LED Lighting Module Technology Industry and Market Trends

Transcription

1 From Technologies to Market LED Lighting Module Technology Industry and Market Trends Sample September 2017

2 TABLE OF CONTENT (1/6) o ACRONYM P8 o OBJECTIVES OF THE REPORT P9 o AUTHORS OF THE REPORT P10 o WHAT'S NEW? P11 o EXECUTIVE SUMMARY P12 o LED MODULE INTEGRATION INTO LIGHTING SYSTEMS P38 System Integration Engineering Thermal Integration Electrical Insulation Rules Overview Details on Driver Classes Zhaga Guideline for Interchangeability of Light Sources Consortium Members The Dilemma What's New Since 2015? o LED MODULE INTEGRATION INTO LIGHTING SYSTEMS P48 The Different Types of LED Modules Taxonomy Middle Power vs. High Power vs. COB vs. AC vs. Custom vs. CSP Positioning (with integration of CSP LED) Geometry and Size Electrical Interfaces LED Module vs. LEDi Module The Case of Flexible LED Strips LED Market Volume and Revenue o ANALYSIS OF LED LIGHTING MODULES BY FUNCTION P58 Main Functions in LED Modules System Structure Parameter Interdependence Why Thermal Management is Required for LED Systems? Optical Design P63 A Large Panel of Optical Solutions Generic Optical Architecture in Lighting Focus on Reflectors Collimators, Lenses and Refractors - Materials & Process Material - Overview Focus on Silicon Optics Mixing Chamber Other type of optics Thin film µstructured (=micro lens array?) direction turning film Freeform optics Silicone coated with aluminium Complex optic in Soraa lamp 2

3 TABLE OF CONTENT (2/6) o ANALYSIS OF MAIN FUNCTIONS IN LED MODULES P80 Optical Design Case of harsh environment What is different? Where to expect defects Possible solutions Optical Architecture vs. LED Module Technology Overview Analysis per Application Mapping of visible players Market overview Split by type Split by material Substrates/PCB P91 Overview of Technologies FR4 vs MCPCB vs Ceramic Mapping of Players Market Overview By PCB type By Thermal Conductivity o ANALYSIS OF MAIN FUNCTIONS IN LED MODULES P110 Thermal Interface Materials Purpose and Role of TIM Criteria of Choice for a Thermal Interface Material Different Types of TIM Material Suppliers Overview Penetration Rate of TIM Market Overview Heatsink Technologies P123 Introduction Active Cooling vs. Passive Cooling Solutions Recent Developments Mapping of Identified Players Origin of Players 3

4 TABLE OF CONTENT (3/6) o ANALYSIS OF MAIN FUNCTIONS IN LED MODULES P131 Power Supply and Drivers Overview of Drivers The Different Driver Topologies Driver Topology vs. LED Module Technology AC Drivers Low Voltage DC Minigrids Driver Reliability Focus on Capacitor The Flicker Problem Summary and Trends P143 Focus on New PCB Material Market Overview Split by Function o ANALYSIS OF MIDDLE POWER LED MODULES P148 Drivers for Integration Why Middle Power LEDs for LED Modules? Overview of Standard Design Type of LEDs Focus on CSP LED Overview Difference with middle power LED Performance Aspects Substrate/PCB Thermal Management and Reliability Power and Voltage Drivers Optics ANALYSIS OF MIDDLE POWER LED MODULES P166 Focus on AC Middle Power LED Module Introduction Impact on Design Efficacy Cost Aspects Performance Standards for Luminaire Advantages and drawbacks (position of driver on PCB) Middle Power LED Module Market Volume and Revenue o ANALYSIS OF HIGH POWER LED MODULES P172 Introduction High Power LEDs vs. Middle Power LEDs vs. CSP LEDs High Power LED Modules vs. Middle Power LED Modules vs. CSP LED Modules The Different Type of High Power LED Modules High Power LEDs compared to CSP LEDs High Brightness and Large (HBL) Module Overview Substrate/PCB Drivers and Electrical Connections Thermal Management Optics High Quality of Light (HQL) Module Overview Beating CDM Lamp Evolution Multichannel Technology Phosphor Technology High Brightness and Compact (HBC) Module High Power LED Module Market Volume and Revenue 4

5 TABLE OF CONTENT (4/6) o ANALYSIS OF COB LED MODULES P189 Introduction COB Technology - A Compromise Solution Main COB Design Choices Chip Layout Trends High Lumen Density in COB Positioning of High Density COB Market Segmentation and Uses New COB Devices COB Evolution and Roadmap Ecosystem Interconnection Options for COB Comparison of Technology Holder Reliability Diversity and Compatibility Standardization Zhaga Influence Optics Overview Integration Management of System Performance Drivers Thermal Management COB LED Module Market Volume and Revenue o ANALYSIS OF CSP LED MODULES P220 Definition of CSP LED Devices Price Positioning of CSP LED Modules Impact of CSP LED Device on System/Module Design Thermal Management Optical Design Electrical Management Opportunities of CSP LED Modules CSP LED System/Module Performance in Application o ANALYSIS OF FLEXIBLE LED STRIPS P244 Flexible LED Strips at a Glance Flexible LED Strips vs. Rigid LED Strips Status of the Industry Differentiation Factors Overview Focus on Large Variety of Flexible LED Strip Types Focus on Quality Criteria Focus on Specific Products and Innovative Solutions Focus on Price Voltage Connectors Dust/Water Protection Adhesive Recent Developments Flexible LED Module Market Volume and Revenue 5

6 TABLE OF CONTENT (5/6) o LED MODULE MARKET SUMMARY P262 Application vs Module Technology LED Module Market Volume Excluding Flexible LED Module LED Module Market Revenue Excluding Flexible LED Module Total LED Module Market Revenue o LED LIGHTING MODULE INDUSTRY AND MARKET TRENDS P268 Introduction Status of The Package LED Industry P269 Introduction to LEDs History of LED Industry Overview Application Diversification Horticultural Lighting Automotive Lighting IR UV CSP Package LED Industry and Market Trends P283 Focus on General Lighting Applications Light quality CRI and its Limitations Diversity of index and evolution Human Centric Lighting: Definition LED LIGHTING MODULE INDUSTRY AND MARKET TRENDS P291 Focus on Automotive Lighting Focus on Horticultural Lighting Diversity of color LEDs Same evolution modules for general lighting? LED Industry in Main Challenges Smart Lighting Cost Efficacy Colour Shift CONCLUSION P297 APPENDIX - DEFINITIONS AND USES OF LED MODULES P302 Definitions LED Module in the Global LED Value Chain Luminaire Design Approach with a LED Module Benefits of LED Module for Integrator Overview Focus on Time and Cost Savings Impact on LED Module Type of LED Used Phosphor Modification Smart Lighting 6

