Ace Tech Circuit Presentation

Transcription

1 Presentation (ZIP) , Jeongwang-Dong, Siheung-si, GyeongGi-Do, Korea (New Address : 32 (#509-1Na Dong), 79 Beon-Gil, Gong Dan 1 Daero, (Jeong Wang Dong ShiWha Industrial CPLX ) Shi-Heung City, Kyoung-Ki Do, S. Korea ) TEL : (REP) FAX : The motto of ATC is to make differences in providing a technical quality services. The company is carrying out and [Open Book Management, Operational Accountability, and Value Based Management], which are the corporate philosophy of ATC. ATC is doing its very best efforts to gain high level of trust from its clients. Rev. 5 ( )

2 Brief Company History 1998 year 04. (ATC) was established. 07. Developed Multilayer technology up to 24 Layers year 09. Developed Multilayer up to 40Layers. 11. Acquired ISO 9001 from Authorized Institute. 12. Expanded Production Line Capacity (MLB : 30,000 m2 /month) 2004 year 05. Recognized from Administration of Korea as High Technical Venture Company 06. Recognized from Korea Technology Credit Fund as Super Technology Company year 02 Incorporated from private company to public company year 02. Acquired UL Certification (E225596) 11. Registered as Prospective Enterprise to Kookmin bank 2003 year 06. Started exporting products to USA 2005 year 04. Moved to new factory and increased its production capacity. 04. Authorized from Government for R & D Institution 07. Selected as a technological innovation Business ( Inno Biz) 10. Gained Best Venture Grand Gold Metal among all Korean venture company 11. Acquired ISO14001 from Authorized Institute. 11. Gained "One million Dollar Export Golden Tower" from Government TEL: , FAX : /26 Rev. 5 ( )

3 Brief Company History 2006 year 11. Gained "Three Million Dollar Export Golden Tower" from Government 2008 year 2011 year 01. Newly equipped with Reverse Pulse Plating LINE 2009 year 05. Newly equipped with Image LINE & PSR LINE (Starting to set-up LDI Machine) 06. Additional establishment of Reverse Pulse Plating LINE 11. Gained Five Million Dollar Export Golden Tower" from Government Korea Technology Awards Have gained award from Knowledge and Economy Minister year 09. Gained " Promising Small & Medium Enterprise" from Gyeong Gi local government. 10. Commended by Gyeong Gi Provincial governor as Venture Business year 12. Pending Patent for OSCILLATION AND SHOCKING APPARATUS of PCB 2013 year 06. Selected The Best Firm for working (Small and medium Business Corporation) 06. Selected Promising Export Firm (kyeonggi Regional Small Medium Business Administration) TEL: , FAX : /26 Rev. 5 ( )

4 Company Philosophy Emphasize Quality Emphasize Quality We understand and conform to our customer s quality requirements in PCB business and We deliver error-free products and services on time delivery. (Please see our quality systems page) Overall Manufacturing Process in House Overall Manufacturing process in house Every each process of manufacturing is done in house all without any other outsourcing, so it is possible to not only shorten the lead time, but also reduce the cost. Measure Performance Measure Performance We manage by timely feedback Quality, Delivery and Customer inputs for inquiries as well as orders Development Programs Development Programs We analysis the defect data to generate Process Improvement actions and develop new technologies continuously. TEL: , FAX : /26 Rev. 5 ( )

5 Organization President Executive Director Managing Director Institute of technology Produce Sector Support Sector Production Team Production Management Quality Team Domestic Sales Team Overseas Sales Team Engineering /Cam Team Production &Technique Human Resources &manager Team laminating PART Imaging PART PSR PART Production Management PART Sales Management PART Quality Assurance PART Quality Control PART Engineering PART CAM PART Production& Technique PART Facilities manageme nt PART Human Resources/ Accounts PART Manager PART Gold Plating PART TEL: , FAX : /26 Rev. 5 ( )

6 ATC s Main Customers Microelectronics Business End User Industrial Business Overseas Business TEL: , FAX : /26 Rev. 5 ( )

7 Facilities & Process CAM INNER LAYER IMAGE AOI HOT PRESS DRILLING CU PLATING OUTER LAYER IMAGE PSR SURFACE FINISHING ROUTER B.B.T CAM Applying to the PCB manufacturing with designs for the productions by accuracy, speedy and stored specifications in computers. Equipments : Orbotech-Genesis FINAL INSPECTION TEL: , FAX : /26 Rev. 5 ( )

