PCB workshop at ESTEC in Noordwijk
|
|
- Anthony O’Brien’
- 6 years ago
- Views:
Transcription
1 PROPRIETARY INFORMATION reserves all rights including in Noordwijk ESA MIL IPC Page 1
2 PROPRIETARY INFORMATION reserves all rights including Introduction Thomas Maihöfer Dipl.- Ing (FH) Since 2006 Born in Mutlangen Course of studies in surface coating at FH Aalen Process Engineer in PCB manufacturing at STP in Sindelfingen Application Engineer for PCB tools at Kemmer Präzision in Lorch Development Engineer at Tesat Spacecom for PCB production Thomas Maihöfer PCB and Plating Tesat Spacecom GmbH & Co. KG Gerberstraße 49 D Backnang Phone: +49 (0) Page 2
3 PROPRIETARY INFORMATION reserves all rights including Page 3
4 PROPRIETARY INFORMATION reserves all rights including Page 4
5 PROPRIETARY INFORMATION reserves all rights including Page 5
6 PROPRIETARY INFORMATION reserves all rights including Page 6
7 PROPRIETARY INFORMATION reserves all rights including Page 7
8 PROPRIETARY INFORMATION reserves all rights including Approval PCB`s Innovation Input s / Output`s Quality audit Job preparation Tesat PCB Technology Team Customer service In-line process control Quality assurance Page 8
9 PROPRIETARY INFORMATION reserves all rights including PCB Audit 2009 Printed Circuit Board Manufacturing: Features Layer count up to: September max. total thickness: 3.2 mm min. core thickness: 70 µm Aspect ratio for plated through vias: Aspect ratio for micro vias: Lines / Spacing: 7:1 0.5 : µm / 150 µm Construction: 2 n 2 Min. hole size: 300 µm Impedance value: +/- 10% AOI inspection: 100% Electrical test: 100% Page 9
10 PROPRIETARY INFORMATION reserves all rights including PCB Product Overview Multilayer Radio frequency PCB Metal core Multilayers Heatsinks Microvia Multilayer Multi-Dielectric Board COB-Technology PCB Impedance control application Flex and Rigid-flex boards PCB Surface Tin/Lead reflow Copper/Lead diffusion layer Electroless Nickel/Gold Page 10
11 PROPRIETARY INFORMATION reserves all rights including Tests, Inspections, Analyses AOI inspection Analysis of sample Electrical test Specifiations: ESA specifikation (since 1968) ECSS-Q70-10A/11A Inspection MIL-PRF55110F MIL-P50884D IPC 6012 ;6013 ; 6016 Visual inspection Microsectioning Microsection preparation Page 11
12 PROPRIETARY INFORMATION reserves all rights including New Developments for High Rel Applications and future trends HDI boards with µ-via Technology goals: Denser packaging High reliability due to selective hole formation New world of design freedom Other surface finish Electroless Nickel / Gold Electroless Nickel / Palladium / Gold Solder resist Fine structure Line, Space and Pad Size to reduce pitches Page 12
13 PROPRIETARY INFORMATION reserves all rights including Page 13 New Developments for High Rel Applications and future trends Low CTE for assembly Metal layers Carbon layers (C-Film) Composite material of Epoxy and Low CTE material in buildup Quality characteristics Low CTE in x,y and z-axis High Glass Transition Temperature High Peel Strength High Dielectric Constant Low Dissipation Factor High Thermal Conductivity Metal layers Carbon layers
14 PROPRIETARY INFORMATION reserves all rights including Thank you for your attention Page 14
PCB technologies and manufacturing General Presentation
PCB technologies and manufacturing General Presentation 1 Date : December 2014 3 plants for a global offer dedicated to the European market and export Special technologies, Harsh environment PCB for space
More informationCAPABILITIES Specifications Vary By Manufacturing Locations
Revised June 2011 Toll Free: 1-800-979-4PCB (4722) www.4pcb.com sales@4pcb.com Material FR4 RoHS RF Materials CAPABILITIES Specifications Vary By Manufacturing Locations Number of Conductive Layers Standard
More informationGeneric Multilayer Specifications for Rigid PCB s
Generic Multilayer Specifications for Rigid PCB s 1.1 GENERAL 1.1.1 This specification has been developed for the fabrication of rigid SMT and Mixed Technology Multilayer Printed Circuit Boards (PCB's)
More informationHigh Frequency Single & Multi-chip Modules based on LCP Substrates
