MC34064, MC33064, NCV33064

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MC3464, MC3364, NCV3364 Undervoltage Sensing Circuit The MC3464 is an undervoltage sensing circuit specifically designed for use as a reset controller in microprocessor based systems.

1 MC3464, MC3364, NCV3364 Undervoltage Sensing Circuit The MC3464 is an undervoltage sensing circuit specifically designed for use as a reset controller in microprocessor based systems. It offers the designer an economical solution for low voltage detection with a single external resistor. The MC3464 features a trimmed in package bandgap reference, and a comparator with precise thresholds and builtin hysteresis to prevent erratic reset operation. The open collector reset output is capable of sinking in excess of m, and operation is guaranteed down to. V input with low standby current. The MC devices are packaged in 3 pin TO92, micro size TSOP 5, pin SOIC and Micro surface mount packages. The NCV device is packaged in SOIC and. pplications include direct monitoring of the 5. V MPU/logic power supply used in appliance, automotive, consumer and industrial equipment. Features Trimmed In Package Temperature Compensated Reference Comparator Threshold of 4.6 V at 25 C Precise Comparator Thresholds Guaranteed Over Temperature Comparator Hysteresis Prevents Erratic Output Capable of Sinking in Excess of m Internal Clamp Diode for Discharging Delay Capacitor Guaranteed Operation with. V Low Standby Current Economical, TSOP 5, SOIC and Micro Surface Mount Packages NCV Prefix for utomotive and Other pplications Requiring Site and Control Changes These Devices are Pb Free and are RoHS Compliant 5 Pin SOIC D SUFFIX CSE 75 Micro DM SUFFIX CSE 46 TSOP 5 SN SUFFIX CSE 43. Ground NC 5. NC STRIGHT LED ENT LED ULK PCK TPE & REEL MMO PCK P SUFFIX CSE 29 Pin PIN CONNECTIONS Ground N.C. Ground N.C N.C. 6 N.C. 5 N.C. (Top View).2 V ref This device contains 2 active transistors. Figure. Representative lock Diagram = Sink Only Positive True Logic ORDERING INFORMTION See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. DEVICE MRKING INFORMTION See general marking information in the device marking section on page 7 of this data sheet. Semiconductor Components Industries, LLC, 26 October, 26 Rev. 9 Publication Order Number: MC3464/D

2 MXIMUM RTINGS Rating Symbol Value Unit Power Supply Voltage V in. to V Output Voltage V O V Output Sink Current (Note 2) I Sink Internally Limited m Clamp Diode Forward Current, to Pin (Note 2) I F m Power Dissipation and Thermal Characteristics P Suffix, Plastic Package Maximum Power T = 25 C Thermal Resistance, Junction to ir D Suffix, Plastic Package Maximum Power T = 25 C Thermal Resistance, Junction to ir DM Suffix, Plastic Package Maximum Power T = 25 C Thermal Resistance, Junction to ir P D R J P D R J P D R J mw C/W mw C/W mw C/W Operating Junction Temperature T J 5 C Operating mbient Temperature MC3464 MC3364 NCV3364 T to 7 4 to 5 4 to 25 C Storage Temperature Range T stg 65 to 5 C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.. ESD data available upon request. ELECTRICL CHRCTERISTICS (For typical values T = 25 C, for min/max values T is the operating ambient temperature range that applies [Notes 3 and 4] unless otherwise noted.) Characteristics Symbol Min Typ Max Unit COMPRTOR Threshold Voltage V High State Output (V in Increasing) Low State Output (V in Decreasing) Hysteresis V IH V IL V H RESET OUTPUT Output Sink Saturation (V in = 4. V, I Sink =. m) (V in = 4. V, I Sink = 2. m) (V in =. V, I Sink =. m) Output Sink Current (V in, = 4. V) I Sink 27 6 m Output OffState Leakage (V in, = 5. V) I OH.2.5 Clamp Diode Forward Voltage, to Pin (I F = m) V F V TOTL DEVICE Operating Voltage Range V in. to 6.5 V Quiescent Current (V in = 5. V) I in Maximum package power dissipation limits must be observed. 3. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient as possible. 4. T low = C for MC3464 T high = 7 C for MC C for MC C for MC C for NCV C for NCV NCV prefix is for automotive and other applications requiring site and change control. V OL V 2

3 I MC3464, MC3364, NCV V O, OUTPUT VOLTGE (V) R L = k to V in T = 25 C V O, OUTPUT VOLTGE (V) R L = k to V in T = 25 C V in, INPUT VOLTGE (V) Figure 2. Output Voltage versus Voltage V in, INPUT VOLTGE (V) Figure 3. Output Voltage versus Voltage R L = k to V in th, THRESHOLD VOLTGE (V) V Upper Threshold High State Output Lower Threshold Low State Output in, INPUT CURRENT (m) T = 25 C 5 C T = 25 C 4 C 4 C 5 C T, MIENT TEMPERTURE ( C) Figure 4. Comparator Threshold Voltage versus Temperature V in, INPUT VOLTGE (V) Figure 5. Current versus Voltage V OL, OUTPUT STURTION (V) V in = 4. V T = 5 C T = 25 C T = 4 C 9% 5. V 4. V % 5.V 4.V V in V in k V in = 5. V to 4. V R L = k T = 25 C REF I Sink, SINK CURRENT (m) Figure 6. Output Saturation versus Sink Current 2 ns/div Figure 7. Delay Time 3

