STMicroelectronics LIS3L02AE 3-Axis Accelerometer. MEMS Process Review

Size: px
Start display at page:

Download "STMicroelectronics LIS3L02AE 3-Axis Accelerometer. MEMS Process Review"

Transcription

1 3-Axis Accelerometer For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology, please call Sales at Chipworks Richmond Road, Suite 500, Ottawa, ON K2H 5B7, Canada Tel: Fax:

2 Some of the information is this report may be covered by patents, mask and/or copyright protection. This report should not be taken as an inducement to infringe on these rights Chipworks Incorporated This report is provided exclusively for the use of the purchasing organization. It can be freely copied and distributed within the purchasing organization, conditional upon the accompanying Chipworks accreditation remaining attached. Distribution of the entire report outside of the purchasing organization is strictly forbidden. The use of portions of the document for the support of the purchasing organization s corporate interest (e.g., licensing or marketing activities) is permitted, as defined by the fair use provisions of the copyright act. Accreditation to Chipworks must be attached to any portion of the reproduced information. MPR JMKG Revision 1.0 Published: May 21, 2007

3 Table of Contents 1 Overview 1.1 List of Figures 1.2 List of Tables 1.3 Company Profile 1.4 Introduction 1.5 Device Summary 1.6 Process Summary 2 Device Overview 2.1 Package and Die 2.2 C5L05B8 Accelerometer Die 2.3 Control ASIC 3 Process Overview (A676A Control ASIC) 3.1 Dielectrics 3.2 Metallization 3.3 CMOS Transistors and Poly 3.4 Capacitors and Resistors 3.5 Wells and Substrate 4 Process Overview (Accelerometer) 4.1 General Device Structure 4.2 Bond Pads 4.3 Metallization and Polysilicon 4.4 Interpoly Vias and Contacts 4.5 Interpoly Dielectrics, Isolation, and Substrate 5 Architectural Analysis 5.1 X-Y Axis Sensors 5.2 Capacitor Plates 5.3 X-Y Proof Mass Springs 5.4 Tether and X-Y Proof Mass Spring 5.5 X-Y Proof Mass Stops 5.6 Z Axis Sensor 5.7 Interconnects and Air Bridges

4 6 Critical Dimensions 6.1 Critical Dimensions (CSL058 MEMS Accelerometer) 6.2 Critical Dimensions (Control ASIC) 7 Statement of Measurement Uncertainty About Chipworks

5 Overview Overview 1.1 List of Figures 2 Device Overview Top Package View Bottom Package View Plan View Package X-Ray Side View Package X-Ray Accelerometer Assembly Die Assembly Tilt View Silicon Cap and Pb Glass Seal Package Cross Section Pb Glass Seal Accelerometer Cavity C5L05B8 Accelerometer Die Accelerometer at Substrate Underside of Cap Layer Die Markings Die Markings Die Corner A676A Control ASIC Die Markings Die Markings Die Corner 3 Process Overview (A676A Control ASIC) General View PMD and LOCOS Minimum Pitch Metal Minimum Pitch Metal Standard Logic Minimum Gate Length CMOS Transistors Bipolar Transistors Plan View MIM Capacitors MIM Capacitor Poly 1 Resistors N + Sub-Collector 4 Process Overview (Accelerometer) General View Die Edge Bond Pads Bond Pad in Cross Section Aluminum Bond Pad Edge

6 Overview Aluminum Metallization on Poly Aluminum Metallization Aluminum Metallization Minimum Width Poly Poly 2 Line Edge Minimum Width Poly Poly Interpoly Via Contact Dielectric Layers SRP of Poly 1 and Substrate 5 Architectural Analysis Proof Masses Accelerometer at Poly Center of X-Y Proof Mass X Axis Capacitors Y Axis Capacitors Capacitor Plates and Spring Capacitor Plates Capacitor Plates in Tilt View Capacitor Plates in Cross Section X-Y Proof Mass and Springs X-Y Proof Mass Anchor X-Y Proof Mass Anchor and Tethers Anchors in Tilt View Tether and Spring End of Spring Spring X-Y Proof Mass and Stop X-Y Stop Tilt View X-Y Stop Tilt View of the Z Axis Proof Masses Z Proof Mass Gap Between Z Proof Masses Z Proof Mass at Poly Tether and Anchor Tether and Stop Tether Detail Z Proof Mass Stops and Tether Tether Air Bridges Tilt View Air Bridge Poly 2 Interconnect

7 About Chipworks About Chipworks Chipworks is the recognized leader in reverse engineering and patent infringement analysis of semiconductors and electronic systems. The company s ability to analyze the circuitry and physical composition of these systems makes them a key partner in the success of the world s largest semiconductor and microelectronics companies. Intellectual property groups and their legal counsel trust Chipworks for success in patent licensing and litigation earning hundreds of millions of dollars in patent licenses, and saving as much in royalty payments. Research & Development and Product Management rely on Chipworks for success in new product design and launch, saving hundreds of millions of dollars in design, and earning even more through superior product design and faster launches. Contact Chipworks To find out more information on this report, or any other reports in our library, please contact Chipworks at Chipworks 3685 Richmond Road, Suite 500 Ottawa, Ontario K2H 5B7 Canada T F Web site: info@chipworks.com Please send any feedback to feedback@chipworks.com

InvenSense IDG-300 Dual-Axis Angular Rate Gyroscope Sensor

InvenSense IDG-300 Dual-Axis Angular Rate Gyroscope Sensor InvenSense IDG-300 Dual-Axis Angular Rate Gyroscope Sensor MEMS Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor

More information

Qualcomm QFE1100 Envelope Tracking PA Power Supply

Qualcomm QFE1100 Envelope Tracking PA Power Supply Qualcomm QFE1100 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in this report may be covered by patents, mask and/or copyright protection.

