2015 European Microelectronics Packaging Conference (EMPC 2015)

Transcription

1 205 European Microelectronics Packaging Conference (EMPC 205) Friedrichshafen, Germany 4-6 September 205 IEEE Catalog Number: ISBN: CFP554H-POD

2 Copyright 205, IMAPS Europe All Rights Reserved ***This publication is a representation of what appears in the IEEE Digital Libraries. Some format issues inherent in the e-media version may also appear in this print version. IEEE Catalog Number: CFP554H-POD ISBN (Print-On-Demand): Additional Copies of This Publication Are Available From: Curran Associates, Inc 57 Morehouse Lane Red Hook, NY 257 USA Phone: (845) Fax: (845) curran@proceedings.com Web:

3 conference program sunday AT A GLANCE 2:00 6:00 pm Early Registration 6:00 7:30 pm Welcome Reception sponsored by Dupont Location: Exhibition area Polarized optical micrograph of multi-layers of microparticles. Hyperconnect

4 monday AT A GLANCE 8:30 am 9:30 am 9:50 am 0:25 am :00 am :40 am 2:55 pm 2:00 pm 3:40 pm 4:50 pm Registration Opening session Keynote Keynote 2 Exhibition opening & coffee break Session.: Si Substrate Technologies Session.2: Thermal Design & Materials Lunch break sponsored by inemi Session 2.: Bonding Materials and Processes Session 2.2: MEMS Packaging Coffee break & Poster Session A Session 3.: PCB Technology Session 3.2: Progress in LED Packaging Organic crystals within a Microparticle bed Hyperconnect 6

5 Monday :30 am :40 am 8:30 9:30 am Registration 9:30 9:50 am Opening session e ome to M 205 General Chair: Martin Schneider-Ramelow a ts ig res o M 205 Technical Chair: Markus Detert e ome ddress State Secretary Günther Leßnerkraus / Ministry of Finance and Economy Baden-Württemberg 9:50 0:25 am Keynote : Changes Along the Electronics Value Chain Packaging as a Key Enabler Dr. Michael Alexander, Roland Berger Strategy Consultants GmbH 0:25 :00 am Keynote 2: Industry Consortium for New Era of Automotive Electronics with Entire System-on-Package Vision at Georgia Tech 9 Prof. Rao Tummala & Prof. Klaus Wolter Microsystems Packaging Research Center (PRC) Georgia Tech, USA :00 :40 am Exhibition opening & coffee break Location: Exhibition area

6 Monday 4.9. :40 am 3:40 pm. Si Substrate Technologies Session Chairs: Markku Tilli, Okmetic Oyj Jürgen M. Wolf, Fraunhofer IZM :40 am Ultra-Thin High Density Capacitors for Advanced Packaging Solutions Konrad Seidel, Wenke Weinreich, Mathias Böttcher 2, Stephan Dobritz 2, Malte Czernohorsky Fraunhofer IPMS-CNT, Germany; 2 Fraunhofer IZM-ASSID, Germany 24 2:05 pm Development of a Statistical Approach for DNA-based Nanowires Electrical Study Christophe Brun, Cheikh-Tidiane Diagne, Corentin Carmignani, Simona Torrengo 2, Pierre-henri Elchinger 3, Patrick Reynaud, Aurelie Thuaire, Didier Gasparutto 2, Raluca Tiron, Arianna Filoramo 4, Xavier Baillin CEA DRT / LETI, MINATEC Campus, France; 2 CEA DSM/INAC, France; 3 CEA DSV / IRTSV, France; 4 CEA DSM / IRAMIS, France 29 2:30 pm Advanced Interposers with Metali ed Through Via Satoru Kuramochi, Sumio Koiwa, Takamasa Takano, Miyuki Akazawa, Hiroshi Mawatari, Kousuke Suzuki, Yoshitaka Fukuoka 2 0 Dai Nippon Printing Ltd, Japan; 2 Worldwide Electronic Integrated Substrate Technology, Japan 35 2:55 2:00 pm Lunch Break sponsored by inemi Location: Exhibition area 2 2. Bonding Materials and Processes Session Chairs: Martin Schneider-Ramelow, Fraunhofer IZM Karl-Heinz Drüe, Ilmenau University of Technology 2:00 pm "Non-piercing" a Must for Flip Chips! Matthias Lorenz AEMtec, Germany 57 2:25 pm Ni Sn Solid-liquid Interdiffusion (SLID) for Thermo-electric Elements in Extreme Environments Bond Layer Thickness 6 Andreas Larsson,2, Torleif A Tollefsen 3, Ole Martin Løvvik 4, Knut E Aasmundtveit 2 TECHNI AS, Borre, Norway; 2 HBV Buskerud and Vestfold University College, Borre, Norway; 3 TEGma AS, Kristiansand, Norway; 4 SINTEF Materials & Chemistry, Oslo, Norway 2:50 pm Analysis of Soldering Processes Using In-Situ X-Ray Observations Alexander Klemm, Martin Oppermann, Thomas Zerna Technische Universität Dresden, Germany 67 3:5 pm Assembly and Packaging of Micro Systems by Using Reactive Bonding Processes Axel Schumacher, Ulrike Gaiß, Stephan Knappmann, Georg Dietrich 2, Stefan Braun 2, Erik 2, Frank Roscher 3, Klaus Vogel 3, Dirk Kähler 4, Wolfgang Reinert 4 Hahn-Schickard-IMIT, Villingen-Schwenningen, Germany; 2 Fraunhofer IWS, Dresden, Germany; 3 Technical University Chemnitz, Germany; 4 Fraunhofer ISIT, Itzehoe, Germany 73