7 TABLE OF CONTENT (6/6) o APPENDIX - LED LIGHTING MODULE INDUSTRY TRENDS P310 LED Lighting Module Industry Trends History of the LED Lighting Module Industry The SSL Chasm Main LED Module Suppliers (Excluding COB and Flexible LED Strips) Main COB LED Suppliers Main Flexible LED Strip Suppliers Non-COB LED Module Supplier vs. COB LED Module Supplier Origin of Players Overview Positioning of some LED Module Suppliers Example of Vossloh Schwabe Focus on Packaged LED Manufacturers Focus on Driver Manufacturers Focus on Optic, Luminaire and Connector Manufacturers o APPENDIX - PRESENTATION OF YOLE DÉVELOPPEMENT P327 7

8 OBJECTIVES OF THE REPORT PROVIDE A COMPREHENSIVE OVERVIEW OF LED LIGHTING MODULES, INCLUDING TECHNOLOGIES, MARKETS AND APPLICATIONS, MAIN FUNCTIONS AND INTEGRATION INTO LIGHTING SYSTEMS ANALYSE THE POSITIONING OF EACH LED LIGHTING MODULE TYPE, INCLUDING MID-POWER, HIGH POWER, COB AND FLEXIBLE STRIP,AND THE MAIN TECHNOLOGIES IN USE ANALYSE THE MAIN TECHNOLOGIES FOR EACH LED LIGHTING MODULE TYPE, INCLUDING PCB/ SUBSTRATE,TIM, HEATSINK, OPTICAL DESIGN, POWER SUPPLY AND DRIVER Detailed analysis of PCB,TIM, heatsink, secondary optics and power supply! ANALYSE THE LED LIGHTING MODULE INDUSTRY STRUCTURE AND FUTURE TRENDS PROVIDE AN OVERVIEW OF THE LED LIGHTING MODULE MARKET FORECAST ( ) IN VOLUME AND VALUE Detailed market analysis of PCB,TIM and secondary optics! 8

9 WHAT'S NEW? THE REPORTS PROVIDES A DETAILED ANALYSIS OF: Secondary optics, including penetration rates, market forecast in volume and revenue Substrate/PCB used in LED modules, including market forecast in volume and revenue split by type of PCB Thermal interface material including penetration rates and market forecast in revenue Heatsink with identified players and recent developments Power supply with focus on challenges to overcome such as capacitor reliability or flicker Note to customers of the previous version: This report is an update and some slides are similar to the previous report. We highlighted new slides with a box on top right corner. New Slide Note to new customers: This report provides an overview of the LED module industry and analyse each function in LED module (secondary optics, PCB, TIM, heatsink, power supply). The slides in the appendix will give you some definitions as well as an overview of the LED module industry. 9

10 ABOUT THE AUTHORS Biography & contact Pierrick Boulay Pierrick Boulay works as Market and Technology Analyst in the fields of LED, OLED and Lighting Systems to carry out technical, economic and marketing analysis at Yole Développement, the "More than Moore" market research and strategy consulting company. He has experience in both LED lighting (general lighting, automotive lighting ) and OLED lighting. In the past, he has mostly worked in R&D department for LED lighting applications. Pierrick holds a master degree in Electronics (ESEO - France). boulay@yole.fr Pars Mukish Pars MUKISH holds a master degree in Materials Science & Polymers (ITECH - France) and a master degree in Innovation & Technology Management (EM Lyon - France). Since 2015, Pars MUKISH has taken on responsibility for developing LED, OLED and Sapphire activities as Business Unit Manager at Yole Développement. Previously, he has worked as Marketing Analyst and Techno-Economic Analyst for several years at the CEA (French Research Center). mukish@yole.fr Artificial organ Sample 10

11 DEFINITIONS AND USES OF LED MODULES LED Module in the Global LED Value Chain LED MODULES LED Die/Chip Packaged LED Light/LED Module Light Source (Module + Driver) Luminaire Light System/ Solution Lumileds Philips Lighting From LED chip to LED lighting system, several steps of value drive the lighting industry. LED modules represent a bridge between the packaged LED offer and the luminaire shaped product. A significantly integrated LED package reduces the level of know-how necessary for lighting manufacturers, thereby enabling conventional lighting system manufacturers to have easier access to the technology. Basically, we can consider an LED module as a unit containing one or more LEDs with mechanical and optical components. It may contain additional components (e.g., connectors, resistors, ESD protection devices, lenses ). Generally, LED module is considered a replaceable item for use in a luminaire. An LED module represents a component/sub-system optimized for a given application scope. 11

12 LED MODULE INTEGRATION INTO LIGHTING SYSTEMS System Integration System integration is based on standardized interfaces and building blocks: LED module, driver, optic, electronic ( ). The design effort of the integrator is mainly focused on: The interfaces between these building blocks. The system performance qualification. Modular approach enable an easier integration of LED modules. Please note that lower efforts can be done on the LED module qualification which is under the responsibility of the LED module manufacturer / supplier. Modular architecture can be developed to easier upgrade of the building blocks ( allowing for short and efficient product development / evolution). With this strategy, companies benefit from: PCB / Connector Packaged LED Optic Improvement of LED performance (lm/w). LED cost decrease ($/lm). Thermal System Mechanical Assembly Work also for other components, such as driver ( ). Technology leverage Same LED module for different applications. Thermal redesign. Driver Optics redesign (and improvements). 12

13 LED MODULE INTEGRATION INTO LIGHTING SYSTEMS The Different Types of LED Modules - Positioning (Flux vs. Power Consumption vs. LES) Middle Power LED Module The middle power LED is a solution offering low power consumption and high flux. High flux High Power LED Module The middle power LED is a solution offering small lighting emitting surface and high flux. COB LED Module The COB module architecture is a solution offering good compromise between size of the light emitting surface, flux power and power consumption. COB MODULE CSP LED Module The CSP LED is a solution offering good compromise between flux power, power consumption and price. It is the smallest solution of LED market. LOW POWER LED The choice of the right LED module solution depends on requirements at application level, cost level ( ). Low power consumption Small light emitting surface 13

14 LED MODULE INTEGRATION INTO LIGHTING SYSTEMS LED Module Market Revenue ($M) Split by Module Type The LED lighting module market revenue represented a size of ~$4B in 2016 and is expected to reach $13.8B in

15 MAIN FUNCTIONS IN LED MODULES System Structure (1/2) LED Lighting Module Function Associated Components / Materials Thermal Management To dissipate heat produced by LEDs Substrate / PCB Thermal Interface Management / Material Heatsink Optical Design To shape the light emitted from LED Optics (Collimator / Reflector / Lens Plate / Diffusers ) Power Supply & Driver To realize AC to DC conversion External Driver Integrated Driver 15