High Frequency Single & Multi-chip Modules based on Substrates Overview Labtech Microwave has produced modules for MMIC s (microwave monolithic integrated circuits) based on (liquid crystal polymer) substrates
More informationFPGA World Conference Stockholm 08 September John Steinar Johnsen -Josse- Senior Technical Advisor
FPGA World Conference Stockholm 08 September 2015 John Steinar Johnsen -Josse- Senior Technical Advisor Agenda FPGA World Conference Stockholm 08 September 2015 - IPC 4101C Materials - Routing out from
More informationSectional Design Standard for Flexible/Rigid-Flexible Printed Boards
Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards Developed by the Flexible Circuits Design Subcommittee (D-) of the Flexible Circuits Committee (D-0) of IPC Supersedes: IPC-2223C -
More informationTechnical Capabilities Non Standard Technologies. CML pcbs from just around the corner
Technical Capabilities Non Standard Technologies PAGE 1 Capabilities Rigid Layer Count 1-12 layer (above 12 layer see HDI) 0.4-3.2 mm (> 3.2 mm on request) Finished Board Thickness Tolerance: +/-10% Core
More informationMichael R. Creeden CEO/CID+ San Diego PCB, Inc. & EPTAC (858)
Michael R. Creeden CEO/CID+ San Diego PCB, Inc. & EPTAC mike.creeden@sdpcb.com (858)271-5722 1. Why we collaborate? 2. When do we collaborate? 3. Who do we collaborate with? 4. What do we collaborate?
More informationTransistor Installation Instructions
INTRODUCTION When inserting high power RF transistor packages into amplifier circuits there are two important objectives. Firstly, removing heat and, secondly, providing a longterm reliable solder joint
More informationAltiumLive 2017: Creating Documentation for Successful PCB Manufacturing
AltiumLive 2017: Creating Documentation for Successful PCB Manufacturing Julie Ellis TTM Field Applications Engineer Thomas Schneider Field Applications Engineer 1 Agenda 1 Complexity & Cost 2 3 4 5 6
More informationB. Flip-Chip Technology
B. Flip-Chip Technology B1. Level 1. Introduction to Flip-Chip techniques B1.1 Why flip-chip? In the development of packaging of electronics the aim is to lower cost, increase the packaging density, improve
More informationPhone: 33 (0)
Phone: 33 (0)1 69 07 70 71 Email : contact@systronic.com Introduction Systronic is dedicated to the manufacture of high reliability printed circuits for space, aeronautic and medical industries. 2000 sqm
More informationCIA GENERAL SPECIFICATION. For Double-sided and Multi-layer Printed Circuit Boards. Version 1.3
CIA GENERAL SPECIFICATION For Double-sided and Multi-layer Printed Circuit Boards Version 1.3 Records of Revision Date Paragraph Page Summary Latest Version 04-10-24 First Issue 1.0 09-06-14 ccl 1.2 14-07-10
More informationAN5046 Application note
Application note Printed circuit board assembly recommendations for STMicroelectronics PowerFLAT packages Introduction The PowerFLAT package (5x6) was created to allow a larger die to fit in a standard
More informationSectional Design Standard for High Density Interconnect (HDI) Printed Boards
IPC-2226 ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES Sectional Design Standard for High Density Interconnect (HDI) Printed Boards Developed by the HDI Design Subcommittee (D-41) of the HDI Committee
More informationStudy on Solder Joint Reliability of Fine Pitch CSP
As originally published in the IPC APEX EXPO Conference Proceedings. Study on Solder Joint Reliability of Fine Pitch CSP Yong (Hill) Liang, Hank Mao, YongGang Yan, Jindong (King) Lee. AEG, Flextronics
More informationInteresting Customer Questions
Interesting Customer Questions Topics of Customer Questions Gold plating vs Gold Flash Gull Wing Toe Fillet requirements Class 3 rework Tempered leads, what are they? 2 Gold Plating vs Gold Flash Question:
More informationDistributed by: www.jameco.com 1-800-831-4242 The content and copyrights of the attached material are the property of its owner. FEATURES AND SPECIFICATIONS Features and enefits Exceeds Category 5 performance
More informationPKF series. General information. PKF series
PKF series PKF series General information SMD and through hole versions with ultra-low component height 8.0 mm (0.315 in.) Up to 87% efficiency at full load Safety requirements in accordance with EN60950
