Session 4.1 Soldering & Surface Finish

Transcription

1 Session 4.1 Soldering & Surface Finish Chung-Kuang Lin National Chiao Tung University I am a PHD student, currently studying at department of material science and engineering, Natinal Chiao Tung University, PHD. My specialty is Electromigration and thermomigration in flip chip solder joints, interfacial reaction in Cu-Sn system and Ni-Sn system and thermoelectric coupling was conduct Temperature-dependent failure mechanism of SnAg solder joints with Cu metallization after current stressing: experimentation and analysis Study Electromigration/Thermomigration reliability issues in Flip Chip/microbumps Commercial electronic products now require higher I/O density, which makes the Electromigration and Thermomigratoin become the topic reliability issues. And the electroplating of nanotwin Cu. The electroplating technology of nanotwin cu was developed to highly improves the material properties of Cu. Yasuhiro Tanabe Okuno Chemical Industries Co., LTD. Katsuhisa Tanabe C. Uyemura & Co., Ltd. Yasutaka Amitani MEC COMPANY LTD B.A. in Industrial Chemistry,Doshisha Univ B.A. in applied chemistry, Waseda University Joined Uyemura Japan Senior researcher of R&D in Uyemura Japan Yasutaka Amitani received his B.E. and M.E. degrees in Macromolecular Science and Engineering from Kyoto Institute of Technology, Japan, in 2001 and 2003, respectively. He joined R&D division of MEC COMPANY LTD. in 2008 and has been engaged in developing various copper surface treatment process. The Electroless Ni-P Plating Film Adapting for Flexible Printed Wiring Boards Electroless Ni-P/Au plating has been applied as the treatment of surface finishing for FPC(flexible printed wiring boards)and others widely. Since electroless Ni-P plating film is hard and brittle, it cannot keep up with the ductility of Cu of electrode at the time of bending FPC in an implement process, so that there is a problem with occurrence of crack. To solve this problem, we studied electroless Ni plating film which has excellent bending-resistance and is optimum to FPC. At last, we found two kinds of Ni-P film which have good bendingresistance of FPC by changing bath composition. We found the films which are provided from these baths have good bending-resistance, and show different forms of broken-out section. The consequent use of LDI capability over the complete PCB manufacturing flow New Copper Surface Treatment for CO2 Laser Direct Drilling We introduce a newly-developed copper surface treatment for copper direct drilling by CO2 laser. It can overcome the drawbacks of both the black oxide and the brown treatment. It provides superior performance in laser drilling by the synergistic effects of roughened copper surface and coated compound. It is possible to form micro via holes even with quite low etching amount (under 1µm etching), which makes it possible to form micro via holes on ultra-thin copper foil used in MSAP method.

2 Session 4.2 Base Materials II Alun Morgan Isola Group Europe Alun Morgan is Director of OEM Marketing for Isola Group Europe and Managing Director of Isola UK. He additionally holds the posts of Chairman and Treasurer of the European Institute of Printed Circuits. Alun began his career as a Research Investigator at the Institute of Physics Fulmer Research Institute before joining Nevin Electric as Technical Manager. He joined MAS Electronics in 1982 becoming UK General Manager in Following the acquisition of MAS by Isola he joined the Isola UK management team becoming a Director in 1999 and was appointed a Corporate Vice President of the Isola Group in Alun holds a B.Sc. Honours degree in Metallurgy from the Department of Materials Science and Engineering at the University of Surrey, is an Associate of the University of Surrey and a Fellow of the Institute of Circuit Technology. Fire Retardancy - The What, Why, and How The paper takes a critical look at all aspects of fire retardancy, starting with the need for fire safety. The function of a flame retardant is examined and reactive and additive flame retardant classes are contrasted along with their chemical and physical effect mechanisms. The major flame retardant compounds, both halogen and halogen free, are examined in detail. Environmental concerns and life cycle analysis are examined. Carsten Ihmels Nabaltec AG Dr. Lin Lin Automotive & Industrial Systems Company Panasonic Corporation After promotion in Polymerization Technology at the Technical University of Berlin Carsten Ihmels joined the Division Functional Fillers of Nabaltec AG in Today, he is responsible for the R&D of thermoset applications and for the sales in Japan, Taiwan, and South Korea. M.S., Dept. of Polymer Chemistry, Kyoto University, Japan Ph.D., Dept. of Polymer Chemistry, Kyoto University, Japan A researcher at Circuit Board Materials Group, Technology Development Center of Automotive & Industrial Systems Company, Panasonic Corporation, Metal Hydrates and Oxides as Functional Fillers to Improve Flame Retardancy and Properties of Thermosetting Compounds in E&E Applications Modern epoxy formulations for the use in E&E applications have to fulfill a broad range of requirements. Next to flame retardancy crucial parameters like thermal & mechanical properties, and processability become more important. This paper shows the combination of metal hydrates and oxides with halogen free, organic flame retardants. Their influence on parameters like flame retardancy performance, thermal stability, thermal expansion, thermal conductivity, and processability are discussed. Ultra-low Transmission Loss Multilayer Material for High-Speed and High-Frequency Applications A new low-transmission-loss multilayer material suitable for printed circuit boards applied to such as Infrastructure-Communication Network and antennas of base stations is successfully developed. The laminates made with new resins have excellent dielectric properties and show the equal level of low transmission loss to the PTFE laminate. Moreover, they have high thermal stability, low moisture absorption, and high thermal decomposition temperature suited for the lead-free soldering process.