More information

Bosch Sensortec BMP180 Pressure Sensor

Bosch Sensortec BMP180 Pressure Sensor Bosch Sensortec BMP180 MEMS Process Review 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com MEMS Process Review Some of the information in this report may be

More information

Texas Instruments/Apple 343S0538 Touch Screen Controller with F Die Markings

Texas Instruments/Apple 343S0538 Touch Screen Controller with F Die Markings Texas Instruments/Apple 343S0538 Touch Screen Controller with F761530 Die Markings 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in

More information

STMicroelectronics STMT05 S-Touch Capacitive Touch Screen Controller

STMicroelectronics STMT05 S-Touch Capacitive Touch Screen Controller STMicroelectronics STMT05 S-Touch Capacitive Touch Screen Controller with Costing Analysis 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information

More information

Texas Instruments ISO7220A Capacitor Type Digital Isolator

Texas Instruments ISO7220A Capacitor Type Digital Isolator Texas Instruments ISO7220A Process Review 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Process Review Some of the information in this report may be covered

More information

Marvell 88E6046-TAH1 Four Port Fast Ethernet Plus Two Port Gigabit Ethernet Switch

Marvell 88E6046-TAH1 Four Port Fast Ethernet Plus Two Port Gigabit Ethernet Switch Marvell 88E6046-TAH1 Four Port Fast Ethernet Plus Two Port Gigabit Ethernet Switch 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in

More information

Marvell I1062-B0 Hard Drive Controller SoC

Marvell I1062-B0 Hard Drive Controller SoC Marvell I1062-B0 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in this report may be covered by patents, mask, and/or copyright protection.

More information

Freescale MCIMX535DVV1C i.mx535 Mobile Applications Processor

Freescale MCIMX535DVV1C i.mx535 Mobile Applications Processor Freescale MCIMX535DVV1C i.mx535 Basic Functional Analysis 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Basic Functional Analysis Some of the information

More information

Samsung SDP1301 DTV SERDES Interface

Samsung SDP1301 DTV SERDES Interface Samsung SDP1301 Basic Functional Analysis 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Basic Functional Analysis 2 Some of the information in this report

More information

FocalTech FT5206GE1 Capacitive Touch Screen Controller IC

FocalTech FT5206GE1 Capacitive Touch Screen Controller IC FocalTech FT5206GE1 Functional Analysis with Costing Analysis 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Functional Analysis Some of the information in

More information

Apple A5 APL0498 (APL0498E01 Die Markings) Mobile Processor Extracted from the ipad 2

Apple A5 APL0498 (APL0498E01 Die Markings) Mobile Processor Extracted from the ipad 2 Apple A5 APL0498 (APL0498E01 Die Markings) Mobile Processor Extracted from the ipad 2 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information

More information

MediaTek MT6167A Smartphone Radio Frequency (RF) Transceiver

MediaTek MT6167A Smartphone Radio Frequency (RF) Transceiver MediaTek MT6167A Smartphone Radio Frequency (RF) Transceiver 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in this report may be

More information

Apple/Dialog Semiconductor 343S0622-A1/D2018A WLED Driver

Apple/Dialog Semiconductor 343S0622-A1/D2018A WLED Driver Apple/Dialog Semiconductor 343S0622-A1/D2018A 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in this report may be covered by patents,

More information

Freescale MCIMX6Q5EYM10AC (i.mx6q) Integrated Multimedia Applications Processor

Freescale MCIMX6Q5EYM10AC (i.mx6q) Integrated Multimedia Applications Processor Freescale MCIMX6Q5EYM10AC (i.mx6q) Integrated Multimedia Applications Processor 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in

More information

FocalTech Systems FT5336GQQ and FT5436iGQQ (FS-123ATPBC Die) Capacitive Touch Screen Controller

FocalTech Systems FT5336GQQ and FT5436iGQQ (FS-123ATPBC Die) Capacitive Touch Screen Controller FocalTech Systems FT5336GQQ and FT5436iGQQ (FS-123ATPBC Die) 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in this report may be

More information

RDA Microelectronics RDA8851A GSM/GPRS Baseband SoC

RDA Microelectronics RDA8851A GSM/GPRS Baseband SoC RDA Microelectronics RDA8851A 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in this report may be covered by patents, mask, and/or

More information

Akustica AKU2000 MEMS Microphone. MEMS Process Review

Akustica AKU2000 MEMS Microphone. MEMS Process Review Akustica AKU2000 MEMS Microphone MEMS Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology, please call