More informationAPPLICATION NOTE 6381 ORGANIC LAND GRID ARRAY (OLGA) AND ITS APPLICATIONS
Keywords: OLGA, SMT, PCB design APPLICATION NOTE 6381 ORGANIC LAND GRID ARRAY (OLGA) AND ITS APPLICATIONS Abstract: This application note discusses Maxim Integrated s OLGA and provides the PCB design and
More informationATTRIBUTES STANDARD ADVANCED
TECHNOLOGY MATRIX 2017 ATTRIBUTES STANDARD ADVANCED Line/Space.005 /.005.003 /.003 Copper Foil. Oz. Min/Max ½ / 2 3 / 8 Pad Size Int. (dia over Drill).014.008 Pad Size Ext. (dia over Drill).012.008 Drill-to-Metal
More informationOB-FPC: FLEXIBLE PRINTED CIRCUITS FOR THE ALICE TRACKER
OB-FPC: FLEXIBLE PRINTED CIRCUITS FOR THE ALICE TRACKER Main Requirements. The OB FPC must meet demanding requirements: Material: Low material budget Electrical: impedance of differential lines @ 100W,
More informationCIA GENERAL SPECIFICATION. For Double-sided and Multi-layer Printed Circuit Boards. Version 1.4
CIA GENERAL SPECIFICATION For Double-sided and Multi-layer Printed Circuit Boards Version 1.4 Records of Revision Date Paragraph Page Summary Latest Version 04-10-24 First Issue 1.0 14-06-09 ccl 1.2 10-07-14
More informationElectrical Specifications. Insertion to +85 TOP VIEW SIDE VIEW BOTTOM VIEW. Pin 2. Yantel Corporation
Description The is a low profile, high performance 20dB directional coupler. It is designed for DCS & PCS applications. This component is suitable for feed-forward amplifier and signal sampling circuits
More informationAssembly/Packagng RF-PCB. Thick Film. Thin Film. Screening/Test. Design Manual
Thick Film Thin Film RF-PCB Assembly/Packagng Screening/Test Design Manual RHe Design Manual The following rules are effective for the draft of circuit boards and hybrid assemblies. The instructions are
More informationSpecifications subject to change Packaging
VCSEL Standard Product Packaging Options All standard products are represented in the table below. The Part Number for a standard product is determined by replacing the x in the column Generic Part Number
More informationArtwork: (A/W) An accurately scaled configuration used to produce the artwork master or production master.
Adhesive: The material used for bonding two substrates of material together. (usually; LF of FR 0100) Adhesive Squeeze-Out: Adhesive will ooze out slightly during the lamination cycle. Annular Ring: That
More informationSNT Package User's Guide
(Small outline Non-leaded Thin package) [Target Packages] SNT-4A SNT-6A SNT-6A (H) SNT-8A SNT Package User s Guide Introduction This manual describes the features, dimensions, mountability, reliability,
More informationOvercoming the Challenges of HDI Design
ALTIUMLIVE 2018: Overcoming the Challenges of HDI Design Susy Webb Design Science Sr PCB Designer San Diego Oct, 2018 1 Challenges HDI Challenges Building the uvia structures The cost of HDI (types) boards
More informationHermetic Packaging Solutions using Borosilicate Glass Thin Films. Lithoglas Hermetic Packaging Solutions using Borosilicate Glass Thin Films
Hermetic Packaging Solutions using Borosilicate Glass Thin Films 1 Company Profile Company founded in 2006 ISO 9001:2008 qualified since 2011 Headquarters and Production in Dresden, Germany Production
More informationComparative tests on Electronic Technologies to be compatible with thermal cycling over extreme temperature range
Comparative tests on Electronic Technologies to be compatible with thermal cycling over extreme temperature range 11th ESA Workshop on Advanced Space Technologies for Robotics and Automation ASTRA 2011
More informationTCLAD: TOOLS FOR AN OPTIMAL DESIGN
TCLAD: TOOLS FOR AN OPTIMAL DESIGN THINGS TO CONSIDER WHEN DESIGNING CIRCUITS Many factors come into play in circuit design with respect to etching, surface finishing and mechanical fabrication processes;
More informationBuried Broadband Capacitors How To Order
Quick Select by Application and Resonant Free Bandwidth Size Resonant Free Bandwidth** Typical Insertion Loss (S21)*** 2 Cap Values in Parallel (pf) Temp. Coeff. Working VDC FIT Calc. using cont. op. temp.
