Complementary MOSFET
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1 General Description uses advanced trench technology to provide excellent Rds(on) and low gate charge. Complementary MOSFET Features N-channel Vds=40V, Id=8.0A, Rds(on)=22mΩ(Vgs=10V) Vds=40V, Id=6.0A, Rds(on)=28mΩ(Vgs=4.5V) P-channel Vds=-40V, Id=-7.2A, Rds(on)=42mΩ(Vgs=-10V) Vds=-40V, Id=-6.2A, Rds(on)=60mΩ(Vgs=-4.5V) Maximum Absolute Ratings Ta=25 C. Unless otherwise noted. Parameter Symbol N-ch (Max.) P-ch (Max.) Unit Drain-source voltage Vds V Gate-source voltage Vgs ±20 ±20 V Ta=25 C Continuous drain current(tj=150 C) Id A Ta=70 C Pulsed drain current Idm A Tc=25 C Power dissipation Pd W Tc=70 C Junction and storage temperature range Tj,Tstg -55 to to 150 C Thermal Characteristics Parameter Symbol Device Typ. Max. Unit Maximum junction-to-ambient Steady-state Rθja N-ch 62.5 C/W Maximum junction-to-ambient Steady-state Rθja P-ch 62.5 C/W Pin configuration Circuit SOP-8(TOP VIEW) Pin No. Pin name 1 SOURCE1 2 GATE1 3 SOURCE2 4 GATE2 5 DRAIN2 6 DRAIN2 7 DRAIN1 8 DRAIN1 N-ch G1 D1 S1 G2 P-ch D2 S2 8-1
2 Electrical Characteristics (N-ch) STATIC PARAMETERS Ta=25 C. Unless otherwise noted. Parameter Symbol Conditions Min. Typ. Max. Unit Drain-source breakdown voltage BVdss Id=250μA, Vgs=0V 40 V Zero gate voltage drain current Idss Vds=32V, Vgs=0V Ta=85 C 10 Gate-body leakage current Igss Vds=0V, Vgs=±20V ±100 na Gate threshold voltage Vgs(th) Vds=Vgs, Id=250μA V On state drain current Id(on) Vgs=10V, Vds=5V 20 A Static drain-source on-resistance Rds(on) Vgs=10V, Id=8.0A mω Vgs=4.5V, Id=6.0A Forward transconductance Gfs Vds=15V, Id=5.0A 25 S Diode forward voltage Vsd Is=2A, Vgs=0V V Max.body-diode continuous current Is 1.5 A DYNAMIC PARAMETERS Input capacitance Complementary MOSFET Ciss Output capacitance Coss Vgs=0V, Vds=20V, f=1mhz 110 pf 1 μa 850 pf Reverse transfer capacitance Crss 75 pf SWITCHING PARAMETERS Total gate charge Qg nc Vgs=4.5V, Vds=20V, Gate-source charge Qgs 2.8 nc Id=5A Gate-drain charge Qgd 3.2 nc Turn-on delay time td(on) 6 12 ns Turn-on rise time tr Vgs=10V, Vds=20V, Id=5.0A ns Turn-off delay time td(off) RL=4Ω, Rgen=1Ω ns Turn-off fall time tf 6 12 ns 8-2
3 Complementary MOSFET Typical Electrical and Thermal Characteristics (N-ch) 8-3
4 Complementary MOSFET 8-4
5 Electrical Characteristics (P-ch) STATIC PARAMETERS Ta=25 C. Unless otherwise noted. Parameter Symbol Conditions Min. Typ. Max. Unit Drain-source breakdown voltage BVdss Id=-250μA, Vgs=0V -40 V Zero gate voltage drain current Idss Vds=-32V, Vgs=0V -1 Ta=85 C -20 Gate-body leakage current Igss Vds=0V, Vgs=±20V ±100 na Gate threshold voltage Vgs(th) Vds=Vgs, Id=-250μA V On state drain current Id(on) Vgs=-10V, Vds=-5V -20 A Static drain-source on-resistance Rds(on) Vgs=-10V, Id=-7.2A mω Vgs=-4.5V, Id=-6.2A Forward transconductance Gfs Vds=-15V, Id=-5A 20 S Diode forward voltage Vsd Is=-2A, Vgs=0V V Max. body-diode continuous current Is -1.7 A DYNAMIC PARAMETERS Input capacitance Complementary MOSFET Ciss Output capacitance Coss Vgs=0V, Vds=-20V, f=1mhz 145 pf μa 1100 pf Reverse transfer capacitance Crss 115 pf SWITCHING PARAMETERS Total gate charge Qg nc Vgs=-4.5V, Vds=-20V Gate-source charge Qgs 4.5 nc Id=-5A Gate-drain charge Qgd 6.5 nc Turn-on delay time td(on) ns Turn-on rise time tr Vgs=-4.5V, Vds=-20V ns Turn-off delay time td(off) Id=-5A, RL=4Ω, Rgen=1Ω ns Turn-off fall time tf ns 8-5
6 Complementary MOSFET Typical Electrical and Thermal Characteristics (P-ch) 8-6
7 Complementary MOSFET 8-7
8 Test circuit and waveform Complementary MOSFET 8-8
Complementary MOSFET
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DESCRIPTION The SPN2304 is the N-Channel logic enhancement mode power field effect transistors are produced using high cell density, DMOS trench technology. This high density process is especially tailored
More informationTC = 25 C unless otherwise noted. Maximum lead temperature for soldering purposes, 300 1/8" from case for 5 seconds
General Description This Power MOSFET is produced Features using Maple semi s Advanced Super-Junction technology. - 7.6A, 500V, R DS(on) typ. = 0.5Ω@ = 10 V This advanced technology has been especially