7 .2 Thermal Design & Materials Session Chairs: Jens Müller, Ilmenau University of Technology Klaus-Jürgen Wolter, Microsystems Packaging Research Center (PRC) Georgia Tech, USA Location: Ludwig-Dürr-Hall Thermally Enhanced Power Fan-Out WLP Demonstrator Steffen Kroehnert, André Cardoso, Mariana Pires, Raquel Pinto, Gusztáv Hantos 2 NANIUM S.A., Portugal; 2 EET BME, Hungary 4 Cutting the Cost of Packaging with Nano-ceramic Substrates Giles Humpston Cambridge Nanotherm Ltd, United Kingdom 49 Quantifying the Thermal Conductivity Enhancement of Percolating Thermal Under lls 53 Brian R. Burg, Jonas Zürcher, Gerd Schlottig, Xi Chen, Thomas Brunschwiler IBM Research - Zurich, Switzerland 2.2 MEMS Packaging Session Chairs: Bertram Schmidt, OVGU Magdeburg Gilles Poupon, CEA-Leti Minatec Location: Ludwig-Dürr-Hall Challenges of Wafer-Level MEMS Packaging Sebastian Schuler-Watkins, Ralf Reichenbach, Uwe Hansen Robert Bosch GmbH, Germany 79 Flexible Packaging by Film Assisted Molding for Microintegration of MEMS Based Sensors D. Hera, J. D. Schulze Spüntrup 2, T. Günther, A. Berndt 2, C. Reuter 2, C. Harendt 2, K.-P. Fritz, H. Kück, A. Zimmermann Hahn-Schickard-IMAT e.v., Stuttgart, Germany; 2 Institute for Microelectronic, Stuttgart, Germany 83 Flip-Chip MEMS Microphone Package with Small Front and Large Back Volume Sebastian Walser, Christian Siegel 2, Matthias Winter 2, Wolfgang Pahl 2, Anton Leidl 2, Gregor Feiertag, 2 University of Applied Sciences Munich, Germany; 2 EPCOS AG, Germany 89 In uence of Sensor-Package Hermeticity-Level on Long-Term Drift for a Pie oresistive MEMS Pressure-Sensor 94 Åsmund Sandvand, 2, Einar Halvorsen, Knut E. Aasmundtveit, Henrik Jakobsen HBV Buskerud and Vestfold University College, Borre, Norway; 2 Memscap AS, Skoppum, Norway

8 Monday :40 pm 6:30 pm 3:40 4:50 pm Coffee break & Poster Session A Session Chairs: Nihal Sinnadurai, IMAPS Europe ELC Karl-Heinz Drüe, Ilmenau University of Technology Location: Poster area 3 3. PCB Technology Session Chairs: Artem Ivanov, University of Applied Sciences Landshut Lutz-Günter John, VDI VDE IT 4:50 pm Nickel-free Final Surface Finishs in the Electronics Industry Norbert Sitte, Andreas Gross Umicore Galvanotechnik GmbH, Schwäbisch Gmünd, Germany 99 5:5 pm 5:40 pm 6:05 pm Thin Film Based LCP Multi Layer Circuits: Manufacturing Technology and Characteri ation 03 Alexander Kaiser, Karin Ruess, Paul Matej, Christian Herbort, Carlos Maximilian Bee, Günther Bauböck 2, Karl-Heinz Fritz 3 Cicor Advanced Microelectronics & Substrates, Ulm, Germany; 2 Cicor Advanced Microelectronics & Substrates, Radeberg, Germany; 3 Cicor Advanced Microelectronics & Substrates, Boudry, Switzerland Combining Organic and Printed Electronics in Hybrid System in Foil (HySiF) Based Smart Skin for Robotic Applications 09 Mahadi-Ul Hassan, Christine Harendt, Jürgen Keck 4, Hagen Klauk 5, Jan Kostelnik 3, Stefan Saller 2, Alina Schreivogel 3, Tarek Zaki, Joachim N. Burghartz Institute für Mikroelektronik Stuttgart, Germany; 2 Festo AG & Co. KG, Esslingen, Germany; 3 Würth Elektronik GmbH & Co. KG, Rot am See, Germany; 4 Hahn-Schickard-Gesellschaft, Institut für Mikroaufbautechnik, Stuttgart, Germany; 5 Max-Planck-Institut für Festkörperforschung, Stuttgart, Germany Innovative Solutions for Systems Based on Embedding of Thin Components into Flexible Printed Circuit Boards 5 Jürgen Wolf, Muhammad Samir Alshahed 2, Thomas Gneiting 3, Christine Harendt 2, Jan Kostelnik, Andreas Kugler 4, Enno Lorenz 4 Würth Elektronik GmbH & Co. KG, Rot am See, Germany; 2 Institut für Mikroelektronik Stuttgart, Stuttgart, Germany; 3 AdMOS GmbH, Frickenhausen, Germany; 4 Robert Bosch GmbH, Renningen, Germany

