Industry Collaboration Driving Proactive Environmental Improvements. Grace O Malley inemi March 29, 2011

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1 Industry Collaboration Driving Proactive Environmental Improvements Grace O Malley inemi March 29, 2011

2 Agenda inemi Introduction Highlights of Environmental Conscious Electronics Chapter of inemi Roadmap Key inemi Projects Concluding Thoughts 1

3 About inemi Mission: Forecast and Accelerate improvements in the Electronics Manufacturing Industry for a Sustainable Future. 5 Key Deliverables: Technology Roadmaps Collaborative Deployment Projects Research Priorities Documents Proactive Forums Position Papers 4 Major Focuses: Miniaturization Environment Energy Medical Electronics International Electronics Manufacturing Initiative (inemi) is an industry-led consortium of over 80 global manufacturers, suppliers, industry associations and consortia, government agencies and universities. Working on advancing manufacturing technology since Visit us at 2

4 International Members Across The Total Supply Chain The International Membership Incorporated Location; Number of Members INEMI Member Business Type North America Asia Region Europe Totals OEM ODM/EMS (inc. pkg. & test services) Material Suppliers Equipment Suppliers Universities & Research Institutes Industry & Government Organizations/Consulting Totals Things to note: Total Global Supply Chain Integration and Perspective Key influencers on the supply chain involved. Roadmap participation open to the whole industry Forums/workshop open to all stakeholders e.g. Both Greenpeace and Clean Production Action have participated. 3

5 The inemi Environmental Vision To take the initiative to fully leverage the inemi roadmap and aggressively drive the key environmental gaps and opportunities in and through the manufacturing electronics supply chain Proactive member led environmental improvement projects that close the technology gaps. Focused collaborative research with universities and key governmental labs working in sync with industry. Problems will be attacked with scientific depth and rigor and the solutions implemented will be far reaching and sustainable. 4

6 inemi Roadmap Environmentally Conscious Electronics Chapter

7 Overarching Themes Awareness Continuous monitoring and forecasting Engage with policy makers, stakeholders Flexibility and Collaboration Continuous, forward - looking research Tools for quick execution/decisions Coordinated - engaged supply chain/ ecosystem Creation and Architecture Technical roadmap that sets the ECE agenda rigorous, credible, trusted Engage and deliver to the electronics supply chain Standards that keep up with technology Promote harmonized solutions across supply chain 6

8 ECE Regulations Over Time; Growing Challenge Energy/Power Substances Climate change The ICT supply chain is global. Products are designed & manufactured for the global market. Inconsistent environmental regulations are challenges to continued innovation in ECE 3/31/2011

9 Example of Environmental Compliance Industry Responsibility Highly Complex DfE Manufacture Supply Chain Take-Back, Disposal, & compliance Design for Environment Compliant Processes Identify Categorize Treatment Reporting/ Analysis Site Inspection Material Compliance for WW RoHS Lead Free reliability Identify Parts & Assemblies Substance Data mining (IT) Waste Water and Energy Disposal Confirmation Audit Design for Recyclability Design For EuP ECO- Design Design For PS Design verification RoHS /REACH Compliant Product Information Management Proof Of Compliance Support Changing legislation Packaging Compliance Alternative technologies Date of Mfg (DoM) Retailer, distributor Material Declaration (PCD) Ship to Restrictions HazMat Country Specific Legislation WEEE Recovery Treatment Disposal Operations Transportation ELV (Vehicles) Material Manifest Destruction Certificate ESI Package distribution Non- Conformance Corrective Action Process

10 Environmental Conscious Electronics (ECE) The ECE Chapter has 5 Focus Topics 1. Materials 2. Energy 3. Recycling 4. Eco Design 5. Sustainability It is one of 21 chapters in the inemi Roadmap. Each of these also considers the Environmental impact in their specific technical areas. The 2011 roadmap will be available from March 31 st

11 ECE Issues Cut Across Many Roadmap Groups 10

12 Summary of key issues identified and being worked on 1. Materials Un-Harmonized restrictions challenge science based evaluation Remaining Lead and halogen free challenges Rare earth metals Nano Materials 2. Energy Efficiency harmonized requirements and metrics Carbon footprint - promote credible, workable methodologies 3. Recycling Common approach and infrastructure closer collaboration Harmonize patchwork requirements Market incentives for recovered materials 11

13 ECE Chapter Continued 4. Eco-Design Life cycle impact methodologies and database needs Design tools that incorporate LCA analysis real time 5. Sustainability ICT technology as an enabler to address climate change Water and manufacturing eco-efficiency are emerging areas 12