More information

Qualcomm Atheros AR8035 Ultra Low Power Single RGMII Gigabit Ethernet PHY

Qualcomm Atheros AR8035 Ultra Low Power Single RGMII Gigabit Ethernet PHY Qualcomm Atheros AR8035 Ultra Low Power Single RGMII Gigabit Ethernet PHY 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in this report

More information

Apple/Cirrus Logic 338S1081/46L01 Multi-Standard Audio Decoder

Apple/Cirrus Logic 338S1081/46L01 Multi-Standard Audio Decoder Apple/Cirrus Logic 338S1081/46L01 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in this report may be covered by patents, mask, and/or

More information

u-blox M8030-KT Concurrent Multi-GNSS Receiver

u-blox M8030-KT Concurrent Multi-GNSS Receiver u-blox M8030-KT Basic Functional Analysis 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Basic Functional Analysis 2 Some of the information in this report

More information

Marvell Avastar 88W ac Wi-Fi 2x2 MIMO Combo Chip

Marvell Avastar 88W ac Wi-Fi 2x2 MIMO Combo Chip Marvell Avastar 88W8897 Basic Functional Analysis 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Basic Functional Analysis 2 Some of the information in this

More information

CMOSIS CMV Mp, 5.5 µm Pixel Pitch High-Speed Pipelined Global Shutter CMOS Image Sensor with Correlated Double Sampling

CMOSIS CMV Mp, 5.5 µm Pixel Pitch High-Speed Pipelined Global Shutter CMOS Image Sensor with Correlated Double Sampling CMOSIS CMV4000 4 Mp, 5.5 µm Pixel Pitch High-Speed Pipelined Global Shutter CMOS Image Sensor with Correlated Double Sampling Imager Process Review 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada

More information

MediaTek MT3333AV (BT10085B Die) Satellite Receiver SoC

MediaTek MT3333AV (BT10085B Die) Satellite Receiver SoC MediaTek MT3333AV (BT10085B Die) 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in this report may be covered by patents, mask, and/or

More information

Qualcomm MSM8260A Snapdragon S4 Dual-Core System-on-Chip (SoC) Mobile Applications Processor

Qualcomm MSM8260A Snapdragon S4 Dual-Core System-on-Chip (SoC) Mobile Applications Processor Qualcomm MSM8260A Snapdragon S4 Dual-Core System-on-Chip (SoC) Mobile Applications Processor Basic Functional Analysis with Costing 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414

More information

FocalTech FT5316 Touch Screen Controller

FocalTech FT5316 Touch Screen Controller FocalTech FT5316 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in this report may be covered by patents, mask, and/or copyright protection.

More information

NVE IL715-3E GMR Type Digital Isolator (30457J Die Markings) 0.50 µm CMOS Process

NVE IL715-3E GMR Type Digital Isolator (30457J Die Markings) 0.50 µm CMOS Process NVE IL715-3E GMR Type Digital Isolator (30457J Die Markings) 0.50 µm CMOS Process Process Analysis 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Process Analysis

More information

Fullhan FH8520 Image Signal Processor

Fullhan FH8520 Image Signal Processor Fullhan FH8520 Basic Functional Analysis 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Basic Functional Analysis 2 Some of the information in this report

More information

Qualcomm MDM6600 Gobi Baseband Processor Plus RF Transceiver

Qualcomm MDM6600 Gobi Baseband Processor Plus RF Transceiver Qualcomm MDM6600 Gobi Baseband Processor Plus RF Transceiver Basic Functional Analysis with Costing 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Basic Functional

More information

InvenSense ITG-3200 Three-Axis Digital Output Yaw, Pitch, and Roll Gyroscope

InvenSense ITG-3200 Three-Axis Digital Output Yaw, Pitch, and Roll Gyroscope InvenSense ITG-3200 Three-Axis Digital Output Yaw, Pitch, and Roll Gyroscope MEMS Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning

More information

Qualcomm MDM9235M 4G LTE Advanced Modem

Qualcomm MDM9235M 4G LTE Advanced Modem Qualcomm MDM9235M Basic Functional Analysis 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Basic Functional Analysis 2 Some of the information in this report

More information

Texas Instruments TXS0108EZXYR 8 Bit Bidirectional Voltage-Level Translator

Texas Instruments TXS0108EZXYR 8 Bit Bidirectional Voltage-Level Translator Texas Instruments TXS0108EZXYR 8 Bit Bidirectional Voltage-Level Translator 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in this

More information

Qualcomm APQ8084 Snapdragon 805 Application Processor

Qualcomm APQ8084 Snapdragon 805 Application Processor Qualcomm APQ8084 Snapdragon 805 Basic Functional Analysis 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Basic Functional Analysis 2 Some of the information

More information

IBM POWER7 Server 46J6702 IBM 45 nm Dual Stress Liner SOI CMOS Process with edram

IBM POWER7 Server 46J6702 IBM 45 nm Dual Stress Liner SOI CMOS Process with edram IBM POWER7 Server 46J6702 IBM 45 nm Dual Stress Liner SOI CMOS Process with edram Front End Process Analysis 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com

More information

Texas Instruments WL1283C WiLink 7.0 Single Chip WLAN, GPS, Bluetooth, and FM Transceiver

Texas Instruments WL1283C WiLink 7.0 Single Chip WLAN, GPS, Bluetooth, and FM Transceiver Texas Instruments WL1283C WiLink 7.0 Single Chip WLAN, GPS, Bluetooth, and FM Transceiver Basic Functional Analysis with Cost Estimate 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414

