Technology Roadmaps: Driving Industry Collaboration. September 26, 2006 SMTAI, Rosemont, Illinois Chuck Richardson

Transcription

1 Technology Roadmaps: Driving Industry Collaboration September 26, 2006 SMTAI, Rosemont, Illinois Chuck Richardson

2 Topics Covered Overview Situation Analysis Highlights from the Product Emulator Groups Highlights from the Individual Roadmaps Identified Needs Paradigm Shifts and Strategic Concerns Key Recommendations Major Trends Innovation Challenge Closing Pb-free gaps 2007 Roadmap 1

3 Mission Assure Leadership of the Global Electronics Manufacturing Supply Chain for the benefit of members and the industry Materials Build to Components Transformation Order Collaborative Design Life Cycle Materials Solutions Equipment Software Software Solutions Solutions Supply Chain Management Information Technology Logistics Communications Business Practices Marketing Design Manufacturing Order Fulfillment Customer 2

4 3 Industry Leaders belong OEM/EMS

5 4 Industry Leaders belong Suppliers

6 Industry Leaders belong Consultants, Government, Organizations & Universities 5

7 Organization Technology Working Group Technology Working Group Technology Working Group Technology Working Group Product Emulator Group Technology Roadmapping 19 Industry TWGs Product Need Roadmapping 5 Industry PEGs Product Emulator Group inemi Board of of Directors Responsible for for Strategic Strategic Objectives Objectives Operations Operations Technical Committee Responsible for for Project Project Strategy Strategy Roadmapping Research Committee Responsible for for Break-Through Technologies inemi Staff Responsible for for Communications Membership Development Technical Technical Facilitation Facilitation Implementation 7 inemi TIGs Board Assembly TIG ECE TIG Heat Transfer TIG Medical TIG Optoelectronics TIG SiP TIG Substrates TIG 6

8 Some Definitions TWG - Technical Working Group Develops the roadmaps Presently 19 groups TIG - Technology Integration Group Develops tactical 5 year inemi internal plan Based on roadmap findings and gap analysis meetings Acts as program management / oversight for projects PEG Product Emulator Group Virtual Product : future product attributes plus key cost and density drivers Number of PEGs or product emulator groups may vary each cycle Seven product sectors in 2004 Five in

9 Methodology Available to Market Place Competitive Solutions Technology Evolution Government Roadmap Research Product Needs Disruptive Technology Academia Global Industry Participation GAP Analysis No Work Required inemi Members Collaborate Projects Industry Solution Needed 8

10 Attributes of inemi Roadmaps inemi Roadmap is customer need driven, not technology driven. OEM driven Product Emulator Groups (PEGs) start roadmapping process by presenting what they need to remain competitive in the world market. Focus of Roadmaps is on process and technology rather than end products. Technology Working Groups (TWGs) respond and identify gaps and showstoppers. They do not provide solutions. inemi Technical Committee prioritizes gaps and forms Technology Integration Groups (TIGs) to close them. 9

11 2004 Roadmap Priorities Maintain strong linkages with other roadmaps. Strengthen and realign Product Emulators. Begin proactively globalizing roadmap. Expand emphasis on disruptive events (business & technical). Expand emphasis on identifying market needs and business situations. Increase quantification of needs. Prioritize Research and Deployment needs. Increase strategic vision of the roadmap: Release at APEX

12 Statistics for the 2004 Roadmap > 470 Participants > 220 Companies/organizations 11 Countries from 3 Continents 19 Technology Working Groups (TWGs) (added Sensors) 7 Product Emulator Groups (PEGs) Over 1200 Pages of Information Roadmaps the needs for

13 7 Product Emulator Groups (PEGs) Emulators Characteristics Portable / Consumer High volume Consumer Products for which cost is the primary driver including Hand held, battery -powered products driven by size and weight reduction System in a Package Complete function provided in a packag e to system manufacturer Office Systems / Large Business Systems Network / Datacom / Telecom Products Products which seek maximum performance from a few thousand dollar cost limit to literally no cost limit Products that serve the networking, datacom and telecom markets and cover a wide range of cost and performance targets Medical Products Products which must operate within a high ly reliab le environment Automotive Products which must operate in an automotive environment Defense and Aerospace Produc ts which must operate in extreme environments Yellow = Completely new Emulator Green = Broadened focus 12