16 OPTICAL DESIGN FOR LED MODULES Collimators, Lenses and Refractors - Reflectors vs. Collimators A LED is not a "plug and play" light source and it requires and optical management. Because most of LEDs emit with a Lambertian intensity distribution, LEDs must be associated to optics to shape the light. In this context, reflectors are mostly used when the size of the light source is large or when the light source consist of an array of dies under a common phosphor (typically COB module). As reflector do not capture all the light generated by LEDs, beam control is less efficient compared to a lens. Collimators are more adapted to small light sources and have the ability to capture most of the light generated by LEDs leading to a better beam control than reflectors. But if the light source is too large, it does not make sense to design a huge lens due to high manufacturing costs. Reflector Size of Light Source Large Small Glare Xxx Xxx Collimator Light Distribution Wide angle Narrow angle Thermal Stress Xxx Xxx Beam Control Xxx Xxx Cost Xxx Xxx Both optics have advantages and drawbacks and the choice of the secondary optic depends on multiple parameters such as light source or light distribution among others. Some hybrid optics have also been developed that combine a collimator at the bottom of a reflector for a better control of the light beam. Total Internal Reflection (TIR) lens (top) vs reflector (bottom) Source: Ledil Hybrid optic Source: Gaggione 16

17 THERMAL MANAGEMENT FOR LED MODULES - SUBSTRATE/PCB Overview of Technologies Flexible PCB Glass-epoxy PCB (FR4, CEM1, CEM3 etc.) Standard Xxx Metal Core Glass-Epoxy There are 5 main types / technologies of PCB used for LED module manufacturing. PCB for LED Module Metal Core PCB (Aluminum, Copper core) Standard Xxx Xxx Xxx Ceramic PCB (Al 2 0 3,AlN) Xxx Others Xxx 17

18 THERMAL MANAGEMENT FOR LED MODULES - SUBSTRATE/PCB Industry - Identified Manufacturers of Glass Epoxy PCB EUROPE AT&S (AT) NCAB Group (SW) Haeusermann (AU) SOUTH JAPAN TAIWAN Chin Poon Industrial Finpo PCB KOREA CHINA Kinwong Electronic Mankun Electronic NORTH AMERICA Cofan (US) SINGAPORE Opulent (SG) 18

19 THERMAL MANAGEMENT FOR LED MODULES - TIM Criteria of Choice for TIM - Overview Power to dissipate High bulk thermal conductivity Xxx Low cost Xxx Xxx Xxx Xxx Thermal Interface Material Xxx Electrically conductive/ insulating Xxx Ease of application Xxx Xxx 1 Maximum storage temperature and storage time Xxx Not carcinogenic Xxx Xxx Xxx Xxx Conformability 2 1. Xxx 2. Xxxx 19

20 THERMAL MANAGEMENT FOR LED MODULES - HEATSINK Heatsink Design vs. LED Module Technology Although the heatsink contributes to the design of the luminaire, it remains a part dedicated to cool the whole system. Shape, size, weight are directly the consequence of the total embedded thermal power and the thermal power density. Maximum heatsink required performance Middle power LED modules have low cooling needs due to their large surfaces and low embedded power. Some lighting products like T5 tubes don t need a heatsink. COB LED modules concentrate the light output on a small area, requiring good design of the thermal cooling system for performance and reliability management. No heatsink needed or low heatsink performance Moderate heatsink performance Passive cooling High heatsink performance Active cooling High power LED modules in general require large and efficient heatsinks. Active cooling is an option to reduce the size while getting the required thermal performance. 20

21 MIDDLE POWER LED MODULES Middle Power LEDs vs. CSP LEDs The main difference between CSP LEDs and middle power LEDs is its size as global size is close to the size of its die. Traditional Middle Power LEDs In average 3,0 x 1,4mm Up to 5,6 x 3,0mm CSP LEDs In average 0,65 x 0,65mm Up to 2,2 x 2,2 mm Single LED Package surface (mm²) Electrical performances of middle power and CSP LED CSP LEDs are much smaller LEDs than traditional middle power LEDs but can be driven at higher current due to their conception resulting in a better heat dissipation. Internal thermal resistance of CSP LEDs is lower than standard LED chip devices. Like middle power LEDs, a high number of CSP LEDs can be used to avoid the creation of hot spot in luminaire but the difference is the ability of CSP LED to produce more light than middle power LEDs. 21

22 HIGH POWER LED MODULES HQL Module - Phosphor Technology High CRI above 80 require a combination of X phosphors while CRI > 90 typically require X phosphors (however the use of a redder phosphor with a broad yellow/green also allows to reach slightly above 90 values). UV Chip Blue Chip Blue Phosphor Green Phosphor Yellow / Amber Phosphor Orange / Red Phosphor Red Chip CCT Typical CRI R9 X X X X Xxx Xxx Xxx X X 5000K to 8300K Xxx Low X X High Xxx Xxx X X 1800K Xxx High X X X Xxx 80 to 90 Xxx X X X Low Xxx Xxx X X X X Xxx Xxx Xxx X X X Xxx Xxx Xxx X X X Low (2700K) Xxx Xxx 22

23 COB LED MODULES New COB Devices - Main Areas of Development High CRI COB is the main area of development at short term. On the 55 COB LED manufacturers identified, 37 companies can be considered as innovators and 18 as followers. Within the 37 companies considered as innovators, main area of innovations are: 1. High CRI COB. 2. High Power COB. 3. Flip Chip on Board (FCOB). 4. Dual CCT COB. Related to high power density COB Related to Spectrum enhanced COB 5. Others (UV COB,AC COB, innovative connectors ). Remark: Total is not equal to 37 as some companies work on multiple areas of development regarding COB. 23

24 CONCLUSION UV applications IR applications Following packaged LED manufacturers, LED module manufacturers bet on niche applications to diversify. Horticultural applications Automotive lighting applications Tuneable white applications Smart lighting applications From general lighting to many other applications 24

