 µm Pixel Size, APS-C (DX Format) CMOS Image Sensor
More informationQualcomm MDM9215M Gobi 4G GSM/CDMA Modem 28 nm LP. Module 2: CMOS FEOL Analysis
Qualcomm MDM9215M Gobi 4G GSM/CDMA Modem 28 nm LP Module 2: CMOS FEOL Analysis Qualcomm MDM9215M Gobi 4G GSM/CDMA Modem 28 nm LP 2 Some of the information in this report may be covered by patents, mask
More informationToshiba TH58NVG2S3BTG00 4 Gbit NAND Flash Structural Analysis
July 5, 2005 Toshiba TH58NVG2S3BTG00 4 Gbit NAND Flash Structural Analysis For questions, comments, or more information about this report, or for any additional technical needs concerning semiconductor
More informationSamsung K9G8G08U0M-PCB0 8 Gbit MLC NAND Flash Structural Analysis
November 6, 2006 Samsung K9G8G08U0M-PCB0 Structural Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology, please
More informationSTMicroelectronics STMT05 S-Touch Capacitive Touch Screen Controller
STMicroelectronics STMT05 S-Touch Capacitive Touch Screen Controller with Costing Analysis 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information
More informationOlympus EVOLT E-410/Matsushita LiveMOS Image Sensor
Olympus EVOLT E-410/Matsushita Imager Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology, please call
More informationSony IMX018 CMOS Image Sensor Imager Process Review
September 6, 2006 Sony IMX018 CMOS Image Sensor Imager Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology,
More informationCanon LC Mp, 4.3 µm Pixel Size, APS-C Format CMOS Image Sensor from the Canon EOS Rebel T4i (EOS 650D/EOS Kiss X6i)
Canon LC1270 18.0 Mp, 4.3 µm Pixel Size, APS-C Format CMOS Image Sensor from the Canon EOS Rebel T4i (EOS 650D/EOS Kiss X6i) Module 3: Planar Pixel Analysis Canon LC1270 CMOS Image Sensor 2 Some of the
More informationSamsung K9HAG08U1M-PCB0 16 Gbit MLC NAND Flash Structural Analysis Report
March 6, 2006 Samsung K9HAG08U1M-PCB0 16 Gbit MLC NAND Flash Structural Analysis Report For comments, questions, or more information about this report, or for any additional technical needs concerning
More informationNikon NC81369R 24.2 Mp, 3.8 µm Pixel Size, APS-C Format CMOS Image Sensor from the Nikon D3200. Module 5: Substrate Dopant Analysis
Nikon NC81369R 24.2 Mp, 3.8 µm Pixel Size, APS-C Format CMOS Image Sensor from the Nikon D3200 Module 5: Substrate Dopant Analysis Nikon NC81369R CMOS Image Sensor from the Nikon D3200 2 Some of the information
More informationOmniVision OVM7692 (OV289AA Die Markings) VGA CameraCubeChip. Module 3: Planar Pixel Analysis
OmniVision OVM7692 (OV289AA Die Markings) VGA CameraCubeChip Module 3: Planar Pixel Analysis OmniVision OVM7692 VGA CameraCubeChip 2 Some of the information in this report may be covered by patents, mask
More informationPanasonic DMC-GH Mp, 4.4 µm Pixel Size LiveMOS Image Sensor from Panasonic LUMIX DMC-GH1 Micro Four Thirds Digital Interchangeable Lens Camera
Panasonic DMC-GH1 12.1 Mp, 4.4 µm Pixel Size LiveMOS Image Sensor from Panasonic LUMIX DMC-GH1 Micro Four Thirds Digital Interchangeable Lens Camera Imager Process Review For comments, questions, or more
More informationInvenSense ITG-3200 Three-Axis Digital Output Yaw, Pitch, and Roll Gyroscope
InvenSense ITG-3200 Three-Axis Digital Output Yaw, Pitch, and Roll Gyroscope MEMS Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning
More informationTexas Instruments BRF6350B Bluetooth Link Controller UMC 90 nm RF CMOS
Texas Instruments BRF6350B UMC 90 nm RF CMOS Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology, please
More informationTexas Instruments/Apple 343S0538 Touch Screen Controller with F Die Markings
Texas Instruments/Apple 343S0538 Touch Screen Controller with F761530 Die Markings 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in
More informationMicrosoft X02046 IBM PowerPC Processor from the XBOX 360 Structural Analysis
February 7, 2006 Microsoft X02046 IBM PowerPC Processor from the XBOX 360 Structural Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning
More informationMarvell I1062-B0 Hard Drive Controller SoC
Marvell I1062-B0 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in this report may be covered by patents, mask, and/or copyright protection.