14 2004 Auto PEG Spreadsheet of Key Attributes 13

15 19 Technology Working Groups (TWGs) Modeling, Simulation, and Design Semiconductor Technology Connectors Sensors Packaging RF Components & Subsystems Passive Components Optoelectronics Mass Storage (Magnetic & Optical) Test, Inspection & Measurement Thermal Management Ceramic Substrates Displays Energy Storage Systems Organic Substrates Board Assembly Final Assembly Customer Product Lifecycle Information Management (PLIM) Environmentally Conscious Electronics 14

16 Roadmap Alliances Interconnect Substrates Ceramic Semiconductors inemi / ITRS Packaging TWG inemi / IPC Interconnect TWG Interconnect Substrates Organic inemi Board Assy TWG inemi Roadmap inemi Product Lifecycle Information Management TWG Supply Chain Management inemi Optoelectronics TWG inemi Mass Data Storage TWG Magnetic and Optical Storage Optoelectronics and Optical Storage 15

17 Standards Alliances Currently we have standards alliances with the following organizations: IPC IEEE EIA/JEDEC RosettaNet 16

18 Situation Analysis: Market Technology Legislation

19 The Expanding Digital Product Base New products, enabled by new technologies, are creating a pronounced market shift in the industry: Blurring of the lines: computers & communications Cell phone market growth Emergence of Wireless Products (Bluetooth, ) Digital Cameras and Personal Entertainment Systems Automotive electronics (add functionality of home & office to your car plus added safety features) Significant presence in emerging markets is an imperative (no longer a differentiator). 18

20 Global Market Growth Production of computers & office products is expected to reach $379Bn in 2004 with growth of 6.2% / year to $483Bn in 2008, accounting for 37% of the electronics market the largest segment. Production of netcom equipment is forecast to be $180Bn in 2004 about 18% of the electronics industry. Internet use should increase at this segment about 6.3% / year to $230Bn in Portable / Consumer electronics production is reach $183Bn in 2004 increase about 5.1% / year to reach $223Bn in Medical electronics production is expected to be $39.5Bn in 2004 (accounting for about 4.9% of the global industry), growing at 4.9% / year to Bn SiPs assembled in Forecast for 2008 is 3.25Bn (average growth of 12% / year). * Market data provided by Prismark Partners, LLC 19

21 The End of Semiconductor Scaling The anticipated end to semiconductor scaling c will create a major technology shift: Implementation of advanced, non-classical CMOS devices with enhanced drive current Identification, selection, and implementation of advanced devices (beyond-cmos) Increased need for improved cooling Potential need for high speed optical communications at the backplane level Innovative Packaging for: Nano size devices Giga-function System in Package (SiP) Innovation must begin soon to meet the needs! 20

22 Technology Changes Growth in silicon device size is slowing SiP applications have become technology driver for: Small components packaging assembly processes high density substrates LCD & plasma displays encroaching on CRT market MEMS technology is making new capabilities feasible in old and new markets Alternative approaches to today s established data storage technologies will develop over the next decade. 21

23 Global Environmental Legislation Legislation impacting the design and recycling of electronic products is being enacted throughout the world: Environmental legislation in various product segments requires the electronics industry to share detailed material content data of products and components. To meet regional legislative requirements, manufacturers must remove environmental Materials of Concern, such as lead. The electronics industry is facing producer responsibility (recycling) legislation. 22

24 Highlights from the Product Emulator Groups (PEGs)

25 Automotive PEG Highlights Reliability 100,000 miles or 10 years Harsh Environment becoming harsher HEV (Hybrid Electric Vehicles) creating new opportunities For Automotive Electronics Merging of Automotive and Consumer Electronics Ability to respond to environmental legislation Substrate, component assembly, and IC package costs should drop: 30% in the next 5 Years 60% in the next 10 Years 24