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26 LED LIGHTING MODULE TECHNOLOGY INDUSTRY AND MARKET TRENDS Market & Technology report - September 2017 After wide use in general lighting applications, LED module manufacturers are now looking for new applications with higher margins. KEY FEATURES OF THE REPORT Get the sample of the report on Detailed technical and market analysis of functions in a LED module Analysis of the new trends in the LED module industry Overview of key applications targeted by LED module manufacturers LED lighting market volume and revenue forecast for WHAT S NEW The report provides a detailed analysis of: Secondary optics, including penetration rates, market forecasts for volume and revenue Substrates and PCBs used in LED modules, including market forecasts for volume and revenue, split by type Thermal interface materials including penetration rates and market forecast for revenue Heatsinks with identified players and recent developments Future trends and growth engines, including ultraviolet, automotive or horticultural lighting LED LIGHTING MODULE MARKET VALUE WILL TREBLE IN THE NEXT FIVE YEARS, DRIVEN BY MID-POWER MODULES Light Emitting Diode (LED) technology is increasingly penetrating general lighting applications, thanks to how easily integrators can use it. The LED lighting module market will therefore deliver a 22.6% compound annual growth rate from Mid-power LEDs can be used in almost all applications. Mid-power LED modules are therefore driving the market, providing 60% of 2016 s market revenues. High power LEDs are used only in applications requiring high luminous flux in a small module. As a result, the number of applications using high power LED modules is limited and associated revenues represent about 7% of market revenues. Chip-on-board (COB) LED modules provide a compromise on size, light emitting surface (LES) area, luminous flux and power consumption. COB LED modules can therefore be used in many applications, and lead the total LED module market in volumes shipped. But as these modules are relatively easy to manufacture in few Revenue (US$B) steps the associated average selling price is low. Consequently, COB LED modules represent only 20% of market revenue. Flexible LED strips can be directly used as LED lighting systems, mostly in indirect lighting applications. These modules can be easily implemented for residential and commercial lighting. Recent developments, like using LED chips instead of packaged LEDs on a flexible substrate, allow much higher efficiency, opening doors to new applications such as linear lighting. In this context, Yole Développement estimates that the LED lighting module market, including flexible LED strips, reached nearly $4B in 2016 and will grow to $13.8B by This report provides an in-depth analysis of each type of LED module, including technology, trends and market sizes. It covers the whole landscape of LED modules and their potential use in general lighting applications. LED lighting module market revenue forecast (Yole Développement, September 2017) ASSOCIATED COMPONENTS AND MATERIALS ARE TAKING ADVANTAGE OF LED MODULE GROWTH In a luminaire, LED modules are generally associated with components shaping the light, converting between alternating and direct current or enhancing thermal behavior. Secondary optics are almost always used in LED modules to optimize light extraction and contribute to the aesthetic effect of the product. There are two main types of secondary optics: collimators and reflectors. The first type is mainly used in clusters with mid-power LED modules, or individually with high-power LED modules. The second type is frequently used with COB LED modules due to

27 LED LIGHTING MODULE TECHNOLOGY INDUSTRY AND MARKET TRENDS REPORT OBJECTIVES Provide a comprehensive overview of LED lighting modules, including technologies, markets and applications, main functions and integration into lighting systems Analyse the positioning of each LED lighting module type, including midpower, high power, COB, flexible strip, and the main technologies in use Analyse the main technologies for each led lighting module type, including PCBs and substrates, TIMs, heatsinks, optical design, power supplies and drivers Analyse the LED lighting module industry structure and future trends Provide an overview of the LED lighting module market forecast for their large LES. Secondary optics generated $0.9B revenue in 2016, and are expected to generate $4.3B in Printed circuit boards (PCBs) are essential materials in the performance and reliability of LED modules. In the thermal management of LED modules an efficient conduction path has to be built to maintain a safe and optimal temperature. COB LED modules need to use high performance PCBs, such as Metal Core PCBs (MCPCBs) or ceramic PCBs, due to the high power density of these modules. But because COBs are small, so are their high performance PCBs. Also, the business is dominated by mid-power LED modules, LED lighting module Main functions in LED modules Function Thermal Management To dissipate heat produced by LEDs Optical Design To shape the light emitted from the LEDs Power Supply & Driver To realize AC to DC conversion which need low performance PCB materials such as FR4. The large size of these modules generates the highest volumes and revenues. The total LED module PCB business will generate more than $3.2B in revenue in Other components like Thermal Interface Materials (TIMs) and heatsinks are also important in the heat conduction path but generate less revenue. This report analyses the different functions associated with LED modules including secondary optics, PCBs, TIMs, heatsinks, and power supplies. It gives a comprehensive understanding of each function and its related markets, including volume and revenue forecasts. Associated components / materials Substrate / PCB Thermal Interface Management / Material Heatsink Optics including collimator, reflector, lens plate, diffusers... External Driver Integrated Driver (Yole Développement, September 2017) NEW APPLICATIONS EMERGE AS THE LED MODULE INDUSTRY LOOKS FOR GROWTH ENGINES General lighting isn t a blue ocean market any more, due to strong price pressure and intense competition. Therefore, LED module manufacturers are seeking growth engines, following the example provided by the packaged LED industry a few years ago. From general lighting to many other applications From general lighting (Yole Développement, September 2017) UV applications IR applications Horticultural applications Automotive lighting applications Tuneable white applications Smart lighting applications to many other applications As a consequence, industry players are diversifying and looking at what is happening in horticultural lighting, automotive lighting, smart lighting and going beyond visible light into the infrared (IR) or ultraviolet (UV) parts of the spectrum. All of these applications are emerging and the associated margins are much higher than for general lighting applications. The modules used in these applications require high levels of know-how and technical skill. LED module manufacturers targeting these new applications are betting integrators won t have the competencies needed and that high market demand will help them move higher in the value chain. A good example is Everlight. Initially positioned as a light source supplier, it then started developing COB technology. It is now seeking to enter the automotive lighting business, positioning itself as an advanced module supplier. Beyond visible light, UV and IR LED modules are increasingly used, pushed by rapidly growing applications like UV curing and IR surveillance cameras. Large numbers of LEDs are used in each module, and thermal management is crucial for performance, especially for UV applications. This report provides insights into the next growth engines and analyzes targeted applications. Additionally, it gives an overview of the future trends facing the LED module industry.