14 inemi Project Examples Advancing technical solutions to complex challenges

15 inemi Actions in Environmental Area Roadmap of Environmental Conscious Electronics (since 1996) Established the Environmental Leadership Steering Committee to set strategic direction & priorities Issued inemi Position papers on Product Carbon Foot printing and Definition of Low Halogen Issued white paper on Timeline for conversion of Notebook and desktops to HFR-Free and PVC free Leading Projects on Pb-free reliability since 2000 Leading Projects on PVC alternatives since 2009 Leading Projects on HFR-free reliability since 2008 Developing LCA tools for ICT products since 2010 Defining Environmental Research Priorities 14

16 PVC Alternative Initiative Leader Cisco

17 Thrust Area: Environment Goal: TIG: ECE PVC Alternatives Project Perform an Life Cycle Assessment of the electrical and mechanical properties, and safety aspects of PVC alternatives for Power Cord Sets Mar-11 Strategy Issues Graphics Phase 1 Evaluate differences between PVC with PVC-free compounds in the lifecycle of detachable US desktop power cord sets Phase 2 - Develop and conduct a test to gain a better understanding of the electrical, mechanical and safety aspects of PVC-free alternatives Project Lead: Scott O Connell, Cisco Systems Project Co-Lead: Jim Arnold, inemi Industry migration to PVCfree materials Sub-team formed to investigate hot spots in the life cycle using a screening LCA. Current LCA models are limited by lack of data on materials and processes used in the manufacture of power cord sets Tactics Milestones and/or Deliverables Plan Actual Phase 1 - Conduct a cradle-to-grave Life Cycle Assessment (LCA) on PVC and PVC-free Alternatives for detachable US desktop power cord sets Phase 2 - Conduct performance testing of different PVC-free alternatives Research Project Information Define and Collect Data Go / No-Go Decision on LCA Study Investigate LCA models to determine limitations Screening LCA to identify "hot spots" Project Reporting Mar-10 Aug-10 Dec-10 Mar-11 Jun-11 Apr-10 Sep-10 Jan-11 16

18 Industry-wide work to date Vinyl 2010 study on recovery of PVC (2003) Emphasis on EOL aspects of mixed cable waste EU Commission study on PVC and replacement materials (2004) Overview of publicly available LCAs, little information on PVC alternatives in electronic applications USEPA PVC Alternatives Project (2008) Focused on building and telecom wire, emphasis on base resins & additives (Pb vs Pb-free) HDPUG Halogen-Free Guideline (2008) Includes a section on Cables, general information on PVC alternatives HDPUG PVC Alternatives Project (Ongoing) Emphasis on supply chain readiness for PVC-free cables (all cable types) MIT Life Cycle Analysis of Plastics for Clamshell Packaging: PVC & PET (2010) Significant historical data on PVC (and additives); however little data exists on non-pvc alternatives & additives

19 inemi PVC LCA Project Next Steps March develop a screening LCA to identify hot spots across the US desktop power cord life cycle April document the screening LCA results and determine if a more detailed LCA is appropriate June begin Phase II project Second Half 2011 Manufacture PVC-free power cords (test samples) using commercially-available resins First half 2012 Complete Analysis & Publish Report 18

20 HFR-Free leadership projects

21 inemi Project on Transition to HFR-free materials Data Source: S. O Connell, Dell Attack the biggest slice of the cake first Not a simple substitution! Requires Industry Standards & Verification Criteria Real life testing of new Materials & Validation of Performance Business Implications Cost, Capacity 20

22 inemi HFR-Free Leadership Program 1. Identify technology readiness, supply chain capability, and reliability characteristics for HFR-free alternatives to conventional printed circuit board materials and assemblies Spans electrical and mechanical properties Resolve the biggest slice of the cake 2. Define technology limits for HFR-free materials across all market segments Initial focus is on client platforms (desktop, notebook) in 2011 timeframe Goal is to provide specific laminate supplier specs and test methodology requirements. Secondary goal is rapid conversion of the supply base to qualified HFR Free alternatives. 21

23 inemi HFR-Free Leadership Program HF Materials WG Examining differences in the new Halogen free material properties vs. standard FR4. Correlating the material properties to product performance test results. Establishing material property specifications or envelope for acceptable product performance by product segment. Collaborative Development Stephen Tisdale, Chair HFR-Free Leadership Program HFR-Free PCB Materials HFR-Free Signal Integrity Identify key thermo-mechanical performance characteristics and determine if they are in the critical path for the HFR-free PCB material transition. Ensure there is no degradation of electrical signals in HFR-free PCB materials, base on investigation of permittivity, loss and moisture absorption in new HFR-free materials. 22