9 Hyperconnect Polarized optical micrograph of a single layer of microparticles 3.2 Progress in LED Packaging Session Chairs: David Whalley, Loughborough University Krzysztof Nieweglowski, TU Dresden, Electronics Packaging Laboratory Location: Ludwig-Dürr-Hall Direct Attach LED Soldering by New Printable AuSn Paste Abdenacer Ait Mani, Manon Arch CEA Grenoble, France 9 A Micro-display Consisting of LED Pixels on an 80 μm Pitch Sarkar Mahbub Akhter, Jun Su Lee, Pleun Maaskant, Marc Rensing, Noreen Nudds, Peter O'Brien, Patrick Degenaar 2, Brian Corbett Tyndall National Institute, Cork, Ireland; 2 Newcastle University, Newcastle, UK 24 Highly Reliable Thick Film Solutions for Power LEDs and Electronics Paul Gundel, Melanie Bawohl, Mark Challingsworth 2, Christoph Czwickla, Ilias Nikolaidis, Virginia Garcia 2, Christina Modes, Ryan Persons 2, Jessica Reitz Heraeus Deutschland GmbH & Co. KG, Hanau, Germany; 2 Heraeus Precious Metals North America Conshohocken LLC, USA 29 Thermal Simulations and Design Propositions for LEDs Used in Automotive Applications Guillaume Thin, Zdravko Zojceski, Jean-Baptiste Millet 2, Y. Alayli 2, Valeo Lighting Systems, Paris, France; 2 LISV, Velizy, France 33

10 tuesday AT A GLANCE 8:30 am 0:0 am 0:45 am 2:25 pm :35 pm 2:50 pm 3:55 pm 5:5 pm 7:00 pm Session 4.: Solder Joint Reliability Session 4.2: Advanced Adhesive Materials Session 4.3: Innovative Ceramic based Circuit Platforms and Technologies for Telecommunication Satellites I Coffee break Session 5.: Ag Sintering Session 5.2: Design for Reliability and Functionality Session 5.3: Innovative Ceramic based Circuit Platforms and Technologies for Telecommunication Satellites II Lunch break sponsored by ASE Group Session 6.: Embedding for Power Modules Session 6.2: Optoelectronic Packaging Session 6.3: Hyperconnect Workshop: Percolating Thermal Coffee break & Poster Session B Session 7.: Packaging and Encapsulation Session 7.2: Advances in Wirebonding Session 7.3: Hyperconnect Workshop: Neck-based Electrical Interconnects Keynote 3 Gala Dinner and Three Country Boat Trip

11 Tuesday :30 am 0:45 am 4 4. Solder Joint Reliability Session Chairs: Vesa Vuorinen, Aalto University Mathias Nowottnick, Universität Rostock 8.30 am 37 Solder Paste Residue Corrosivity Assesment: Bono Test Emmanuelle Guene, Celine Puechagut, Anne Marie Laugt, Richard Anisko INVENTEC Performance Chemicals, Paris, France 8:55 am 9:20 am 9:45 am The Effect of Thermal Stress on the Reliability of low Ag Solder Joints in High Power LEDs 44 Miriam Rauer, Timo Schreck, Stefan Härter 2, Michael Kaloudis University of Applied Sciences Aschaffenburg, Germany; 2 University of Erlangen-Nuremberg, Germany Comparative Tests for Lead-Free Solder Bumps René P. Zingg, Ricardo Geelhaar 2, Chan Myat 3, Armin Struwe 3, Evstatin Krastev 3 Zinan GmbH, Ismaning, Switzerland; 2 Pactech GmbH, Nauen, Germany; 3 Nordson Dage Ltd, UK Effects of Component Stand-off Height on Reliability of Solder Joints in Assembled Electronic Component 53 Jude E Njoku, Sabuj Mallik, Raj Bhatti, Emeka H Amalu 2, B Ogunsemi 2 University of Greenwich, London, UK; 2 University of Wolverhampton, UK Workshop: Innovative Ceramic based Circuit Platforms and Technologies for Telecommunication Satellites I Session Chair: Jens Müller, Ilmenau University of Technology Location: Alfred-Colsman-Hall 8:30 am 8:55 am Needs and Approaches for Flexible Modules of Future Telecommunication Satellites Michael Schneider Airbus DS GmbH, Germany An Analog Optical Transmitter Module with a Passive Aligned Fiber Based on a Flip Chip Mounted VCSEL N/A Tilo Welker, Sumy Mathew, Steffen Spira, Ralf Stephan, Nam Gutzeit, Jens Müller, Matthias A. Hein Ilmenau University of Technology, Ilmenau, Germany N/A 9:20 am 9:45 am Barium Hexaferrite Thin-Films for Self-Biased Nonreciprocal Devices Frauke Gellersen, Arne Jacob Technical University Hamburg-Harburg, Germany N/A Tolerance-Optimized Microwave Power Dividers in LTCC Peter Uhlig, Tobias Klein, Carsten Günner, Reinhard Kulke, Jordi Balcells IMST GmbH, Kamp-Lintfort, Germany N/A

12 4.2 Advanced Adhesive Materials Session Chairs: Jan Felba, University of Wroclaw Gregor Feiertag, Hochschule München Location: Ludwig-Dürr-Hall Assembly of Transducer Array Using Anisotropic Conductive Film for Medical Imaging Applications 57 Hoang-Vu Nguyen, Trym Eggen 2, Knut Aasmundtveit Buskerud and Vestfold University College, Borre, Norway; 2 GE Vingmed Ultrasound AS, Norway Improvement of Connectivity in CU/OSP Flip Chip Package Using Slow Cure NCP Masaaki Hoshiyama, Yuusuke Kamata, Makoto Kobayashi, Hiromi Sone, Hiroki Myodo, Toyokazu Hocchi Namics Corporation, Niigata, Japan 63 New MEMS DA Adhesives for Screen Printing Tobias Königer, Ralf Kmeth DELO Industrial Adhesives, Windach, Germany 67 Development of Bimodal Electrically Conductive Pastes with Ag Micro- and Nano- llers for Printing Stretchable E-textile Systems 73 Masahiro Inoue, Yosuke Itabashi, Yasunori Tada Gunma University, Kiryu, Japan 0:0 0:45 am Coffee break Location: Exhibition area Fluorescent liquid trapped in the HyperConnect logo Hyperconnect 25

