NCV Amp H-Bridge Driver
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1 V mp HBridge Driver This automotive grade HBridge driver provides a flexible means for controlling loads requiring bidirectional drive currents. Bridge outputs are protected from overcurrent at each switch and overtemperature shutdown provides product robustness. The V770 inputs can be interfaced to a range of voltages, including vehicle battery voltage. The product features a low quiescent current mode, allowing unswitched connection to the power source. The V770 is produced using ON Semiconductor's POWERSSE BCD technology. Features Forward, Reverse, Brake High, Brake Low Modes.0 Output Current Capability (DC) Supply Voltage Range 7.0 V to 26 V 0.25 R DS(ON) per 25 C Sleep Mode (I Q < 0 ) Overvoltage Protection Thermal Protection Undervoltage Disable Function Short Circuit Protection Cross Conduction Protection Synchronous LowSide Rectification for Lower Power Dissipation Diagnostic Output (Open Drain) TTL/CMOS/Pullup to Battery Compatible Inputs 20 Lead SO Package with 8 Internally Fused Leads EC Qualified PPP Capable These are PbFree Devices* Typical pplications DC Motors Stepper Motors Modulator Valves WL YY WW G SOIC20 WB CSE 75D DW SUFFIX 20 = ssembly Location = Wafer Lot = Year = Work Week = PbFree Package PIN CONNECTIONS 20 V BT OUT FULT IN ORDERING INFORMTION MRKING DIGRM Device Package Shipping V770 WLYYWWG V770DWG V770DWR2G SOIC20W (PbFree) SOIC20W (PbFree) 38 Units/Rail 000 Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD80/D. *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Semiconductor Components Industries, LLC, 2007 November, 2007 Rev. 7 Publication Order Number: V770/D
2 V770 V BT Voltage Reference 200 khz Oscillator Charge Pumps M M3 IN Bridge Control Gate Drive OUT FULT Fault Detection TSD OVSD UVLO Masking Timer M2 M4 Figure. Block Diagram MXIMUM RTINGS Rating Value Unit Supply Voltage (DC) V BT (Note ) 0.3 to 45 V Logic Input Voltage (DC) 0.3 to 2 V Junction Temperature Range 40 to 50 C Storage Temperature Range 65 to 50 C Peak Transient (.0 ms rise time, 300 ms period, 3 V Load V BT = 4 V) (Note ) 45 V ESD Susceptibility Human Body Model Machine Model ±4.0 ±200 kv V Package Thermal Resistance JunctiontoCase, R JC Junctiontombient, R J C/W C/W Lead Temperature Soldering: Reflow: (SMD styles only) (Note 2) 230 peak C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.. External reversebattery and transient voltage suppression (TVS) required second maximum above 83 C. 2
3 V770 ELECTRICL CHRCTERISTICS (7.0 V V BT 26 V, 40 C T J 25 C; unless otherwise specified.) Note 3 GERL Characteristic Test Conditions Min Typ Max Unit V BT Quiescent Current: Low Quiescent Normal Operation = 0 V, V BT 2.8 V 2.5 V V BT, V BT = 4 V m LOGIC INPUT Low Level Input Voltage 0.7 V High Level Input Voltage 2.5 V Input Bias Current = 5.0 V Input Leakage Current = 0 V.0 IN,, LOGIC INPUTS Low Level Input Voltage 0.8 V High Level Input Voltage 2.0 V Input Bias Current 5.0 V on Logic Input, = 5.0 V Input Leakage Current 0 V on Logic Input, = 0 V.0 IC PROTECTION Overvoltage Shutdown V Overvoltage Hysteresis V Undervoltage Voltage Lockout 6.5 V Undervoltage Hysteresis mv Thermal Shutdown (Guaranteed by Design) C Thermal Hysteresis (Guaranteed by Design) C DRIVERS OUT, Output High Voltage (V H ) V BT = 4 V, I SOURCE =.0, V H = V BT OUT X V Output Low Voltage (V L ) V BT = 4 V, I SOURCE =.0, V L = OUT X V V Current Limit V BT = 4 V FULT OUTPUT Output Leakage Current V FULT = 5.0 V, Fault bsent 0 Output Low Voltage I FULT = 0.5 m, Fault Present.0 V C CHRCTERISTICS Output TurnOn Delay s Output TurnOff Delay s Current Limit Mask Time s 3. Designed to meet these characteristics over the stated voltage and temperature ranges, though may not be 00% parametrically tested in production. 3
