Chemnitzer Seminar System Integration Technologies. Solder Jetting, Rework & electroless UBM Deposition
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1 Chemnitzer Seminar System Integration Technologies June 14 15, 2016 Solder Jetting, Rework & electroless UBM Deposition Made in Germany
2 PacTech Group - Milestones 1995 PacTech founded in Berlin, Germany as spin-off from Fraunhofer-IZM st Manufacturing facility: PacTech GmbH, Nauen, Germany nd Manufacturing facility: PacTech USA Inc., CA, USA 2005 Equipment Field Service & Support Center, Thailand 2006 NAGASE & Co., Ltd. takes 60% shares in PacTech rd Manufacturing facility: PacTech Asia Sdn. Bhd., Malaysia PacTech Europe (HQ) 2009 NAGASE & Co., Ltd. increases shares in PacTech to 74% 2013 > 115 patents granted 2014 Demo Center Opening: Hsinchu, Taiwan 2015 Demo Center Opening: Shanghai, China PacTech USA 2015 > 1000 Production Machines shipped 2015 NAGASE & Co., Ltd. increases shares in PacTech to 100% PacTech Group (Europe, USA, Asia): 370 employees Annual sales turn over PacTech Group (FY 2015): 45 Mio. PacTech Asia 2
3 PacTech Business Units Subcon Services Equipment Chemistry Wafer Bumping UBM & OPM Plating eless Ni/Au, Ni/Pd & NiPdAu, NiAg, ELP Cu & Au Solder Ball Attach / Solder Jetting Wafer Repassivation Dry Film Application Wafer Level RDL CSP & BGA Ball Rework Wafer Backside Metallization Wafer Thinning Single Wafer Etch TiNiAg & TiNiAu Evaporation Backend & Die Sort Sawing Tape & Reel FC Assembly Inspection AOI X-Ray Inspection SEM & FIB Solder Jetting & BGA Rework/Repair: SB²-M, SB²-SM, SB²-Jet Wafer Level Solder Balling: Ultra-SB² 200/300 Wafer Level Solder Rework/Repair: Ultra-SB² 200/300 WLR Flip Chip Bonder: LAPLACE- FC, LAPLACE-Cap/-Can Electroless Bumping Line: PacLine 200/300 A50 Spin Coating System: SpinPac ASC 200/300 Plasma Cleaning/Ashing: PlasPac 200 Wafer Backside Marking: LS² 200/300 Customized equipment for photovoltaic & solar industry LAPLACE-SOLTEC, LAPLACE-HT Reflow Oven: RFM/RFA 200/300 Electroless Plating Al & Cu pad cleaning Al and Cu pad activation Electroless Ni, Pd, Ag, Cu Immersion Au & Ag Cyanide or Cyanide free Special solutions for Ni & Ag pad cleaning/activation Resists Backside coating Photosensitve Strippers Solvents Flux cleaner Services Worldwide distribution Importer of records Consignment Quality Assurance 3
4 Solder Jetting (SB²) Single Solder Ball Placement 4
5 Solder Jetting (SB²) Applications BGA / clcc Balling Rework/ Repair of BGA-like packages Hard Disk Drive (HGA, HSA, Hook-Up) Camera Modules Wafer Bumping Reworked Package HGA for HDD (Source: Seagate) Wafer Level CSP Bumping Optoelectronics/ Microoptics Filter Devices (SAW, BAW) MEMS & 3D-Packaging Camera Module Bluetooth module on LTCC substrate Eutectic SnPb37 solder balls on FR4 5
6 Solder Jetting (SB²) Process 1/2 Process Video for Solder Jetting and Solder Stacking 6
7 Solder Jetting (SB²) Process 2/2 Ball Reservoir Optical sensor Laser Singulation Disk Optical sensors N 2 Pressure sensor Reflowed solder balls N 2 gas Capillary Search level Bond level Semiconductor wafer Bond pad 7
8 Solder Jetting (SB²) Advantages Solder ball diameter capability: 40µm - 889µm (qualified for volume production) 30µm (in qualification) Solder alloys: SnAgCu, SnAg, SnPb, AuSn, InSn, SnBi No tooling No flux No mechanical stress/contact No thermal stress No additional reflow No cleaning of flux residues Fine pitch applications (< 80µm) 8
9 Solder Jetting (SB²) Coplanarity Unit No. Avg [mm] Min [mm] Max [mm] Std Dev [mm] Coplanarity [mm] 1 0,2205 0,179 0,252 0,0123 0, ,2824 0,242 0,312 0,0136 0, ,2760 0,235 0,305 0,0115 0, ,2628 0,226 0,295 0,0151 0, ,2359 0,203 0,265 0,0117 0, ,2537 0,219 0,287 0,0133 0, ,2411 0,192 0,266 0,0110 0, ,2562 0,223 0,277 0,0105 0, ,2487 0,219 0,275 0,0130 0, ,2512 0,222 0,282 0,0129 0, ,2583 0,233 0,294 0,0116 0,056 Typical FBGA Coplanarity Callout 9
