NCS21911, NCV21911, NCS21912, NCV21912, NCS21914, NCV Product Preview Precision Operational Amplifier, 2 MHz Bandwidth, Low Noise

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NCS29, NCV29, NCS292, NCV292, NCS294, NCV294 Product Preview Precision Operational mplifier, 2 MHz Bandwidth, Low Noise The NCS29x family of high precision op amps feature low input offset voltage

1 NCS29, NCV29, NCS292, NCV292, NCS294, NCV294 Product Preview Precision Operational mplifier, 2 MHz Bandwidth, Low Noise The NCS29x family of high precision op amps feature low input offset voltage and nearzero drift over time and temperature. These low quiescent current, low noise amplifiers have railtorail output swing within mv of the rails. These op amps operate over a wide supply range from 4 V to 36 V. The NCS29, as well as the dual version, NCS292, and the quad version, NCS294, come in a variety of packages and pinouts. ll versions are specified for operation from 40 C to 2 C. utomotive qualified options are available under the NCV prefix. Features Low Offset Voltage: 40 V max Zero Drift: 0.0 V/ C max Low Noise: 2 nv/ Hz typical High Bandwidth: 2 MHz typical Supply Voltage: 4 V to 36 V Quiescent Current: 600 max RailtoRail Output NCV Prefix for utomotive and Other pplications Requiring Unique Site and Control Change Requirements; ECQ00 Qualified and PPP Capable These Devices are Pbfree, Halogen free/bfr free and are RoHS compliant Typical pplications Temperature Measurements Transducer pplications Electronic Scales Medical Instrumentation Current Sensing utomotive SOIC NB CSE 707 TSOP CSE 43 MRKING DIGRMS XXXYW XXXXX LYWX 4 Micro CSE 4602 XXXX YW XXXXX = Specific Device Code = ssembly Location WL = Wafer Lot Y = Year W = Work Week = PbFree Package (Note: Microdot may be in either location) ORDERING INFORMTION See detailed ordering and shipping information on page 2 of this data sheet. 4 SOIC4 NB CSE 703 XXXXXXXXXG WLYWW This document contains information on a product under development. ON Semiconductor reserves the right to change or discontinue this product without notice. Semiconductor Components Industries, LLC, 203 June, 20 Rev. P Publication Order Number: NCS29/D

2 NCS29, NCV29, NCS292, NCV292, NCS294, NCV294 PIN CONNECTIONS Single Channel Configuration NCS29 OUT VSS 2 IN 3 4 IN Dual Channel Configuration NCS292 Quad Channel Configuration NCS294 OUT OUT 4 OUT 4 IN 2 7 OUT 2 IN 2 3 IN 4 IN 3 6 IN 2 IN 3 2 IN 4 VSS 4 IN 2 4 VSS IN 2 0 IN 3 IN IN 3 OUT 2 7 OUT 3 ORDERING INFORMTION Configuration utomotive Device Package Shipping Single No NCS29SN2TG SOT23 / TSOP 3000 / Tape & Reel Yes NCV29SN2TG Dual No NCS292DR2G SOIC- 200 / Tape & Reel Yes NCV292DR2G No NCS292DR2G MICRO / Tape & Reel Yes NCV292DMR2G Quad No NCS294DR2G SOIC / Tape & Reel Yes NCV294DR2G For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD0/D. *Contact local sales office for more information. 2

3 NCS29, NCV29, NCS292, NCV292, NCS294, NCV294 BSOLUTE MXIMUM RTINGS Parameter Rating Unit Supply Voltage ( VSS) 40 V INPUT ND OUTPUT PINS Input Voltage (Note ) VSS 0. to 0. V Differential Input Voltage ±0.7 V Input Current (Note ) ±0 m Output Short Circuit Current (Note 2) Continuous TEMPERTURE Operating Temperature 40 to 2 C Storage Temperature 6 to 0 C Junction Temperature 0 C ESD RTINGS (Note 3) Human Body Model (HBM) 2000 V Charged Device Model (CDM) 000 V OTHER RTINGS Latchup Current (Note 4) 00 m MSL Level Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.. Input terminals are diodeclamped to the powersupply rails. Input signals that can swing more than 0.3 V beyond the supply rails should be current limited to 0 m or less. 2. Shortcircuit to V DD or V SS. Short circuits to either rail can cause an increase in the junction temperature. The total power dissipation must be limited to prevent the junction temperature from exceeding the 0 C limit. 3. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per JEDEC standard JS00207 (ECQ00002) ESD Charged Device Model tested per JEDEC standard JS (ECQ000) 4. Latchup Current tested per JEDEC standard JESD7E (ECQ00004). THERML INFORMTION (Note ) Rating Symbol Package Value Unit Junction to mbient J Micro/MSOP TBD C/W SOIC SOIC4. s mounted on an 0x0x. mm FR4 PCB with 60 mm2 and 2 oz (0.034 mm) thick copper heat spreader. Following JEDEC JESD/EI.,.2,.3 test guidelines. TBD TBD OPERTING CONDITIONS Rating Symbol Range Units Supply Voltage (V DD V SS ) V S 4 to 36 V Specified Operating Temperature Range T 40 to 2 C Input Common Mode Voltage Range V ICMR V SS to V DD. V 3