13 Tuesday :45 am :35 pm 5 5. Ag Sintering Session Chairs: Martin Schneider-Ramelow, Fraunhofer IZM Luigi Calligarich, IMAPS Italy 0:45 am :0 am :35 am Electrical, Thermal and Mechanical Characterization of Low Temperature, Pressure-less Sintered Silver Bond Interfaces 78 Tilo Welker, Jens Müller, Frank Krämer 2, Steffen Wiese 2 Ilmenau University of Technology, Ilmenau, Germany; 2 Saarland University, Saarbrücken, Germany A Novel Approach in Silver Sintering for Reliable High Temperature Die-Attach in Power Electronics Through Aerosol-Jet Printing Technology 85 Aarief Syed-Khaja, Christopher Gruber, Johannes Hoerber, Joerg Franke Friedrich-Alexander-University of Erlangen Nürnberg, Germany Failure Analysis of Ag Sintered Joints after Power Cycling Under Harsh Temperature Conditions from +30 C up to +80 C 9 Constanze Weber, Matthias Hutter, Christian Ehrhardt 2, Klaus-Dieter Lang 2 Fraunhofer IZM, Berlin, Germany; 2 Technical University Berlin, Germany 2:00 Investigations on Power Cycling Induced Fatigue Failure of IGBTs with Silver Sintered Interconnects 98 Rainer Dudek, R. Döring, S. Rzepka, C. Erhardt 2, M. Hutter 2, J. Rudzki 3, F. Osterwald 3, R. Eisele 4, S. Stegmeier 5, K. Weidner 5, M. Rittner 6 Fraunhofer ENAS, Chemnitz, Germany; 2 Fraunhofer IZM, Berlin, Germany; 3 Danfoss Silicon Power GmbH; 4 University of Applied Sciences Kiel, Germany; 5 Siemens AG, Corporate Technology; 6 Robert Bosch GmbH, CR/APJ Workshop: Innovative Ceramic based Circuit Platforms and Technologies for Telecommunication Satellites II Session Chair: Charles E. Bauer, TechLead Corporation Location: Alfred-Colsman-Hall 0:45 am N/A Enhancement Activities for LTCC Manufacturing Dieter Johann Schwanke, Jürgen Pohlner, Thomas Rittweg Micro Systems Engineering GmbH, Berg, Germany :0 am Advanced LTCC Processes for Microwave Structures and Components in LTCC Jens Müller, Tilo Welker, Alexander Schulz Ilmenau University of Technology, Ilmenau, Germany N/A :35 am Hybrid Integration of Solid State Ampli er (SSPA) Cicor RHe Microsystems GmbH, Radeberg, Germany N/A 2:00 Sol Gel Thin Films on LTCC Ceramic Multilayers Enable their Use as Thin Film Substrates Heike Bartsch, Ulrike Brokmann, Robert Weiss, Edda Rädlein, Jens Müller, Boris Goj Ilmenau University of Technology, Ilmenau, Germany 229

14 5.2 Design for Reliability and Functionality Session Chairs: Matthias Petzold, Fraunhofer IWM Markus Detert, Otto-von-Guericke Universität Magdeburg. Location: Ludwig-Dürr-Hall The Role of Molding Compound Microstructure for Packaging Reliability Sander Gielen, Hartmut Fischer, Hasan Sadat Nabi 2, Laurens Weiss 3 TNO Eindhoven, Netherlands; CCGA Solder Column - Reliable Solution for Absorbing Large CTE Mismatch Martin Hart TopLine, Milledgeville, USA 22 In uence of Humidity on Reliability of Plastic Packages Tanja Braun, Jörg Bauer, Karl-Friedrich Becker, Ole Hölck, Hans Walter, Marius van Dijk, Rolf Aschenbrenner, Klaus-Dieter Lang 2 Fraunhofer IZM, Berlin, Germany; 2 Technical University Berlin, Germany 27 Design for Reliability of Au-Sn and Cu-Sn Based SLID Bond Vesa Vuorinen, Antti Rautiainen, Mervi Paulasto-Kröckel Aalto University, Helsinki, Finland 223 2:25 :35 pm Lunch break sponsored by ASE Group Location: Exhibition area