28 MARKET & TECHNOLOGY REPORT COMPANIES CITED IN THE REPORT (non exhaustive list) Acclaim Lighting, American Bright LED, APT, BAG, BJB, Bridgelux, Brightview Electronic, Cambridge Nanotherm, Carclo, CETC Huaying Electronics, Citizen, Cree, CTL, Edison, Edlan Lighting Technology, Elemental LED, Epitex, Everlight, Flexfire LED, Fusion optix, Futuro Lighting, Gaggione, GE Lighting, Harvard, Harvatek, Heatron, Helio, Helvar, Honglitronic, Hueyjann, Hugewin, HuiYuan, Itswell, KKDC, Kodenshi, LED Linear, LED Waves, Ledil, Ledman, Ledtech, LEDtronics, Ledxon, Lextar, LG, Lighten Corp, Lightspot, Lucent Lighting, Lumens, Lumichip, Lumileds, Lumimodule, Luminus Devices, Lustrous Technology, LWF, Molex, Neonica Polska, Nichia, NVC Lighting Technology, OML Technology, Opple, Optogan, Osram, ParagonLED, Philips Lighting, Powerlightec, Prolight, Rishang Optoelectronics, Samsung, Seoul Semiconductor, Shanghai Toplight Tech, Sharp, Shenzen Lingbenyang Industry, Shenzen Rebow Industrial, Shenzhen Refond, Smart Systems Controls, Sunpu-Opto, TCI, TCL Lighting, Thomas Research Product, Toyoda Gosei, Universal LED Solution, Universal Lighting Technology, Vishay, Vossloh-Schwabe, Wen Run Optoelectronics, Wooree LED, Xicato, Yi Ji Xi Guang, and more... TABLE OF CONTENTS (complete content on i-micronews.com) What s new? 11 Executive summary 12 LED module integration into lighting systems 38 > System Integration > Engineering > Thermal Integration > Electrical Insulation Rules - Overview - Details on Driver Classes > Zhaga - Guideline for Interchangeability of Light Sources - Consortium Members - The Dilemma - What s New Since 2015? LED module integration into lighting systems 48 > The Different Types of LED Modules - Taxonomy - Middle Power vs. High Power vs. COB vs. AC vs. Custom vs. CSP - Positioning with Integration of CSP LED - Geometry and Size - Electrical Interfaces - LED Module vs. LEDi Module > The Case of Flexible LED Strips > LED Market Volume and Revenue Analysis of LED lighting modules by function 58 > Main Functions in LED Modules - System Structure - Parameter Interdependence - Why is Thermal Management Required for LED Systems? > Optical Design - A Large Panel of Optical Solutions - Generic Optical Architecture in Lighting - Focus on Reflectors - Collimators, Lenses and Refractors - Materials and Processes - Materials Overview - Focus on Silicon Optics - Mixing Chamber - Other Types of Optics - Harsh Environments - Optical Architecture vs. LED Module Technology - Mapping of Visible LED Players - Market Overview > Substrates/PCB - Overview of Technologies - FR4 vs MCPCB vs Ceramic - Mapping of Players - Market Overview > Thermal Interface Materials - Purpose and Role of TIM - Criteria of Choice for a Thermal Interface Material - Different Types of TIM - Materials Suppliers Overview - Penetration Rate of TIM - Market Overview > Heatsink Technologies - Introduction - Active Cooling vs. Passive Cooling Solutions - Recent Developments - Mapping of Identified Players - Origin of Players > Power Supply and Drivers - Overview of Drivers - The Different Driver Topologies - Driver Topology vs. LED Module Technology - AC Drivers - Summary and Trends Analysis of mid-power LED modules 148 > Drivers for Integration > Why Mid-Power LEDs for LED Modules? > Overview of Standard Design > Type of LEDs > Focus on CSP LED > Performance Aspects > Substrate/PCB > Thermal Management and Reliability > Power and Voltage > Drivers > Optics > Focus on AC Mid-Power LED Module > Mid-Power LED Module Market Volume and Revenue Analysis of high power LED modules 172 > Introduction > The Different Types of High Power LED Modules > High Brightness and Large (HBL) Modules > High Quality of Light (HQL) Modules > High Brightness and Compact (HBC) Modules > High Power LED Module Market Volume and Revenue Analysis of COB LED modules 189 > Introduction > COB Technology - A Compromise Solution > Main COB Design Choices > Trends > High Lumen Density in COB > Positioning of High Density COB > Market Segmentation and Uses > New COB Devices > COB Evolution and Roadmap > Ecosystem > Interconnection > Holder Reliability > Diversity and Compatibility > Standardization > Zhaga Influence > Optics > Management of System Performance > Drivers > Thermal Management > COB LED Module Market Volume and Revenue Analysis of CSP LED modules 220 > Definition of CSP LED Devices > Price Positioning of CSP LED Modules > Impact of CSP LED Device on System/Module Design > Opportunities for CSP LED Modules > CSP LED System/Module Performance in Application Analysis of flexible LED strips 244 > Flexible LED Strips at a Glance > Flexible LED Strips vs. Rigid LED Strips > Status of the Industry > Differentiation Factors > Voltage > Connectors > Dust and Water Protection > Adhesive > Recent Developments > Flexible LED Module Market Volume and Revenue LED module market summary 262 > Application vs Module Technology > LED Module Market Volume and revenue Excluding Flexible LED Modules > Total LED Module Market Revenue LED lighting module industry and market trends 268 > Introduction Status of The Packaged LED Industry - Introduction to LEDs - History of LED Industry > Packaged LED Industry and Market Trends - Focus on General Lighting Applications - Focus on Automotive Lighting - Focus on Horticultural Lighting - LED Industry in Main Challenges Conclusions 297 Appendix - definitions and uses of LED modules 302 Appendix - LED lighting module industry trends 310 Appendix - presentation of Yole Développement 327 RELATED REPORTS Benefit from our Bundle & Annual Subscription offers and access our analyses at the best available price and with great advantages IR LEDS and VCSELs - Technology, Applications and Industry Trends UV LEDs - Technology, Manufacturing and Application Trends LED Packaging 2017: Market, Technology and Industry Landscape Find all our reports on AUTHORS Pars Mukish holds a master degree in Materials Science & Polymers (ITECH - France) and a master degree in Innovation & Technology Management (EM Lyon - France). Since 2015, Pars Mukish has taken on responsibility for developing LED, OLED and Sapphire activities as Business Unit Manager at Yole Développement. Previously, he has worked as Marketing Analyst and Techno-Economic Analyst for several years at the CEA (French Research Center). Pierrick Boulay works as Market and Technology Analyst in the fields of LED, OLED and Lighting Systems to carry out technical, economic and marketing analysis at Yole Développement, the More than Moore market research and strategy consulting company. He has experience in both LED lighting (general lighting, automotive lighting ) and OLED lighting. In the past, he has mostly worked in R&D department for LED lighting applications. Pierrick holds a master degree in Electronics (ESEO - France). Find more details about this report here:

29 ORDER FORM LED Lighting Module Technology Industry and Market Trends BILL TO Name (Mr/Ms/Dr/Pr): Job Title: Company: Address: City: State: Postcode/Zip: Country*: *VAT ID Number for EU members: Tel: Date: PRODUCT ORDER - Ref YDLS17038 Please enter my order for above named report: One user license*: Euro 5,490 Multi user license: Euro 6,490 - The report will be ready for delivery from October 11, For price in dollars, please use the day s exchange rate. All reports are delivered electronically at payment reception. For French customers, add 20% for VAT I hereby accept Yole Développement s Terms and Conditions of Sale (1) Signature: *One user license means only one person at the company can use the report. SHIPPING CONTACT First Name: PAYMENT Last Name: Phone: BY CREDIT CARD Visa Mastercard Amex Name of the Card Holder: Credit Card Number: Card Verification Value (3 digits except AMEX: 4 digits): Expiration date: BY BANK TRANSFER BANK INFO: HSBC, 1 place de la Bourse, F Lyon, France, Bank code: 30056, Branch code: Account No: , SWIFT or BIC code: CCFRFRPP, IBAN: FR RETURN ORDER BY FAX: +33 (0) MAIL: YOLE DÉVELOPPEMENT, Le Quartz, 75 Cours Emile Zola, Villeurbanne/Lyon - France SALES CONTACTS North America - Steve Laferriere: laferriere@yole.fr Europe & RoW - Lizzie Levenez: levenez@yole.fr Japan & Rest of Asia - Takashi Onozawa: onozawa@yole.fr Greater China - Mavis Wang: wang@yole.fr Specific inquiries: info@yole.fr (1) Our Terms and Conditions of Sale are available at The present document is valid 24 months after its publishing date: September 26, 2017 / ABOUT YOLE DEVELOPPEMENT Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media and corporate finance services. With a strong focus on emerging applications using silicon and/or micro manufacturing, the Yole Développement group has expanded to include more than 50 collaborators worldwide covering MEMS, Compound Semiconductors, LED, Displays, Image Sensors, Optoelectronics, Microfluidics & Medical, Advanced Packaging, Manufacturing, Nanomaterials, Power Electronics and Batteries & Energy Management. The More than Moore company Yole and its partners System Plus Consulting, Blumorpho, KnowMade and PISEO support industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to develop their business. CONSULTING Market data & research, marketing analysis Technology analysis Reverse engineering & costing services Strategy consulting Patent analysis More information on FINANCIAL SERVICES Mergers & Acquisitions Due diligence Fundraising More information on Jean-Christophe Eloy (eloy@yole.fr) REPORTS Collection of technology & market reports Manufacturing cost simulation tools Component reverse engineering & costing analysis Patent investigation More information on MEDIA & EVENTS i-micronews.com, online disruptive technologies weekly e-newsletter Communication & webcasts services Events: Yole Seminars, Market Briefings More information on CONTACTS For more information about : Consulting Services: Jean-Christophe Eloy (eloy@yole.fr) Financial Services: Jean-Christophe Eloy (eloy@yole.fr) Report Business: Fayçal Khamassi (khamassi@yole.fr) Press relations: Sandrine Leroy (leroy@yole.fr)