3 Jens Buerger ELANTAS Beck GmbH Jens Buerger was born in He attended the University of Electronics in Hamburg, Germany, graduated in 1998 as a graduate electronic engineer. In 2006 he joined ELANTAS Beck GmbH and is working as a sales engineer for the company, responsible for various customers in Europe. Impact of the Linear Coefficient of Thermal Expansion The coefficient of expansion is a characteristic value describing the behaviour of a material in respect of changes to its dimensions as a function of changes in temperature. The effect responsible for this behaviour has a significant influence on the thermal fatigue resistance of transformers and modules. The temperature shock resistance depends upon the chemical composition, the glass transition temperature and the geometry of the component.

4 Session 4.3 Design II Erkko Helminen TTM Technologies M.Sc. Erkko Helminen is research and development (R&D) manager at TTM Technologies, Inc. His key responsibilities are R&D project management and material engineering. He s acting department manager in TTM AP Materials R&D. Miniaturization Influence on Electrical Functionality of High Density Printed Circuit Board The paper discusses how the trend to higher packaging density as well as thinner dielectric thickness will affect electrical properties of the final product at printed circuit board (PCB) level. The paper presents key challenges which influence on signal integrity and discusses some possible solutions the industry can meet the future challenges in terms of materials and PCB manufacturing technologies. Daniel Hahn Fraunhofer IZM Ming-Tsun Lu HannStar Board Corporation Tarja Rapala-Virtanen TTM Technologies Daniel Hahn is a scientist at the Fraunhofer Institute for Reliability and Microintegration since. He studied electrical engineering at Technische Universität Berlin with focus on micro systems technology. His research interests are reliability aspects of micro systems technologies. Mr. Ming Tsun Lu holds a master degree in civil engineering from Chung Hua University, a supervisor of Research and develop department at Hannstarboard, and in charge of development of new technology and product. He possesses over 10 years experience in the areas of PCB and electrical products. Tarja Rapala-Virtanen studied in Åbo Akademi, Turku, Finland and finished with a degree in M.Sc.in chemical engineering. Starting with Salora PWB manufacturing in 1987 she worked as a process engineer developing the manufacturing processes and quality. Since 1991 she worked for Metalex Oy as a Quality Manager for Salo factory. After the acquisition in 1993 Metalex Oy became a part Aspocomp Oy. Tarja Rapala-Virtanen was in charge of the future technologies and early customer involvement as a Development Director in Aspocomp Group. After acquisition in 2008 Aspocomp became a part of Meadville Group. She continued in Meadville Group as VP Technology and has been responsible for the global R&D of Meadville Group Meadville Group came a part of TTM Technologies, Inc.. She is located at the moment in TTM Asia Pacific Guangzhou factory. Mission Profiles as an Approach to Manage Specific Automotive Requirements for Robust Design of Automotive Semiconductors Within the scope of electrification and challenges to offer innovative products an original equipment manufacturer has to handle the quality of the system. Especially the complexity of electric/electronic systems and subcomponents need to be managed. Suppliers have to understand the environmental and application oriented loads for their products. In this work an approach to focus knowledge and experience of every part of the supply chain to develop and cover robust semiconductors is shown. The Study of coaxial via in multilayers PCB Because PTH didn't have reference plane, so we can't achieve the goal of impedance match. Due to the impedance mismatch, signal will reflect and cause the data loss. The purpose of this research will study the structure of Coaxial via and manufacture process. We hope to get a coaxial via that the impedance is between 40~50 ohm and pass the reliability test. Next generation ultra thin HDI PCB manufacturing challenges High Density Interconnection (HDI) PCB technology is advancing to enable increased miniaturization and functionality of products such as smart phones, tablet computers and wearable devices. This paper will describe the recent challenges and developments in manufacturing ALV HDI technology to meet the needs for high volume, robust, reliable, and cost competitive solutions for electronic packaging.

5 At the Electronic Circuit World Convention 8 (ECWC8) in Tokyo in 1999 and at the ECWC9 in Cologne in 2002, she received the Best Paper Award for outstanding work and communication about advanced technology development in future PCB technology she received outstanding paper award from Emerald LiteratiNetwork.