15 Tuesday 5.9. :35 pm 3:55 pm 6 6. Embedding for Power Modules Session Chairs: Rainer Dudek, Fraunhofer ENAS Aarief Syed-Khaja, Friedrich Alexander University of Erlangen Nürnberg :35 pm Thermal Improvement of Plastic Laminate Based LED Modules with Embedded Chips Andreas Munding, Martin Gruber, Tino Both, Michael Herfurth, Thomas Hammer, Dirk Schweitzer, Klaus Pressel, Andreas Waldschik 2, Elmar Baur 2, Axel Kaltenbacher 2 2 Osram GmbH, Regensburg, Germany 235 2:00 pm Embedded Power Electronics on the Way to be Launched Mike Morianz, Hannes Stahr AT&S AG, Austria 24 2:25 pm Development of Advanced Power Modules for Electric Vehicle Applications Dionysios Manessis, Lars Boettcher 2, Andreas Ostmann 2, Simon Whalley 3 Technical University Berlin, Germany; 2 Fraunhofer IZM, Berlin, Germany; 3 ILFA Feinstleitertechnik GmbH, Hannover, Germany Session Chair: Thomas Brunschwiler, IBM Research - Zurich Location: Alfred-Colsman-Hall :35 pm Enhanced Thermal Under lls by Bridging Nanoparticle Assemblies in Percolating Microparticle Beds N/A Jonas Zürcher, Severin Zimmermann, Brian R. Burg, Rahel Strässle, Xi Chen, Grzegorz Potasiewicz 2 2, Christian Hofmann 3, Mario Baum 3, Thomas Brunschwiler IBM Research - Zurich, Switzerland; 2 ICSC, Poland; 4 Fraunhofer ENAS, Chemnitz, Germany 2:00 pm 2:25 pm Advanced Mixed-Mode Bending A Powerful Method for Fracture Mechanical Interface Characterization of Electronic Packages N/A Juergen Keller, Gerd Schlottig 2, Thomas Brunschwiler 2, Martin Schulz, Bernhard Wunderle 3 AMIC Angewandte Micro-Messtechnik GmbH, Berlin, Germany; 2 IBM Research, Zurich, Switzerland; 3 Technical University of Chemnitz, Germany N/A Numerical Failure Prediction of Percolating Thermal Under lls Sridhar Ganesh Kumar, Uwe Zschenderlein, Florian Schindler-Saefkow 2, Brian R. Burg 3, Gerd Schlottig 3, Severin Zimmermann 3, Mario Baum 4, Thomas Brunschwiler 3, Bernhard Wunderle Technical University Chemnitz, Germany; 2 AMIC Angewandte Messtechnik GmbH, Berlin, Germany; 3 IBM Research - Zurich, Switzerland; 4 Fraunhofer ENAS, Chemnitz, Germany

16 6.2 Optoelectronic Packaging Session Chairs: Henning Schröder, Fraunhofer IZM Ulrich Fischer-Hirchert, Hochschule Harz Location: Ludwig-Dürr-Hall 252 Silicon Photonics Assembly Industrialisation Mark Andrew Shaw, Massimo Fere, Luca Maggi, Adamo Bazzotti STmicroelectronics, Milan, Italy Multichannel Optical Link Based on Polymer Multimode Waveguides for Board-level Interchip Communication 258 Krzysztof Nieweglowski, Lukas Lorenz, Klaus-Jürgen Wolter, Karlheinz Bock Technical University Dresden, Germany Wafer-Level Integration Technology for Multi Emitter High Power Fiber Coupled Lasers 265 Lukas Lorenz, Ralf Rieske, Klaus-Jürgen Wolter, Karlheinz Bock, Krzysztof Nieweglowski Technical University Dresden, Germany 2:50 3:55 pm Coffee break & Poster Session B Location: Poster area Chair: Nihal Sinnadurai, IMAPS Europe ELC Thomas Bartnitzek, MicroHybrid A dust particle trapped in a shallow sea of conductive silver ink Hyperconnect 29

17 Tuesday :55 pm :00 pm 7 7. Packaging and Encapsulation Session Chairs: Grace O'Malley, inemi, Klaus-Dieter Lang, Fraunhofer IZM 3:55 pm Development of a Microcamera with Embedded Image Processor Using Panel Level Packaging 27 Andreas Ostmann, Christian Boehme 2, Kai Schrank, Klaus-Dieter Lang Fraunhofer IZM, Berlin, Germany; 2 Technical University Berlin, Germany 4:20 pm 4:45 pm Evaluation of the Dielectric Cure Monitoring of Epoxy Molding Compound in Transfer Molding Process for Electronic Packages 275 Burcu Kaya, Jan-Martin Kaiser, Karl-Friedrich Becker 2, Tanja Braun 2, Klaus-Dieter Lang 3 Robert Bosch GmbH, Germany; 2 Fraunhofer IZM, Berlin, Germany; 3 Technische Universität Berlin, Germany Functionalized Sensor Packaging Based on Thermoset In ection Molding and Selective Metallization Technology 28 Stefan Beichter, Hagen Müller, Sascha Weser, Thomas Günther, Wolfgang Eberhardt, Heinz Kück, André Zimmermann Hahn-Schickard, Villingen-Schwenningen, Germany 7.3 Hyperconnect Workshop: Neck-based Electrical Interconnects Session Chairs: Maaike M. Visser Taklo, SINTEF Location: Alfred-Colsman-Hall 3:55 pm Copper Ink/Paste Considerations for the Formation of Interconnects Richard John Dixon, Kerry Yu Intrinsiq Materials, Farnborough, UK N/A 4:20 pm 4:45 pm N/A All-Cu Interconnects for Homogeneous and Heterogeneous Assemblies, Jonas Zürcher 2, Thomas Brunschwiler 2, Sridhar Ganesh Kumar 3, Daniel N. Wright, Maaike M. V. Taklo SINTEF, Trondheim, Norway; 2 IBM Research - Zurich, Switzerland; 3 Technical University Chemnitz, Germany N/A Use of Metal Coated Polymer Micro Particles for Electrical Interconnection Susanne Helland, Helge Kristiansen, Junlei Tao 2, David Whalley 2, Daniel N. Wright 3, Maaike M. V. Taklo 3, Conpart AS, Skjetten, Norway; 2 Loughborough University, UK; 3 SINTEF, Trondheim, Norway