More information

Sony IMX128AQP 24.3 Mp 5.9 µm Pixel Pitch CMOS Image Sensor from Nikon D600. Module 1: Overview Analysis

Sony IMX128AQP 24.3 Mp 5.9 µm Pixel Pitch CMOS Image Sensor from Nikon D600. Module 1: Overview Analysis Sony IMX128AQP 24.3 Mp 5.9 µm Pixel Pitch CMOS Image Sensor from Nikon D600 Module 1: Overview Analysis Sony IMX128AQP 24.3 Mp CIS from Nikon D600 2 Some of the information in this report may be covered

More information

SiTime SIT8002AC-13-18E50 One Time Programmable Oscillator

SiTime SIT8002AC-13-18E50 One Time Programmable Oscillator SiTime SIT8002AC-13-18E50 MEMS Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology, please call Sales

More information

Analog Devices AD7658 Analog to Digital Converter icmos Process Technology Process Review

Analog Devices AD7658 Analog to Digital Converter icmos Process Technology Process Review November 1, 2005 Analog Devices AD7658 Analog to Digital Converter icmos Process Technology Process Review For comments, questions, or more information about this report, or for any additional technical

More information

Qualcomm MSM8926 Snapdragon 400 Application Processor

Qualcomm MSM8926 Snapdragon 400 Application Processor Qualcomm MSM8926 Snapdragon 400 Basic Functional Analysis 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Basic Functional Analysis 2 Some of the information

More information

Texas Instruments Sitara XAM3715CBC Application Processor 45 nm UMC Low Power Process

Texas Instruments Sitara XAM3715CBC Application Processor 45 nm UMC Low Power Process Texas Instruments Sitara XAM3715CBC Application Processor Structural Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor

More information

Nikon NC81369R 24.2 Mp, 3.8 µm Pixel Size, APS-C Format CMOS Image Sensor from the Nikon D3200. Module 1: Overview Analysis

Nikon NC81369R 24.2 Mp, 3.8 µm Pixel Size, APS-C Format CMOS Image Sensor from the Nikon D3200. Module 1: Overview Analysis Nikon NC81369R 24.2 Mp, 3.8 µm Pixel Size, APS-C Format CMOS Image Sensor from the Nikon D3200 Module 1: Overview Analysis Nikon NC81369R (CMOS Image Sensor from the Nikon D3200) 2 Some of the information

More information

AKM AK8973 and AK Axis Electronic Compass

AKM AK8973 and AK Axis Electronic Compass AKM AK8973 and AK8974 Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor and electronics technology, please call

More information

Volterra VT1115MF PWM Controller Chip

Volterra VT1115MF PWM Controller Chip Process Review with Supplementary TEM Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology, please call Sales

More information

MEMSIC MMC3120M Tri-Axis Magnetic Sensor

MEMSIC MMC3120M Tri-Axis Magnetic Sensor MEMSIC MMC3120M Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor and electronics technology, please call Sales

More information

Sony IMX Mp, 4.8 µm Pixel Size APS-C (DX Format) CMOS Image Sensor from Nikon D7000. Module 5: Substrate Dopant Analysis

Sony IMX Mp, 4.8 µm Pixel Size APS-C (DX Format) CMOS Image Sensor from Nikon D7000. Module 5: Substrate Dopant Analysis Sony IMX071 16.2 Mp, 4.8 µm Pixel Size APS-C (DX Format) CMOS Image Sensor from Nikon D7000 Module 5: Substrate Dopant Analysis Sony IMX071 16.2 Mp, 4.8 µm Pixel Size, APS-C (DX Format) CMOS Image Sensor

More information

Broadcom BCM43224KMLG Baseband/MAC/Radio All-in-One Die SMIC 65 nm Process

Broadcom BCM43224KMLG Baseband/MAC/Radio All-in-One Die SMIC 65 nm Process Broadcom BCM43224KMLG Baseband/MAC/Radio All-in-One Die SMIC 65 nm Process Structural Analysis 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Structural Analysis

More information

Rockchip RK3188 Mobile Application Processor GF 28 nm SLP Gate First HKMG CMOS Process

Rockchip RK3188 Mobile Application Processor GF 28 nm SLP Gate First HKMG CMOS Process Rockchip RK3188 Mobile Application Processor GF 28 nm SLP Gate First HKMG CMOS Process Process Review FEOL Analysis 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com

More information

AMD ATI TSMC 28 nm Gate Last HKMG CMOS Process

AMD ATI TSMC 28 nm Gate Last HKMG CMOS Process AMD ATI 7970 215-0821060 TSMC 28 nm Gate Last HKMG CMOS Process Package Analysis 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Package Analysis Some of the

More information

Nikon NC81369R 24.2 Mp, 3.8 µm Pixel Size, APS-C Format CMOS Image Sensor from the Nikon D3200. Module 4: Pixel Cross-Sectional Analysis

