HTC Vive VR (Model 0PJT100) Virtual Reality Headset

Transcription

1 HTC Vive VR (Model 0PJT100) Virtual Reality Headset System report by Wilfried THERON February rue la Noue Bras de Fer NANTES - FRANCE info@systemplus.fr by System Plus Consulting HTC Vive VR Headset (SAMPLE) 1

2 Table of Contents 4 o Executive Summary o Main Chipset o Block Diagram o Reverse Costing Methodology Company Profile 9 o HTC Corporation 12 o Content of the Box o Views and Dimensions of the Headset o Headset Opening o Fresnel Lens Details o Display Details o Main Electronic Board Top Side Global view Top Side High definition photo Top Side PCB markings Top Side Main components markings Top Side Main components identification Top Side Other components markings Top Side Other components identification Bottom Side High definition photo Bottom Side Components identification o Photodiode Flex o Front Camera Flex o Microphone Flex o Proximity Sensor Flex o Display Flex 1 & 2 87 o Accessing the BOM o PCB Cost o BOM Cost Main Electronic Board o BOM Cost Photodiode Flex o BOM Cost Front Camera Flex o BOM Cost Microphone Flex o BOM Cost Proximity Sensor Flex o BOM Cost Display Flex 1 & 2 o Housing Parts Estimation o BOM Cost - Housing o Material Cost Breakdown by Sub-Assembly o Material Cost Breakdown by Component Category o Accessing the Added Value (AV) cost o Electronic Board Manufacturing Flow o Details of the Main Electronic Board AV Cost o Details of the System Assembly AV Cost o Added-Value Cost Breakdown o Manufacturing Cost Breakdown Estimated Price Analysis 123 o Estimation of the Manufacturing Price o Estimation of the Selling Price Company services by System Plus Consulting HTC Vive VR Headset (SAMPLE) 2

3 Main Chipset o Executive Summary o Main Chipset o Block Diagram o Reverse Costing Methodology o Glossary The main chipset of the Headset is resumed in the following table : 2017 by System Plus Consulting HTC Vive VR Headset (SAMPLE) 3

4 Block Diagram o Executive Summary o Main Chipset o Block Diagram o Reverse Costing Methodology o Glossary The block diagram of the Headset is described in the following schematics: 2017 by System Plus Consulting HTC Vive VR Headset (SAMPLE) 4

5 Reverse Costing Methodology o Executive Summary o Main Chipset o Block Diagram o Reverse Costing Methodology o Glossary The reverse costing analysis is conducted in several phases: The initialization of the analysis Pictures of the elements to be studied. Identification of the components. Description of the material in the SYScost+ software Creation of an estimation project of the studied board with SYScost+ software. Construction of the Bill of Material (BOM). Assessing the material Searching for the price of each reference among distributors and manufacturers. Assessing the cost of the PCB and of the unaccounted references (unknown by distributors) The BOM is valued with SYScost+ : price simulation according to the requested quantities. Assessing the assembling and test phases Assembly and test lines are modeled with the SYScost+ software. The assembly and tests costs are estimated. Production cost & selling price Estimation of the production cost & selling price. Report A report is edited. SYS.cost+, is a software tool developed by SYSTEM PLUS CONSULTING to calculate the cost of electronic boards. More information on the software can be found at by System Plus Consulting HTC Vive VR Headset (SAMPLE) 5

6 Views and Dimensions Total Weight: 566g (without cables). o Views & Dimensions o Headset Opening o Fresnel Lens o Display o Electronic Board o Flex Boards 117mm Global view of the HTC Vive VR Headset by System Plus Consulting HTC Vive VR Headset (SAMPLE) 6

7 Headset Opening IR Photodiode Flex (x4) o Views & Dimensions o Headset Opening o Fresnel Lens o Display o Electronic Board o Flex Boards IR Photodiode Flex Support Front Camera Headset opening 2017 by System Plus Consulting HTC Vive VR Headset (SAMPLE) 7

8 Headset Opening Each IR Photodiode Flex has a particular shape but each Flex integrates 8 IR Photodiodes. o Views & Dimensions o Headset Opening o Fresnel Lens o Display o Electronic Board o Flex Boards Details of the four IR Photodiode Flex 2017 by System Plus Consulting HTC Vive VR Headset (SAMPLE) 8

9 Headset Opening o Views & Dimensions o Headset Opening o Fresnel Lens o Display o Electronic Board o Flex Boards 2017 by System Plus Consulting HTC Vive VR Headset (SAMPLE) 9

10 Part Collection (1/2) Outer Shell (x2) (PC, 43g) o Views & Dimensions o Headset Opening o Fresnel Lens o Display o Electronic Board o Flex Boards 2017 by System Plus Consulting HTC Vive VR Headset (SAMPLE) 10

11 Display Details o Views & Dimensions o Headset Opening o Fresnel Lens o Display o Electronic Board o Flex Boards 2017 by System Plus Consulting HTC Vive VR Headset (SAMPLE) 11

12 Electronic Board Top Side Global View o Views & Dimensions o Headset Opening o Fresnel Lens o Display o Electronic Board o Flex Boards 2017 by System Plus Consulting HTC Vive VR Headset (SAMPLE) 12

13 Electronic Board Top Side Main Components Markings o Views & Dimensions o Headset Opening o Fresnel Lens o Display o Electronic Board o Flex Boards 2017 by System Plus Consulting HTC Vive VR Headset (SAMPLE) 13