4 NCS29, NCV29, NCS292, NCV292, NCS294, NCV294 ELECTRICL CRCTERISTICS V S = 4 V to 36 V t T = 2 C, R L = 0 kω connected to midsupply, V CM = V OUT = midsupply, unless otherwise noted. Boldface limits apply over the specified temperature range, T = 40 C to 2 C, guaranteed by characterization and/or design. Parameter Symbol Conditions Min Typ Max Units INPUT CHRCTERISTICS Offset Voltage V OS 40 V Offset Voltage Drift vs Temp V OS / T V/ C Input Bias Current I IB p 000 p Input Offset Current I OS p Common Mode Rejection Ratio CMRR V SS < V CM < V DD. V V SS 0. V < V CM < V DD. V 2000 p V S = 36 V db V S = 2 V V S = V V S = 4 V V S = 36 V V S = 2 V V S = V V S = 4 V 0 40 Input Resistance R IN Differential 0. G 00 Common Mode 6 Input Capacitance C IN Differential 6 pf Common Mode 9. OUTPUT CHRCTERISTICS Open Loop Voltage Gain VOL V SS 0. V < V O < V DD 0. V db Open Loop Output Impedance Z OUT_OL f = UGBW, I O = 0 m TBD Output Voltage High, Referenced to Rail Output Voltage Low, Referenced to Rail V OH No Load 6 mv R L = 0 k V OL No Load 6 mv R L = 0 k Short Circuit Current I SC Sinking Current m Sourcing Current 6 Capacitive Load Drive C L nf DYNMIC PERFORMNCE Gain Bandwidth Product GBW C L = 00 pf 2 MHz Gain Margin M C L = 00 pf TBD db Phase Margin ϕ M C L = 00 pf 0 4

5 NCS29, NCV29, NCS292, NCV292, NCS294, NCV294 ELECTRICL CRCTERISTICS V S = 4 V to 36 V t T = 2 C, R L = 0 kω connected to midsupply, V CM = V OUT = midsupply, unless otherwise noted. Boldface limits apply over the specified temperature range, T = 40 C to 2 C, guaranteed by characterization and/or design. Parameter Symbol Conditions Min Typ Max DYNMIC PERFORMNCE Slew Rate SR G =.6 V/ s Settling Time t S Vs = 36 V 0.% 20 s Units 0.0% 27 s Overload Recovery Time t OR VIN G = VS s NOISE PERFORMNCE Total Harmonic Distortion Noise THDN f IN = khz, V =, V OUT = Vrms TBD % Voltage Noise Density e N f = khz 2 nv/ Hz Voltage Noise, PeaktoPeak e PP f = 0. Hz to 0 Hz 70 nv PP Voltage Noise, RMS e RMS f = 0. Hz to 0 Hz 4 nvrms Current Noise Density i N f = Hz 20 f/ Hz POWER SUPPLY Power Supply Rejection Ratio PSRR V S = 4 V to 36 V V/V Quiescent Current I Q Per channel

