Wedge Bonding Chip on Board (COB) and Direct Chip Attach (DCA) Applications
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1 Wedge Bonding Chip on Board (COB) and Direct Chip Attach (DCA) Applications Lee Levine, Consultant Process Solutions Consulting, Inc Distinguished Member of the Technical Staff Hesse & Knipps, Inc or knipps.us Cell , Fax
2 COB and DCA Requirements Flex, COB, laminates, LTCC Many surfaces/materials in one package Different bond heights Discretes Complex PRS, many Reference Systems Multiple wire diameters in same package Only Wire Bonding is Flexible enough to handle all of these requirements
3 Flex Cable/COB & Passives [Courtesy Lexmark]
4 COB/Glob top, Through hole, and Surface mount on Back (courtesy Lexmark)
5 Overview of Wire Bond Interface Reliability Wedge Bond
6 Effect on Thin film Au Bondability of Photoresist Contamination on Various Bonding Technologies [Bushmire] Wedge Bonding is capable of bonding on dirtier surfaces than ball bonding. COB, Flex, Hybrids have dirtier surfaces than chips or leadframes
7 Improving Bondability of Laminate Packages
8 No Ni With Ni
9 Nickel/Gold Plating for Wire Bonding Larger Wire> Thicker Plating> Higher Bonding Parameters For Al wedge Al Ni Intermetallic has best reliability For wire Au wire 3.75µm Ni 0.6µm Au Thinner Au results in bonding problems Al wire 3.75µm Ni µm Au Au passivates the Ni (prevents oxidation) but bond is to Ni Heavy wire no Au required
10 Palladium, ENIG, ENIPIG Plating for Wire Bond Both solder and wire bond Less expensive than Ni/Au (thinner plating) Pure Pd plating softer and easier bonding than 4 6% P containing Pd (Atotech) For fine wire suggested film stack 3.75µm Ni µm Pd 0.03µm Au
11 Transducer FEM Why Wedge Bond? 2011 Hesse & Knipps Inc. 11
12 What is PiQC? Process Integrated Quality Control Simply put, PiQC is the truest measure of bond quality available today. Why Wedge Bond? 2011 Hesse & Knipps Inc. 12
13 What is PiQC? Digital Ultrasonic Generator PiQC -Signals Mechanical Oscillations Friction Current Voltage Frequency Actuator Wire Deformation Sensor (patented) The wedge tip oscillation has significant influence on bond quality and is influenced by the conditions of the wire & bond interface (friction feedback). Monitoring all these signals provides an exhaustive insight into the bond process. Why Wedge Bond? 2011 Hesse & Knipps Inc. 13
14 PiQC Production Views Deformation Current Radar Chart Histogram Q Development (200 values) Individual user interface possible Why Wedge Bond? 2011 Hesse & Knipps Inc. 14
15 PiQC: Optimized Source Bond Wire No. Frequency Friction Ultrasonic Wedge PiQC exclusive Signals Wire Quality Index Why Wedge Bond? 2011 Hesse & Knipps Inc. 15
16 PiQC: Misplaced Bonds Bond On pad Frequency Friction Ultrasonic PiQC exclusive Signals Wedge Wire Quality Index 75% % % Why Wedge Bond? 2011 Hesse & Knipps Inc. 16
17 PiQC: Displaced Destination Bonds Bond on Pad Frequency Friction Ultrasonic PiQC exclusive Signals Wedge Wire Quality Index 100% % % Why Wedge Bond? 2011 Hesse & Knipps Inc. 17
18 PiQC: Particle on Bond Pad Wire No. Frequency Friction Ultrasonic PiQC exclusive Signals Wedge Wire Quality Index Why Wedge Bond? 2011 Hesse & Knipps Inc. 18
19 PiQC: Scratch on Bond Pad Wire No. Frequency Friction Ultrasonic PiQC exclusive Signals Wedge Wire Quality Index Why Wedge Bond? 2011 Hesse & Knipps Inc. 19
20 PiQC: Short Tail + Big Deformation Wire No. Frequency Friction Ultrasonic PiQC exclusive Signals Wedge Wire Quality Index Why Wedge Bond? 2011 Hesse & Knipps Inc. 20
21 Deep Access Capability to 18 mm Why Wedge Bond? 2011 Hesse & Knipps Inc. 21
22 AUTHORS For additional information please contact: Lee Levine Distinguished Member of the Technical Staff Wedge Bonding Expert (610) knipps.us Joseph S. Bubel President Hesse & Knipps, Inc. (484) knipps.us knipps.com Register at WireBondDemo.com for wire bonding demonstration videos and updates. Why Wedge Bond? 2011 Hesse & Knipps Inc. 22
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