400V/18A POWER MOSFET (N-Channel) MSU18N40T. 400V/18A Power MOSFET (N-Channel) General Description. Features. Pin Configuration and Symbol TO-220
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1 400V/18A POWER MOSFET (N-Channel) 400V/18A Power MOSFET (N-Channel) General Description is a N-Channel enhancement mode power MOSFET with advanced technology. It is designed to have Better characteristics, such as fast switching time, low gate charge, minimized on-state resistance and withstanding high energy pulse in the avalanche and commutation modes. These devices are well suited for high efficiency switching mode power supply applications. TO-220 is generally used as a load switch or applied in PWM applications. Features RDS(ON) 0.24Ω@VGS=10V Fast switching capability Avalanche energy tested RoHS Compliance and Halogen free Pin Configuration and Symbol 1: GATE 2: DRAIN 3: SOURCE TO-220 TAITRON COMPONENTS INCORPORATED Tel: (800)-TAITRON (800) (661) Fax: (800)-TAITFAX (800) (661) Page 1 of 6
2 Absolute Maximum Ratings (TC=25ºC unless otherwise specified, Note) Symbol Description Ratings Unit VDSS Drain-Source Voltage 400 V VGSS Gate-Source Voltage ± 30 V ID Drain Current -Continuous 18 A IDM Drain Current -Pulsed 72 A IAR Avalanche Current 18 A EAS Single Pulsed Avalanche Energy 1000 mj EAR Repetitive Avalanche Energy 30 mj Dv/dt Peak Diode Recovery 10 V/ns PD Maximum Power Dissipation 235 W RθJC Thermal Resistance (Junction-to-Case) 0.53 C/ W TJ Junction Temperature +150 C TSTG Storage Temperature Range -55 to +150 C Note1: Absolute maximum ratings are those values beyond which the device could be permanently damaged. Absolute maximum ratings are stress ratings only and functional device operation is not implied. Page 2 of 6
3 Electrical Characteristics (TC=25ºC unless otherwise specified) Symbol Description Min. Typ. Max. Unit Conditions OFF CHARACTERISTICS V(BR)DSS Drain-Source Breakdown Voltage V VGS=0V, ID=250µA IDSS Drain-Source leakage Current μa VDS=400V, VGS=0V IGSS Gate-Source leakage Current ON CHARACTERISTICS Forward na VGS=30V Reverse na VGS=-30V VGS(th) Gate-Source Threshold Voltage V VDS=VGS, ID=250µA Static Drain-Source On-State Resistance Ω VGS=10V, ID=9A RDS(ON) DYNAMIC CHARACTERISTICS Ciss Input Capacitance pf Coss Output Capacitance pf Crss Reverse Transfer Capacitance pf SWITCHING CHARACTERISTICS t d (on) Turn-on Delay Time ns t r Turn-on Rise Time ns t d (off) Turn-off Delay Time ns t f Turn-off Fall Time ns VDS=25V, VGS=0V, f=1.0mhz VGS =10V, VDS=0.5VDSS, ID=9A (Note 1,2) Qg Total Gate Charge nc VGS =10V, VDS=0.5VDSS, Qgs Gate-Source Charge nc ID=18A, RG=5Ω Qgd Gate-Drain Charge nc (Note 1,2) DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS VSD IS ISM Drain-Source Diode Forward Voltage Maximum Continuous Drain-Source Diode Forward Current Maximum Pulse Drain-Source Diode Forward Current V VGS =0V, IF= Is A VGS =0V A Repetitive t rr Reverse Recovery Time ns VGS =0V, Is=18A Q rr Reverse Recovery Charge uc di F /dt=100a/us, VR=100V (Note 1) Note 1: Pulse test: Pulse width 300us, Duty cycle 2% 2: Essentially independent of operating temperature Page 3 of 6
4 Drain Current ID (µa) Drain Current ID (µa) Drain Current ID (A) Drain Current ID (A) Typical Characteristics Curves Fig.1- Drain Current vs. Source to Drain Voltage Fig.2- Drain to Source On-State Resistance Characteristics Source to Drain Voltage VSD (mv) Drain to Source Voltage VDS (A) Fig.3- Drain Current vs. Gate Threshold Voltage Fig.2- Drain Current vs. Drain to Source Breakdown Voltage Gate Threshold Voltage VTH (V) Drain to Source Breakdown Voltage BVDSS (V) Page 4 of 6