8 Facilities & Process CAM INNER LAYER IMAGE AOI HOT PRESS DRILLING CU PLATING OUTER LAYER IMAGE PSR SURFACE FINISHING ROUTER B.B.T FINAL INSPECTION IMAGE The conductive patterns are formed by etching process of Dry Films. The Imaged Dry Films with the patterns, are contacted to the Copper Foils closely. (Utilize 100% Laser Direct Imaging on UV (light Exposure) TEL: , FAX : /26 Rev. 5 ( )

9 Facilities & Process CAM INNER LAYER IMAGE AOI HOT PRESS DRILLING CU PLATING OUTER LAYER IMAGE PSR SURFACE FINISHING ROUTER B.B.T AOI During the manufacturing the PCB, the all patterns are inspected by optical equipments with Halogen lamp. Equipments :Orbotech, GIGAVIS FINAL INSPECTION TEL: , FAX : /26 Rev. 5 ( )

10 Facilities & Process CAM INNER LAYER IMAGE AOI HOT PRESS DRILLING CU PLATING OUTER LAYER IMAGE PSR SURFACE FINISHING ROUTER B.B.T HOT PRESS Each layer's Copper foil & Prepreg are laid up by heat and press. The lay up should be performed a controlled environment room for best result. Equipments : MEIKI, FUSEI MENIX FINAL INSPECTION TEL: , FAX : /26 Rev. 5 ( )

11 Facilities & Process CAM INNER LAYER IMAGE AOI HOT PRESS DRILLING CU PLATING OUTER LAYER IMAGE PSR SURFACE FINISHING ROUTER B.B.T DRILLING Drills for making holes are performed for plating holes to be electrical connecting between the top and bottom, and component's mounting on the boards. Equipments : HITACHI FINAL INSPECTION TEL: , FAX : /26 Rev. 5 ( )

12 Facilities & Process CAM INNER LAYER IMAGE AOI HOT PRESS DRILLING CU PLATING OUTER LAYER IMAGE PSR SURFACE FINISHING ROUTER B.B.T CU PLATING The hole's plating process is one of the most important process for PCB manufacturing, and its process is requiring special analysis for checking plating's situations in technical specialized plating shop. We have a reverse pulse type plating for a reliability. FINAL INSPECTION TEL: , FAX : /26 Rev. 5 ( )

13 Facilities & Process CAM INNER LAYER IMAGE AOI HOT PRESS DRILLING CU PLATING OUTER LAYER IMAGE PSR SURFACE FINISHING ROUTER B.B.T PSR The specification of significant parameters of solder paste are important to repeatable high quality results. It should be sufficient to meet process variable and products requirements. Legend is worked by using Inkjet Marking machine. FINAL INSPECTION TEL: , FAX : /26 Rev. 5 ( )

14 Facilities & Process CAM INNER LAYER IMAGE AOI HOT PRESS DRILLING CU PLATING OUTER LAYER IMAGE PSR SURFACE FINISHING ROUTER B.B.T SURFACE FINISHING We do surface finishing with Gold plating, Tin plating, Silver plating and HASL Hard Gold Plating : 50 µ Flash Gold Plating : 2~20µ FINAL INSPECTION TEL: , FAX : /26 Rev. 5 ( )

15 Facilities & Process CAM INNER LAYER IMAGE AOI HOT PRESS DRILLING CU PLATING OUTER LAYER IMAGE PSR SURFACE FINISHING ROUTER B.B.T ROUTER The boards are cut as customer's required specifications. FINAL INSPECTION TEL: , FAX : /26 Rev. 5 ( )

16 Facilities & Process CAM INNER LAYER IMAGE AOI HOT PRESS DRILLING CU PLATING OUTER LAYER IMAGE PSR SURFACE FINISHING ROUTER B.B.T B.B.T The all boards are tested with the checking of all patterns and holes by electrical testing. Equipments : MicroCraft(EMMA), ATG, MANIA FINAL INSPECTION TEL: , FAX : /26 Rev. 5 ( )

17 Facilities & Process CAM INNER LAYER IMAGE AOI HOT PRESS DRILLING CU PLATING OUTER LAYER IMAGE PSR SURFACE FINISHING ROUTER B.B.T FINAL INSPECTION For final board's inspection would be effected by the checking the board's specifications with customer's requirements and the general things, including the its shipping packages. FINAL INSPECTION TEL: , FAX : /26 Rev. 5 ( )

18 Product Types Probe Cards/Boards Burn-in Boards Hi-fix Boards Load Boards / SOC Boards TEL: , FAX : /26 Rev. 5 ( )

19 Probe Cards/Boards (Controlled Impedance Boards) Applications : Semiconductor wafer probing & IC testing High-speed signal processing units High frequency communication equipment Typical ATC Controlled Impedance Boards Specification mm Units inch Layers 14~52 14~52 Base material FR-4 FR-4 High Tg FR-4 FR-4 High Tg Thickness 4.8~ ~0.26 Conductor width Conductor space Min. Hole diameter ø 0.30 ø Surface treatment (Electro Hard / Electroless Au Plating) etc. 1.3µ m 50µ HPL TEL: , FAX : /26 Rev. 5 ( )