26 System in Package PEG Highlights Broadest adoption of SiP has been for stacked memory/ logic devices & small modules (integrate mixed signal devices & passives for mobile phones). SiP provides more integration flexibility, faster time to market, lower R&D cost, & lower product cost for some applications (vs. SOC). Infrastructure issues facing SiP implementations include: Need for low cost higher density substrates High speed simulation tools for electrical & mechanical analysis Wafer level packaging Lower cost assembly equipment Improved materials for encapsulation Skill set and business models vary for EMS/SAS (Semiconductor Assembly Services) 25

27 Projected growth for SiPs SiP Units (Billions) Overall SiP Market: 2003 vs RF Cellular Digital Satellite 15% Infrastructure 30% WLAN/Bluetooth Other 4% Power Supply Handsets 51% Automotive Image/Display Optoelectronics Other Sources: Prismark (primary), Deutch Bank, Credit Suisse First Boston, Allied Business Intelligence. 26

28 Netcom PEG Highlights Themes for next generation development: Common design tools Common manufacturing / test capabilities Common component specifications Leverage across the communications hardware industry Telecommunications equipment is facing a crisis: ability to manage the thermal load in next-generation systems Need for flexible manufacturing is pervasive across entire Netcom product portfolio Most profound paradigm shift is change in supply chain model, moving from completely vertically integrated companies to nearly completely horizontally integrated companies Two strong growth areas will be high-speed Internet access and VOIP (Voice Over IP). 27

29 Highlights from the Individual Roadmaps

30 Environmentally Conscious Electronic Highlights To remain competitive, the electronics industry must continue to keep pace with emerging: Material restrictions End-of life requirements Customer preferences for energy efficient products Holistic design requirements Sustainable business practices. 29

31 Environmentally Conscious Electronic Needs Design: Qualification of replacements for hazardous substances Automated data management systems for materials declarations Product and WEEE compliance verification processes LCA / SLCA tools Materials: Pb-free for high reliability requirement applications Cd and Pb-free PVC cables REACH risk assessment for chemical emissions Energy: Cost effective methods to improve power supply efficiency Enabled power management of IT equipment Recycling: Compliance to diverse regional Recycling requirements Sustainability: Standard Sustainability Indicators and Reporting protocol for EEE 30

32 Board Assembly Highlights Board assembly incurs most of the direct-material costs for electronics products and is critical to electronics supply chain Identified areas for improvement: - Efficiency and utilization of high mix/low volume lines - Set up times & adoption of factory information integration with real time optimization - Ramps to volume and line flexibility - Qualification processes for materials & process development - DPMO leverage to understand package performance - DFx tools integrated with factory data systems Board assembly is being impacted by MEMS, optoelectronics and wireless communications packaging technology development Movement of board assembly to low cost areas of the world primarily China continues. 31

33 Assembly Gaps Associated With Components Parameter Definition Digital Terminals Maximum number of terminals to the board. That are carrying a digital signal per package RF Terminals Maximum number of terminals to the board. That are carrying a RF signal per package Maximum Body Size (L x W)- mm Minimum Terminal Pitch BGA Pitch of the I/O (mm) Minimum Terminal Pitch CSP Pitch of the I/O (mm) Number of stack die Maximum number of stacked die in a package Number of die in SiP Maximum number of stacked or max unstacked die in a package Minimum Minimum component size used in a Component size package by type Embedded Passives N/A Few YES YES YES YES MSL Level Moisture sensitivity level per IPC that Max Reflow Temperature Die Attach Materials Key Current Capability In Development Research Needed packages are qualified Common reflow temperature for multi die packages. deg C Thermal conductivity critical 80% 85% 90% 90% 90% Low temperature capability <5% <5% <5% <5% <5% Pre-applied <1% 3% 5% 20% 30% Matched CTE capability 0% 5% 7% 15% 25% 32

34 Interconnection Substrates Highlights Area array components driving wiring density increases in organic substrates New high speed requirements demand Z axis control, signal integrity and EMI design considerations Integral passives are needed for both wiring density and electrical performance Cost expectations of inemi emulators may be difficult for European & North American fabricators. 33

35 Packaging Highlights Packaging costs have become a larger part of I/C costs Impact of packaging is increasing, but R&D investment is not Packaging has become a major competitive factor due to: rapid growth in wireless complex consumer products Emerging device technologies driving new packaging requirements Major challenge: modeling/simulation of mechanical, thermal & electrical performance of the entire chip, package & heat removal structures as a system. 34

