ATTRIBUTES STANDARD ADVANCED
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1 TECHNOLOGY MATRIX 2017 ATTRIBUTES STANDARD ADVANCED Line/Space.005 / /.003 Copper Foil. Oz. Min/Max ½ / 2 3 / 8 Pad Size Int. (dia over Drill) Pad Size Ext. (dia over Drill) Drill-to-Metal (Relief dia over Drill) Drill Size Min. (After Plating) Drill Aspect Ratio Slot Size Min Hole Location Tolerance (TP) +/ /-.003 Hole-to-Image Tolerance +/ /-.003 Hole Plated Size Tolerance +/ /-.002 Hole Non-Plated Size Tolerance +/ /-.001 Panel/Board Size, Multilayer 18x24 / 16x22 18x24 / 16.25x16.25 Panel/Board Size, Double Sided) 18x24 / 16.5x x24 / 16.5x22.5 Thickness, Finished Max Thickness, Finished Min Thickness, Finished Tolerance +/ /-.005 Layers, Number Max Dielectric, Min Warpage, per Inch Material FR4, Cem 1, FR1 Rogers, Halogen-Free Teflon / HighTemp. Polyimide SMT Center-to-Center, Min SolderMask Dam, Min SolderMask Clearance, Min SolderMask Colors Green Yellow, White, Black, Red, Blue, Amber, Clear Silkscreen Line, Min Silkscreen Colors White Black, Yellow Finishes Hot Air Solder Level, ENIG, Hard Gold, ENEPIG Carbon Ink, Immer. Silver, Immersion Tin, Lead Free Solder Rout Dimension Tolerance +/ /-.003 Internal Radius, Min Vscore Depth Tolerance +/ /-.003 Electrical Test: Pitch/Feature Min..008 / /.003 Electrical Test Voltage 100 Volt 1000 Volt Impedance Tolerance +/- 10% +/- 5% Via Fill Hole / Conductivity.008 / Non-Conductive.010 / Conductive
2 MULTI-LAYER CONSTRUCTION Rigid Max Layers Rigid-Flex Max Layers Flex Flex: Single & Double Layer Flex: Multi-Layer Rigid Max. Thickness Up to = >.250 Min Thickness Tolerance +/- 10% +/- 7% +/- 5% Blind and Buried via Yes Yes Yes Controlled Dielectrics Thickness +/ / /-.001 Layer to Layer Registration +/ / /-.003 Bow & Twist (Inch per Inch) >.007 >.005 >.004 DRILLING Min Drill Size-Mechanical Controlled Depth Drilling Yes Yes Yes Drill Position (RTP) +/ / /-.002 Flex Hole Edge to Rigid-Flex Interface <.025 ELECTROLYTIC PLATING (COPPER & GOLD) Max Aspect Ratio, Copper (Thru Holes) 9:1 10:1 12:1 Max Aspect Ratio, Copper (Micro via).5:1.75:1.85:1 Plasma Etch-Back Yes Yes Yes Electrolytic Hard Gold, Tips, Selective Yes Yes Yes Electrolytic Soft Gold Yes Yes Yes Conductive Silver Via Fill (Via in Pad) - Yes Yes Edge Plating Yes Yes Yes
3 SOLDER MARK & LEGEND Solder Mask Type (LPISM) Taiyo PSR-4000 PSR-9000 PSR-9000 Solder Mask Type - Flex Mask Colors Green - - Min Solder Mask Dams Min Solder Mask Clearance Legend Colors White - - Via Fill (Conductive / Non-Conductive Yes Yes Yes Via Tent (Dry Film) Yes Yes Yes Conductive Paste/Ink Yes Yes Yes Carbon Paste Yes Yes Yes Dry Film Solder Mask Available Available Available SURFACE FINISHES Hot Air Solder Leveling (Leaded & UnLeaded) Yes Yes Yes ENIG Yes Yes Yes ENEPIG Yes Yes Yes Hard Gold Yes Yes Yes Soft Gold Yes Yes Yes Immersion Tin Yes Yes Yes Immersion Silver Yes Yes Yes FABRICATION Fabricated Dimensions-Routing +/ / /-.004 Fabrication Radius +/- 5 degrees +/-.005 degrees +/-.005 degrees Fabricated Dimensions-Scoring, X,Y +/ / /-.005 Fabricated Dimensions Scoring, Z +/ / /-.004 Beveling Yes Yes Yes Edge Milling Yes Yes Yes Counter Sink/Bore Yes Yes Yes Precision Controlled Depth
4 TESTING-ELECTRICAL & IMPEDANCE Single Sided Grid (.100) Yes Yes Yes Flying Probe (Fixture Less) Yes Yes Yes Impedance-Single Ended, Differential, Broad- Yes Yes Yes Side Coupled, Edge Coupled, Co-Planar Impedance Tolerance +/- 10% +/- 10% +/- 8% PANEL SIZES 12 x18, 16 x18, 18 x24 All All All Flex Min 12 x9 Max 16 x18 All All All Max Board Size 16.5 x x x22.5 MATERIALS FR Tg Yes (single & - - double layers) FR-4, 170 Tg Yes - - FR-4, > 170Tg - Available Available Polyimide, 260Tg Available Available Available Teflon - Available Available Rogers 4000 & Duriod 5800 Available Available Available Lead-Free Temp Rated Available Available Available Ceramic Available Available Available Low Loss - Available Available Halogen-Free Available Available Available Flex Pyralux Flexible Polyimide Available Available Available Flex Copper (Rolled Annealed, E.D) Available Available Available
5 INNER LAYERS Min Core Dielectic = > Min Line ½ Copper = > Min Space ½ Copper => Min Line 1 oz. Copper Min Space 1 oz. Copper Min Line 2 oz. Copper Min Space 2 oz. Copper Min Pad Size Over Drill (Overall).012 (.006 per.010 (.005 per.008 (.004 per FlexMin Pad Size Over Drill (Overall).020 (.010 per.014 (.007 per.010 (.005 per Min Plane Clearance Diameter over Drilled Hole (Overall).020 (.010 per.016 (.008 per.012 (.006 per FlexMin Plane Clearance Diameter over Drilled Hole (Overall).024 (.012 per.020 (.010 per.016 (.008 per OUTER LAYERS Min. Line 1 oz. Copper Min Space 1 oz Copper Min Line 2 oz Copper Min Space 2 oz Copper Min Line 3 oz Copper Min Space 3 oz Copper Base Copper Foil 0.5 oz oz 0.25 oz Min Pad Over Drill (Overall).012 (.006 per.010 (.005 per.008 (.004 per
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