Nikon NC81369R 24.2 Mp, 3.8 µm Pixel Size, APS-C Format CMOS Image Sensor from the Nikon D3200. Module 4: Pixel Cross-Sectional Analysis Nikon NC81369R 24.2 Mp, 3.8 µm Pixel Size, APS-C Format CMOS Image Sensor from the Nikon D3200 Module 4: Pixel Cross-Sectional Analysis Nikon NC81369R (CMOS Image Sensor from the Nikon D3200) 2 Some of

More information

Canon LC Mp, 4.3 µm Pixel Size, APS-C Format CMOS Image Sensor from the Canon EOS Rebel T4i (EOS 650D/EOS Kiss X6i)

Canon LC Mp, 4.3 µm Pixel Size, APS-C Format CMOS Image Sensor from the Canon EOS Rebel T4i (EOS 650D/EOS Kiss X6i) Canon LC1270 18.0 Mp, 4.3 µm Pixel Size, APS-C Format CMOS Image Sensor from the Canon EOS Rebel T4i (EOS 650D/EOS Kiss X6i) Module 3: Planar Pixel Analysis Canon LC1270 CMOS Image Sensor 2 Some of the

More information

Samsung K4B1G0846F-HCF8 1 Gbit DDR3 SDRAM 48 nm CMOS DRAM Process

Samsung K4B1G0846F-HCF8 1 Gbit DDR3 SDRAM 48 nm CMOS DRAM Process Samsung K4B1G0846F-HCF8 48 nm CMOS DRAM Process Structural Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor and electronics

More information

PowerDsine/Freescale

PowerDsine/Freescale April 25, 2005 PowerDsine/Freescale PD64004 4 Channel Power-Over-Ethernet (POE) Manager Process Review For questions, comments, or more information about this report, or for any additional technical needs

More information

Nikon NC81369R 24.2 Mp, 3.8 µm Pixel Size, APS-C Format CMOS Image Sensor from the Nikon D3200. Module 5: Substrate Dopant Analysis

Nikon NC81369R 24.2 Mp, 3.8 µm Pixel Size, APS-C Format CMOS Image Sensor from the Nikon D3200. Module 5: Substrate Dopant Analysis Nikon NC81369R 24.2 Mp, 3.8 µm Pixel Size, APS-C Format CMOS Image Sensor from the Nikon D3200 Module 5: Substrate Dopant Analysis Nikon NC81369R CMOS Image Sensor from the Nikon D3200 2 Some of the information

More information

Foveon FX17-78-F13D Mp, 7.8 µm Pixel Size CIS from Sigma DP1 Compact Digital Camera 0.18 µm Dongbu Process

Foveon FX17-78-F13D Mp, 7.8 µm Pixel Size CIS from Sigma DP1 Compact Digital Camera 0.18 µm Dongbu Process Foveon FX17-78-F13D-07 14.1 Mp, 7.8 µm Pixel Size CIS from Sigma DP1 Compact Digital Camera 0.18 µm Dongbu Process Imager Process Review For comments, questions, or more information about this report,

More information

OmniVision OVM7692 (OV289AA Die Markings) VGA CameraCubeChip. Module 3: Planar Pixel Analysis

OmniVision OVM7692 (OV289AA Die Markings) VGA CameraCubeChip. Module 3: Planar Pixel Analysis OmniVision OVM7692 (OV289AA Die Markings) VGA CameraCubeChip Module 3: Planar Pixel Analysis OmniVision OVM7692 VGA CameraCubeChip 2 Some of the information in this report may be covered by patents, mask

More information

Freescale SCK20DN51Z K20 USB MHz Microcontroller eflash. Flash Process Review

Freescale SCK20DN51Z K20 USB MHz Microcontroller eflash. Flash Process Review Freescale SCK20DN51Z K20 USB 2.0 50 MHz Microcontroller eflash Flash Process Review Freescale SCK20DN51Z Microcontroller eflash 2 Some of the information in this report may be covered by patents, mask

More information

Sony PMW-F55 CineAlta 4K PMW Series HD Super 35 mm Digital Motion Camera with Global Shutter CMOS Image Sensor. Module 3: Planar Pixel Analysis

Sony PMW-F55 CineAlta 4K PMW Series HD Super 35 mm Digital Motion Camera with Global Shutter CMOS Image Sensor. Module 3: Planar Pixel Analysis Sony PMW-F55 CineAlta 4K PMW Series HD Super 35 mm Digital Motion Camera with Global Shutter CMOS Image Sensor Module 3: Planar Pixel Analysis Sony PMW-F55 CineAlta 4K HD Super 35 mm Digital Motion Camera

More information

MemsTech MSM3C-S4045 Integrated Silicon Microphone with Supplementary TEM Analysis

MemsTech MSM3C-S4045 Integrated Silicon Microphone with Supplementary TEM Analysis MemsTech MSM3C-S4045 Integrated Silicon Microphone with Supplementary TEM Analysis MEMS Process Review For comments, questions, or more information about this report, or for any additional technical needs

More information

Intel Xeon E3-1230V2 CPU Ivy Bridge Tri-Gate 22 nm Process

Intel Xeon E3-1230V2 CPU Ivy Bridge Tri-Gate 22 nm Process Intel Xeon E3-1230V2 CPU Ivy Bridge Tri-Gate 22 nm Process 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in this report may be covered

More information

Sony IMX096AQL 24.3 Mp, 3.9 µm Pixel Pitch APS-C CMOS Image Sensor from the Sony α77 (SLT-A77) Digital Single Lens Reflex (DSLR) Camera

Sony IMX096AQL 24.3 Mp, 3.9 µm Pixel Pitch APS-C CMOS Image Sensor from the Sony α77 (SLT-A77) Digital Single Lens Reflex (DSLR) Camera Sony IMX096AQL 24.3 Mp, 3.9 µm Pixel Pitch APS-C CMOS Image Sensor from the Sony α77 (SLT-A77) Digital Single Lens Reflex (DSLR) Camera Module 2: Die Utilization Sony IMX096AQL APS-C CMOS Image Sensor

More information

Peregrine Semiconductor PE4268 SP6T RF UltraCMOS TM Switch Structural Analysis

Peregrine Semiconductor PE4268 SP6T RF UltraCMOS TM Switch Structural Analysis September 21, 2005 Peregrine Semiconductor PE4268 Structural Analysis For questions, comments, or more information about this report, or for any additional technical needs concerning semiconductor technology,

More information

Altera 5SGXEA7K2F40C2ES Stratix V TSMC 28 nm HP Gate Last HKMG CMOS Process

Altera 5SGXEA7K2F40C2ES Stratix V TSMC 28 nm HP Gate Last HKMG CMOS Process Altera 5SGXEA7K2F40C2ES Stratix V TSMC 28 nm HP Gate Last HKMG CMOS Process Process Review FEOL Analysis 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Process

More information

FLIR Systems Indigo ISC0601B from Extech i5 Infrared Camera

FLIR Systems Indigo ISC0601B from Extech i5 Infrared Camera FLIR Systems Indigo ISC0601B from Extech i5 Infrared Camera Infrared Imager Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning

More information

Texas Instruments BRF6350B Bluetooth Link Controller UMC 90 nm RF CMOS

Texas Instruments BRF6350B Bluetooth Link Controller UMC 90 nm RF CMOS Texas Instruments BRF6350B UMC 90 nm RF CMOS Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology, please

More information

OmniVision OVM7692 (OV289AA Die Markings) VGA CameraCubeChip. Module 1: Overview Analysis

OmniVision OVM7692 (OV289AA Die Markings) VGA CameraCubeChip. Module 1: Overview Analysis OmniVision OVM7692 (OV289AA Die Markings) VGA CameraCubeChip Module 1: Overview Analysis OmniVision OVM7692 VGA CameraCubeChip 2 Some of the information in this report may be covered by patents, mask and/or

More information

Maxim. MAX V Ultra-Precision Low Noise Op Amp. Circuit Analysis

Maxim. MAX V Ultra-Precision Low Noise Op Amp. Circuit Analysis Maxim MAX44251 20 V Ultra-Precision Low Noise Op Amp Circuit Analysis 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613.829.0414 Fax: 613.829.0515 www.chipworks.com Some of the information

More information

Samsung K3PE7E700B-XXC1 3x nm 4 Gbit Mobile DRAM. DRAM Process Report with Custom BEOL and Dopant Analysis

Samsung K3PE7E700B-XXC1 3x nm 4 Gbit Mobile DRAM. DRAM Process Report with Custom BEOL and Dopant Analysis Samsung K3PE7E700B-XXC1 3x nm 4 Gbit Mobile DRAM DRAM Process Report with Custom BEOL and Dopant Analysis Samsung K3PE7E700B-XXC1 3x nm 4 Gbit Mobile DRAM 2 Some of the information in this report may be

More information

Intel Xeon E3-1230V2 22 nm Tri-Gate Microprocessor

Intel Xeon E3-1230V2 22 nm Tri-Gate Microprocessor Intel Xeon E3-1230V2 Package Analysis 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Package Analysis Some of the information in this report may be covered

More information

Intel Q3GM ES 32 nm CPU (from Core i5 660)

Intel Q3GM ES 32 nm CPU (from Core i5 660) Intel Q3GM ES Partial Package Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor and electronics technology, please

More information

Atmel. MXT540E Touch Screen Controller. Circuit Analysis of Charge Integrator and I/O Blocks

Atmel. MXT540E Touch Screen Controller. Circuit Analysis of Charge Integrator and I/O Blocks Atmel MXT540E Touch Screen Controller Circuit Analysis of Charge Integrator and I/O Blocks 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613.829.0414 Fax: 613.829.0515 www.chipworks.com

More information

Intel Xeon E3-1230V2 CPU Ivy Bridge Tri-Gate 22 nm Process

Intel Xeon E3-1230V2 CPU Ivy Bridge Tri-Gate 22 nm Process Intel Xeon E3-1230V2 CPU Structural Analysis 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Structural Analysis Some of the information in this report may

More information

Silicon Laboratories

Silicon Laboratories Silicon Laboratories Si8233BD 4.0 A Isolated High-Side/Low-Side Driver Full Circuit Analysis 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613.829.0414 Fax: 613.829.0515 www.chipworks.com

More information

Texas Instruments. SR5580CBA4 HDD Pre-Amplifier. Circuit Analysis of Hard Drive Write System

Texas Instruments. SR5580CBA4 HDD Pre-Amplifier. Circuit Analysis of Hard Drive Write System Texas Instruments SR5580CBA4 HDD Pre-Amplifier Circuit Analysis of Hard Drive Write System 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613.829.0414 Fax: 613.829.0515 www.chipworks.com

More information

Sonion TC100Z21A DigiSiMic Silicon Condensor Microphone MEMS Process Review

Sonion TC100Z21A DigiSiMic Silicon Condensor Microphone MEMS Process Review November 8, 2006 Sonion TC100Z21A DigiSiMic Silicon Condensor Microphone MEMS Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning

More information

Sharp NC Megapixel CCD Imager Process Review

Sharp NC Megapixel CCD Imager Process Review Sharp NC9360 2.0 Megapixel CCD Imager Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology, please call

More information

Oki 2BM6143 Microcontroller Unit Extracted from Casio GW2500 Watch 0.25 µm CMOS Process

Oki 2BM6143 Microcontroller Unit Extracted from Casio GW2500 Watch 0.25 µm CMOS Process Oki 2BM6143 Microcontroller Unit Extracted from Casio GW2500 Watch 0.25 µm CMOS Process Custom Process Review with TEM Analysis For comments, questions, or more information about this report, or for any

More information

Qualcomm MDM9215M Gobi 4G GSM/CDMA Modem 28 nm LP. Module 2: CMOS FEOL Analysis

Qualcomm MDM9215M Gobi 4G GSM/CDMA Modem 28 nm LP. Module 2: CMOS FEOL Analysis Qualcomm MDM9215M Gobi 4G GSM/CDMA Modem 28 nm LP Module 2: CMOS FEOL Analysis Qualcomm MDM9215M Gobi 4G GSM/CDMA Modem 28 nm LP 2 Some of the information in this report may be covered by patents, mask

More information

Nikon 12.1 Mp CMOS Image Sensor from a D3s DSLR Camera with NC81361A Die Markings

Nikon 12.1 Mp CMOS Image Sensor from a D3s DSLR Camera with NC81361A Die Markings Nikon 12.1 Mp CMOS Image Sensor from a D3s DSLR Camera with NC81361A Die Markings Imager Process Review For comments, questions, or more information about this report, or for any additional technical needs

More information

TLE7242-G 4 Channel Fixed Frequency Constant Current Control IC

TLE7242-G 4 Channel Fixed Frequency Constant Current Control IC Infineon TLE7242-G 4 Channel Fixed Frequency Constant Current Control IC One Channel Fixed Constant Current Control, Bandgap, Bias, and R-String DAC Circuit Analysis 1891 Robertson Road, Suite 500, Ottawa,

More information

Motorola MPXV5004G Integrated Pressure Sensor Structural Analysis

Motorola MPXV5004G Integrated Pressure Sensor Structural Analysis December 21, 2004 Motorola MPXV5004G Integrated Pressure Sensor Structural Analysis For questions, comments, or more information about this report, or for any additional technical needs concerning semiconductor

More information

Sony IMX Mp, 1.2 µm Pixel Pitch Back Illuminated (Exmor R) CMOS Image Sensor from the Sony Cyber-shot HX300 Digital Compact Camera

Sony IMX Mp, 1.2 µm Pixel Pitch Back Illuminated (Exmor R) CMOS Image Sensor from the Sony Cyber-shot HX300 Digital Compact Camera Sony IMX147 20 Mp, 1.2 µm Pixel Pitch Back Illuminated (Exmor R) CMOS Image Sensor from the Sony Cyber-shot HX300 Digital Compact Camera Module 5: Substrate Dopant Analysis Sony IMX147 Back Illuminated

More information

Samsung K9F2G08U0M-YCB0 2Gbit NAND Flash Device Structural Analysis

Samsung K9F2G08U0M-YCB0 2Gbit NAND Flash Device Structural Analysis April 4, 2006 Samsung K9F2G08U0M-YCB0 2Gbit NAND Flash Device Structural Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor

More information

Freescale MCIMX357DVM5B 90 nm Multimedia Application Processor

Freescale MCIMX357DVM5B 90 nm Multimedia Application Processor Freescale MCIMX357DVM5B 90 nm Multimedia Application Processor ESD Protection Device Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning

More information

Maxim Integrated. MAX88920 Gesture/Proximity Sensor. Analog Circuit Analysis

Maxim Integrated. MAX88920 Gesture/Proximity Sensor. Analog Circuit Analysis Maxim Integrated MAX88920 Gesture/Proximity Sensor Analog Circuit Analysis 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613.829.0414 Fax: 613.829.0515 www.chipworks.com Some of the information

More information

Samsung S5K3BAFB 2 Megapixel CMOS Image Sensor 0.13 µm Copper CMOS Process Process Review Report

Samsung S5K3BAFB 2 Megapixel CMOS Image Sensor 0.13 µm Copper CMOS Process Process Review Report October 13, 2006 Samsung S5K3BAFB 2 Megapixel CMOS Image Sensor 0.13 µm Copper CMOS Process Process Review Report (with Optional TEM Analysis) For comments, questions, or more information about this report,

More information

Sony IMX Megapixel, 1.4 µm Pixel 1/3.2 Optical Format CMOS Image Sensor

Sony IMX Megapixel, 1.4 µm Pixel 1/3.2 Optical Format CMOS Image Sensor Sony IMX046 8.11 Megapixel, 1.4 µm Pixel 1/3.2 Optical Format CMOS Image Sensor Imager Process Review For comments, questions, or more information about this report, or for any additional technical needs

