Let me also remind you the two on-going challenges until 30 th June for the ASPICS and for Custom products. Take your chance!

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1 Dear Partners, The first term of this year has been marked by a sharp intensification in direct communication through worldwide exhibitions. IPDiA products and technologies have been displayed in more than 7 shows and conferences where more than 300 valuable contacts have been taken. More details and pictures are available in the Events part of the Newsletter. On a business point of view, more focus has been made on capacitors niche markets. It has lead to a tremendous success in Hi-Rel applications with our High and X-treme Temperature Silicon Capacitors range. We have thus been able to gain 5 new customers in this area. At the same time, 4 new customers have been convinced by our Low Profile Capacitors range. And finally, new success has been obtained for custom RF IPD (companion chip for GPS/GloNav RF front end and silicon interposer for mobile phone application). In terms of press, IPDiA has also started to address non-anglophone press with articles in Japanese, Chinese and German. This communication is not only a good way to get ourselves talked about but it is also a great way to improve our search engine control and be on the first web page when people are looking for silicon capacitors, whatever the language. Following our webcasts about IPDiA Design Wins and about DC/DC applications, IPDiA is pleased to announce its next live event dedicated to the applications related to the Industrial Market Segment. Save your date for Monday 14 th May! Let me also remind you the two on-going challenges until 30 th June for the ASPICS and for Custom products. Take your chance! This Newsletter relates our Press Activity, Design Wins, Ads and Events. Have a pleasant read, Laurent Dubos Sales & Marketing Director 1

2 In the International Press #6 April 16th, 2012 Silicon Integrated Passive Device Technology for LED Applications The 3D technology emerges from laboratories and comes to the rescue of Moore s law. The first components to use this technology have arrived on the market. One general trend in electronics is the integration of components and functions in one single integrated circuit. Laurent Dubos, Market Segment Director for Lighting at IPDiA, shows that not only active components can be part of an IC, but also several passive components can be integrated. He demonstrates that besides space savings, quality issues are also a hot topic that need to be looked at and are a reason to use this technology. Published: January 2012 in LED Professional To read more: IPDiA gets the ISO certification for medical devices IPDiA, manufacturer of integrated passive components on silicon, confirms its major role in the medical market area by getting the ISO certification. Since its creation, IPDiA has aroused the interest of medical devices manufacturers with its technology and electronic components that bring some essential benefits for the medical market segment: miniaturization, reduction of energy consumption and increase of the reliability. IPDiA proves its ability to provide electronic systems for medical devices that comply with customers requirements. It confirms the company reliability and allows to start straight away some trusting relationships with all its partners. Press Release, February 2012 Mouser Electronics Partners with IPDiA for Global Distribution February 9, 2012 Mouser Electronics, Inc., regarded as a top design engineering resource and global distributor for semiconductors and electronic components, today announced during the Applied Power Electronics Conference and Exposition (APEC 2012), that it has penned a distribution agreement with IPDiA, a leader in 3D silicon technology for passive devices. Press Release, February 2012 To read more: 2

3 Latest news reports on the IPDiA-Leti Common Lab results Leti and IPDiA are proud to unveil a new worldwide record in capacitance density GRENOBLE, France April 10, 2012 CEA-Leti and IPDiA report to overcome a crucial step toward market deployment of a new generation of 3D high-density capacitor achieving 550nF/mm2. In less than two years, CEA-Leti and IPDiA are successfully developing a new process based on deposition of atomic medium-k dielectric layers into the aggressive architectures of IPDiA s 3D dimensional metal-insulator-metal capacitors. The atomic layer deposition (ALD) is a key process technology to enable conformal coating of high aspect ratio surfaces and to enable exact thickness control on atomic level. A capacitance density of 500nF/mm2 has been obtained by keeping leakage current and parasitic levels as low as in the 250nF/mm2 PICS3 product. Press Release, April 2012 To read more: And also, our press releases in German, Japanese and Chinese: 3

4 Last Design Wins #6 April 16th, 2012 Thanks to your successful results, we have gathered below the latest design wins. This table gives you some important selling points and forceful arguments for your future business discussions. Market Segment Application Pain to Solve IPDiA solution Potential revenue (3 years) Medical Industrial Communication Pacemaker RFID Oil Drilling RFID Oil Drilling Oil Drilling GPS/GloNav Mobile Phone Space constraint, leakage current for battery life time, reliability and aging Limited space in Z dimension Reliability and stability of existing capacitors, up to 225 C Limited space in Z dimension Reliability and stability of existing capacitors, up to 225 C Reliability and stability of existing capacitors, up to 225 C Space constraint and performances Space constraint and performances High Stability Silicon capacitors Low profile Silicon capacitor (100 µm) High temperature silicon caps Low profile Silicon capacitor (100 µm) High temperature silicon caps High temperature silicon caps Custom RF IPD Front end Custom RF IPD 2D interposer $2,500,000 $150,000 $150,000 $20,000 $150,000 $200,000 $2,000,000 $7,500,000 Aerospace Satellite Reliability and miniaturization Low profile silicon capacitor $50,000 4

5 Ads In March, IPDiA has launched its ads campaign for 2012, this time based on electronic banners on specialized websites and e-newsletters. This enables to get more visibility, to improve our search engine control and drive new contacts directly to our website. The ad campaign has started with banners about our high temperature capacitors range displayed on Passive Components Industry - 5

6 Events #6 April 16th, 2012 As per our introduction, IPDiA has mainly focused its efforts on direct contact with potential customers via many exhibitions and conferences. Have a look at our photo gallery! March 5 th to 8 th, 8 th International Conference and Exhibition on Device Packaging, IMAPS, Fountain Hills, Arizona Faycal Mounaim Catherine Bunel March 19 th, The Heat is On, San Jose, California Michael Heise March 19 th to 22 nd, CIPPE, Beijing, China Lionel Lenoir and Shilong Wang 6

7 Guillaume Raimbault March 26 th to 29 th, Design West, San Jose, California And also: March 21 st, Ankara, Turkey: Laurent Lengignon has presented our full range of capacitors to more than a hundred of engineers invited to a seminar organized by Aktif Neser, our Turkish distributor. That s all Folks! 7