More informationTN008. PCB Design Guidelines for 2x2 LGA Sensors. Introduction. 2x2 LGA Package Marking
PCB Design Guidelines for 2x2 LGA Sensors Introduction This technical note is intended to provide information about Kionix s 2 x 2 mm LGA packages and guidelines for developing PCB land pattern layouts.
More informationWhat the Designer needs to know
White Paper on soldering QFN packages to electronic assemblies. Brian J. Leach VP of Sales and Marketing AccuSpec Electronics, LLC Defect free QFN Assembly What the Designer needs to know QFN Description:
More informationOptimalisation of the PCB design and PCB production to control cost
Optimalisation of the PCB design and PCB production to control cost Edward Snelleman 1 Introduction Q.P.I. Group 1988 started to be active in the field of PCB supply/development and PCB Design 2015 member
More informationFeatures. Preliminary. = +25 C, IF = 1 GHz, LO = +13 dbm*
Typical Applications Features The is ideal for: Test Equipment & Sensors Point-to-Point Radios Point-to-Multi-Point Radios Military & Space Functional Diagram Wide IF Bandwidth: DC - 17 GHz Input IP3:
More informationMETRIC PITCH BGA AND MICRO BGA ROUTING SOLUTIONS
White Paper METRIC PITCH BGA AND MICRO BGA ROUTING SOLUTIONS June 2010 ABSTRACT The following paper provides Via Fanout and Trace Routing solutions for various metric pitch Ball Grid Array Packages. Note:
More informationHOW DOES SURFACE FINISH AFFECT SOLDER PASTE PERFORMANCE?
HOW DOES SURFACE FINISH AFFECT SOLDER PASTE PERFORMANCE? Tony Lentz FCT Assembly Greeley, CO, USA tlentz@fctassembly.com ABSTRACT The surface finishes commonly used on printed circuit boards (PCBs) have
More informationHigh Efficient Heat Dissipation on Printed Circuit Boards. Markus Wille, R&D Manager, Schoeller Electronics Systems GmbH
High Efficient Heat Dissipation on Printed Circuit Boards Markus Wille, R&D Manager, Schoeller Electronics Systems GmbH m.wille@se-pcb.de Introduction 2 Heat Flux: Q x y Q z The substrate (insulation)
More information2mm Pitch 2 Piece Battery Connector. Horizontal/Vertical
FEATURES Low profile battery connectors (GF21/GF22/GF31 only) with 2.6mm (.12") height. 2 piece type with a highly reliable connection Sequence connection (FMLB : First Mate Last Break, 1 pin only) is
More informationModel BD3238N5050AHF. Ultra Low Profile 0404 Balun
Model BD338N55AHF Ultra Low Profile 44 Balun 5Ω to 5Ω Balanced Description The BD338N55AHF is a low cost, low profile sub-miniature unbalanced to balanced transformer designed for differential inputs and
More informationApplication Bulletin 240
Application Bulletin 240 Design Consideration CUSTOM CAPABILITIES Standard PC board fabrication flexibility allows for various component orientations, mounting features, and interconnect schemes. The starting
More informationHandling and Processing Details for Ceramic LEDs Application Note
Handling and Processing Details for Ceramic LEDs Application Note Abstract This application note provides information about the recommended handling and processing of ceramic LEDs from OSRAM Opto Semiconductors.
More informationCAPABILITIES Rev novembre 2017
THE PRINTED CIRCUIT BOARD PRODUCTION PROCESS CAPABILITIES Rev. 8-27 novembre 2017 Tecnometal Srl PCB & ELECTRONICS INDUSTRY SERVICES TECNOMETAL S.r.l. Via Ancona nr. 3-20060 Trezzano Rosa (MI) ITALY Tel:
More informationReflow Technology Product Overview
Reflow Technology Product Overview THR COMPONENT REQUIREMENTS THR Components Components for THR (Through-Hole Reflow) soldering must withstand higher temperatures than those found in standard wave soldering.