More informationMotorola PRF5P21240 RF Power MOSFET Structural Analysis
September 2, 2004 Motorola PRF5P21240 RF Power MOSFET Structural Analysis For questions, comments, or more information about this report, or for any additional technical needs concerning semiconductor
More informationNikon NC81369R 24.2 Mp, 3.8 µm Pixel Size, APS-C Format CMOS Image Sensor from the Nikon D3200. Module 1: Overview Analysis
Nikon NC81369R 24.2 Mp, 3.8 µm Pixel Size, APS-C Format CMOS Image Sensor from the Nikon D3200 Module 1: Overview Analysis Nikon NC81369R (CMOS Image Sensor from the Nikon D3200) 2 Some of the information
More informationSony IMX128AQP 24.3 Mp 5.9 µm Pixel Pitch CMOS Image Sensor from Nikon D600. Module 1: Overview Analysis
Sony IMX128AQP 24.3 Mp 5.9 µm Pixel Pitch CMOS Image Sensor from Nikon D600 Module 1: Overview Analysis Sony IMX128AQP 24.3 Mp CIS from Nikon D600 2 Some of the information in this report may be covered
More informationRF Micro Devices RF1500 Antenna Switch
RF Micro Devices RF1500 Process Node Assessment with TEM Option 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 chipworks.com Process Node Assessment with TEM Option 2 Some
More informationMarvell 88E6046-TAH1 Four Port Fast Ethernet Plus Two Port Gigabit Ethernet Switch
Marvell 88E6046-TAH1 Four Port Fast Ethernet Plus Two Port Gigabit Ethernet Switch 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in
More informationMagnaChip MC511DB 1.3 Megapixel CMOS Image Sensor 0.18 µm Process
MagnaChip MC511DB 1.3 Megapixel CMOS Image Sensor 0.18 µm Process Imager Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning
More informationQualcomm QFE1100 Envelope Tracking PA Power Supply
Qualcomm QFE1100 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in this report may be covered by patents, mask and/or copyright protection.
More informationOki 2BM6143 Microcontroller Unit Extracted from Casio GW2500 Watch 0.25 µm CMOS Process
Oki 2BM6143 Microcontroller Unit Extracted from Casio GW2500 Watch 0.25 µm CMOS Process Custom Process Review with TEM Analysis For comments, questions, or more information about this report, or for any
More informationFreescale MCIMX535DVV1C i.mx535 Mobile Applications Processor
Freescale MCIMX535DVV1C i.mx535 Basic Functional Analysis 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Basic Functional Analysis Some of the information
More informationSony IMX Megapixel, 1.4 µm Pixel 1/3.2 Optical Format CMOS Image Sensor
Sony IMX046 8.11 Megapixel, 1.4 µm Pixel 1/3.2 Optical Format CMOS Image Sensor Imager Process Review For comments, questions, or more information about this report, or for any additional technical needs
More informationSony IMX096AQL 24.3 Mp, 3.9 µm Pixel Pitch APS-C CMOS Image Sensor from the Sony α77 (SLT-A77) Digital Single Lens Reflex (DSLR) Camera
Sony IMX096AQL 24.3 Mp, 3.9 µm Pixel Pitch APS-C CMOS Image Sensor from the Sony α77 (SLT-A77) Digital Single Lens Reflex (DSLR) Camera Module 2: Die Utilization Sony IMX096AQL APS-C CMOS Image Sensor
More informationSharp NC Megapixel CCD Imager Process Review
Sharp NC9360 2.0 Megapixel CCD Imager Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology, please call
More informationMEMSIC MMC3120M Tri-Axis Magnetic Sensor
MEMSIC MMC3120M Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor and electronics technology, please call Sales
More informationAMD ATI TSMC 28 nm Gate Last HKMG CMOS Process
AMD ATI 7970 215-0821060 TSMC 28 nm Gate Last HKMG CMOS Process Package Analysis 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Package Analysis Some of the
More informationSony PMW-F55 CineAlta 4K PMW Series HD Super 35 mm Digital Motion Camera with Global Shutter CMOS Image Sensor. Module 3: Planar Pixel Analysis
Sony PMW-F55 CineAlta 4K PMW Series HD Super 35 mm Digital Motion Camera with Global Shutter CMOS Image Sensor Module 3: Planar Pixel Analysis Sony PMW-F55 CineAlta 4K HD Super 35 mm Digital Motion Camera
More informationFLIR Systems Indigo ISC0601B from Extech i5 Infrared Camera
FLIR Systems Indigo ISC0601B from Extech i5 Infrared Camera Infrared Imager Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning
More informationNikon NC81369R 24.2 Mp, 3.8 µm Pixel Size, APS-C Format CMOS Image Sensor from the Nikon D3200. Module 4: Pixel Cross-Sectional Analysis
Nikon NC81369R 24.2 Mp, 3.8 µm Pixel Size, APS-C Format CMOS Image Sensor from the Nikon D3200 Module 4: Pixel Cross-Sectional Analysis Nikon NC81369R (CMOS Image Sensor from the Nikon D3200) 2 Some of