4 IF, FORWRD CURRENT (m) V in = V T = 25 C V F, FORWRD VOLTGE (V) Figure. Clamp Diode Forward Current versus Voltage Power Supply R Microprocessor Circuit.2 V ref C DLY Figure 9. Low Voltage Microprocessor time delayed reset can be accomplished with the addition of C DLY. For systems with extremely fast power supply rise times (<5 ns) it is recommended that the RC DLY time constant be greater than 5. s. V th(mpu) is the microprocessor reset input threshold. t DLY = RC DLY In V th(mpu) V in TEST DT Power Supply I in R H.2V ref R L V H 4.6 R H.2 R L V th(lower) 34 R H x 6 Where:R H 5 Where:R L.5, k Microprocessor Circuit V H (mv) V th (mv) R H () R L (k) Comparator hysteresis can be increased with the addition of resistor R H. The hysteresis equation has been simplified and does not account for the change of input current I in as V CC crosses the comparator threshold (Figure 4). n increase of the lower threshold V th(lower) will be observed due to I in which is typically 34 at 4.59V. The equations are accurate to ±% with R H less than 5 and R L between.5 k and k Figure. Low Voltage Microprocessor with dditional Hysteresis 4

5 Power Supply.k Solar Cells.2V ref.2v ref Figure. Voltage Monitor Figure 2. Solar Powered attery Charger 25H V in =.5 to 4.5V 4.7k 47 MPSW5 47 N k V O = 5. V I O = 5 m 33 N756 Test Conditions Results Line Regulation V in =.5 V to 4.5 V, I O = 5 m 35 mv Load Regulation V in = 2.6 V, I O = m to 5 m 2 mv Output Ripple V in = 2.6 V, I O = 5 m 6 mvpp Efficiency V in = 2.6 V, I O = 5 m 77%.2V ref Figure 3. Low Power Switching Regulator V CC R L 4.6V 27 MTP355EL.2V ref Overheating of the logic level power MOSFET due to insufficient gate voltage can be prevented with the above circuit. When the input signal is below the 4.6 V threshold of the MC3464, its output grounds the gate of the L 2 MOSFET. Figure 4. MOSFET Low Voltage Gate Drive Protection 5

6 ORDERING INFORMTION MC3464D 5G Device Operating Temperature Range Package Shipping SOIC 9 Units / Rail MC3464D 5R2G SOIC 25 Units/ Tape & Reel MC3464DM 5R2G Micro 4 Units / Tape & Reel MC3464P 5G MC3464P 5RG T = C to 7 C 2 Units / ag 2 Units / Tape & Reel MC3464P 5RPG 2 Units / mmo Pack MC3464P 5RMG MC3464SN 5TG TSOP 5 3 Units / Tape & Reel MC3364D 5G SOIC 9 Units / Rail MC3364D 5R2G SOIC 25 Units / Tape & Reel MC3364DM 5R2G Micro 4 Units / Tape & Reel MC3364P 5G T = 4 C to 5 C 2 Units / ag MC3364P 5RG 2 Units / Tape & Reel MC3364P 5RPG 2 Units / mmo Pack MC3364SN 5TG TSOP 5 3 Units / Tape & Reel NCV3364D 5R2G* SOIC 25 Units / Tape & Reel NCV3364P 5RG* NCV3364P 5RPG* T = 4 C to 25 C 2 Units / Tape & Reel 2 Units / mmo Pack NCV3364DM 5R2G* Micro 4 Units / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, pleaserefer to our Tape and Reel Packaging Specifications rochure, RD/D. *NCV3364: T low = 4 C, T high = 25 C. Guaranteed by design. NCV prefix is for automotive and other applications requiring site and change control. 6

7 MRKING DIGRMS SOIC D SUFFIX CSE 75 Micro DM SUFFIX CSE 46 P SUFFIX CSE 29 3x64 LYW5 V364 LYW5 Ly5 YW VI5 YW MC3x 64P 5 LYW NCV3 64P 5 LYW TSOP 5 SN SUFFIX CSE 43 5 SR YW MC SSN YW MC3364 x = 3 or 4 y = C or I = ssembly Location L = Wafer Lot Y = Year W = Work Week = Pb Free Package (Note: Microdot may be in either location) 7

8 PCKGE DIMENSIONS SOIC D SUFFIX CSE 75 7 ISSUE K Y X 5 4 S.25 (.) M Y M K NOTES:. DIMENSIONING ND TOLERNCING PER NSI Y4.5M, CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION ND DO NOT INCLUDE MOLD PROTRUSION. 4. MXIMUM MOLD PROTRUSION.5 (.6) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DMR PROTRUSION. LLOWLE DMR PROTRUSION SHLL E.27 (.5) TOTL IN EXCESS OF THE D DIMENSION T MXIMUM MTERIL CONDITION THRU 75 6 RE OSOLETE. NEW STNDRD IS Z H G D C.25 (.) M Z Y S X S SETING PLNE. (.4) N X 45 M J MILLIMETERS INCHES DIM MIN MX MIN MX C D G.27 SC.5 SC H J K M N S SOLDERING FOOTPRINT* SCLE 6: mm inches *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.