6 NCS29, NCV29, NCS292, NCV292, NCS294, NCV294 PPLICTION INFORMTION Overview The NCS29, NCS292, and NCS294 precision op amps provide low offset voltage and zero drift over temperature. With a maximum offset voltage of 40 V and input common mode voltage range that includes ground, the NCS29 series is wellsuited for applications where precision is required, such as low side current sensing and interfacing with sensors. The NCS29 series of amplifiers uses a chopperstabilized architecture, which provides the advantage of minimizing offset voltage drift over temperature and time. The simplified block diagram is shown in Figure. Unlike the classical chopper architecture, the chopper stabilized architecture has two signal paths. Main amp IN IN OUT Chopper Chopper RC notch filter Figure. Simplified NCS29 Block Diagram In Figure, the lower signal path is where the chopper samples the input offset voltage, which is then used to correct the offset at the output. The offset correction occurs at a frequency of 20 khz. The chopperstabilized architecture is optimized for best performance at frequencies up to the related Nyquist frequency (/2 of the offset correction frequency). s the signal frequency exceeds the Nyquist frequency, 2 khz, aliasing may occur at the output. This is an inherent limitation of all chopper and chopperstabilized architectures. Nevertheless, the NCS29 series op amps have minimal aliasing up to 200 khz and are less susceptible to aliasing effects when compared to competitor parts from other manufacturers. ON Semiconductor s patented approach utilizes two cascaded, symmetrical, RC notch filters tuned to the chopper frequency and its fifth harmonic to reduce aliasing effects. The chopperstabilized architecture also benefits from the feedforward path, which is shown as the upper signal path of the block diagram in Figure. This is the high speed signal path that extends the gain bandwidth up to 2 MHz. Not only does this help retain high frequency components of the input signal, but it also improves the loop gain at low frequencies. This is especially useful for lowside current sensing and sensor interface applications where the signal is low frequency and the differential voltage is relatively small. 6

7 NCS29, NCV29, NCS292, NCV292, NCS294, NCV294 pplication Circuits LowSide Current Sensing Low side current sensing is used to monitor the current through a load. This method can be used to detect over current conditions and is often used in feedback control. sense resistor is placed in series with the load to ground. Typically, the value of the sense resistor is less than 00 m to reduce power loss across the resistor. The op amp amplifies the voltage drop across the sense resistor with a gain set by external resistors R, R2, R3, and R4 (where R = R2, R3 = R4). Precision resistors are required for high accuracy, and the gain is set to utilize the full scale of the DC for the highest resolution. V R 3 Load R Microcontroller R SENSE DC control R 2 R 4 Figure 2. LowSide Current Sensing Differential mplifier for Bridged Circuits Sensors to measure strain, pressure, and temperature are often configured in a Wheatstone bridge circuit as shown in Figure 3. In the measurement, the voltage change that is produced is relatively small and needs to be amplified before going into an DC. Precision amplifiers are recommended in these types of applications due to their high gain, low noise, and low offset voltage. Figure 3. Bridge Circuit mplification EMI Susceptibility and Input Filtering Op amps have varying amounts of EMI susceptibility. Semiconductor junctions can pick up and rectify EMI signals, creating an EMI induced voltage offset at the output, adding another component to the total error. Input pins are the most sensitive to EMI. The NCS29x integrates low pass filters to decrease its sensitivity to EMI. General Layout Guidelines To ensure optimum device performance, it is important to follow good PCB design practices. Place 0. F decoupling capacitors as close as possible to the supply pins. Keep traces short, utilize a ground plane, choose surface mount components, and place components as close as possible to the device pins. These techniques will reduce susceptibility to electromagnetic interference (EMI). Thermoelectric effects can create an additional temperature dependent offset voltage at the input pins. To reduce these effects, use metals with low thermoelectric coefficients and prevent temperature gradients from heat sources or cooling fans. 7

8 NCS29, NCV29, NCS292, NCV292, NCS294, NCV294 PCKGE DIMENSIONS TSOP CSE 43 ISSUE M 2X 2X 0.20 NOTE T 0.0 B 0.0 T B H G TOP VIEW SIDE VIEW C D X S 0.20 C SETING PLNE C B M K DETIL Z DETIL Z J END VIEW NOTES:. DIMENSIONING ND TOLERNCING PER SME Y4.M, CONTROLLING DIMENSION: MILLIMETERS. 3. MXIMUM LED THICKNESS INCLUDES LED FINISH THICKNESS. MINIMUM LED THICKNESS IS THE MINIMUM THICKNESS OF BSE MTERIL. 4. DIMENSIONS ND B DO NOT INCLUDE MOLD FLSH, PROTRUSIONS, OR GTE BURRS. MOLD FLSH, PROTRUSIONS, OR GTE BURRS SHLL NOT EXCEED 0. PER SIDE. DIMENSION.. OPTIONL CONSTRUCTION: N DDITIONL TRIMMED LED IS LLOWED IN THIS LOCTION. TRIMMED LED NOT TO EXTEND MORE THN 0.2 FROM BODY. MILLIMETERS DIM MIN MX B C D G 0.9 BSC H J K M 0 0 S SOLDERING FOOTPRINT* SCLE 0: mm inches *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.

