STMicroelectronics LIS3L02AE 3-Axis Accelerometer. MEMS Process Review
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1 3-Axis Accelerometer For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology, please call Sales at Chipworks Richmond Road, Suite 500, Ottawa, ON K2H 5B7, Canada Tel: Fax:
2 Some of the information is this report may be covered by patents, mask and/or copyright protection. This report should not be taken as an inducement to infringe on these rights Chipworks Incorporated This report is provided exclusively for the use of the purchasing organization. It can be freely copied and distributed within the purchasing organization, conditional upon the accompanying Chipworks accreditation remaining attached. Distribution of the entire report outside of the purchasing organization is strictly forbidden. The use of portions of the document for the support of the purchasing organization s corporate interest (e.g., licensing or marketing activities) is permitted, as defined by the fair use provisions of the copyright act. Accreditation to Chipworks must be attached to any portion of the reproduced information. MPR JMKG Revision 1.0 Published: May 21, 2007
3 Table of Contents 1 Overview 1.1 List of Figures 1.2 List of Tables 1.3 Company Profile 1.4 Introduction 1.5 Device Summary 1.6 Process Summary 2 Device Overview 2.1 Package and Die 2.2 C5L05B8 Accelerometer Die 2.3 Control ASIC 3 Process Overview (A676A Control ASIC) 3.1 Dielectrics 3.2 Metallization 3.3 CMOS Transistors and Poly 3.4 Capacitors and Resistors 3.5 Wells and Substrate 4 Process Overview (Accelerometer) 4.1 General Device Structure 4.2 Bond Pads 4.3 Metallization and Polysilicon 4.4 Interpoly Vias and Contacts 4.5 Interpoly Dielectrics, Isolation, and Substrate 5 Architectural Analysis 5.1 X-Y Axis Sensors 5.2 Capacitor Plates 5.3 X-Y Proof Mass Springs 5.4 Tether and X-Y Proof Mass Spring 5.5 X-Y Proof Mass Stops 5.6 Z Axis Sensor 5.7 Interconnects and Air Bridges
4 6 Critical Dimensions 6.1 Critical Dimensions (CSL058 MEMS Accelerometer) 6.2 Critical Dimensions (Control ASIC) 7 Statement of Measurement Uncertainty About Chipworks
5 Overview Overview 1.1 List of Figures 2 Device Overview Top Package View Bottom Package View Plan View Package X-Ray Side View Package X-Ray Accelerometer Assembly Die Assembly Tilt View Silicon Cap and Pb Glass Seal Package Cross Section Pb Glass Seal Accelerometer Cavity C5L05B8 Accelerometer Die Accelerometer at Substrate Underside of Cap Layer Die Markings Die Markings Die Corner A676A Control ASIC Die Markings Die Markings Die Corner 3 Process Overview (A676A Control ASIC) General View PMD and LOCOS Minimum Pitch Metal Minimum Pitch Metal Standard Logic Minimum Gate Length CMOS Transistors Bipolar Transistors Plan View MIM Capacitors MIM Capacitor Poly 1 Resistors N + Sub-Collector 4 Process Overview (Accelerometer) General View Die Edge Bond Pads Bond Pad in Cross Section Aluminum Bond Pad Edge
6 Overview Aluminum Metallization on Poly Aluminum Metallization Aluminum Metallization Minimum Width Poly Poly 2 Line Edge Minimum Width Poly Poly Interpoly Via Contact Dielectric Layers SRP of Poly 1 and Substrate 5 Architectural Analysis Proof Masses Accelerometer at Poly Center of X-Y Proof Mass X Axis Capacitors Y Axis Capacitors Capacitor Plates and Spring Capacitor Plates Capacitor Plates in Tilt View Capacitor Plates in Cross Section X-Y Proof Mass and Springs X-Y Proof Mass Anchor X-Y Proof Mass Anchor and Tethers Anchors in Tilt View Tether and Spring End of Spring Spring X-Y Proof Mass and Stop X-Y Stop Tilt View X-Y Stop Tilt View of the Z Axis Proof Masses Z Proof Mass Gap Between Z Proof Masses Z Proof Mass at Poly Tether and Anchor Tether and Stop Tether Detail Z Proof Mass Stops and Tether Tether Air Bridges Tilt View Air Bridge Poly 2 Interconnect
7 About Chipworks About Chipworks Chipworks is the recognized leader in reverse engineering and patent infringement analysis of semiconductors and electronic systems. The company s ability to analyze the circuitry and physical composition of these systems makes them a key partner in the success of the world s largest semiconductor and microelectronics companies. Intellectual property groups and their legal counsel trust Chipworks for success in patent licensing and litigation earning hundreds of millions of dollars in patent licenses, and saving as much in royalty payments. Research & Development and Product Management rely on Chipworks for success in new product design and launch, saving hundreds of millions of dollars in design, and earning even more through superior product design and faster launches. Contact Chipworks To find out more information on this report, or any other reports in our library, please contact Chipworks at Chipworks 3685 Richmond Road, Suite 500 Ottawa, Ontario K2H 5B7 Canada T F Web site: info@chipworks.com Please send any feedback to feedback@chipworks.com
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