18 7.2 Advances in Wirebonding Session Chairs: Thomas Bartnitzek, MicroHybrid Lars Rebenklau, Fraunhofer IKTS Location: Ludwig-Dürr-Hall Biased Humidity Degradation Model for Cu-Al Wire Bonded Contacts Based on Molding Compound Properties 287 Amar Mavinkurve, Rene Rongen, Orla O'Halloran, Leon Goumans, Michiel van Soestbergen, Mark Luke Farrugia NXP Semiconductors, Eindhoven, Netherlands Prospects of Wire Bonding as an Approach for Contacting Additive Manufactured Aerosol Jet Printed Structures 297 Christopher Kaestle, Johannes Hoerber, Florian Oechsner, Joerg Franke Friedrich-Alexander-University Erlangen-Nürnberg, Germany FEM Analysis of Ball- and Wedge Bond Techniques for the Interconnection Formation on Soft Die Bonds 303 Steffen Wiese, Frank Kraemer Saarland University, Saarbrücken, Germany 5:5 6:00 pm Keynote 3: Future 2050 the Most Important Technologies in the Decades to Come 30 Dr. Ulrich Eberl, Head of Innovation Communication, Siemens AG 7:00 :00 pm Gala Dinner and Three Country Boat Trip

19 wednesday AT A GLANCE 8:45 am 0:50 am :30 am :40 pm Session 8.: Challenges in 2.5D and 3D Packages Session 8.2: FEM Simulation & Reliability Coffee break Session 9.: Sensor Packaging Session 9.2: Advanced Ceramic Materials & Processes Closing session - Awards - Advance information on ESTC 206 and EMPC 207

20 Wednesday :45 am -.30 am 8 8:45 am 8. Challenges in 2.5D and 3D Packages Session Chairs: Steffen Kroehnert, NANIUM S.A. Alexander Kaiser, Cicor Advanced Microelectronics & Substrates Si Interposer with 0x00 um Copper TSVs for 2.5D Integration Kai Xue, Chongshen Song,2, Susu Yang, Zhenzhong Yong, Hengfu Li, Xiangmeng Jing,2, Uihyoung Lee 3, Wenqi Zhang,2 NCAP, Wuxi, People's Republic of China; 2 Chinese Academy of Sciences, Beijing, People's Republic of China; 3 Samsung Electronics Co., Ltd., Seoul, Republic of South Korea 324 9:0 am Low-Temperature Re ll Process for Through-Silicon-Vias (TSVs) in Stacked Ultra-Thin Chip-on-Wafer by Aerosol Jet Printed Silver 329 Saleh Ferwana, Jürgen Keck 2, Mahadi-Ul Hassan, Christine Harendt, Joachim N. Burghartz Institute for Microelectronics Stuttgart (IMS CHIPS), Germany; 2 Hahn-Schickard-Institute for Micro Assembly Technology (HSG-IMAT), Stuttgart, Germany 9:35 am Comparison of Passivation Materials for High Frequency 3D Packaging Application Xiaomin Duan, Mathias Böttcher 2, Stephan Dobritz 2, David Dahl 3, Christian Schuster 3, Ivan Ndip, Klaus-Dieter Lang Fraunhofer IZM, Berlin, Germany; 2 Fraunhofer IZM-ASSID, Dresden, Germany; 3 Technical University Hamburg-Harburg, Germany 335 0:00 am 3D RDL with Peripheral Interconnects for Wafer Level Packaging of Electronic Devices Ayad Ghannam, Alessandro Magnani, David Bourrier, Thierry Parra 3 DiS Technologies, Labège, France N/A 0:25 am ewlb Package for Millimeter Wave Application Ngoc-Hoa Huynh, Trotta Saverio, Maciej Wojnowski, Gerhard Haubner 2, Sebastian Pahlke 2, Jean Schmitt 2, Helmut Mayr, Johann Würtele, Uwe Rueddenklau, Ismail Nasr, Jagjit Singh Bal :50 :30 am Coffee break Location: Exhibition area

21 8.2 FEM Simulation & Reliability Session Chairs: Lars Böttcher, Fraunhofer IZM Berlin Thomas Bartnitzek, MicroHybrid Location: Ludwig-Dürr-Hall Application of the IForce Piezoresistive Silicon Based Stress Sensor for Prognostic and Health Monitoring Methods 344 Alicja Palczynska, Bulong Wu 2, Dae-Suk Kim 2, Przemyslaw Gromala, Bongtae Han 2, Tobias Melz 3 Robert Bosch GmbH, Reutlingen, Germany; 2 University of Maryland College Park, USA; 3 Fraunhofer LBF, Darmstadt, Germany Toward Meeting Automotive Reliability Requirements for Flip Chip Packages with Copper Pillar Bump Interconnection N/A Bradford J Factor, Christophe Zinck, Charles Lee ASE Group, Waterloo, Belgium Void Formation in Cu Sn Solid-Liquid Interdiffusion (SLID) Bonding Knut E Aasmundtveit, Thi-Thuy Luu, Kaiying Wang, Nils Hoivik HBV - Buskerud and Vestfold University College, Norway 350 Adequate Mechanical Characterization of PCB Copper Traces for 2nd Level FEM Simulations 356 Steffen Wiese, Frank Kraemer, Daniel Bruch Saarland University, Saarbrücken, Germany Evaluation of Pattern Scale Stress Effects of 28nm Technology during Wire Bond and Cu-Pillar Flip Chip Assembly 362 Eberhard Kaulfersch, Jürgen Auersperg, Dirk Breuer 2, Birgit Brämer, Sven Rzepka Fraunhofer ENAS, Chemnitz, Germany; 2 Globalfoundries Dresden, Germany Hyperconnect Crystal growth 35