30 Source: Wikimedia Commons Yole Développement From Technologies to Market 2017

31 FIELDS OF EXPERTISE COVERED BY OUR 35+ ANALYSTS Software Photonics Imaging MEMS & Sensors RF Devices & Techno. Displays MedTech Solid State Lighting (LED, OLED, ) Manufacturing Compound Semi. Advanced Packaging Power Electronics Advanced Substrates Batteries / Energy Management About Yole Développement 27

32 3 BUSINESS MODELS o Consulting and Analysis Market data & research, marketing analysis Technology analysis Strategy consulting Reverse engineering & costing Patent analysis Design and characterization of innovative optical systems Financial services (due diligence, M&A with our partner) o Reports Market & technology reports Patent investigation and patent infringement risk analysis Teardowns & reverse costing analysis Cost simulation tool o Media i-micronews.com e-newsletter Communication & webcast services Events: TechDays, forums, About Yole Développement 28

33 A GROUP OF COMPANIES Due diligence Innovation and business maker Market, technology and strategy consulting Manufacturing costs analysis Teardown and reverse engineering Cost simulation tools IP analysis Patent assessment Design and characterization of innovative optical systems About Yole Développement 29

34 OUR GLOBAL ACTIVITY Europe office Frankfurt Paris Nantes Vénissieux Nice HQ in Lyon Yole Korea Yole Japan Greater China office 40% 30% of our business Seoul Tokyo Hsinchu Yole Inc. Phoenix Palo Alto 30% of our business of our business About Yole Développement 30

35 ANALYSIS SERVICES - CONTENT COMPARISON Breadth of the analysis High Technology and Market Report Leadership Meeting Multi- Customers Action Q&A Service Meet the Analyst Custom Analysis Low Depth of the analysis High About Yole Développement 31

36 SERVING THE ENTIRE SUPPLY CHAIN Integrators and end-users Our analysts provide market analysis, technology evaluation, and business plans along the entire supply chain Device manufacturers Suppliers: material, equipment, OSAT, foundries Financial investors, R&D centers About Yole Développement 32

37 SERVING MULTIPLE INDUSTRIAL FIELDS We work across multiples industries to understand the impact of More-than- Moore technologies from device to system Industrial and defense Energy management Transportation makers Medical systems Mobile phone and consumer electronics Automotive From A to Z About Yole Développement 33

38 REPORTS COLLECTION o o o Yole Développement publishes a comprehensive collection of market & technology reports and patent analysis in: MEMS & Sensors RF devices & technologies Imaging Medical technologies (MedTech) Photonics Advanced packaging Manufacturing Advanced substrates Power electronics Batteries and energy management Compound semiconductors Solid state lighting Displays You are looking for: An analysis of your product market A review of your competitors evolution An understanding of your manufacturing and production costs An understanding of your industry technology roadmap and related IPs A clear view on the evolution of the supply chain The combined team of 60+ experts (PhDs, MBAs, industry veterans ) from Yole Développement, System Plus Consulting and KnowMade, collect information, identify the trends, the challenges, the emerging markets, the competitive environments and turn it into results to give you a complete picture of your industry landscape. In the past 19 years, we worked on more than projects, interacting with technology professionals and high level opinion makers from the main players of the industry. Every year, Yole Développement, System Plus Consulting and Knowmade publish +120 reports. Gain full benefit from our Bundle and Annual Subscription offers About Yole Développement 34

39 OUR 2017 REPORTS PLANNING (1/2) MARKET AND TECHNOLOGY REPORTS by Yole Développement o MEMS & SENSORS Acoustic MEMS and Audio Solutions 2017 Integrated Passive Devices Market Status D Imaging & Sensing 2017 Status of the MEMS Industry 2017 Silicon Photonics 2017* MEMS & Sensors for Automotive 2017 High End Inertial Sensors for Defense and Industrial Applications 2017* Magnetic Sensors Market and Technologies 2017 Sensors and Sensing Modules for Smart Homes and Buildings 2017 Sensing and Display for AR/VR/MR 2017** MEMS Packaging 2017 Fingerprint Sensor Applications and Technologies - Consumer Market Focus 2017 o RF DEVICES AND TECHNOLOGIES RF Front End Modules and Components for Cellphones 2017 Advanced RF SiP for Cellphones G Impact on RF Industry: From Wireless Infrastructure to Cellphone Terminals 2017 RF Technologies for Automotive Applications 2017 GaN and Si LDMOS Market and Technology Trends for RF Power 2017 o MANUFACTURING Glass Substrate Manufacturing 2017 Equipment & Materials for Fan Out Technology 2017 Equipment and Materials for 3D TSV Applications 2017 Emerging Non Volatile Memories 2017* *2016 version still available / **To be confirmed o MEDTECH Status of the Microfluidics Industry 2017 Solid State Medical Imaging 2017 Connected Medical Devices: the Internet of Medical Things 2017 Sensors for Medical Robotics 2017 Artificial Organs: Market & Technology Analysis 2017 Organs-on-a Chip 2017 o ADVANCED PACKAGING Advanced Substrates Overview 2017 Integrated Passive Devices Market Status 2017 Status of the Advanced Packaging Industry 2017 Fan Out Packaging: Market & Technology Trends 2017* 3D TSV and 2.5D Business Update - Market and Technology Trends 2017 Advanced QFN: Market & Technology Trends 2017** MEMS Packaging 2017 Advanced Packaging for Memories 2017 Advanced RF SiP for Cellphones 2017 Power Packaging Market and Technology Trends 2017 Embedded Die Packaging: Technologies and Markets Trends 2017 o IMAGING & OPTOELECTRONICS 3D Imaging & Sensing 2017 Status of the CMOS Image Sensor Industry 2017* Camera Module for Consumer and Automotive Applications 2017* Uncooled Infrared Imaging Technology & Market Trends 2017* Solid State Medical Imaging 2017 Embedded Software for Machine Vision Systems 2017** o BATTERY AND ENERGY MANAGEMENT Status of the Rechargeable Li-ion Battery Industry About Yole Développement 35

