STMicroelectronics LSM303DLH 3-Axis Accelerometer and 3-Axis Honeywell Magnetometer Sensor

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1 STMicroelectronics LSM303DLH 3-Axis Accelerometer and 3-Axis Honeywell Magnetometer Sensor MEMS Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor and electronics technology, please call Sales at Chipworks Richmond Road, Suite 500, Ottawa, ON K2H 5B7, Canada Tel: Fax:

2 MEMS Process Review Some of the information is this report may be covered by patents, mask and/or copyright protection. This report should not be taken as an inducement to infringe on these rights Chipworks Inc. This report is provided exclusively for the use of the purchasing organization. It can be freely copied and distributed within the purchasing organization, conditional upon the accompanying Chipworks accreditation remaining attached. Distribution of the entire report outside of the purchasing organization is strictly forbidden. The use of portions of the document for the support of the purchasing organization s corporate interest (e.g., licensing or marketing activities) is permitted, as defined by the fair use provisions of the copyright act. Accreditation to Chipworks must be attached to any portion of the reproduced information. MPR CYTW Revision 1.0 Published: April 6, 2010

3 MEMS Process Review Table of Contents 1 Overview 1.1 List of Figures 1.2 List of Tables 1.3 Company Profile 1.4 Introduction 1.5 Sensor Devices Summary 1.6 ASIC Process Summary 2 Device Overview 2.1 STMicroelectronics LSM303DLH Tri-Axis Acceleration and Magnetic Field Sensor Package 2.2 Accelerometer ASIC and MEMS Die 2.3 AMR ASIC 2.4 Dual-Axis Magnetic Sensor Die 2.5 Single-Axis Magnetic Sensor Die 3 AMR ASIC Die Process 3.1 Overview 3.2 General Device Structure 3.3 ASIC Dielectrics 3.4 Metallization, Vias, and Contacts 3.5 Transistors and Polysilicon 3.6 Isolation 4 Magnetic Sensor Architectural Analysis 4.1 Overview 5 Magnetic Sensor Process Analysis 5.1 Magnetic Sensor 5.2 Die Edge, Bond Pad, and General Structure 5.3 Barber Pole Shorting Electrodes and AMR Strips 6 Critical Dimensions 7 References 8 Statement of Measurement Uncertainty and Scope Variation About Chipworks

4 Overview Overview 1.1 List of Figures 2 Device Overview Top Package View Photograph Bottom Package View Photograph Plan-View Package X-Ray Left Edge View of Package X-Ray Bottom Edge View of Package X-Ray Accelerometer ASIC Die Photograph Accelerometer Sensor ASIC Die Markings Accelerometer Sensor AMR ASIC Die Photograph AMR ASIC Die Markings A AMR ASIC Die Markings B AMR ASIC Die Markings C AMR ASIC Die Markings Logo Die Corner Bond Pads Dual-Axis Magnetic Sensor Die Photograph Dual-Axis Magnetic Sensor Die Markings A Dual-Axis Magnetic Sensor Die Markings B Dual-Axis Magnetic Sensor Die Corner and Bond Pads Dual-Axis Magnetic Sensor Bond Pads Single-Axis Magnetic Sensor Die Photograph Single-Axis Magnetic Sensor Die Corners and Bond Pads 3 AMR ASIC Die Process AMR ASIC Die Photograph Die Edge General Structure Die Edge Seal Passivation IMD IMD 4, IMD 3, and IMD IMD 1 and PMD ASIC Die Metal 6 Structure Minimum Pitch Metal Minimum Pitch Metal Minimum Pitch Via 2s, Via 3s, and Via 4s Minimum Pitch Contact to Diffusion Contact to Polycide Minimum Gate Length MOS Transistors MOS Transistor Detail Poly Over Isolation

5 Overview Magnetic Sensor Architectural Analysis Wheatstone Bridge Schematic Z Axis Magnetic Sensor Layout X-Y Axis Magnetic Sensor Layout Magnetizing Coil and AMR Strip AMR Sensor Leg Overview Barber Pole Structure 5 Magnetic Sensor Process Analysis Magnetic Sensor Planes of Cross-Sectioning Magnetic Sensor Die Thickness Die Edge Seal Bond Pad Left Side General Structure Bottom of Metal 3 TEM Metal 3 Through Metal 1 Barber Pole Structure Edge Metal 2 and Metal 1 AMR SEM Detail Metal 2 Nitride Cap TEM Metal 2 TEM AMR TEM

6 Overview List of Tables 1 Overview Device Identification AMR ASIC Die Summary AMR Sensor Die Summary ASIC Die Process Summary 2 Device Overview Pin Description AMR ASIC Die Dimensions Dual-Axis Magnetometer Die Dimensions Single-Axis Magnetometer Die Dimensions 3 AMR ASIC Die Process Dielectric Thicknesses Metallization Vertical Dimensions Metallization Horizontal Dimensions Via and Contact Horizontal Dimensions Peripheral Transistor and Capacitor Dimensions 4 Magnetic Sensor Architectural Analysis Magnetic Sensor Planar Dimensions 5 Magnetic Sensor Process Analysis Metallization Vertical Dimensions Dielectric Vertical Dimensions 6 Critical Dimensions Package and Die Dimensions Dielectric Thicknesses Metallization Vertical Dimensions Metallization Horizontal Dimensions

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