36 Identified Needs

37 Design Technology - Needs Design & simulation tools are main roadblocks to more rapid introduction of new technologies: Mechanical & reliability modeling Thermal & thermo-fluid simulation Co-design of mechanical, thermal & electrical performance of the entire chip, package & associated heat removal structures Simulation tools for nano devices & materials Improved design tools for emerging technologies like embedded passives & optoelectronic PWBs Integrated design & simulation tools (circuit, EM, thermal, mechanical, manufacturing, etc.) for higher functionality in mixed-mode wireless chips & modules. 36

38 Manufacturing Technology - Needs Improved stencil technology or paste dispensing Cost effective under fill process including rework Equipment to close cost gap between flip chip & SMT placement Reconfigurability for final assembly SMT compatible optical assembly processes with accuracies < 10 m Test procedures for optical components & electro/optical systems Analog test including scan and self-test technology. 37

39 Optoelectronics Technology - Needs Development of optical polymeric materials for improved multimode data transmission Development of multi-frequency chip-to-chip interconnections Combined processing of high frequency and micro optical components Development of optical connectors and package interfaces Wafer level packaging for optoelectronic systems Cost-effective packaging for long wavelength single mode VCSELs. 38

40 Packaging Technology - Needs Improved organic substrates Reliable packages for Cu/low k devices Pb, Sb, Halogen free packaging materials Improved Materials for: - High frequency performance > 2 GHz - Smaller packages and tighter I/O pitches (exceeding today s capabilities). 39

41 Component/Subsystem Technology - Needs Improved performance & reduced leakage in low power applications Medium power, low-loss, high-selectivity RF filters Improved optoelectronic subcomponents and component integration Low cost, high volume optical connectors In-circuit test technologies that are incorporated into the build process Cost & performance models: Evaluate trade offs between embedded passives and components Evaluate optical versus copper interconnection 40

42 Supply Chain Integration - Needs Material Traceability through Product Life Cycle for: Environmental and Medical Regulations Automotive and Military Requirements. Further Integration of design chain/supply chain to reduce costs and improve performance throughout the product life cycle: Understanding customer needs (moving target) Critical information flow Timely decisions that optimize performance of entire chain rather than one node. 41

43 Paradigm Shifts & Strategic Concerns

44 Paradigm Shifts Convergence of broadband communications and digital technology has increased product opportunities while creating market uncertainty: What is the right combination of functions? Which companies/services will win? Trends are beginning to emerge System in Package functional modules are speeding the design of new portable and office system products and reducing risk to the OEM. Product examples: Bluetooth WiFi (802.11b,a,g) GSM (Global System for Mobile Communication ) 43

45 Vision of the Evolution of SiP Source: Professor Rao Tummala, Georgia Institute of Technology-Packaging Research Center. 44

46 Potential Disruptive Technology Rapid introduction of complex, multifunctional new products to address converging markets favors development of functional, modular components (e.g. SiP) Increases flexibility & shortens product design cycle & places test burden on module producers This architecture allows for MEMS device construction with a variety of new applications in fuel cells & life sciences (DNA/blood testing) Wireless applications are an important driver for semiconductor products & technologies and may stimulate disruptive solutions Nanotechnology has the potential to be a very disruptive technology during the period covered by the roadmap New energy technologies that may cause disruptive opportunities include fuel cells and high power batteries for hybrid electric vehicles. 45

47 Next Generation Packaging Technology Innovative Miniaturized Packaging Source: Professor Dr. Reichl, Fraunhofer IZM, Berlin Germany 46

48 Strategic Concerns Given flow of technology & manufacturing between countries, many key component industries are looking for alternative business strategies to maintain leadership Innovative approaches to Enterprise IT & supply chain management which increase ROI in a predictable way EMSs are being asked to provide R&D leadership while keeping overhead low this may not be a viable business strategy The materials supply base does not have adequate demand (at high enough margins) to drive many of the needed new materials Impact of Environmental Compliance on financials, reliability, & IT infrastructure Reliability of less mature material systems 47

