Glass: Enabling Next-Generation, Higher Performance Solutions. Peter L. Bocko, Ph.D CTO Glass Technologies 5 September 2012

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1 Glass: Enabling Next-Generation, Higher Performance Solutions Peter L. Bocko, Ph.D CTO Glass Technologies 5 September 2012

2 Forward Looking And Cautionary Statements Certain statements in this presentation constitute forward looking statements within the meaning of the U.S. Private Securities Litigation Reform Act of Such forward looking statements are based on current expectations and involve certain risks and uncertainties. Actual results might differ from those projected in the forward looking statements. Additional information concerning factors that could cause actual results to materially differ from those in the forward looking statements is contained in the Securities and Exchange Commission filings of the Company and at the end of this presentation. 2

3 Outline Glass has a history of outstanding cost and capability in high performance applications in display Next-generation packaging needs new material solutions Glass as a contributor to 3D-IC technology can enable higher performance in mobile devices. Glass can enhance next-generation devices in fundamental ways: Process Efficiency Capability for interposers (through-glass-vias) Ultra-slim glass is an emerging capability with potential for 3D-IC. 3

4 Glass Can Be A Transformational Material in Semiconductor Packaging Specialty glass delivers enabling attributes for semiconductor applications Thin Superior Optical Qualities Uniform & Isotropic Green Superior Mechanical Attributes Precision Surface 4

5 Fusion-Formed Glass Provides Solution to Both Quality Needed & Process Expected Optical Melting + Precision Fusion Technology Innovative Glass Composition Superior Glass Substrate Products Scalable No thinning No polishing As-formed surface (no CMP) Customizable physical, thermal & electrical properties Intrinsic strength Scalable System Solution 5

6 Thinner Glass Has Been Increasingly Employed In Evolving Applications of Display Substrates & Cover Glass Gen Size Glass Thickness (mm) Thin m 1 0.5m 1.0m m 6 2.0m 7 2.5m 8 3m 10 Flexible display & electronics e-paper, continuous roll-to-roll component manufacture Mobile LCD panels & touch sensor plates Mobile LCD panels, cover glass, touch sensor plates for notebooks, net-books & mobile internet devices Slates, notebooks, monitors & TVs, small & medium size touch sensors & cover glass Commercial availability Scheduled Development Proposed TV & desktop monitors. Large size cover glass & touch sensor plates 6

7 Highly Engineered Glass Can Be Both Durable and Clear Superior Mechanical Attributes 7

8 Glass Can Contribute to 3D-IC Technology Enabling Higher Performance Devices Glass as a Carrier Glass an Interposer or PCB IC Glass Interposer IC Glass PCB Glass can be extraordinarily uniform and isotropic Fusion glass can be extraordinarily flat Composition can be tailored for the specific material properties Can be manufactured to final thickness without polishing Flexible in size and format Robust display glass ecosystem can be adapted to semiconductor packaging 8

9 Glass Enables Cost-Effective Solutions For High Volume Manufacturing Ideal Properties Options for High Volume Manufacturing Ultra-High Resistivity, Low Dielectric Constant, Ultra-Low Electrical Loss Tailorable CTE for SMT-to-Board Thin, Ultra-Thin, Ultra-Flat Emerging Approaches To Vias Large Area (Wafer Panel Roll) Tailorable Thermal Dissipation With Cu TPV Source: GaTech 9

10 Possible Path for Higher Production of Interposers Large Area (Wafer Panel Roll) Roll-to Roll Panel Wafer 10

11 Continued Progress to Ultra-Flat Thin, Ultra-Thin, Ultra-Flat Champion Wafer Specs (a) Average TTV = 0.8 µm (b) Average Flatness = 17 µm 11

12 Thermal Reliability Ultra-High Resistivity, Low Dielectric Constant, Ultra-Low Electrical Loss Glass flexibility with respect to CTE allows for better management of stack warp. Si Interposer Glass Interposer 3 ppm/ C ~3 ppm/ C 3ppm/ C ~8-10 ppm/ C 15 ppm/ C 15 ppm/ C Silicon 2.5D Interposer Glass 2.5D Interposer 12

