NUD4700. LED Shunt. Features. Typical Applications MARKING DIAGRAM PIN FUNCTION DESCRIPTION ORDERING INFORMATION.
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1 LED Shunt The is an electronic shunt which provides a current bypass in the case of a single LED going into open circuit. LEDs are by nature quite fragile when subjected to transients and surge conditions. There are also many cases where high reliability of the LED lighting must be maintained such as headlights, lighthouses, bridges, aircraft, runways and so forth. In these cases the low cost addition of the will provide full assurance that an entire string of LEDs will not extinguish should one LED fail. is also applicable to other loads where circuit continuity is required. This device is designed to be used with 1 W LEDs (nominally 35 3 V). Features A Simple Two Terminal Device Automatically Resets Itself if the LED Heals Itself or is Replaced ONState Voltage Typically 1 V OFFState Current less than 25 A This is a PbFree Device Typical Applications LEDs where Preventive Maintenance is Non Practical LED Headlights LEDs with High Reliability Requirements Crowbar Protection for Open Conditions Overvoltage Protection for Sensitive s POWERMITE CASE 457 PLASTIC MARKING DIAGRAM M MNH M = Date Code MNH = Device Code = PbFree Package Pin PIN FUNCTION DESCRIPTION Description Positive Input Voltage to the Device Negative Input Voltage to the Device ORDERING INFORMATION Device Package Shipping SNT1G POWERMITE (PbFree) 3/Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD811/D. Semiconductor Components Industries, LLC, 21 March, 21 Rev. 8 1 Publication Order Number: /D
2 MAXIMUM RATINGS (Maximum ratings are those, that, if exceeded, may cause damage to the device. Electrical Characteristics are not guaranteed over this range) Rating Symbol Value Unit Peak Repetitive Off State Voltage ( to ) V DM.3 to 1 V Average OnState Current, (T A = 25 C), (Note 1) (Note 2) I T(AVG) A Thermal Resistance, JunctiontoAir (Note 1) (Note 2) Q JA Thermal Resistance, JunctiontoLead Q JL 35 C/W Power Dissipation (T A = 25 C) (Note 1) (Note 2) P MAX Operating Temperature Range T J 4 to 15 C NonOperating Temperature Range T J 15 C Lead Temperature, Soldering (1 Sec) T L 26 C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Mounted onto a 1 x 1 square copper pad. Normally this device would be mounted on the same copper heat sink and adjacent to the LED. If the LED were to go open, then the shunt would now dissipate the power using the same copper heat sink. Since the has a voltage that is nominally 3% of the LED, then the power dissipation would be easily handled by the same heat sink as the LED. 2. Device mounted on minimum copper pad. C/W W ELECTRICAL CHARACTERISTICS (Unless otherwise noted: T A = 25 C) Characteristics Symbol Min Typ Max Unit OffState Current (V = 5 V) Breakdown Voltage (I BR = 1 ma) Holding Current (V = 1 V, I initial = 1 ma) Latching Current (V = 1 V) I LEAK 1 25 A V (BR) V I H ma I L 35 7 ma OnState Voltage (I T =.35 A) (I T =.75 A) (I T = 1. A) V T V DYNAMIC CHARACTERISTICS Critical RateofRise of Off State Voltage (V pk = Rated V (BR), T J = 125 C, Exponential Method) dv/dt 25 V/ s 2
3 TYPICAL PERFORMANCE CURVES (T A = 25 C unless otherwise noted) 4 6 I L, LATCHING CURRENT (ma) I H, HOLDING CURRENT (ma) T A, AMBIENT TEMPERATURE ( C) Figure 1. Latching Current vs Temperature T A, AMBIENT TEMPERATURE ( C) Figure 2. Holding Current vs Temperature 1 45 C d, CAPACITANCE (pf) I DSS, LEAKAGE CURRENT ( A) VOLTS (V) Figure 3. Capacitance vs Voltage T A, AMBIENT TEMPERATURE ( C) Figure 4. Leakage Current vs Temperature V T, ONSTATE VOLTAGE (V) I 35 ma I 75 ma I 1. ma V T, ONSTATE VOLTAGE (V) TEMPERATURE ( C) Figure 5. OnState Voltage vs. Temperature I T, ONSTATE CURRNT (A) Figure 6. OnState Voltage vs. OnState Current (I T ) at 25 C 3
4 TYPICAL APPLICATION CIRCUIT Q1 AC/DC Converter R1 NUD41 Current Source Figure 7. Typical Application 4
5 TYPICAL OPERATION WAVEFORMS Switching event LED being opened LED Current voltage Off state voltage ONstate switching waveforms (Powermite) Figure 8. Switching Waveforms Current overshoot due to response time of current source Switching event LED being opened LED Current voltage Off state voltage ONstate switching waveforms (zoom in) Figure 9. Zoom in of Figure 8 5
6 PACKAGE DIMENSIONS POWERMITE CASE 4574 ISSUE E A S C J F.8 (.3) M T B S C S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED.15 (.6) PER SIDE. K R B J H T L PIN 1 PIN 2 D.8 (.3) M T B S C S MILLIMETERS INCHES DIM MIN MAX MIN MAX A B C D F H J K L R S.5 REF.19 REF SOLDERING FOOTPRINT* SCALE 1:1 mm inches *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. POWERMITE is a registered trademark of and used under a license from Microsemi Corporation. The product described herein (), may be covered by one or more U.S. patents. There may be other patents pending. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 8217 USA Phone: or Toll Free USA/Canada Fax: or Toll Free USA/Canada orderlit@onsemi.com N. American Technical Support: Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: Japan Customer Focus Center Phone: ON Semiconductor Website: Order Literature: For additional information, please contact your local Sales Representative /D
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