49 Key Recommendations

50 inemi Technical Projects Key Recommendations Establish a SiP TIG to address process, materials, equipment, & reliability gaps. Establish a project in the interconnect arena that explores dimensional stability of materials used in PWB manufacturing (driven by fine pitch and microvia technology). Establish a research project on new organic materials with improved properties for electronics packaging. Design Develop co-design capabilities of mechanical, thermal, and electrical performance of the entire chip, package, & heat removal structures. Develop improved design tools for emerging technologies like embedded passives and optoelectronic PWBs. Manufacturing Technology Develop automated printing, dispensing, placement, and rework equipment capable of the pitch requirements for SiP package assembly at current process speeds. 49

51 50 Materials Development Key Recommendations Low cost, higher thermal conductivity, packaging materials, such as adhesives, thermal pastes, and thermal spreaders. New interconnect technologies deploying nano-materials to support decreased pitch and increased interconnect frequencies. Characterize & improve reliability of material systems. Energy and the Environment Development & implementation of scientific methodologies to assess true environmental impacts of materials and potential trade-offs for alternatives. Develop a common, straightforward definition of sustainability that: Can be applied quantitatively at the business level Can be easily communicated to stakeholders Can be used to set targets Technology Development Thermal Management of high power densities Develop reconfigurable or adaptive radio transceivers.

52 Some applications and benefits of Nanotechnology (Motorola) Nano Composites: stronger, tougher, stiffer, lighter materials (adhesives, structural,thermal, electronic, optical functionality) Nano displays: Large, lower cost and brighter displays based on embedded carbon nanotubes Nano sensors: smaller, more sensitive Nano scale sensors for bio, optical, chemical and physical sensing Nano antennas: Nano scale fractal antennas for multiple spectra and broadband Nano power: High capacity power sources (storage, conversion, advanced fuel cells, photonic energy), parasitic energy harvesting, nanobiotech related functionality 51

53 Major Trends

54 Major Trends Current & Future Environmental considerations will expand RoHS/WEEE is the beginning Significant impact to supply chain/information needs Design for Environment/Sustainability Defensive posture has reduced industry s influence on regulations Mfg. migration to low cost regions continues Some corrections seen due to security/logistics costs Commodity design is following SiP is a major trend in portable products Infrastructure issues need attention Could find use in other sectors where mixed IC technologies are used Lack of integrated design/simulation tools is: Delaying new technology adoption Impacting product time to market 53

55 54 Major Trends Current & Future The predicted end of semiconductor scaling could have major implications: Non classical CMOS Beyond CMOS Increased thermal challenges Significant impact to packaging/interconnect Nanotechnology has the potential to dramatically effect electronics: Materials Displays Sensors Power Innovation thrusts have become very fashionable Many are policy oriented inemi can add value by creating research vision.

56 Innovation Challenge

57 Closing Needs through Research: A Challenge to be Strategic A number of Needs have appeared since the 1994 Roadmap. We need to be innovative and look for disruptive business & technology Solutions to these Needs. We need to identify the research areas that would provide the technology Solutions to these Needs. For example: Material Needs: Nanomaterials Manufacturing Processes: flexibility and reconfigurability Design: Rapid Modeling of Complex Systems 56

58 The Next Great Challenge The End of Semiconductor Scaling The anticipated end to semiconductor scaling will create a major technology shift in the industry: Implementation of advanced, non-classical CMOS devices with enhanced drive current Identification, selection, and implementation of advanced devices (beyond-cmos) Increased need for improved cooling Innovative Packaging for giga-function systems Innovation must begin today to meet these needs inemi Innovation Leadership Forum - 9/15, 9/16 Convened key industry, government, university and business leaders Discussed issues and developed a Research Vision that will focus investments on the right topics. 57

59 Innovation Forum Results Major Accomplishments: 1. Identification and participation of leaders in electronics manufacturing innovation. 2. Great descriptions of all levels of innovation (i.e. identification of "next big things", some level of supply chain technology related to electronics manufacturing, and innovation process/business model strategies). 3. Identification of shortcomings/limitations in government policy (related to innovation). Next steps: 1. Create Innovation/Research Vision 2. Communicate to Research Stakeholders 3. Develop plan for inemi next big thing. 58