14 Electronic Board Top Side Main Components Identification o Views & Dimensions o Headset Opening o Fresnel Lens o Display o Electronic Board o Flex Boards 2017 by System Plus Consulting HTC Vive VR Headset (SAMPLE) 14

15 IR Photodiode Flex Top Side Detailed View & Component Identification o Views & Dimensions o Headset Opening o Fresnel Lens o Display o Electronic Board o Flex Boards IR Photodiode Flex details 2017 by System Plus Consulting HTC Vive VR Headset (SAMPLE) 15

16 Front Camera Flex Camera Image Sensor View o Views & Dimensions o Headset Opening o Fresnel Lens o Display o Electronic Board o Flex Boards 2017 by System Plus Consulting HTC Vive VR Headset (SAMPLE) 16

17 C O S T ANALYSIS 2017 by System Plus Consulting HTC Vive VR Headset (SAMPLE) 17

18 PCB Cost o Accessing the BOM o PCB Cost o BOM Cost Electronics o Housing Parts Estimation o BOM Cost - Housing o Material Cost Breakdown o Added-Value Cost o Manufacuring Cost 2017 by System Plus Consulting HTC Vive VR Headset (SAMPLE) 18

19 BOM Cost Main Board (1/3) o Accessing the BOM o PCB Cost o BOM Cost Electronics o Housing Parts Estimation o BOM Cost - Housing o Material Cost Breakdown o Added-Value Cost o Manufacuring Cost 2017 by System Plus Consulting HTC Vive VR Headset (SAMPLE) 19

20 Material Cost Breakdown by Sub-Assembly o Accessing the BOM o PCB Cost o BOM Cost Electronics o Housing Parts Estimation o BOM Cost - Housing o Material Cost Breakdown o Added-Value Cost o Manufacuring Cost 2017 by System Plus Consulting HTC Vive VR Headset (SAMPLE) 20

21 Material Cost Breakdown by Component Categories o Accessing the BOM o PCB Cost o BOM Cost Electronics o Housing Parts Estimation o BOM Cost - Housing o Material Cost Breakdown o Added-Value Cost o Manufacuring Cost 2017 by System Plus Consulting HTC Vive VR Headset (SAMPLE) 21

22 MANUFACTURING PROCESS FLOW 2017 by System Plus Consulting HTC Vive VR Headset (SAMPLE) 22

23 Assessing the Added-Value (AV) Cost o Accessing the BOM o PCB Cost o BOM Cost Electronics o Housing Parts Estimation o BOM Cost - Housing o Material Cost Breakdown o Added-Value Cost o Manufacuring Cost 2017 by System Plus Consulting HTC Vive VR Headset (SAMPLE) 23

24 Details of Main Board Added-Value (AV) Cost o Accessing the BOM o PCB Cost o BOM Cost Electronics o Housing Parts Estimation o BOM Cost - Housing o Material Cost Breakdown o Added-Value Cost o Manufacuring Cost 2017 by System Plus Consulting HTC Vive VR Headset (SAMPLE) 24

25 Details of Main Board Added-Value (AV) Cost o Accessing the BOM o PCB Cost o BOM Cost Electronics o Housing Parts Estimation o BOM Cost - Housing o Material Cost Breakdown o Added-Value Cost o Manufacuring Cost 2017 by System Plus Consulting HTC Vive VR Headset (SAMPLE) 25

26 Added-Value Cost Breakdown o Accessing the BOM o PCB Cost o BOM Cost Electronics o Housing Parts Estimation o BOM Cost - Housing o Material Cost Breakdown o Added-Value Cost o Manufacuring Cost 2017 by System Plus Consulting HTC Vive VR Headset (SAMPLE) 26

27 Manufacturing Cost Breakdown o Accessing the BOM o PCB Cost o BOM Cost Electronics o Housing Parts Estimation o BOM Cost - Housing o Material Cost Breakdown o Added-Value Cost o Manufacuring Cost 2017 by System Plus Consulting HTC Vive VR Headset (SAMPLE) 27

28 SELLING P R I C E 2017 by System Plus Consulting HTC Vive VR Headset (SAMPLE) 28

29 Estimation of the Manufacturing Price o Financial Ratios o Manufacturer Price 2017 by System Plus Consulting HTC Vive VR Headset (SAMPLE) 29

30 COMPANY SERVICES 2017 by System Plus Consulting HTC Vive VR Headset (SAMPLE) 30

31 Business Models Fields of Expertise Manufacturing Process Flow o Company services o Feedbacks o Contact o Legal Custom Analyses (>130 analyses per year) Reports (>40 reports per year) Costing Tools Trainings

32 Contact Manufacturing Process Flow PHOENIX YOLE Inc. FRANKFURT/MAIN Europa Sales Office NANTES Headquarter LYON YOLE HQ TOKYO YOLE KK o Company services o Feedbacks o Contact o Legal GREATER CHINA YOLE Headquarters 21 rue La Noue Bras de Fer Nantes FRANCE sales@systemplus.fr Europe Sales Office Lizzie LEVENEZ Frankfurt am Main GERMANY llevenez@systemplus.fr America Sales Office Steve LAFERRIERE Phoenix USA laferriere@yole.fr Asia Sales Office Takashi ONOZAWA Tokyo JAPAN onozawa@yole.fr Mavis WANG GREATER CHINA wang@yole.fr 2017 by System Plus Consulting HTC Vive VR Headset (SAMPLE) 32