22 Wednesday 6.9. :30 am 2:00 pm 9 9. Sensor Packaging Session Chairs: :30 am :55 am 2:20 pm 2:45 pm Manufacturing of Flexible (Ultra-)Thin Magnetic Field Sensors Daniel Ernst, Michael Melzer 2, Denys Makarov 2, Falk Bahr 3, Wilfried Hofmann 3, Oliver G. Schmidt 2, Thomas Zerna Technical University Dresden, Germany; 2 Leibniz Institute for Solid State and Materials Research Dresden, Germany; 3 Technical University Dresden, Germany Integrated High-frequency Sensors in Catheters for Minimally Invasive Plaque Characterization 373 Subhajit Guha, Ulrich Schumann 3, Farabi Jamal, David Wagner 2, Bertram Schmidt 2, Christian Wenger, Jan Wessel, Markus Detert 2 IHP GmbH Innovations for High Performance Microelectronics, Frankfurt (Oder), Germany; 2 Chair Otto-von-Guericke-University Magdeburg, Germany; 3 Otto-von Guericke-University Magdeburg, Germany Temperature Sensors Based on Thermoelectric Effect Lars Rebenklau, Paul Gierth, Angelika Paproth, Klaus Irrgang 2, Lutz Lippman 2, Axel Wodtke 3, Klaus Augsburg 3, Franz Bechtold 4, Klaus Augsburg 3 Fraunhofer IKTS, Dresden, Germany; 2 Temperaturmeßtechnik Geraberg GmbH, Martinroda, Germany; 3 Ilmenau University of Technology, Illmenau, Germany; 4 VIA electronic GmbH, Hermsdorf, Germany Very Compact, Water-Cooled SiPM Module for PET/MRT Applications Rainer Dohle, Ruben Perrone, Thomas Rittweg, Dr. Vladimir Chernyshev, Elke Beyer, Jörg Goßler, Ilaria Sacco 2, Peter Fischer 2 Micro Systems Engineering GmbH, Berg, Germany; 2 University of Heidelberg, Germany :0 pm Heat Sensitive Joining Method for Miniaturized Sensor Components in Medical Technology 390 David Wagner, David Ranisch, Bertram Schmidt, Markus Detert Otto-von-Guericke-University Magdeburg, Germany :40 2:00 pm Closing Session Awards Advance information on ESTC 206 and EMPC 207 Chairs: Martin Schneider-Ramelow, Fraunhofer IZM Markus Detert, IMAPS Deutschland e.v.

23 9.2 Advanced Ceramic Materials & Processes Session Chairs: Jens Müller, Ilmenau University of Technology Andrzej Dziedzic, Wroclaw University of Technology Location: Ludwig-Dürr-Hall Lamination of 3D Structures in LTCC Using Elastomer Bags Artem Ivanov, Andrej Besborodow, Gerhard Sattelberger University of Applied Sciences, Landshut, Germany 394 Solder Wettability and Solder Joint Reliability of Rapid Thermal Firing Thick Film Pastes Paul Gierth, Lars Rebenklau Fraunhofer IKTS, Dresden, Germany 400 LTCC Technology for Micro uidic Applications Based on the Gap Waveguide Topology Cristina Arenas-Buendia, 2, François Gallée, Alejandro Valero-Nogueira 2, Christian Person LabSticc- Institut-Mine-Télécom- Télécom Bretagne, Brest, France; 2 Universitat Politècnica de Valencia, Spain 407 Thick lm Ceramic Ready for MCM Interposer, Günter Reppe, Angela Rebs, Marcus Herrmann, Christopher Mauermann, Alexander Kaiser 2, Karl-Heinz Fritz 3 Cicor Advanced Microelectronics & Substrates, RHe Microsystems GmbH, Radeberg, Germany; 2 Cicor Advanced Microelectronics & Substrates, Reinhard Microtech GmbH, Ulm, Germany; 3 Cicor Advanced Microelectronics & Substrates, Cicorel AG, Boudry, Switzerland 42 Advancing Packaging Solutions Using 3D Capabilities of Ceramic Multilayers Torsten Thelemann, Thomas Bartnitzek, Karl-Heinz Suphan, Stefan Apel Micro-Hybrid Electronic GmbH, Hermsdorf, Germany 47 Hyperconnect 37

24 poster session A Monday :40 4:50 pm Session Chairs: Nihal Sinnadurai, IMAPS Europe ELC Karl-Heinz Drüe, Ilmenau University of Technology Location: Poster area A A2 Investigation of Fracuture Mechanisms and Bond-Line of Insert Bump Bonding Specimens 423 Jae Hak Lee, Jun Yeob Song, Tae Ho Ha, Chang Woo Lee, Seung Man Kim, Yong Jin Kim, Young Kang Lee Korea Institute of Machinery and Materials (KIMM), Republic of South Korea Wire Bonding of Au-coated Ag Wire: Wire Properties, Bondability and IMCs Formation Yi-Wei Tseng, Fei-Yi Hung, Truan-Sheng Lui National Cheng Kung University, Taiwan, Republic of China 427 A3 Bump Scaling and Shear Test Requirements René P. Zingg Zinan GmbH, Ismaning, Switzerland 43 A4 Isotropic Conductive Paste Based on Epoxy with Ag Coated Cu and SAC305 Solder Yong Sung Eom, Hak-Son Lee, Hyun-Cheol Bae, Kwang-Seong Choi, Jin-Ho Lee ETRI, Daejeon, Republic of South Korea 434 A5 Reliability Prediction for Textile Packages Hartmann Hieber ICR, Germany 439 A6 In uence of the PCB Attachment on the Mechanical Properties in Modal Analysis Boleslav Psota, Ivan Szendiuch, Alexandr Otáhal University of Technology, Brno, Czech Republic 444 A7 A Crack Propagation Analysis of Multilayer Ceramic Capacitors Joseph Al Ahmar, Steffen Wiese Saarland University, Saarbrücken, Germany 448