24 Timelines are not short Phase #1 Phase #2 Phase # Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Condense brainstorm list PCB Material & SI Workgroup membership finalized. Assign owners and/or subteam Identified Test Methods, Test Structures and Critical dielectric parameters/limits Decide on TV construction and start Test Structure designs Complete POC Test Structure Validation Build Test Methods verified, Phase 2 build complete and under test Complete EOM/ODM Verification Testing Complete analysis of data from Phase 2 test suite builds and start verification OEM/ODM builds Final Report with Webinar Deliver the HF dielectric electrical requirements to the material suppliers and ODMs 23

25 Leadership Firms Participating in the Program 24

26 Summary of Industry BFR/PVC-Free Projects Project Title Project Chair Key Objectives Expected Completion HDPUG Reliability of BFR/PVC-Free Notebook PWBs Dell Wistron ITRI Supply chain assessment of 100% BFR/PVC-Free Notebook PWBs (board + components) and reliability assessment Results expected in late 2009 HDPUG BFR/PVC- Free Cables Dell Assess a broad range of BFR/PVC-Free materials for different cable and wire applications. Publication expected by early 2010 JEDEC Low Halogen (J-709) IBM Develop a new BFR/PVC-Free standard (define maximum concentration values for halogens across a variety of applications, not just PCBs) Published Nov 2010 US EPA - Flame Retardants in Printed Circuit Boards EPA Identify and evaluate commercially available flame retardants in FR-4 printed circuit boards and their environmental, human health and safety and environmental fate aspects. Finalize report and publicize results in late 2009 inemi - HFR-Free PCB Material Evaluation Intel Identify technology readiness, supply capability and standards development opportunities for halogenfree alternatives to conventional printed wiring board materials Project completed in 2008 and presented at SMTAI inemi Position paper on Low-Halogen Electronics Dell Intel HP Cisco Lenovo Provide a working definition in place of an IPC standard Released July 1, 2009

27 Estimating Life Cycle Eco-impact for ICT Products Leaders Alcatel-Lucent Cisco

28 Project Participants 27

29 inemi ICT LCA Project Objectives Phase 1: Develop a methodology for providing a simplified means of deriving key eco-environmental information for ICT equipment / assets 12 months (ended September 2010) Define a set of industry acceptable practices for more easily estimating the eco-impact for different types of ICT equipment Provide sufficient accuracy to meet the information s intended use (within ICT industry and its 1 st tier suppliers) Provide a simplified means for calculating significant eco-impacts of a particular product type over its life cycle stages Provide users with a unified format for requesting LCA information from suppliers Phase 2 : Develop an eco-environmental impact assessment estimating tool for ICT equipment / assets Timeline ~ 12 months 28

30 inemi Project Background Roots of the project began in September 2008 at the inemi Sustainability Summit in Illinois Discovered an area of Common Concern: ICT equipment LCAs are generally non-competitive methods and data are similar for typical classes of products About 90% of parts have common application in ICT product types / classes (we use the same suppliers) Identified an Opportunity can we use a building block approach in providing LCAbased eco-impact information for ICT product assets /sub-assemblies? Develop an estimator based possibly on asset / sub-assembly type, weight, size, number of devices by class, energy consumption per LCA stage, etc. Establish consensus within major ICT industry constituents System agnostic, updateable databases via cross-industry information sharing Evaluator can also be used for company-specific products / projects e.g. get credit for post-consumer content, energy efficiency feature, new material substitute (using primary data) 29

31 ICT LCA Estimator Methodology Scope Four major life cycle stages for ICT products Manufacturing Stage Transport Stage Use Stage End-of-Life Stage Raw Materials Extraction; Intermediate Components and Subassemblies Manufacturing Intermediate Transport and Assembly of ICT Product Final Transport, Distribution, and Installation of ICT Product Use and Servicing of ICT Product Takeback, Recycling, final disposition of ICT Product Gate-to-Gate Embodied Carbon Footprint Cradle-to-Gate Operational Carbon Footprint Gate-to-Grave Total Carbon Footprint Cradle-to-Grave 30 30

32 Concluding Thoughts Electronics products enable quality of life including environmental solutions Industry committed to environmentally conscious electronics (ECE) across the product life cycle Through inemi, working in consortia to define technical roadmap for environmentally conscious electronics Issues are complex and sustainable ECE Solutions require collaboration: Global electronics industry and Supply chain Research institutions and government labs Others stakeholders such as governments and NGOs Long timeline from identification of new issue to full implementation of harmonized solution across supply chain Technical ECE solutions involve trade-offs and simple drop-in substitutes are rare Unharmonized product environmental regulations are an innovation obstacle 31

33 contacts: Bill Bader Bob Pfahl Grace O Malley - Europe gomalley@inemi.org Haley Fu - Asia haley.fu@inemi.org