FBTI Flexible Bumped Tape Interposer

Transcription

1 FBTI Flexible Bumped Tape Interposer Development of FBTI (Flexible Bumped Tape Interposer) * * * * *2 Kazuhito Hikasa Toshiaki Amano Toshiya Hikami Kenichi Sugahara Naoyuki Toyoda CSPChip Size Package CSPFBTIFBTI ViaCu SnAgSiAu FBTI 1. PDAPersonal Digital Assistance CSPChip Size Package 2 90 CSP FBTI m E 10 25m 75mSnAg150m Cu18m 75m ViaBC0.5 mmsnag ViaLGALand Grid Allay Top View Bottom View Via SnAg Solder Bump Pitch: 150mp Bump Diameter: 75m Bump Height: 1025mt Via SnAg Solder Pitch: 500mp Via Diameter: 150m Via Height: mt * *2 1 40m Example of interposer using 40 m-thick polyimide

2 FBTI Flexible Bumped Tape Interposer LGA Pad Top View Process of Via Face ( BC-side ) Material Acceptance Forming of Via Holes Desmear Filling in Via Hole Laminating of Sensitized Dry Film Polyimide Film or Glass Epoxy Solder Plated 2 Bottom View Cross View DCA Pad with Schematic structure of interposer Process of Bump & Pattern Face ( E-side ) Exposure for Bump Pattern Development & SnAg Pattern Plating Film Removing Laminating of Sensitized Dry Film Exposure for Wiring Pattern Development & Alkali Etching & Film Removing Making Film Surface Roughness Treatment Outward Form Cutting m E 50mSnAg84m Cu18m 34m NiAu Cu Sn BCVia 150m0.35 mm SnAg Via BC BC Via ViaSnAgVia 3.2 E E Cu SnAg Cu NCFNon Conductive Film Cu 3 Manufacturing process 4. FBTI 4.1 Via Via ViaVia 4 40m 50m Via 4.2 Via CuViaSnAg Cu Via 5 X Via Via a 40m 40m thick polyimide b 50m 50m thick glass epoxy 4 Photomicrographs of via holes after laser drilling and desmearing

3 FBTI Flexible Bumped Tape Interposer Via Fill Part Via Fill Part a40m 40m thick polyimide 5 ViaX Soft X-ray image of via hole filling 4.3 SnAg SnAgAu m CuNCF 6 1 Properties of base materials used for interposer Unit Polyimide Glass Epoxy Test Method Thickness mm Volume Resistance cm 510 IPC-TM-650, Surface Resistance Insulation Resistance IPC-TM-650,2.5.9 Solder Heat Resistance 26060sec. OK sec. OK Peel Strength N/cm JIS C-5012 Flexual Strength 25 MPa Elongation at Break Point % Modulus of Elaasticity Ratio of Size Variation after Etching Ratio of Size Variation after Heating MPa MD % 0.00 TD MD TD % % % Heat Resistance in Oven OK Tg 180 Water Absorption % 0.31 UL Flame Class UL-94V-0 UL-94V-0 IPC-TM-650, Min Min. 6 Cu Cu foil surface after roughening treatment 5. FBTIViaSnAg Ag 5.1 SnAgCuFIB-SIM Focused Ion Beam-Secondary Ion Microscope SnAgAgFIB-SIM 45 8 Ag SnAg m 250 mm Roll 1 Lot Lot 60 point15 Lot 150 m250 mmroll 1 Lot Lot108 point 15 Lot 2 Via Ag Sn-Cu Intermetallic Compound SnAgCu Interface area of Cu foil plated with SnAg SnAg Solder Cu

4 FBTI Flexible Bumped Tape Interposer 6. 8 Bump Height (m) Via Height (m) Bump (Ag wt%) Via (Ag wt%) 3 2 Material Heights of plating Polyimide Film Glass Epoxy Ag EPMAElectron Probe Micro AnalysisAg 100 m 250 mm Roll150 m250 mm Roll 1 Lot Lot9 point 15 Lot 3 Ag Via -4.0 Ag Ag composition in plating layer Material Ag SnAg Photomicrograph of SnAg plating layer Polyimide Film Glass Epoxy FBTI Si Si Au Nagase-Chiba URF200 Post fluxharima chemical, Inc F-50FNo clean flux Au1505 min secsi NAMICS U min mmt FR-4Cu18mt 0.3 mm0.4 mm LGALand Grid ArrayBGABall Grid Array2 LGA 400m100mt BGA 300m 300m100mt 6.2 LGA BGA 3n 20 9 Post Flux Coating *Harima Chemicals, Inc. F-50F(No Clean Flux) NAMICS *U Metal Mask Opening 100mt 400m LGA Electoro Ni/Au Plating Nagase-ChibaUFR200 Chip Mount Post Cure 150 5min Chip Attach with Heat Tool sec Under Filling the Resin min 300m Solder Ball Attach Metal Mask Opening 100mt 300m BGA Mount on the Mother Board FR-4 1.6mmt 18mt Cu Foil Double Site Pad Size 0.3mm SR Opening Size 0.4mm Preparation process of specimens for reliability evaluation

5 FBTI Flexible Bumped Tape Interposer 4 Test conditions and results of reliability test 0.5mm Molded Resin Si Chip Au Stud Bump NCF Test Test Condition Pass Criteria (1) Component BGA Failure Rate On the Board (2) LGA (3) BGA Via Hole Filling (SnAg Solder) Cu Wiring Interposer Thermal Shock High Temp. High Humid. Autoclave High Temp. Storage Pre-Conditioning JEDEC -55 to Min. Dwells 85, 85 % RH, No Bias 121, 100 % RH , 85 % RH, 168 Hours 220 Reflow 3 Pass <1 % Failure Probability Zero or One Failure in 168 Hours 24 Hours 1008 Hours Level 1 >2000 Cycles Level 1 Passed 288 Cycles BGA LGABGA m FBTI 2,3 547 Cycles FBTI 7.1 TQONThin Quad Outline Non-Leaded 10 TQON TQON 11TQON mm0.5 mm0.65 mm 0.5 mm 11 TQON Structure of TQON 7.2 PTPPaper Thin Package 12PTPSBM System Block ModulePTP50m IC3 13 PTP SBMSystem Block Module TQONPTP SnAg AuSEM 15ViaCu SBMSystem Block Module Appearance of SBM (System Block Module) 130m Chip Havimg 50m Thickness Au Stud Bump Via Hole Filling (SnAg Solder) Under-fill Resin Interposer 10 TQONThin Quad Outline Non-Leaded Appearance of TQON (Thin Quad Outline Non-Leaded) 13 PTP Structure of PTP

6 FBTI Flexible Bumped Tape Interposer Si Chip Au Stud Bump Molded Resin Via Fill (SnAg Solder or Cu) Solder Mask Au Wire Bonding Interposer Solder Ball Wire Bonding Au Pad 14 Interposer under development SnAg Bump SEM SEM image of bump surface Au SnAg Via CSP 1 Toshiaki Asada and Toshiaki Amano: Development of a Bumped Tape Carrier (BTC) for CSP Substrates, The Fourth VLSI Packaging Workshop of Japan, Nov. 1998, Takashi Imoto, Mikio Matsui, Chiaki Takubo, and Shuzo Akejima: Development of 3-Dimensional Module Package, System Block Module, Proc. 51th ECTC Conferrence System Block ModuleSBM,, July 2001,