4 V770 Table. HBridge Mode Control IN HBridge OUT 0 X X Off (Sleep Mode) Off Off 0 0 Brake Low Low Low 0 Forward High Low 0 Reverse Low High Brake High High High Table 2. Fault Diagnostics Fault Condition Fault Pin HBridge No Faults High Z Normal Operation Undervoltage Low Off Overvoltage Low Off Thermal Shutdown Low Off Current Limit Low or more Drivers in Current Limit PCKGE PIN DESCRIPTION Pin No. Symbol Description V BT IC supply voltage 2, 9, 0, 9, 20 No connection 3 Bridge output V IGN 4, 5, 6, 7, 4, 5, 6, 7 Power ground 8 FULT Diagnostic output Mode control input 2 IN Mode control input TVS + 47 F 20 V BT OUT 3 Chip enable 8 OUT Bridge output V770 Operating Description During powerup, the outputs are HIZ regardless of the input states. When the undervoltage lockout threshold is exceeded, the outputs will reflect the input states. Outputs change to HIZ whenever an undervoltage, overvoltage or thermal shutdown fault is detected. Normal operation will resume when faults are resolved. FULT IN Overcurrent Protection Current is monitored continuously in each switch of each half bridge when the input is in a high state thus protecting each switch from faults due to short to, short to V BT or shorted load conditions. Only the affected halfbridge is disabled for short to V BT or short to faults. mask timer is initiated after a fault is detected and prevents recognition of an overcurrent event until the mask time expires. Persistence of an overcurrent condition causes the bridge output to change to HIZ and the FULT output to latch low until the next transition occurs on either the input related to the faulted output or the input is brought low then high again. This method of protection provides current limiting on a cyclebycycle basis and helps allow a stall torque current to be ignored during motor start. Continued overcurrent may eventually result in activation of the thermal shutdown circuitry, thus activating a second level of protection for the V770. V CC Controller Figure 2. pplication Diagram 4
5 V770 PCKGE DIMSIONS SOIC20 WB CSE 75D05 ISSUE G H 0X 0.25 M B M 20 D E h X 45 NOTES:. DIMSIONS RE IN MILLIMETERS. 2. INTERPRET DIMSIONS ND TOLERES PER SME Y4.5M, DIMSIONS D ND E DO NOT ILUDE MOLD PROTRUSION. 4. MXIMUM MOLD PROTRUSION 0.5 PER SIDE. 5. DIMSION B DOES NOT ILUDE DMBR PROTRUSION. LLOWBLE PROTRUSION SHLL BE 0.3 TOTL IN EXCESS OF B DIMSION T MXIMUM MTERIL CONDITION. 20X B 0.25 M T S 8X e 0 B B S T SETING PLNE C L MILLIMETERS DIM MIN MX B C D E e.27 BSC H h L POWERSSE is a trademark of Semiconductor Components Industries, LLC. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. ll operating parameters, including Typicals must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/ffirmative ction Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICTION ORDERING INFORMTION LITERTURE FULFILLMT: Literature Distribution Center for ON Semiconductor P.O. Box 563, Denver, Colorado 8027 US Phone: or Toll Free US/Canada Fax: or Toll Free US/Canada orderlit@onsemi.com N. merican Technical Support: Toll Free US/Canada Europe, Middle East and frica Technical Support: Phone: Japan Customer Focus Center Phone: ON Semiconductor Website: Order Literature: For additional information, please contact your local Sales Representative V770/D
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