40 OUR 2017 REPORTS PLANNING (2/2) o POWER ELECTRONICS Status of Power Electronics Industry 2017 Power MOSFET 2017: Market and Technology Trends IGBT Market and Technology Trends 2017 Power Module Packaging: Material Market and Technology Trends 2017 Power SiC 2017: Materials, Devices, and Applications Power GaN 2017: Materials, Devices, and Applications* Materials Market Opportunities for Cellphone Thermal Management (Battery Cooling, Fast Charging, Data Processing, etc.) 2017 Gate Driver Market and Technology Trends 2017 Power Management ICs Market Quarterly Update 2017 Integrated Passive Devices Market Status 2017 Thermal Management for LED and Power 2017 o COMPOUND SEMICONDUCTORS Power SiC 2017: Materials, Devices, and Applications Power GaN 2017: Materials, Devices, and Applications* GaN and Si LDMOS Market and Technology Trends for RF Power G Impact on RF Industry: From Wireless Infrastructure to Cellphone Terminals 2017 Bulk GaN Substrate Market 2017 o DISPLAYS MicroLED Displays 2017 MicroLED IP 2017 Quantum Dots for Display Applications 2017 Phosphors & Quantum Dots LED Downconverters for Lighting & Displays Horticultural Lighting Technology, Industry and Market Trends Automotive Lighting Technology, Industry and Market Trends* Active Imaging and Lidar IR Lighting** LED Lighting Module Technology, Industry and Market Trends IR LEDs and VCSELs - Technology Applications and Industry Trends 2017 Phosphors & Quantum Dots LED Downconverters for Lighting & Displays MicroLED Displays 2017 CSP LED Lighting Module 2017 LED Packaging 2017 Thermal Management Technology and Market Perspectives in Power Electronics and LEDs 2017 PATENT ANALYSIS by Knowmade Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping 2017 Patent Licensing Companies in the Semiconductor Market - Patent Litigation Risk and Potential Targets 2017 MEMS Microphone: Patent Landscape Analysis 2017 Knowles MEMS Microphones in Apple iphone 7 Plus Patent-to-Product Mapping Microbolometer: Patents Used in Products 2017 Microfluidic Technologies for Diagnostic Applications Patent Landscape 2017 Pumps for Microfluidic Devices Patent Landscape III-N Patent Watch MicroLEDs: Patent Landscape Analysis 2017 Uncooled Infrared Imaging: Patent Landscape Analysis D Monolithic Memory: Patent Landscape Analysis 2017 NMC Lithium-Ion Batteries Patent Landscape Analysis FLUIDIGM Patent Portfolio Analysis o SOLID STATE LIGHTING UV LEDs Technology, Manufacturing and Application Trends* *2016 version still available / **To be confirmed TEARDOWN & REVERSE COSTING by System Plus Consulting More than 60 teardowns and reverse costing analysis and cost simulation tools to be published in About Yole Développement 36

41 OUR 2016 PUBLISHED REPORTS LIST (1/2) MARKET AND TECHNOLOGY REPORTS by Yole Développement o MEMS & SENSORS Gas Sensors Technology and Market 2016 Status of the MEMs Industry 2016 Sensors for Cellphones and Tablets 2016 Market and Technology Trends of Inkjet Printheads 2016 Sensors for Biometry and Recognition 2016 Silicon Photonics 2016 o IMAGING & OPTOELECTRONICS Status of the CMOS Image Sensor Industry 2016 Uncooled Infrared Imaging Technology & Market Trends 2016 Imaging Technologies for Automotive 2016 Sensors for Drones & Robots: Market Opportunities and Technology Evolution 2016 o MEDTECH BioMEMS 2016 Point of Care Testing 2016: Application of Microfluidic Technologies o ADVANCED PACKAGING Embedded Die Packaging: Technology and Market Trends D & 3D IC TSV Interconnect for Advanced Packaging: Business Update 2016 Fan-Out: Technologies and Market Trends 2016 Fan-In Packaging: Business update 2016 Status and Prospects for the Advanced Packaging Industry in China 2016 o MANUFACTURING Thin Wafer Processing and Dicing Equipment Market 2016 Emerging Non Volatile Memories 2016 o COMPOUND SEMICONDUCTORS Power GaN 2016: Epitaxy and Devices, Applications and Technology Trends GaN RF Devices Market: Applications, Players, Technology and substrates 2016 Sapphire Applications & Market 2016: from LED to Consumer Electronics Power SiC 2016: Materials, Devices, Modules, and Applications o LED UV LED Technology, Manufacturing and Applications Trends 2016 OLED for Lighting 2016 Technology, Industry and Market Trends Automotive Lighting: Technology, Industry and Market Trends 2016 Organic Thin Film Transistor 2016: Flexible Displays and Other Applications Sapphire Applications & Market 2016: from LED to Consumer Electronics o POWER ELECTRONICS Power Electronics for EV/HEV 2016: Market, Innovations and Trends Status of Power Electronics Industry 2016 Passive Components Technologies and Market Trends for Power Electronics 2016 Power SiC 2016: Materials, Devices, Modules, and Applications Power GaN 2016: Epitaxy and Devices, Applications, and Technology Trends Inverter Technologies Trends & Market Expectations 2016 Opportunities for Power Electronics in Renewable Electricity Generation 2016 Thermal Management Technology and Market Perspectives in Power Electronics and LEDs 2017 GaN RF Devices Market: Applications, Players, Technology and substrates 2016 o BATTERY AND ENERGY MANAGEMENT Beyond Li-ion Batteries: Present and Future Li-ion Technology Challengers 2016 Stationary Storage and Automotive Li-ion Battery Packs 2016 Opportunities for Power Electronics in Renewable Electricity Generation About Yole Développement 37

42 OUR 2016 PUBLISHED REPORTS LIST (2/2) PATENT ANALYSIS by Knowmade Microbattery Patent Landscape Analysis Miniaturized Gas Sensors Patent Landscape Analysis 3D Cell Culture Technologies Patent Landscape Phosphors and QDs for LED Applications Patent Landscape TSV Stacked Memory Patent Landscape Fan-Out Wafer Level Packaging Patent Landscape Analysis TEARDOWN & REVERSE COSTING by System Plus Consulting More than 45 teardowns and reverse costing analysis and cost simulation tools published in MORE INFORMATION o o All the published reports from the Yole Group of Companies are available on our website Ask for our Bundle and Annual Subscription offers: With our bundle offer, you choose the number of reports you are interested in and select the related offer. You then have up to 12 months to select the required reports from the Yole Développement, System Plus Consulting and KnowMade offering. Pay once and receive the reports automatically (multi-user format). Contact your sales team according to your location (see the last slide) About Yole Développement 38