60 VALUE CREATION IN THE SUPPLY CHAIN N94.034bes-chain Electronic Materials $62Bn Active Components $197Bn IC Assembly Services $6.2Bn Passive Components $143Bn EMS Assembly $110Bn 2003 Finished Equipment $950Bn Typical Companies Sumitomo Bakelite, DuPont, Ablestik Intel, STMicro, LSI Logic Amkor, ASE, SPIL Tyco, Molex, AVX, Sharp Solectron, Sanmina-SCI, Flextronics Dell, HP, Cisco, Nokia, Teradyne, Visteon, Siemens Gross Margin Operating Margin 30% 40% 12% 25% 7% 30% 10% 15% 8% 8% 2.5% 8% R&D 7% 15% 2% 5% <1% 8% Margin Value R&D Value $6Bn $30Bn $0.5Bn $11Bn $3Bn $76Bn $4Bn $30Bn $0.1Bn $7Bn <$1Bn $76Bn %Total R&D 3% 25% 64% Prismark 59

61 Wake Up Call: Vision Focus Areas Need 2005 Sputnik equivalent of Wake up or rallying call. Must have social value. Could it be: Energy: reduce imports by P% in N years.. Security/Safety: post 9/11. Health Care: ex. 30min of paperwork for every hour of patient care, 98K avoidable deaths/yr Data/Telecom: from New Orleans breakdown Define national goals with specific timelines. Rallying call with a face Credible spokesperson should make the call Credibility issue with Mars landing vision Must convince 5 th precinct the public 60

62 Guiding principles in the new innovation model Monolithic Product Development Global Product development networks Governance Top-down control Symbiotic partnerships Corporate ethos Not invented here Best from anywhere Attitude toward IP Own and protect Share and expand Innovation processes Rigid Flexible Success metrics Patents Customer experience Role of customers Passive users Active co-innovators Source: Forrester Research-Navi Radjou 61

63 Pb-free Assembly: Closing Gaps

64 Closing Gaps: Environmental Projects to Eliminate Pb Solder 1998 Roadmap identified the technology gap. Phase I project developed the alloy, process, components and reliability from Results: The inemi efforts accelerated the establishment of SAC alloys as the standard and reduced the effort in each member company. Phase II projects have expanded the technology base to include assembly and rework of large complex PWB assemblies. 63

65 Closing Gaps: Environmental Projects to Eliminate Pb Solder 2002 Roadmap identified a number of business Issues to convert to a Pb-free supply chain. Five Phase III project teams have addressed these supply chain transition issues. Phase IV projects have been established to close recently identified technology gaps: Wave/selective solder Mixed assemblies (Pb-free BGA s in a SnPb assembly process) Pb-free surface finishes Pb-free Rework Optimization Pb-free DPMO Pb-free Nano-solder High Reliability RoHS Compliance 64

66 Lead-Free Assembly Chair: Edwin Bradley, PhD Motorola Co-Chair: Rick Charbonneau Lead-Free Assembly & Rework Chairs: Jerry Gleason, HP Charlie Reynolds, IBM Environmentally Conscious Electronics (ECE) Technology Integration Group (TIG) Complete Complete RoHS Transition Task Group Chair: Dave McCarron, Dell Projects: Component Supply Chain Readiness Chair: John Oldendorf Component and Board Marking Chair: Vivek Gupta, Intel Assembly Process Specifications Chair: Frank Grano, -SCI Materials Declarations Chair: Nancy Bolinger, IBM Complete Tin Whisker Accel. Tests Chair: Valeska Schroeder, HP Co-Chairs: Jack McCullen, Intel Mark Kwoka, Intersil Tin Whisker Users Group Chairs: Joe Smetana, Alcatel Richard Coyle, Lucent Tin Whisker Modeling Chair: George Galyon, IBM Co-Chair: Maureen Williams, NIST Pb-free Wave Soldering Chair: Denis Barbini, Vitronics Soltec Co-chair Paul Wang, Microsoft Pb-free Rework Optimization Chair: Jasbir Bath, Solectron Halogen-free Chair: Steve Tisdale, Intel RoHS High Rel Chair: Mike Davisson, Agilent Co-Chair: Joe Smetana, Alcatel 65