More informationUNSIGNED HARDCOPY NOT CONTROLLED
Subject: APPROVED BY STATUS PURPOSE Printed Wire Board Fabrication Manager, Hardware Engineering Maintenance Revision Extension to the master drawing for the fabrication and inspection of rigid single,
More informationInnovative pcb solutions used in medical and other devices Made in Switzerland
Innovative pcb solutions used in medical and other devices Made in Switzerland Chocolate Watches Money.PCB`s innovative pcb`s... Customer = innovation driver Need to add more parts and I/O make smaller/thinner
More informationREFLOW TECHNOLOGY. Product Overview
REFLOW TECHNOLOGY Product Overview THR COMPONENT REQUIREMENTS THR Components Components for THR (Through-Hole Reflow) soldering must withstand higher temperatures than those found in standard wave soldering.
More informationUltra-Thin, Highly Flexible Cables and Interconnections for Low and High Frequencies
Ultra-Thin, Highly Flexible Cables and Interconnections for Low and High Frequencies Hans Burkard a, Tobias Lamprecht b, Thomas Morf b, Bert Jan Offrein b, Josef Link a a Hightec MC AG, Fabrikstrasse,
More informationTLAM SYSTEM DESIGN GUIDE
TLAM SYSTEM DESIGN GUIDE PART TWO: MANUFACTURABILITY www.lairdtech.com Innovative Technology for a Connected World ABOUT LAIRD TECHNOLOGIES Laird Technologies designs and manufactures customized, performancecritical
More informationSMA - 50 Ohm Connectors
For Flexible Cable Straight Crimp Type Plug - Captivated Contact CABLE TYPE RG-178/U, 196 1.20 +.025 f (GHz) 0-12.4 GHz 142-0402-001 142-0402-006 RG-161/U, 174,188, 316 RG-188 DS, RG-316 DS RG-58/U, 141,
More informationReturn loss (db) Insertion loss (db) .56±.06 TBD. GND / DC Feed 1 + RF GND 2. Unbalanced Port Balanced Port Balanced Port.
Model BD6N5AHF Ultra Low Profile 44 Balun 5Ω to Ω Balanced Description The BD6N5AHF is a low cost, low profile sub-miniature unbalanced to balanced transformer designed for differential inputs and output
More informationBuried Microwave Designs using LTCC Multilayer Technology for High Density Integrated Space Hybrids
Buried Microwave Designs using LTCC Multilayer Technology for High Density Integrated Space Hybrids Micro- and Millimetre Wave Technology and Techniques Workshop 2014 25-27 November 2014 ESA-ESTEC, Noordwijk,
More informationHigh Precision Wraparound - Wide Ohmic Value Range Thin Film Chip Resistors
P Vishay Sfernice High Precision Wraparound - Wide Ohmic Value Range For low noise and precision applications, superior stability, low temperature coefficient of resistance, and low voltage coefficient,
More informationPRODUCT SPECIFICATION
i TM / i+ TM 0.8 mm PITCH I/O CONNECTOR SYSTEM of TABLE OF CONTENTS.0 SCOPE... 3.0 PRODUCT DESCRIPTION... 3. PRODUCT NAME AND SERIES NUMBER(S)... 3. DIMENSION, MATERIALS, PLATING AND MARKINGS... 3.3 SAFETY
More informationModel B0922N7575AHF Rev B. Ultra Low Profile 0404 Balun
Model B9N7575AHF Ultra Low Profile 44 Balun 75Ω to 75Ω Balanced Description The B9N7575AHF is a low profile, low impedance mm square subminiature wideband unbalanced to balanced transformer designed for
More informationSouth Bay Circuits. Manufacturability Guidelines. Printed Circuit Boards FOR. South Bay Circuits, Inc. 99 N. McKemy Ave Chandler, AZ 85226
Manufacturability Guidelines FOR Printed Circuit Boards South Bay Circuits, Inc. 99 N. McKemy Ave Chandler, AZ 85226 GL-0503B By: Edward Rocha Dear Customer, The intention of this document is to provide
More informationBLIND MICROVIA TECHNOLOGY BY LASER
BLIND MICROVIA TECHNOLOGY BY LASER Larry W. Burgess LaserVia Drilling Centers, L.L.C. Wilsonville, Oregon, USA ABSTRACT The most costly process in the fabrication of today's multilayer printed circuit
More informationDescription of the Method Developed for Dye Penetrant Analysis of Cracked Solder Joints
Description of the Method Developed for Dye Penetrant Analysis of Cracked Solder Joints Background The extension of cracks in solder joints after fatigue testing is usually evaluated using crosssectioning
More informationChip Inductor INTRODUCTION FEATURE AND APPLICATION. Feature. Application
INTRODUCTION Multilayer Chip Inductor is an electronic part that uses in resonance circuit, for noise suppression and for impedance matching in the electrical circuit. SAMSUNG Electro-mechanics has 2 series
More informationFYS4260/FYS9260: Microsystems and Electronics Packaging and Interconnect Printed Circuit Boards
FYS4260/FYS9260: Microsystems and Electronics Packaging and Interconnect Printed Circuit Boards Interior detail from an Apple iphone 5 printed circuit board Learning objectives Understand how printed wiring/circuit
More informationModel PD0409J7575S2HF
Model PD49J77SHF Ultra Low Profile 8 Power Divider 7Ω to 7Ω Description The PD49J77SHF is a low profile, sub-miniature Wilkinson power divider in an easy to use surface mount package. The PD49J77SHF is
More informationWebinar. Project planning & EDA demonstration.
Webinar Project planning & EDA demonstration www.we-online.com Webinar Project planning & EDA demonstration Brief Overview of Technologies ET Solder ET Microvia ET Flip-Chip Procedures for New Projects
More informationModel PD3150J5050S2HF
Model PD315J55S2HF Ultra Low Profile 85 Power Divider 5Ω to 5Ω Description The PD315J55S2HF is a low profile, sub-miniature Wilkinson power divider in an easy to use surface mount package. The PD315J55S2HF
More informationModel PD0409J5050S2HF
Model PD49JSHF Ultra Low Profile 8 Power Divider Ω to Ω Description The PD49JSHF is a low profile, sub-miniature Wilkinson power divider in an easy to use surface mount package. The PD49JSHF is ideal for
More informationModel PD2328J5050S2HF
Model PD2328J55S2HF Ultra Low Profile 85 Power Divider 5Ω to 5Ω Description The PD2328J55S2HF is a low profile, sub-miniature Wilkinson power divider in an easy to use surface mount package. The PD2328J55S2HF
More informationHigh currents in safe paths
High currents in safe paths Webinar November 3 rd 2015 Speaker: Andreas Schilpp www.we-online.de topics Flex-rigid technology with thick copper layers Update Design Rules Wirelaid Update UL-Listing Wirelaid
More informationPRODUCT SPECIFICATION
2.54mm Board to Board Header Connectors Page 1 1.0 SCOPE This specifies Pitch 2.54mm Headers Connectors. The connector shall meet the performances, specified here under the condition with the plug connector
More informationPRODUCT SPECIFICATION
2.54mm Board to Board Socket Connectors Page 1 1.0 SCOPE This specifies 2.54mm pitch Socket Connectors. The connector shall meet the performances, specified here under the condition with the plug connector
More informationOur Top 10 Commonly Asked Soldering Questions This Year
Our Top 10 Commonly Asked Soldering Questions This Year 1 Chip Component Shifting Can be related to components floating on the molten solder plus the equipment may have vibrations, which may not be felt
More informationTQM BC1/B2 BAW Duplexer
QM2 Not for New Design as an alternative. Applications CDMA / UMTS Handsets Data Cards Mobile Routers PCS Band Class 1 and Band 2 8 Pin 2.6 x 2.1 x 0.0 mm Product Features Functional Block Diagram Excellent
More informationTechnology Overview. Blind Micro-vias. Embedded Resistors. Chip-on-flex. Multi-Tier Boards. RF Product. Multi-chip Modules. Embedded Capacitance
Blind Micro-vias Embedded Resistors Multi-Tier Boards Chip-on-flex RF Product Multi-chip Modules Embedded Capacitance Technology Overview Fine-line Technology Agenda Corporate Overview Company Profile
More informationCustom MMIC Packaging Solutions for High Frequency Thermally Efficient Surface Mount Applications.
Custom MMIC Packaging Solutions for High Frequency Thermally Efficient Surface Mount Applications. Steve Melvin Principal Engineer Teledyne-Labtech 8 Vincent Avenue, Crownhill, Milton Keynes, MK8 AB Tel
More informationDetailed Electrical Specifications: Specifications subject to change without notice. Broadband Narrowband 25 C
fee Ultra Low Profile 85 Balun 75Ω to 75Ω Balanced Description The B225J7575AHF is a low profile sub-miniature balanced to unbalanced transformer designed for differential inputs and output locations on
More informationCapacitors. Damage Prevention When Soldering Ceramic Chip Capacitors
Capacitors Damage Prevention When Soldering Ceramic Chip Capacitors Survey Results of Failure Analysis Majority of failures were related to either: Capacitors Printed Circuit Boards 2 Types of Capacitor
More informationWedge Bonding Chip on Board (COB) and Direct Chip Attach (DCA) Applications
Wedge Bonding Chip on Board (COB) and Direct Chip Attach (DCA) Applications Lee Levine, Consultant Process Solutions Consulting, Inc Distinguished Member of the Technical Staff Hesse & Knipps, Inc levilr@ptd.net
More informationTechnology Flexible Printed Circuits Rev For latest information please visit
Options and Characteristics Online calculation On explicit enquiry Quantity 1 pieces up to 1m² total area 1piece to mass production Number of layers 1 to 2 layers up to 6 layers Material thickness 0,05mm
More informationModel BD2425N50200AHF. Ultra Low Profile 0404 Balun 50Ω to 200Ω Balanced
Model BD45N5AHF Ultra Low Profile 44 Balun 5Ω to Ω Balanced Description The BD45N5AHF is a low cost, low profile sub-miniature unbalanced to balanced transformer designed for differential inputs and output
More informationHandling and Processing Details for Ceramic LEDs Application Note
Handling and Processing Details for Ceramic LEDs Application Note Abstract This application note provides information about the recommended handling and processing of ceramic LEDs from OSRAM Opto Semiconductors.
More informationSPECIFICATION FOR APPROVAL. 1/32W, Low Resistance Chip Resistor (Lead / Halogen free)
PAGE : 1 OF 7 1/32W, 01005 Low Resistance Chip Resistor (Lead / Halogen free) 1. Scope This specification applies 0.2mm x 0.4mm (01005) size 1/32W, fixed metal film chip resistors rectangular type for
More informationImproving Density in Microwave Multilayer Printed Circuit Boards for Space Applications
Improving Density in Microwave Multilayer Printed Circuit Boards for Space Applications David NÉVO (1) Olivier VENDIER (1), Jean-Louis CAZAUX (1), Jean-Luc LORTAL (2) (1) Thales Alenia Space 26 avenue
More informationRF2044 GENERAL PURPOSE AMPLIFIER
GENERAL PURPOSE AMPLIFIER RoHS Compliant & Pb-Free Product Package Style: Micro-X Ceramic Features DC to >6000MHz Operation Internally matched Input and Output 20dB Small Signal Gain 4.0dB Noise Figure
More informationSunstone Circuits DFMplus Summary Report
Job Name DFM081-wireless_controller_v0 Part Number Wireless_Controller Customer Name Contact Name Job Class IPC Class 2 Job View Creation Time 2014-08-14 15:55:31 Revision V0 Operator Name lyndap Contact
More informationSURFACE FINISH FOR ELECTRONIC PACKAGING WITH LEAD-FREE SOLDERS. Abstract
~ ~ SURFACE FINISH FOR ELECTRONIC PACKAGING WITH LEAD-FREE SOLDERS PDF- I. V. Kadija J. A. Abys AT&T Bell Laboratories 600 Mountain Avenue Murray Hill, NJ 07974 Abstract Current trends in the preservation
More informationElectroless Bumping for 300mm Wafers
Electroless Bumping for 300mm Wafers T. Oppert Internepcon 2006 Tokyo Big Sight, Japan Outline Short Company Profile Electroless Ni/Au Under Bump Metallization UBM for Copper Devices Solder Bumping: Stencil
More informationProbe. Placement P Primer P. Copyright 2011, Circuit Check, Inc.