5 Dimensions in mm ( inch) TO Page 5 of 6
6 Ordering Information MS U 18 N 40 T 85 UG Packing Code: TU/UG: Tube, RoHS/ Halogen Free Factory Location Code Outline: T: TO-220; Voltage Code: 40:400V Channel Code: N: N-Channel Ampere Code: 18:18A Technology Taitron MOSFET (Standard) How to contact us US HEADQUARTERS WEST HARRISON PARKWAY, VALENCIA, CA Tel: (800)-TAITRON (800) (661) Fax: (800)-TAITFAX (800) (661) taitron@taitroncomponents.com IPAK (TO-251) TAITRON COMPONENTS MEXICO, S.A.DE C.V. BOULEVARD CENTRAL 5000 INTERIOR 5 PARQUE INDUSTRIAL ATITALAQUIA, HIDALGO C.P MEXICO Tel: Fax: TAITRON COMPONENTS INCORPORATED TAIWAN, TAIPEI 6F., No.190, Sec. 2, Zhongxing Rd., Xindian Dist., New Taipei City 23146, Taiwan R.O.C. Tel: Fax: TAITRON COMPONENT TECHNOLOGY, SHANGHAI CORPORATION METROBANK PLAZA,1160 WEST YAN AN ROAD, SUITE 1503, SHANGHAI,200052, CHINA Tel: Fax: CROSS REGION PLAZA, 899 LINGLING ROAD, SUITE 18C, SHANGHAI, , CHINA Page 6 of 6
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N-channel 600 V, 0.55 Ω typ., 7.5 A MDmesh M2 Power MOSFET in a TO-220FP package Datasheet - production data Features Order code VDS@TJmax. RDS(on) max. ID STF10N60M2 650 V 0.60 Ω 7.5 A Extremely low gate
More informationAM V N-CHANNEL ENHANCEMENT MODE MOSFET
DESCRIPTION The is the N-Channel logic enhancement mode power field effect transistor is produced using high cell density. Advanced trench technology to provide excellent RDS(ON). This high density process
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DESCRIPTION APPLICATIONS The SPN70T10 is the N-Channel logic enhancement DC/DC Converter mode power field effect transistor which is produced Load Switch using high cell density DMOS trench technology.
More informationIRFF9130 JANS2N6849 JANTXV2N V, P-CHANNEL. Absolute Maximum Ratings. Features: 1 PD D. REPETITIVE AVALANCHE AND dv/dt RATED
PD - 90550D REPETITIVE AVALANCHE AND dv/dt RATED HEXFET TRANSISTORS THRU-HOLE (TO-205AF) Product Summary Part Number BVDSS RDS(on) ID IRFF9130-100V 0.30Ω -6.5A IRFF9130 JANTX2N6849 JANTXV2N6849 JANS2N6849
More informationSymbol Parameter Typ Max Units Thermal Resistance Junction to Ambient C t 10s 62 Thermal Resistance Junction to Ambient C
SMC93M Dual P-Channel MOSFET DESCRIPTION SMC93 is the Dual P-Channel enhancement mode power field effect transistors are using trench DMOS technology.this advanced technology has been especially tailored
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FKD93 % EAS Guaranteed Green Device Available Super Low Gate Charge Excellent CdV/dt effect decline Advanced high cell density Trench technology Product Summary BVDSS RDSON ID V 3mΩ 3A -V 5mΩ -A Description
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DESCRIPTION The SPN7002 is the N-Channel enhancement mode field effect transistors are produced using high cell density DMOS technology. These products have been designed to minimize on-state resistance
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N-channel 650 V, 0.15 Ω typ., 20 A MDmesh M2 Power MOSFET in a TO-220FP ultra narrow leads package Datasheet - production data Features Order code VDS RDS(on) max ID 650 V 0.18 Ω 20 A 1 2 3 Extremely low
More informationFeatures. Description. AM15572v1_no_tab. Table 1: Device summary Order code Marking Package Packing STWA48N60DM2 48N60DM2 TO-247 long leads Tube
N-channel 600 V, 0.065 Ω typ., 40 A MDmesh DM2 Power MOSFET in a TO-247 long leads package Datasheet - production data Features Order code VDS RDS(on) max. ID STWA48N60DM2 600 V 0.079 Ω 40 A Fast-recovery
More informationFeatures. Description. Table 1: Device summary Order code Marking Package Packing STF5N60M2 5N60M2 TO-220FP Tube