13 Higher Bandwidth Ultra-High Resistivity, Low Dielectric Constant, Ultra-Low Electrical Loss Signal Path Delays in 3D-IC Total Signal Path Delay (ps) Best Case Worse Case 10-30µm 0.1-1µm oxide liner Traditional Silicon Interposer 5-10µm 3D ICs with TSV 0.1-1µm oxide liner 10-30µm NO liner needed GT 3D Glass Interposer Source: GaTech PRC 13

14 Glass Electrical Properties Significantly Reduce Signal Loss Signal Loss Measured at Georgia Tech Ultra-High Resistivity, Low Dielectric Constant, Ultra-Low Electrical Loss 6.2mm CPW in Glass Interposer 1.0mm CPW in Wafer Si Interposer Insertion Loss/mm at 10 GHz: Glass interposer: 0.06 db Wafer-Si interposer: 1.16 db CPW = Coplanar Waveguide 10x lower signal loss in glass for a 6x longer interconnect than silicon (~60x lower leakage improves power efficiency) Source: GaTech PRC 14

15 Glass Interposer Reduces Power Consumption of High Bandwidth Interconnects Interposer Technology Ultra-High Resistivity, Low Dielectric Constant, Ultra-Low Electrical Loss Glass 128 Larger Driver Size = Higher Power Consumption Wafer Si Transistors per I/O Driver Glass 180 Wafer Si Cannot Transmit Data Signal Delay (ps) 32 Transistors per I/O Driver Glass interposer enables high bandwidth with smaller I/O drivers leading to low power consumption at system level Higher parasitics of Wafer Si signal lines necessitates larger I/O drivers requiring higher power Significant reduction in signal delay in glass also enables higher data rates Source: GaTech PRC 15

16 Demonstration Vias in High Quality Glass Substrates Emerging Approaches to Vias Ultra-slim glass has significant opportunities to simplify TGV manufacturing processes. Capabilities up to 300mm wafers and panels up to 0.5M 11,716 holes 2,500 holes 30 µm Diameter Blind Holes X-SEM Cu Filling Performance With TGV Substrate Based On Corning Fusion Glass Fully Patterned Wafers With 100,000s of holes Blind Via Diameter ~ 27 µm 16

17 Flexible Glass Applications Roadmap Lab-scale Device Demos Initial Commercial Products Next-Generation Technologies HP Oxide TFTs OLED or LCD Color Filter Flexible display E-Paper WMU / CAMM Organic PV ITRI-DTC Ch-LC display ProCap Touch Sensor OLED lighting Organic PV University of Stuttgart TFT-LCD Flexible CIGS PV panels Roll-to-roll displays Glass with Vias

18 The Final Word For more than 160 years, our scientists and engineers have taken advantage of the technical and aesthetic properties of glass to drive new innovations We re amazed by its strength, stability, versatility, and complex engineering No other material provides such a perfect marriage of form and function. Wendell P. Weeks, Chairman & CEO, Corning Incorporated 18

19 Forward Looking And Cautionary Statements This presentation contains forward looking statements that involve a variety of business risks and other uncertainties that could cause actual results to differ materially. These risks and uncertainties include the possibility of changes or fluctuations in global economic conditions; currency exchange rates; product demand and industry capacity; competitive products and pricing; availability and costs of critical components and materials; new product development and commercialization; order activity and demand from major customers; capital spending by larger customers in the telecommunications industry and other business segments; the mix of sales between premium and non-premium products; possible disruption in commercial activities due to terrorist activity and armed conflict; ability to obtain financing and capital on commercially reasonable terms; acquisition and divestiture activities; the level of excess or obsolete inventory; the ability to enforce patents; product and components performance issues; and litigation. These and other risk factors are identified in Corning s filings with the Securities and Exchange Commission. Forward looking statements speak only as of the day that they are made, and Corning undertakes no obligation to update them in light of new information or future events. 19

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