More informationQualcomm MSM8260A Snapdragon S4 Dual-Core System-on-Chip (SoC) Mobile Applications Processor
Qualcomm MSM8260A Snapdragon S4 Dual-Core System-on-Chip (SoC) Mobile Applications Processor Basic Functional Analysis with Costing 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414
More informationSony IMX Mp, 1.2 µm Pixel Pitch Back Illuminated (Exmor R) CMOS Image Sensor from the Sony Cyber-shot HX300 Digital Compact Camera
Sony IMX147 20 Mp, 1.2 µm Pixel Pitch Back Illuminated (Exmor R) CMOS Image Sensor from the Sony Cyber-shot HX300 Digital Compact Camera Module 5: Substrate Dopant Analysis Sony IMX147 Back Illuminated
More informationFocalTech FT5206GE1 Capacitive Touch Screen Controller IC
FocalTech FT5206GE1 Functional Analysis with Costing Analysis 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Functional Analysis Some of the information in
More informationApple A5 APL0498 (APL0498E01 Die Markings) Mobile Processor Extracted from the ipad 2
Apple A5 APL0498 (APL0498E01 Die Markings) Mobile Processor Extracted from the ipad 2 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information
More informationApple/Cirrus Logic 338S1081/46L01 Multi-Standard Audio Decoder
Apple/Cirrus Logic 338S1081/46L01 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in this report may be covered by patents, mask, and/or
More informationNikon 12.1 Mp CMOS Image Sensor from a D3s DSLR Camera with NC81361A Die Markings
Nikon 12.1 Mp CMOS Image Sensor from a D3s DSLR Camera with NC81361A Die Markings Imager Process Review For comments, questions, or more information about this report, or for any additional technical needs
More informationMediaTek MT6167A Smartphone Radio Frequency (RF) Transceiver
MediaTek MT6167A Smartphone Radio Frequency (RF) Transceiver 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in this report may be
More informationMicron MT9T Megapixel, ¼ Optical Format, 1.75 µm Pixel Size System-on-Chip (SOC) CMOS Image Sensor
Micron MT9T111 3.1 Megapixel, ¼ Optical Format, 1.75 µm Pixel Size System-on-Chip (SOC) CMOS Image Sensor Imager Process Review with Optional TEM Analysis of SRAM For comments, questions, or more information
More informationOmniVision OVM7692 (OV289AA Die Markings) VGA CameraCubeChip. Module 1: Overview Analysis
OmniVision OVM7692 (OV289AA Die Markings) VGA CameraCubeChip Module 1: Overview Analysis OmniVision OVM7692 VGA CameraCubeChip 2 Some of the information in this report may be covered by patents, mask and/or
More informationBasic Functional Analysis. Sample Report Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel:
Basic Functional Analysis Sample Report 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Basic Functional Analysis Sample Report Some of the information in this
More informationQualcomm Atheros AR8035 Ultra Low Power Single RGMII Gigabit Ethernet PHY
Qualcomm Atheros AR8035 Ultra Low Power Single RGMII Gigabit Ethernet PHY 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in this report
More informationQualcomm MDM6600 Gobi Baseband Processor Plus RF Transceiver
Qualcomm MDM6600 Gobi Baseband Processor Plus RF Transceiver Basic Functional Analysis with Costing 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Basic Functional
More informationFreescale MCIMX6Q5EYM10AC (i.mx6q) Integrated Multimedia Applications Processor
Freescale MCIMX6Q5EYM10AC (i.mx6q) Integrated Multimedia Applications Processor 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in
More informationTexas Instruments WL1283C WiLink 7.0 Single Chip WLAN, GPS, Bluetooth, and FM Transceiver
Texas Instruments WL1283C WiLink 7.0 Single Chip WLAN, GPS, Bluetooth, and FM Transceiver Basic Functional Analysis with Cost Estimate 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414
More informationModule 2: CMOS FEOL Analysis
Module 2: CMOS FEOL Analysis Manufacturer Device # 2 About Chipworks Chipworks is the recognized leader in reverse engineering and patent infringement analysis of semiconductors and electronic systems.
More informationLinear Technology. LTC3808EGN DC/DC Controller. Circuit Analysis
Linear Technology LTC3808EGN DC/DC Controller Circuit Analysis For questions, comments, or more information about this report, or for any additional technical needs concerning semiconductor technology,
More informationFUJIFILM MS3897A CCD Image Sensor Imager Process Review
September 7, 2006 MS3897A CCD Image Sensor Imager Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology,
More information