67 Board Assembly Projects Board Assembly TIG Chair: Tom Pearson, Intel Pb-free Nano-solder Chair: Andrew Skipor, Motorola SMT Reel Labeling Chair: Patrick Figueroa, Delphi Electronics & Safety Pb-Free BGAs in SnPb Assemblies Chair: Robert Kinyanjui, Sanmina-SCI Co-chair: Charan Gurumurthy, Intel Pb -Free Assembly Substrate Surface Finishes Chair: Keith Newman, Sun Microsystems, Co-chair: Charan, Gurumurthy, Intel Pb-free DPMO Chair: Andrew Dugenske, Georgia Institute of Technology 66

68 2005 Technical Plan Gap analysis completed 5 year plans created Basis for future projects Distributed to inemi members 67

69 2005 Research Priorities Document

70 Closing Gaps: Research Priorities Document 2004 Roadmap identified a number of R&D issues that were beyond tactical project timing Priorities summarized in a 2005 inemi Research Document Seven product sector drivers: SIP Medical Office/Large Business Systems Automotive Aerospace / Defense Netcom 69

71 2005 Research Priorities Gap analysis completed 10 year priorities created Distributed to members & others Contents: Technology Research Needs by Product Sector Priorities Summarized by Research Area Manufacturing Processes System Integration Materials & Reliability Energy and the Environment Design Significant Gaps and Issues from Roadmap Options for Innovation Research Priorities 70

72 2007 Roadmap

73 2007 Product Emulator Groups (PEGs) Emulators Characteristics Portable / Consumer Office Systems / Large Business / Communication Systems High volume Consumer Products for which cost is the primary driver including Hand held, battery -powered products driven by size and weight reduction Products which seek maximum performance from a few thousand dollar cost limit to literally no cost limit Medical Products Products which must operate within a high ly reliab le environment Automotive Products which must operate in an automotive environment Defense and Aerospace Products which must operate in extreme environments 72

74 2007 Technology Working Groups (TWGs) Modeling, Simulation, and Design Connectors RF Components & Subsystems Test, Inspection & Measurement Organic & Printed Electronics Semiconductor Technology Sensors Packaging Passive Components Optoelectronics Thermal Management Ceramic Substrates Mass Storage (Magnetic & Optical) Energy Storage Systems Organic Substrates Board Assembly Final Assembly Customer Product Lifecycle Information Management (PLIM) Environmentally Conscious Electronics Red=Business Green=Engineering Blue=Manufacturing Blue=Component & Subsystem 73

75 2007 Product Emulator Groups (PEGs) Product Emulator Chair(s) 2004 Chair(s) 2006 Automotive Products Jim Spall, Delphi Jim Spall * Aerospace/Defense Products William E. Murphy, Lockheed Martin William E. Murphy * Medical Products Terry Dishongh, Intel Anthony Primavera, Guidant Terry Disho ngh, Intel Consumer / Portable Products Gerry Bird, 3M Susan Noe, 3M * Office/Large Business System Products Tom Pearson, Intel George Katopis, IBM Erich Klink, IBM Erich Klink, IBM Europe Tom Pearson, Intel Network, Data, Telecom Mike Schabel, Lucent Rolled Into Office /Large Business Systems for 2007 Need Co -Chair* 74

76 2007 Technology Working Group (TWGs) Business Processes / Technologies Chair(s) Co-Chair(s) Product Lifecycle Information Mgmt. Eric Simmon, NIST Joanne Friedman, Connekted Design Technologies Modeling, Simulation & Design Sanjeev Sath e, ASE S.B. Park, Binghamton U. Yi -Shao Lai, ASE Environmentally Conscious Electronics Mark Newton, Dell Joe Johnson, Cisco Thermal Management Cam Murray, Carl Fisher 3M Manufacturing Technologies Board Assembly Dongkai Shangguan, Flextronics David G eiger, Flextronics Ravi Bhatkal, Cookson Final Assembly Steven Davidson, Delphi Reijo Tuokko, Tampere U. Test, Inspection & Measurement Michael Reagin, Delphi Michael J. Smith, Teradyne