Probe Placement P Primer P What's Involved? Control Design ICT Friendly UUT Location Location Location Increase your odds in the manufacturing process Good contact Small targets Agilent Bead Probes Suggested
More informationWire Wound Chip Inductors LPI0805FT Series
INTRODUCTION Product : LPI Miniature SMD Inductor For Power Line Size : 0805 The LPI series are low profile inductor used in notebook, PC, cellular phone backlight, inverter and etc. The devices are designed
More informationPRODUCT SPECIFICATION
ipass TM 0.8 mm PITCH I/O CONNECTOR REVISION: ECR/ECN INFORMATION: EC No: UCP200-137 DATE: 200 / 02 / 08 TITLE: 1 of 14 TABLE OF CONTENTS 1.0 SCOPE 3 2.0 PRODUCT DESCRIPTION 3 2.1 PRODUCT NAME AND SERIES
More informationPRODUCTS FOR SOLDER-TO-BOARD APPLICATIONS
BOARD/WIRE-TO-BOARD CONNECTORS PRODUCTS FOR SOLDER-TO-BOARD APPLICATIONS Minitek Headers for Pin-in-Paste Processes OVERVIEW Minitek is FCI s brand for board-to-board and wire/cableto-board connectors
More information50W TO220 High Power Resistors
50W TO220 High Power Resistors MHP 50 Non-inductive, thin film technology. Thermally enhanced Industry standard TO220 package. RoHS compliant. Low thermal resistance, 2.3 C/W resistor hot spot to metal
More informationTQM EVB. Not for New Designs BC14/BC1/B25 BAW Duplexer. Applications. Functional Block Diagram. Product Features. General Description
TQM96314 Applications CDMA/LTE handset, data card & mobile router applications using the extension PCS band (Band Class 14) / BC1 / B25 8 Pin 2.6 x 2.1 x.88 mm Product Features Excellent Triple Beat Performance:
More informationLeiterplattenoberflächen im Fokus
Leiterplattenoberflächen im Fokus Auswahl der besten technischen und kommerziellen Lösung für Ihre Anwendung Hubert Haidinger Director PE/CAM BU Industrial & Automotive 28. Februar 2013 www.ats.net Austria
More informationDISCRETE SEMICONDUCTORS DATA SHEET. BFG97 NPN 5 GHz wideband transistor. Product specification File under Discrete Semiconductors, SC14
DISCRETE SEMICONDUCTORS DATA SHEET File under Discrete Semiconductors, SC14 September 1995 DESCRIPTION NPN planar epitaxial transistor mounted in a plastic SOT223 envelope. It features excellent output
More informationAce Tech Circuit Presentation
Presentation (ZIP)429-912 1254-8, Jeongwang-Dong, Siheung-si, GyeongGi-Do, Korea (New Address : 32 (#509-1Na Dong), 79 Beon-Gil, Gong Dan 1 Daero, (Jeong Wang Dong ShiWha Industrial CPLX ) Shi-Heung City,
More informationDesign for Manufacturability of Rigid Multi-Layer Boards By: Tom Hausherr
Design for Manufacturability of Rigid Multi-Layer Boards By: Tom Hausherr INTRODUCTION SECTION CONTENTS PAGE 1 INTRODUCTION...1-3 2 RAW MATERIALS SELECTION...2-3 2.1 Material Selection and Panel Utilization...2-3
More informationCharacterization of Printed Circuit Board Material & Manufacturing Technology for High Frequency
As originally published in the IPC APEX EXPO Conference Proceedings. Characterization of Printed Circuit Board Material & Manufacturing Technology for High Frequency AT&S Leoben, Austria Oliver Huber 1,
More informationDesigned for mission critical applications requiring high power, filtering, hold-up and current pulse generation.
Tantalum Through-Hole Capacitors Hermetically Sealed Overview KEMET's M550 and M551 Modular Series are manufactured by placing T550 or T551 Polymer Hermetic Sealed Capacitors (PHS) in parallel. The T550
More informationRF2044A GENERAL PURPOSE AMPLIFIER
GENERAL PURPOSE AMPLIFIER RoHS Compliant and Pb-Free Product Package Style: Micro-X Ceramic Features DC to >6000MHz Operation Internally matched Input and Output 18.5dB Small Signal Gain @ 2GHz 4.0dB Noise
More informationModel BD4859L50100A00 Rev A
Model BD4859L51A Ultra Small Low Profile 63 Balun 5Ω to 1Ω Balanced Description The BD4859L51A is an ultra-small low profile balanced to unbalanced transformer designed for differential inputs and output
More information