43 MICRONEWS MEDIA o About Micronews Media To meet the growing demand for market, technological and business information, Micronews Media integrates several tools able to reach each individual contact within its network.we will ensure you benefit from this. ONL I N E ONS I TE INP E e-newsletter i-micronews.com i-micronewsjp.com FreeFullPDF.com Unique, cost-effective ways to reach global audiences. Online display advertising campaigns are great strategies for improving your product/brand visibility. They are also an efficient way to adapt with the demands of the times and to evolve an effective marketing plan and strategy. Benefit from the i-micronews.com traffic generated by the 8,500+ monthly visitors, the 11,500+ weekly readers e-newsletter Events Brand visibility, networking opportunities Today's technology makes it easy for us to communicate regularly, quickly, and inexpensively but when understanding each other is critical, there is no substitute for meeting in-person. Events are the best way to exchange ideas with your customers, partners, prospects while increasing your brand/product visibility. Seven main events planned for 2017 on different topics to attract 100 attendees on average Webcasts Targeted audience involvement equals clear, concise perception of your company s message. Webcasts are a smart, innovative way of communicating to a wider targeted audience. Webcasts create very useful, dynamic reference material for attendees and also for absentees, thanks to the recording technology. Gain new leads for your business from an average of 300 registrants per webcast Contact: Camille Veyrier (veyrier@yole.fr), Marketing & Communication Project Manager About Yole Développement 39

44 CONTACT INFORMATION o o CONSULTING AND SPECIFIC ANALYSIS North America: Steve LaFerriere, Director of Northern America Business Development laferriere@yole.fr Japan & Rest of Asia: Takashi Onozawa, General Manager, Asia Business Development onozawa@yole.fr Greater China: Mavis Wang, Director of Greater China Business Development wang@yole.fr RoW: Jean-Christophe Eloy, CEO & President, Yole Développement eloy@yole.fr REPORT BUSINESS North America: Steve LaFerriere, Director of Northern America Business Development laferriere@yole.fr Europe: Lizzie Levenez, EMEA Business Development Manager levenez@yole.fr Rest of Asia: Takashi Onozawa, General Manager, Asia Business Development onozawa@yole.fr Japan & Asia: Miho Othake, Account Manager ohtake@yole.fr Greater China: Mavis Wang, Director of Greater China Business Development wang@yole.fr Follow us on o FINANCIAL SERVICES (in partnership with Woodside Capital Partners) Jean-Christophe Eloy, CEO & President eloy@yole.fr o GENERAL Public Relations: leroy@yole.fr info@yole.fr About Yole Développement 40

45 About Solid State Lighting LED, OLED and Display Activities 41

46 FOCUS ON SOLID STATE LIGHTING LED, OLED AND DISPLAY ACTIVITIES Yole is active throughout the value chain: Example of LED and Sapphire activities Substrate Front-end Level 0 - Epitaxy Nucleation layer n-type layer Active layers MQW p-type layer Front-end Level 1 - Device Production Inspection Masking/Lithography Etching Metallization/Contacts/Mirrors We are active throughout the value chain: from substrates to systems. And we interact with industrial/r&d players from each level. SiC/Sapphire/Silicon/Bulk GaN/Engineered substrates Back-End level 1 - Packaging Die Attach and Interconnections Phosphors Encapsulation and Optics Testing and Binning LED dies LED epiwafer Back-End Level 0 - Packaging Substrate separation and Bonding Die singulation Testing and Binning Mesa LED, Flip Chip LED, Vertical LED structures LED dieson-wafer Module Packaging Substrates PCB Encapsulation and Optics Heatsink Testing and Binning Packaged LEDs LED modules LED systems and applications 42

47 FOCUS ON SOLID STATE LIGHTING LED, OLED AND DISPLAY ACTIVITIES Insights on Forecast Methodology Example of LED and Sapphire activities APPLICATION 'What s Behind the Crystal Ball?' Only analysts that follow the industry on a daily basis through interviews and developed market modeling tools based on discussions with key players of the industry. Forecast of standard product market volume unit e.g.: Smartphone, TVs, lamps Forecast of LED market volume in units Split by application, power type low vs. medium vs. high power, package type single vs. multi-die System Plus Consulting expertise in reverse costing/reverse engineering Definition of functions using LEDs e.g.: 'Flash vs. Keypad' for smartphone Definition of LED ASP Per power type, packaged type Definition of manufacturing flows for front-end and packaging process, technologies, materials, yields Split by application, power type, package type Definition of technical requirements e.g.: Efficacy, size Forecast of LED market size in $ Split by application, power type, package type Forecast of LED manufacturing equipment and material markets in units and $ e.g.: Phosphors, encapsulant, dicing equipment Definition of LED penetration rate and competitiveness with alternative technologies e.g.: 'OLED vs. LED' in smartphone Definition of sales levels of key manufacturers in $ Ex: LED, packaging materials, epitaxy materials, manufacturing equipment, MOCVD reactor, substrate Definition of LED die surface in mm² Definition of substrate die surface in mm² and epiwafer volume unit Split by type of substrate Forecast of LED substrate markets in units and $ Split by type of substrate 43

48 FOCUS ON SOLID STATE LIGHTING LED, OLED AND DISPLAY ACTIVITIES About Yole s Analyst Team Pars MUKISH - Business Unit Manager - SSL and Display Pars MUKISH holds a master degree in Materials Science and Polymers ITECH - France and a master degree in Innovation and Technology Management EM Lyon - France. Since 2015, Pars MUKISH has taken on responsibility for developing LED, OLED and Sapphire activities as Business Unit Manager at Yole Développement. Previously, he has worked as Marketing Analyst and Techno-Economic Analyst for several years at the CEA French Research Center. A team based on persons having complementary skills and expertise. Dr. Eric VIREY - Senior Market and Technology Analyst - Sapphire and Display Eric VIREY holds a Ph-D in Optoelectronics from the National Polytechnic Institute of Grenoble INPG - France. He works as Market and Technology Analyst in the fields of Sapphire, LED/OLED and Display. In the last 12 years, he has held various R&D, engineering, manufacturing and marketing positions with Saint-Gobain. Most recently, he was Market Manager at Saint- Gobain Crystals, in charge of Sapphire and Optoelectronic products. Pierrick BOULAY - Market and Technology Analyst - SSL Pierrick BOULAY holds a master degree in Electronics from ESEO France. He works as Market and Technology Analyst in the fields of LED, OLED and Lighting Systems to carry out technical, economic and marketing analysis. He has experience in both LED lighting general lighting, automotive lighting and OLED lighting. In the past, he has mostly worked in R&D department for LED lighting applications. 44