AC GHz to 5.9GHz LINEAR POWER AMPLIFIER GND 1 RF IN RF IN GND

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1 AC558.9GHz to 5.9GHz LINEAR POWER AMPLIFIER Features RoHS &Pb-Free Product.9~5.9GHz Frequency Range VCCD 16 DET 15 VCC1 1 VCC V~5.5V Operation 3.% EVM@dBm for 8.11a 5Mbps, 5.5V GND 1 1 GND 3.% EVM@.5dBm for 8.11a 5Mbps, 5V RF IN 11 RF OUT.5% EVM@18dBm for 8.11a 5Mbps, 3.3V maquiescentcurrent RF IN 3 Input Match Output Match RF OUT db Gain (Typ) GND Power on/off Bias Circuit 9 GND >db Input Return Loss@5.8GHz On-Chip Power Detector Applications VCTR VBIAS VCCB GND Functional Block Diagram IEEE 8.11a/n WLAN Cband application 5.8GHz RFID Spread-Spectrum and MMDS Systems Product Description The AC558 is a -stage.9-5.9ghz high efficiency, high linearity power amplifier based on InGaP/GaAs HBT technology.the amplifier provides atypical gain of db and P1dB power of 3.5 dbm, typical bias condition is 5.5V at ma. The input and output are internally matched to 5 and require a minimum of external matching components to cover the entire.9ghz to 5.9GHz. The AC558 is assembled in a16-pin, mm mm, QFN package. Ordering Information AC558 AC558EVB-1 AC558EVB- 5.8GHz Linear PowerAmplifier 5.GHz to 5.8GHz Evaluation PCB 5.6GHz to 5.9GHz Evaluation PCB

2 Pin Description Pin No. Symbol Description 1,, 8, 9, 1 NC/GND No connectionor Ground connection, 3 RF IN RF input 5 VCTR Power on/off control voltage 6 VBIAS Bias voltage 7 VCCB Supply voltage for bias, 11 RF OUT RF output 13 /1 VCC /VCC1 Supplyvoltage for the nd / 1 st stage 15 DET Providesan output voltage proportionalto the RF level 16 VCCD Supplyvoltage for power detector Pkg Base GND Ground connection Absolute Maximum Ratings Parameter Rating Unit Caution! ESD sensitive device. Input RF Power +15 dbm Supply Voltage -.5 to +7. V Bias Voltage -.5 to +. V DCSupplyCurrent ma OperatingAmbient - to+85 C Temperature Storage Temperature - to +15 C ESD Rating: Class1C Value: Passes V min. Test: Human Body Model (HBM) Standard: JEDEC Standard JESD-A11 ESD Rating: Class IV Value: Passes V min. Test: Charged Device Model (CDM) Standard: JEDEC Standard JESD-C1 MSLRating: Level 3at +6 Cconvection reflow Standard: JEDEC Standard J-STD- Electrical Specifications Table 1Test Frequency: 5.6 to 5.9GHz (VCC1, VCC = 5.5 V,Temp =+5 C) Parameter Specification Min. Typ. Max. Unit Condition Compliance and Nominal Conditions VCC=5.5V, ICC=mA, Temp=+5 C, Freq=5.6GHz to 5.9GHz Frequency Range GHz Output Power@1dB Compression 3.5 dbm VCC=5.5V@5.8 GHz Gain 1.5 db VCC=5.5V@5.8 GHz EVM % Pout=+dBm, VCC =5.5V@5.8 GHz 8.11a, 5 Mbps, 6QAM Power Supply Operating Voltage 5.5 V Bias Voltage.83 V Quiescent Current (Total) ma

3 (VCC1, VCC = 5. V,Temp =+5 C) Parameter Specification Min. Typ. Max. Unit Condition Compliance and Nominal Conditions VCC =5.V, ICC=mA,Temp=+5 C, Freq=5.6GHz to 5.9GHz Frequency Range GHz Output Power@1dB Compression 9.5 dbm VCC=5.V@5.8 GHz Gain db VCC=5.V@5.8 GHz EVM 3. % Pout=+.5dBm, VCC =5.V@5.8 GHz 8.11a, 5 Mbps, 6QAM Power Supply Operating Voltage 5. V Bias Voltage.87 V Quiescent Current (Total) ma

4 Table Test Frequency: 5. to 5.8GHz (VCC1, VCC = 5. V,Temp = +5 C) