Bosch Sensortec BMI160 Low Power IMU

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1 Bosch Sensortec BMI160 Basic Functional Analysis 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: chipworks.com

2 Basic Functional Analysis 2 Some of the information in this report may be covered by patents, mask and/or copyright protection. This report should not be taken as an inducement to infringe on these rights. Chipworks Inc all rights reserved. Chipworks and the Chipworks logo are registered trademarks of Chipworks Inc. This report is provided exclusively for the use of the purchasing organization. It can be freely copied and distributed within the purchasing organization, conditional upon the accompanying Chipworks accreditation remaining attached. Distribution of the entire report outside of the purchasing organization is strictly forbidden. The use of portions of the document for the support of the purchasing organization's corporate interest (e.g., licensing or marketing activities) is permitted, as defined by the fair use provisions of the copyright act. Accreditation to Chipworks must be attached to any portion of the reproduced information. FAR CYMRKL Revision 1.0 Published: May 22, 2015

3 Basic Functional Analysis 3 Table of Contents 1 Introduction 1.1 Device Naming Conventions Used in this Report 1.2 Device Samples Used for Analysis 1.3 Company Profile 1.4 Executive Summary 1.5 BAI160C Die Summary 2 Device Identification 2.1 F510S Downstream Device 2.2 BMI160 Package 2.3 BAI160C Die 2.4 BAI160C Die Features 2.5 CMA334M Die 2.6 CMG230M Die 3 Process Analysis 3.1 BAI160C Die Cross-Sectional Analysis 4 Functional Layout Analysis 4.1 BAI160C Die Functional Layout Analysis 4.2 BAI160C Die Functional Block Summary 5 Cost Analysis 5.1 BMI160 Manufacturing Cost Analysis 6 References 7 Statement of Measurement Uncertainty and Scope Variation About Chipworks

4 Basic Functional Analysis 4 List of Figures Figure F510S Smartphone Top Isometric View Figure F510S Smartphone Bottom Isometric View Figure F510S Main PCB Top Figure BMI160 Package Photograph Top Figure BMI160 Package Photograph Bottom Figure BMI160 Package X-Ray Plan View Figure BMI160 Package X-Ray Side View Figure BAI160C Die Photograph Figure BAI160C Die Markings Figure BAI160C Die Photograph Delayered to the Polysilicon Layer Figure BAI160C Die Corner Figure BAI160C Minimum Pitch Bond Pads Figure CMA334M Die Photograph Figure CMG230M Die Photograph Figure BAI160C General Structure Logic Figure BAI160C Minimum Metal 1 Pitch Figure BAI160C Minimum Contacted Gate Pitch Figure BAI160C MIM Capacitor Figure BAI160C Functional Blocks at the Polysilicon Layer List of Tables Table BMI160 Component Summary Table BAI160C Die Summary Table BAI160C Observed Critical Dimensions Table BAI160C Functional Block Summary Table BAI160C Manufacturing Cost Characteristics Table BMI160 Manufacturing Costs

5 Basic Functional Analysis 34 7 Statement of Measurement Uncertainty and Scope Variation Statement of Measurement Uncertainty Chipworks calibrates length measurements on its scanning electron microscopes (SEM), transmission electron microscope (TEM), and optical microscopes, using measurement standards that are traceable to the International System of Units (SI). Our SEM/TEM cross-calibration standard was calibrated at the National Physical Laboratory (NPL) in the UK (Report Reference LR0304/E /SEM4/190). This standard has a 146 ± 2 nm (± 1.4%) pitch, as certified by NPL. Chipworks regularly verifies that its SEM and TEM are calibrated to within ± 2% of this standard, over the full magnification ranges used. Fluctuations in the tool performance, coupled with variability in sample preparation, and random errors introduced during analyses of the micrographs, yield an expanded uncertainty of about ± 5%. The materials analysis reported in Chipworks reports is normally limited to approximate elemental composition, rather than stoichiometry, since calibration of our SEM and TEM based methods is not feasible. Chipworks will typically abbreviate, using only the elemental symbols, rather than full chemical formulae, usually starting with silicon or the metallic element, then in approximate order of decreasing atomic % (when known). Secondary ion mass spectrometry (SIMS) data may be calibrated for certain dopant elements, provided suitable standards were available. A stage micrometer, calibrated at the National Research Council of Canada (CNRC) (Report Reference LS ), is used to calibrate Chipworks optical microscopes. This standard has an expanded uncertainty of 0.3 µm for the stage micrometer s 100 µm pitch lines. Random errors, during analyses of optical micrographs, yield an expanded uncertainty of approximately ± 5% to the measurements. Statement of Scope Variation Due to the nature of reverse engineering, there is a possibility of minor content variation in Chipworks standard reports. Chipworks has a defined table of contents for each standard report type. At a minimum, the defined content will be included in the report. However, depending on the nature of the analysis, additional information may be provided in a report, as value-added material for our customers.

6 Basic Functional Analysis About Chipworks Patent and Technology Partner to the World s Most Successful Companies For over 20 years, Chipworks has been a trusted patent and technology partner to the world s largest and most successful companies. Business leaders rely on us to help them identify and fully leverage their most valuable patents and provide crucial analysis of high-revenue products in the most competitive, fastest changing technology markets. By combining deep patent and market knowledge with an unmatched ability to analyze the broadest range of technology products we are able to provide the most insightful Patent Intelligence and Competitive Technical Intelligence services in the industry. Contact Chipworks To find out more information about this report, or any other reports in our library, please contact Chipworks at Chipworks 1891 Robertson Road, Suite 500 Ottawa, Ontario K2H 5B7 Canada T F Web site: info@chipworks.com Please send any feedback to feedback@chipworks.com

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