9 NCS29, NCV29, NCS292, NCV292, NCS294, NCV294 Micro CSE 4602 ISSUE J H E D E NOTES:. DIMENSIONING ND TOLERNCING PER NSI Y4.M, CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION DOES NOT INCLUDE MOLD FLSH, PROTRUSIONS OR GTE BURRS. MOLD FLSH, PROTRUSIONS OR GTE BURRS SHLL NOT EXCEED 0. (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLED FLSH OR PROTRUSION. INTERLED FLSH OR PROTRUSION SHLL NOT EXCEED 0.2 (0.00) PER SIDE OBSOLETE, NEW STNDRD PIN ID T SETING PLNE 0.03 (0.00) e b PL 0.0 (0.003) M T B S S MILLIMETERS INCHES DIM MIN NOM MX MIN NOM MX b c D E e 0.6 BSC BSC L H E c L RECOMMENDED SOLDERING FOOTPRINT* X 0.4 X PITCH DIMENSION: MILLIMETERS *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 9

10 NCS29, NCV29, NCS292, NCV292, NCS294, NCV294 SOIC NB CSE 707 ISSUE K X B Y Z H G D 4 S C 0.2 (0.00) M Z Y S X S 0.2 (0.00) M SETING PLNE Y 0.0 (0.004) M N X 4 M K SOLDERING FOOTPRINT* J NOTES:. DIMENSIONING ND TOLERNCING PER NSI Y4.M, CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION ND B DO NOT INCLUDE MOLD PROTRUSION. 4. MXIMUM MOLD PROTRUSION 0. (0.006) PER SIDE.. DIMENSION D DOES NOT INCLUDE DMBR PROTRUSION. LLOWBLE DMBR PROTRUSION SHLL BE 0.27 (0.00) TOTL IN EXCESS OF THE D DIMENSION T MXIMUM MTERIL CONDITION THRU 706 RE OBSOLETE. NEW STNDRD IS 707. MILLIMETERS INCHES DIM MIN MX MIN MX B C D G.27 BSC 0.00 BSC H J K M 0 0 N S STYLE : PIN. SOURCE 2. GTE 3. SOURCE 2 4. GTE 2. DRIN 2 6. DRIN 2 7. DRIN. DRIN SCLE 6: mm inches *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 0

11 NCS29, NCV29, NCS292, NCV292, NCS294, NCV294 SOIC4 NB CSE 703 ISSUE L H M B M 0.0 e D 7 3X b B E 0.2 M C S B S C SETING PLNE L DETIL h X 4 M 3 DETIL NOTES:. DIMENSIONING ND TOLERNCING PER SME Y4.M, CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b DOES NOT INCLUDE DMBR PROTRUSION. LLOWBLE PROTRUSION SHLL BE 0.3 TOTL IN EXCESS OF T MXIMUM MTERIL CONDITION. 4. DIMENSIONS D ND E DO NOT INCLUDE MOLD PROTRUSIONS.. MXIMUM MOLD PROTRUSION 0. PER SIDE. MILLIMETERS INCHES DIM MIN MX MIN MX b D E e.27 BSC 0.00 BSC H h L M SOLDERING FOOTPRINT* 6.0 4X..27 PITCH 4X 0. DIMENSIONS: MILLIMETERS *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.

12 NCS29, NCV29, NCS292, NCV292, NCS294, NCV294 Micro is registered trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. listing of ON Semiconductor s product/patent coverage may be accessed at /site/pdf/patentmarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. Typical parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. ll operating parameters, including Typicals must be validated for each customer application by customer s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FD Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/ffirmative ction Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICTION ORDERING INFORMTION LITERTURE FULFILLMENT: Literature Distribution Center for ON Semiconductor 92 E. 32nd Pkwy, urora, Colorado 00 US Phone: or Toll Free US/Canada Fax: or Toll Free US/Canada orderlit@onsemi.com N. merican Technical Support: Toll Free US/Canada Europe, Middle East and frica Technical Support: Phone: ON Semiconductor Website: Order Literature: For additional information, please contact your local Sales Representative NCS29/D

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