More informationSPC1810. N & P Pair Enhancement Mode MOSFET
DESCRIPTION The SPC1810 is the N- and P-Channel enhancement mode power field effect transistors are produced using high cell density, DMOS trench technology. This high density process is especially tailored
More informationVDS (V) min 650 VTDS (V) max 800 RDS(on) (mω) max* 130. Qrr (nc) typ 54. * Dynamic R(on)
650V Cascode GaN FET in TO-220 (source tab) Description The TPH3208PS 650V, 110mΩ gallium nitride (GaN) FET is a normally-off device. Transphorm GaN FETs offer better efficiency through lower gate charge,
More informationTPH3205WSB. 650V Cascode GaN FET in TO-247 (source tab)
650V Cascode GaN FET in TO-247 (source tab) Description The TPH3205WSB 650V, 52mΩ gallium nitride (GaN) FET is a normally-off device. Transphorm GaN FETs offer better efficiency through lower gate charge,
More informationCYStech Electronics Corp.
N- AND P-Channel Enhancement Mode MOSFET N-CH P-CH BVDSS 2V -2V Features Simple drive requirement Low gate charge Low on-resistance Fast switching speed Pb-free lead plating and halogen-free package Spec.
More informationN-Channel Enhancement Mode MOSFET
DESCRIPTION The SPN7400 is the N-Channel logic enhancement mode power field effect transistors are produced using high cell density, DMOS trench technology. This high density process is especially tailored
More informationSPC4567W. N & P Pair Enhancement Mode MOSFET
DESCRIPTION The SPC4567W is the N- and P-Channel enhancement mode power field effect transistors are produced using high cell density, DMOS trench technology. This high density process is especially tailored
More informationVDS (V) min 600 VTDS (V) max 750 RDS(on) (mω) max* 63. Qrr (nc) typ 136. * Dynamic R(on)
600V Cascode GaN FET in TO-247 (source tab) Not recommended for new designs see TP65H050WS Description The TPH3205WS 600V, 52mΩ gallium nitride (GaN) FET is a normally-off device. Transphorm GaN FETs offer
More informationSPC6801. P-Channel Trench MOSFET with Schottky Diode. Battery Powered System DC/DC Converter Load Switch Cell Phone
DESCRIPTION The SPC6801combines the Trench MOSFET technology with a very low forward voltage drop Schottky barrier rectifier in an TSOP-6P package. The Trench MOSFET is the P-Channel enhancement mode power
More informationSPN2302. N-Channel Enhancement Mode MOSFET
DESCRIPTION The is the N-Channel logic enhancement mode power field effect transistors are produced using high cell density, DMOS trench technology. This high density process is especially tailored to
More informationHigh Speed Switching ESD Diode-Protected Gate C/W
Ordering number : ENA1559B Power MOSFET 60V, 62mΩ, 12A, Single P-Channel http://onsemi.com Features Low On-Resistance Low Gate Charge Pb-free and RoHS Compliance High Speed Switching ESD Diode-Protected
More informationVDS (V) min 650 VTDS (V) max 800 RDS(on) (mω) max* 60. Qrr (nc) typ 136. Qg (nc) typ 28. * Dynamic RDS(on)
650V Cascode GaN FET in TO-247 (source tab) Description The TPH3205WSB 650V, 49mΩ gallium nitride (GaN) FET is a normally-off device. Transphorm GaN FETs offer better efficiency through lower gate charge,
More informationFeatures Package Applications Key Specifications Internal Equivalent Circuit Absolute maximum ratings
DKG2 Aug. 2 Features Low on-state resistance Built-in gate protection diode SMD PKG Package TO252 Applications DC / DC converter Switching Internal Equivalent Circuit D(2) Key Specifications V (BR)DSS
More informationCPH6443. Power MOSFET 35V, 37mΩ, 6A, Single N-Channel
Power MOSFET 35V, 37mΩ, 6A, Single N-Channel This Power MOSFET is produced using ON Semiconductor s trench technology, which is specifically designed to minimize gate charge and low on resistance. This
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Power MOSFET 30V, 215mΩ, 2.0A, Single P-Channel This Power MOSFET is produced using ON Semiconductor s trench technology, which is specifically designed to minimize gate charge and low on resistance. This
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