10 10 Solder Jetting (SB²) Shear Force vs Laser Energy
11 Solder Jetting (SB²) Quality Fracture Mode: Solder Shear Shear Force: min. 300 g (Solder Ball diameter: 300µm) 11
12 Solder Jetting (SB²) Quality Optimal Solder Wetability Metallographic Cross Sections 12
13 Solder Jetting (SB²) Quality Solder balls after second reflow in initial state 13
14 14 Solder Jetting (SB²) Quality
15 Rework via Solder Jetting (SB²) Single Ball Pacement 15
16 Rework via Solder Jetting (SB²) Incoming Inspection of Defective Parts solder residues and other impurities were found during incoming inspection all substrates surfaces are affected a) b) remaining solder volume on pads is highly alternating multiple solder bridges, deformed solder bumps and solder satellites are present all solder bumps/depots show high oxidation level c) d) 16
17 Rework via Solder Jetting (SB²) Process Information solder sphere 200µm SAC 305 flux applied prior solder removal and solder placement heated chuck ~100 C substrates cleaned with ethanol in ultrasonic after finished process 17
18 Vacuum Rework via Solder Jetting (SB²) Process Information Solder Deballing Working direction Solder Reballing Ball Reservoir Laser Heated tip Flux Reflowed solder balls Deballed pads Reflowed solder balls N 2 gas Capillary Heated chuck heated tip temperature higher than solder melting point heated chuck ~100 C to minimize heat sinking and to activate flux tip moves against solder and transfers the heat melted solder is sucked into the tip via vacuum Bond level Bond pad capillary hole diameter < solder ball diameter higher laser energy to get out the solder ball in the capillary bond level is up to 2x higher than the solder ball diameter suitable for solder ball bumping of highly complex applications (HGA, HSA, camera modules etc.) possibility of soldering process in angle higher speed of placing solder balls 18
19 Rework via Solder Jetting (SB²) Deballing 19
20 Rework via Solder Jetting (SB²) Post Deballing Local Removal of a Solder Bump Solder Cap for Resoldering 20
21 Rework via Solder Jetting (SB²) Outgoing Inspection of Reworked Parts a) b) c) d) Deballing result: uniform pad appearance solder resist not damaged all solder bump failures removed completly P Reballing result: solder height ~150µm solder bumps show homogeneous shape stable and reliable results no irritation of surrounding surface P 21
22 22 Laplace Flip Chip BondingTechnology
23 LAPLACE Flip Chip Bonding Final assembled Flip Chip Flip Chip placement and laser reflow 23
24 24 Vertical Chip Bonding (LAPLACE-VC)
25 Vertical Chip Bonding (LAPLACE-VC) Process Video for Vertical Chip Bonding 25
26 26 Vertical Chip Bonding (LAPLACE-VC) Application Memory Chip side-by-side stacking
27 Wafer Level Bumping & Packaging - Wafer Level UBM - 27
28 Electroless NiAu / NiPdAu Plating & Bumping Services 1. E-less Bumping RFID attach by adhesive on antenna LCD driver 2. E-less UBM for solder ball attach Wafer Level CSP Flip chip 3. E-less OPM for fine pitch wire bonding 4. E-less Metallization for Power MOSFET application Automotive high rel./ high temp. wire bonding Copper wire bonding Wire bonding on active pad Aluminum or Copper Clip attached Wire bonding and soldering 28
29 Process Flow Ni/Au & Ni/Pd/Au Bumping Al Pad Cu Pad Zinkating Pd Seed Ni Plating Flash Au Pd Barrier Flash Au UBM for FC & WLCSP OPM for Wire Bonding 29
30 PacLine 300 A50 ENEPIG Plating Systems in the major OEM s 300 mm 30
31 Thank you for your attention! Sebastian Hahn Sales Manager PacTech Packaging Technologies GmbH Am Schlangenhorst 15-17, Nauen, Germany +49 (0) (0) (0)
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