9 PCKGE DIMENSIONS Micro DM SUFFIX CSE 46 2 ISSUE J H E D E NOTES:. DIMENSIONING ND TOLERNCING PER NSI Y4.5M, CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION DOES NOT INCLUDE MOLD FLSH, PROTRUSIONS OR GTE URRS. MOLD FLSH, PROTRUSIONS OR GTE URRS SHLL NOT EXCEED.5 (.6) PER SIDE. 4. DIMENSION DOES NOT INCLUDE INTERLED FLSH OR PROTRUSION. INTERLED FLSH OR PROTRUSION SHLL NOT EXCEED.25 (.) PER SIDE OSOLETE, NEW STNDRD 462. PIN ID T SETING PLNE.3 (.5) e b PL. (.3) M T S S c L MILLIMETERS INCHES DIM MIN NOM MX MIN NOM MX b c D E e.65 SC.26 SC L H E RECOMMENDED SOLDERING FOOTPRINT* X.4 X PITCH DIMENSION: MILLIMETERS *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 9

10 PCKGE DIMENSIONS TSOP 5 SN SUFFIX CSE 43 ISSUE M 2X 2X.2 NOTE 5 T..5 T H G TOP VIEW SIDE VIEW C D 5X S.2 C SETING PLNE C M K DETIL Z DETIL Z J END VIEW NOTES:. DIMENSIONING ND TOLERNCING PER SME Y4.5M, CONTROLLING DIMENSION: MILLIMETERS. 3. MXIMUM LED THICKNESS INCLUDES LED FINISH THICKNESS. MINIMUM LED THICKNESS IS THE MINIMUM THICKNESS OF SE MTERIL. 4. DIMENSIONS ND DO NOT INCLUDE MOLD FLSH, PROTRUSIONS, OR GTE URRS. MOLD FLSH, PROTRUSIONS, OR GTE URRS SHLL NOT EXCEED.5 PER SIDE. DIMENSION. 5. OPTIONL CONSTRUCTION: N DDITIONL TRIMMED LED IS LLOWED IN THIS LOCTION. TRIMMED LED NOT TO EXTEND MORE THN.2 FROM ODY. MILLIMETERS DIM MIN MX C D.25.5 G.95 SC H.. J..26 K.2.6 M S SOLDERING FOOTPRINT* SCLE : mm inches *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.

11 PCKGE DIMENSIONS R N (TO 226) P SUFFIX CSE 29 ISSUE M STRIGHT LED ULK PCK NOTES:. DIMENSIONING ND TOLERNCING PER NSI Y4.5M, CONTROLLING DIMENSION: INCH. 3. CONTOUR OF PCKGE EYOND DIMENSION R IS UNCONTROLLED. 4. LED DIMENSION IS UNCONTROLLED IN P ND EYOND DIMENSION K MINIMUM. P L SETING INCHES MILLIMETERS PLNE K DIM MIN MX MIN MX C D X X D G H G J H J K V C L N P SECTION X X R N V R ENT LED TPE & REEL MMO PCK NOTES:. DIMENSIONING ND TOLERNCING PER SME Y4.5M, CONTROLLING DIMENSION: MILLIMETERS. 3. CONTOUR OF PCKGE EYOND DIMENSION R IS UNCONTROLLED. 4. LED DIMENSION IS UNCONTROLLED IN P ND EYOND DIMENSION K MINIMUM. P T MILLIMETERS SETING PLNE K DIM MIN MX C D.4.54 G X X D G J.39.5 K 2.7 J N V P.5 4. C R 2.93 SECTION X X V 3.43 N Micro is a trademark of International Rectifier. ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. listing of ON Semiconductor s product/patent coverage may be accessed at /site/pdf/patent Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. uyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. Typical parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. ll operating parameters, including Typicals must be validated for each customer application by customer s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FD Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should uyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, uyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/ffirmative ction Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PULICTION ORDERING INFORMTION LITERTURE FULFILLMENT: Literature Distribution Center for ON Semiconductor 952 E. 32nd Pkwy, urora, Colorado US Phone: or Toll Free US/Canada Fax: or Toll Free US/Canada orderlit@onsemi.com N. merican Technical Support: Toll Free US/Canada Europe, Middle East and frica Technical Support: Phone: Japan Customer Focus Center Phone: ON Semiconductor Website: Order Literature: For additional information, please contact your local Sales Representative MC3464/D

MC34064, MC33064, NCV33064

MC34064, MC33064, NCV33064 MC3464, MC3364, NCV3364 Undervoltage Sensing Circuit The MC3464 is an undervoltage sensing circuit specifically designed for use as a reset controller in microprocessorbased systems. It offers the designer