77 2007 TWG Leadership (cont.) Component / Subsystem Technologies Chair(s) Co-Chair(s) Semiconductor Technology Paolo Gargini, Intel Alan K. Allan, Intel Optoelectronics Rick Clayton, Consultant Laura Turbini, CMAP Passive Components Philip Lessner, Kemet Joseph Dougherty, PSU Packaging Joseph Adam, Skyworks Solutions Connectors John MacWilliams, Consultant Bill Bottoms, NanoNexus RF Components & Subsystems Eric Strid, Cascade Microtech J. Stevenson Kenney, GIT John Barr, Agilent, V.J. Nair, Intel Sensors Tim McBride, Sensata Technologie s Mike Azarian, U. Maryland Interconnect Substrates (Ceramic) Howard Imhof, Metalor Ton Schless, Midas Vision Energy Storage & Conversion Systems Dan Doughty, Sandia Labs Ralph Brodd, Broddarp Randhir Malik, IBM Interconnect Substrates (Organic) John T. Fi sher, Consultant Henry Utsunomiya, Consultant Mass Data Storage Tom Coughlin, Coughlin Associates Roger F. Hoyt, Retired Organic & Printed Electronics Dan Gamota, Motorola Jan Obrzut, NIST Jie Zhang, Motorola

78 9 Contributing Organizations Interconnect Substrates Ceramic Semiconductors inemi / ITRS Packaging TWG inemi / IPC/JIEP Interconnect TWG Interconnect Substrates Organic inemi Board Assy TWG inemi Roadmap inemi Product Lifecycle Information Management TWG Supply Chain Management inemi Optoelectronics TWG inemi Mass Data Storage TWG Magnetic and Optical Storage Optoelectronics and Optical Storage 77

79 Roadmap Cooperation with SMTA Formal 2007 inemi Roadmap cycle began at SMTAI, 9/30/05. Product Emulator Group s (PEG s) started the process by reviewing emulators and suggesting changes SMTA is working with inemi to continue to improve educational opportunities for their members. inemi Roadmap Monthly Newsletter Placed on SMTA Website For Members Information inemi is represented by Chuck Richardson inemi Meetings and this roadmap presentation are being held in conjunction with SMTAI

80 2007 Roadmap Schedule 3Q2005: Select Product Sector Champions, teams and refine data charts 3/4Q05: Product Sector Champions Develop Emulators September 6, 2005 Teleconference with P.E. Group Chairs September 30, 2005 Roadmap Kick-off with PEG/TWG/TC at SMTAI November 16, 2005 European Kick-off at Productronica December 2005 review meeting with TC on PEG Emulators 2004 chapter, format, Exec. Summary mailed to each TWG chair (Word 6.0) 1/4/2006 Organizing Teleconference with TWG Chairs 1/23/2006 February 2006 PEG Workshop/TWG Kick-off at APEX Meeting in Anaheim: Product Sector Tables Nearly Complete Chapter Draft Written Cross Cut Issues Addressed April 5, Roadmap European Workshop Semicon Europa, Munich May 8, 2006 Telecon With TWG Chairs May 17, 2006 Open Roadmap Presentation in Herndon, VA 79

81 2007 Roadmap Schedule - Continued June 27 - Roadmap Workshop HDP 06 Shanghai July 1, 2006 TWG Drafts Due for TC Review August 9,10, 2006 TC Face-to-Face Review with TWG Chairs in Kokomo (Delphi) September, 2006 Council Review of Key Issues and Preliminary SMTAI, Final Roadmap Chapters Due 9/22/06 October 31, 2006 Edit, Prepare App. A-D, Exec. Summary November 20, 2006 Go To Press December 4, 2006 Ship to Members Feb, 2007 Industry Release at APEX 80

82 Cost-Effective Supply Chain Technology Deployment inemi roadmaps/gap analyses help set the agenda for electronics industry. inemi is providing the Leadership required to work emerging technologies/opportunities. inemi is Leveraging R&D investments (academia & government) to address industry s agenda. Projects lead to improved deployment (faster, better, lower cost) created across supply chain. Standards efforts (with IPC, EIA, IEEE, and RosettaNet) are encouraging broad utilization of emerging technologies/solutions.

83 contacts: Chuck Richardson Bob Pfahl 82