N-channel 600 V, 1.3 Ω typ., 3.5 A MDmesh M2 Power MOSFET in a TO-220FP package Datasheet - production data Features Order code VDS@ TJmax RDS(on) max. ID STF5N60M2 650 V 1.4 Ω 3.5 A Extremely low gate
More informationFeatures. Description. Table 1: Device summary Order code Marking Package Packing STF24N60DM2 24N60DM2 TO-220FP Tube
N-channel 600 V, 0.175 Ω typ., 18 A MDmesh DM2 Power MOSFET in a TO-220FP package Datasheet - production data Features Order code VDS @ TJmax RDS(on) max. ID 650 V 0.200 Ω 18 A TO-220FP Fast-recovery body
More informationFeatures. Description. Table 1: Device summary Order code Marking Package Packing STW56N65DM2 56N65DM2 TO-247 Tube
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N-channel 600 V, 0.037 Ω typ., 66 A MDmesh DM2 Power MOSFET in a TO-247 package Datasheet - production data Features Order code VDS RDS(on) max. ID PTOT STW70N60DM2 600 V 0.042 Ω 66 A 446 W TO-247 1 3
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DESCRIPTION The SPN8206 is the logic enhancement mode power field effect transistors are produced using high cell density, DMOS trench technology. This high density process is especially tailored to minimize
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DESCRIPTION The is the N-Channel enhancement mode field effect transistors are produced using high cell density DMOS technology. These products have been designed to minimize on-state resistance while
More informationParameter Symbol Limit Unit IDM 20 A T A = PD T A =100
Features: Super high dense cell design for low R DS(ON) Rugged and reliable Surface Mount Package B VDSS =20V, R DS(ON) =24.5mΩ ID=6A Application DC-DC converters Power management in portable and Battery-powered
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STB10N60M2, STD10N60M2, STP10N60M2, N-channel 600 V, 0.55 Ω typ., 7.5 A MDmesh M2 Power MOSFETs in D²PAK, DPAK, TO-220 and IPAK packages Datasheet - production data Features Order code VDS@TJmax. RDS(on)
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TSA20N60S, TSK20N60S 600V N-Channel MOSFET Description SJ-FET is new generation of high voltage MOSFET family that is utilizing an advanced charge balance mechanism for outstanding low on-resistance and
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N-channel 600 V, 32 mω typ., 72 A MDmesh M6 Power MOSFET in TO-247 package Datasheet - production data Features Order code VDS RDS(on) max. ID STW75N60M6 600 V 36 mω 72 A 3 2 1 TO-247 Figure 1: Internal
More informationFeatures. Description. Table 1: Device summary Order code Marking Package Packaging STW45NM50 W45NM50 TO-247 Tube
N-channel 500 V, 0.08 Ω typ., 45 A MDmesh Power MOSFET in a TO-247 package Datasheet - production data Features Order code VDS RDS(on) max ID 500 V 0.1 Ω 45 A TO-247 1 3 2 100% avalanche tested High dv/dt
More informationFeatures. Description. AM01475v1_Tab. Table 1: Device summary Order code Marking Package Packing STW240N10F7 240N10F7 TO-247 Tube
N-channel 100 V, 2.6 mω typ., 180 A, STripFET F7 Power MOSFET in a TO-247 package Datasheet - production data Features Order code VDS RDS(on) max. ID 100 V 3.0 mω 180 A 1 2 3 Among the lowest RDS(on) on
More informationN-channel 650 V, 0.37 Ω typ., 10 A MDmesh M2 Power MOSFET in a TO-220FP ultra narrow leads package. Features. Description.
N-channel 650 V, 0.37 Ω typ., 10 A MDmesh M2 Power MOSFET in a TO-220FP ultra narrow leads package Datasheet - production data Features Order code VDS RDS(on) max ID STFU13N65M2 650 V 0.43 Ω 10A 1 2 3
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