20 Burn-In Boards Applications : Semiconductor IC burn-in testing Typical ATC Burn-in Boards Specification mm Units inch Layers 4~22 4~22 Base material FR-4, polyimide, FR-4 High Tg, BT-Resin FR-4, polyimide, FR-4 High Tg, BT-Resin Thickness 0.3~ ~0.096 Conductor width Conductor space Min. Hole diameter ø 0.15 ø Surface treatment (Electro Hard / Electroless Au Plating) 1.3µ m 50µ Pitch TEL: , FAX : /26 Rev. 5 ( )

21 Hi-Fix Boards Applications : This is for evaluation of Electrical function and characteristic. This can be installed to multi type of Tester and Handler Typical ATC Hi-Fix Boards Specification mm Units inch Layers 12~68 12~68 Base material FR-4 N SI FR-4 High Tg FR-4 N SI FR-4 High Tg Thickness Conductor width Conductor space Min. Hole diameter Φ Φ Surface treatment (Electro Hard / Electroless Au Plating) 1.3µ m 50µ Pitch etc. HPL, Back Drill 68 Layers 6.5T IVH 0.4 Pitch TEL: , FAX : /26 Rev. 5 ( )

22 Load Boards / SOC Boards Applications : This is for evaluation of Electrical function and characteristic. Used for evaluation of device function as from one to many quantity. Typical ATC Load Boards Specification mm Units inch Max. Number of Layers Base material FR-4 FR-4 High Tg FR-4 FR-4 High Tg Thickness 1.6~ ~0.250 Conductor width Conductor space Min. Hole diameter Φ 0.15 Φ Surface treatment (Electroless Au Plating) 0.07µ m 2.8µ Pitch etc. HPL, BUILD-UP TEL: , FAX : /26 Rev. 5 ( )

23 Product Types Ⅱ Build-Up Boards etc. DUT Boards TEL: , FAX : /26 Rev. 5 ( )

24 Measuring instrument No. Model Manufacturer Purpose 1 CITS500S Polar Instruments Measuring Impedance 2 DSA8200 Tektronix Measuring Impedance 3 CMI900 Oxford Instruments Measuring thickness of gold plating 4 CMI700 Oxford Instruments Measuring thickness of copper plating 5 Premium-800C INTEK IMS Measuring in 3 Dimensions 6 Video Microscope IT System Sometech Measuring in 2 Dimensions (inner/outer Trace width) 7 PMG3 OLYMPUS Microscope (Cross Section, thickness of, Surface) 8 QM-HEIGHT 350 Mitutoyo Bow & Twist Test 9 U3B DAESUNG TECH Copper Peeling Test 10 Solder Pot YuYu measuring instrument Soldering Test & Thermal Stress Test 11 Labopol-5 Struers Grinding & Polishing TEL: , FAX : /26 Rev. 5 ( )

25 General ATC Capabilities Overview TEL: , FAX : /26 Rev. 5 ( )

26 General ATC PCB Capabilities Division Standard Advanced mm inch mm inch Impedance Control 10% 8% Pattern Width Inner Layer Outer Layer BGA pitch Immersion Gold 0.03µm 1.2µ 0.5µm 20µ Electrolytic Hard Gold 0.5µ m 20µ 1.5µ m 60µ Max. Number of Layers Min. Hole Size Max. Panel size Max. Board Thickness Max. Aspect Ratio on 0.248" thickness 12 : 1 26 : 1 TEL: , FAX : /26 Rev. 5 ( )

27 General ATC PCB Capabilities ATC leads technique markets of PCB testing semiconductor by using modern facilities Such as Reverse Pulse Copper plating, LDI, Inkjet Marking machines. Possibility of Operating Throwing Power for High Aspect Ratio It is able to be handle 0.05~0.5um Gold thickness by using ENIG <Reverse Pulse Plating> <Flash Gold facility> Minimize deviation of the rate of contraction by unused Exposure Film Get high reliability by <LDI> The Realization of an Accurate Pattern <Plugging M/C> Hole plugging automation Operate Marking Process without a Plate-Marking Net <Inkjet Marking> Print out a Minute Typography, Be excellent in Location of its Typography/Marking <Half Etching facility > For special process TEL : , FAX : /26 Rev. 5 ( )