25 A8 Conformal Barrier and Seed Layers Deposition for Voids Free Copper Electroplating in High Aspect Ratio TSV 452 Susu Yang, Wan Cheng, Heng Wu, Chongshen Song, Wenqi Zhang NCAP, Wuxi, People's Republic of China A9 Functional Coating of Screens/Stencils for Thick- lm Application Ralf Weber KOENEN GmbH, Munich, Germany 456 A0 Design, Setup and Test of a Heterogeneous Module and Characterization by Stress Measurement Thomas Schreier-Alt, Claus Reitlinger 2, Franz Kaul 2, Thomas Metzger 2, Kees Revenberg 3 Fraunhofer IZM, Berlin, Germany; 2 EPCOS AG, Germany; 3 MASER, Netherlands 458 A WiCkeD Tool-Based Design Method for Divide-by-2 Circuits with Multiple Loads Raphael Ronald Noal Souza, Agord de Matos Pinto Jr., Yuzo Iano 2, Leandro Manera 2 IC-Brazil Program, Brazil; 2 State University of Campinas - Unicamp, Brazil 463 A2 Optimize Product Cost and Performance with System-level 3D Chip, Package, Board Co-design Humair Mandavia, Kazunari Koga, Ralf Brüning², Nikola Kontic³ Zuken, Inc. Milpitas, CA, USA; 2 Zuken GmbH, Paderborn, Germany; 3 Zuken UK Ltd, Bristol, UK 468 A3 Thermal Consideration for Systems with High Speed Memories Andy Heinig, Dimitrios Papaioannou, Robert Fischbach Fraunhofer IIS/EAS, Dresden, Germany 472

26 poster session B Tuesday :50 3:55 pm Session Chairs: Nihal Sinnadurai, IMAPS Europe ELC Thomas Bartnitzek, MicroHybrid Location: Poster area B B2 B3 Cost-Effective Thermoelectric Cooler Packaging Using Hybrid Cu Paste Hyun-Cheol BAE, Yong Sung EOM, Aesun Oh, Haksun Lee, Kwang-Sung Choi, Jin-Ho Lee ETRI, Daejeon, Republic of South Korea Temperature Stabilized Chip Expander,3,2,3, Jaroslav Jankovský,3, Václav Šimek Brno University of Technology, Brno, Czech Republic; 2 Central European Institute of Technology, Brno, Czech Republic; 3 SEANT Technology s.r.o., Brno, Czech Republic Investigation on the Suitability of Electrically Conductive Adhesives for the Die-Attachment of Power Devices 488 Eike Moeller, Lars Middelstaedt 2, Folkhart Grieger 2, Andreas Lindemann 2, Jürgen Wilde University of Freiburg, Germany; 2 Otto-von-Guericke-University, Magdeburg, Germany B4 Impact Strength of Sn-58mass%Bi/Cu Joints by Laser Process Hiroshi Nishikawa, Shinya Kubota Osaka University, Japan 493 B5 Application of the System Simulation Methodology for the Package Design and Optimization N/A Sergey Yuferev B6 Lapping and Polishing of Different LTCC Substrates for Thin Film Applications Nam Gutzeit, Michael Fischer, Heike Bartsch, Jens Müller Ilmenau University of Technology, Ilmenau, Germany 497

27 B7 B8 B9 B0 Fabrication of Elastic Bumps and Narrow Metal Patterning for Si Based Flexible Electronics 50 Joon Yub Song, Yongjin Kim, Chang Woo Lee, Tae Ho Ha, Jae Hak Lee, Seung Man Kim, Ju Yong Lee Korea Institute of Machinery and Materials (KIMM), Republic of South Korea CFD Simulations of Wave Soldering on Through-Hole Printed Circuit Assemblies Adam Yuile, Steffen Wiese, Heinz Wohlrabe 2 Saarland University, Saarbrücken, Germany; 2 Dresden University of Technology, Dresden, Germany 5 Electrical Tensile Test Hao-Wen Hsueh, Fei-Yi Hung, Truan-Sheng Lui, Li-Hui Chen National Cheng Kung University, Taiwan, Republic of China 55 Development of a New Piezoelectric Sensor to Measure Loads Sophie Engelsberger, Anton Harasim, Tobias Schmidt 2 University of Applied Sciences Landshut, Germany; 2 CeramTec, Germany 505 B B2 Large Area, Transparent Heaters Based on Carbon Nanotubes and Graphene Platelets for Heated Glass Application 520 Grzegorz Wroblewski, Marcin Sloma,2, Daniel Janczak, Lucja Sarapuk-Dybowska,2, Malgorzata Jakubowska,2 Warsaw University of Technology, Warsaw, Poland; 2 Institute of Electronic Materials Technology, Warsaw, Poland 524 Plasma Dicing 4 Thin Wafers Reinhard Windemuth Panasonic Automotive & Industrial Systems Europe GmbH