More information

Sony IMX118CQT 18.5 Mp, 1.25 µm Pixel Pitch Back Illuminated CIS from the Sony DSC-WX100 Camera

Sony IMX118CQT 18.5 Mp, 1.25 µm Pixel Pitch Back Illuminated CIS from the Sony DSC-WX100 Camera 18.5 Mp, 1.25 µm Pixel Pitch Back Illuminated CIS from the Sony DSC-WX100 Camera Imager Process Review 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Imager

More information

Texas Instruments THS7530PWP Gain Amplifier Structural Analysis

Texas Instruments THS7530PWP Gain Amplifier Structural Analysis March 1, 2005 Texas Instruments THS7530PWP Gain Amplifier Structural Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor

More information

Micron MT66R7072A10AB5ZZW 1 Gbit Phase Change Memory 45 nm BiCMOS PCM Process

Micron MT66R7072A10AB5ZZW 1 Gbit Phase Change Memory 45 nm BiCMOS PCM Process Micron MT66R7072A10AB5ZZW 45 nm BiCMOS PCM Process Process Review 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Process Review Some of the information in

More information

Microchip PIC18F4320-I/ML Enhanced Flash Microcontroller Structural Analysis

Microchip PIC18F4320-I/ML Enhanced Flash Microcontroller Structural Analysis March 13, 2006 Microchip PIC18F4320-I/ML Enhanced Flash Microcontroller Structural Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning

More information

Motorola PRF5P21240 RF Power MOSFET Structural Analysis

Motorola PRF5P21240 RF Power MOSFET Structural Analysis September 2, 2004 Motorola PRF5P21240 RF Power MOSFET Structural Analysis For questions, comments, or more information about this report, or for any additional technical needs concerning semiconductor

More information

Samsung K9G8G08U0M-PCB0 8 Gbit MLC NAND Flash Structural Analysis

Samsung K9G8G08U0M-PCB0 8 Gbit MLC NAND Flash Structural Analysis November 6, 2006 Samsung K9G8G08U0M-PCB0 Structural Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology, please

More information

LSI Logic LSI53C1030 PCI-X to Dual Channel Ultra320 SCSI Controller 0.18 µm CMOS Process

LSI Logic LSI53C1030 PCI-X to Dual Channel Ultra320 SCSI Controller 0.18 µm CMOS Process LSI Logic LSI53C13 PCI-X to Dual Channel Ultra32 SCSI Controller.18 µm CMOS Process Structural Analysis For comments, questions, or more information about this report, or for any additional technical needs

More information

AuthenTec AES1710 Secure Slide Fingerprint Sensor

AuthenTec AES1710 Secure Slide Fingerprint Sensor AuthenTec AES1710 Secure Slide Fingerprint Sensor Package Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology,

More information

Nanya elixir N2TU51280AF-37B 512 Mbit DDR2 SDRAM Structural Analysis

Nanya elixir N2TU51280AF-37B 512 Mbit DDR2 SDRAM Structural Analysis September 20, 2005 Nanya elixir N2TU51280AF-37B 512 Mbit DDR2 SDRAM Structural Analysis For questions, comments, or more information about this report, or for any additional technical needs concerning

More information

FUJIFILM MS3897A CCD Image Sensor Imager Process Review

FUJIFILM MS3897A CCD Image Sensor Imager Process Review September 7, 2006 MS3897A CCD Image Sensor Imager Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology,

More information

Trident. PNX1002EL400 Media Processor. Circuit Analysis of DDR1/DDR2 Memory Interface and DLLs

Trident. PNX1002EL400 Media Processor. Circuit Analysis of DDR1/DDR2 Memory Interface and DLLs Trident PNX1002EL400 Media Processor Circuit Analysis of DDR1/DDR2 Memory Interface and DLLs 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613.829.0414 Fax: 613.829.0515 www.chipworks.com

More information

Powerchip Semiconductor Corporation A3R12E3GEF G6E 635BLC4M 512 Megabit DDR2 SDRAM Structural Analysis

Powerchip Semiconductor Corporation A3R12E3GEF G6E 635BLC4M 512 Megabit DDR2 SDRAM Structural Analysis February 23, 2007 Powerchip Semiconductor Corporation A3R12E3GEF G6E 635BLC4M Structural Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning

More information

Micron MT9T Megapixel, ¼ Optical Format, 1.75 µm Pixel Size System-on-Chip (SOC) CMOS Image Sensor

Micron MT9T Megapixel, ¼ Optical Format, 1.75 µm Pixel Size System-on-Chip (SOC) CMOS Image Sensor Micron MT9T111 3.1 Megapixel, ¼ Optical Format, 1.75 µm Pixel Size System-on-Chip (SOC) CMOS Image Sensor Imager Process Review with Optional TEM Analysis of SRAM For comments, questions, or more information

More information

Sony IMX018 CMOS Image Sensor Imager Process Review

Sony IMX018 CMOS Image Sensor Imager Process Review September 6, 2006 Sony IMX018 CMOS Image Sensor Imager Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology,

More information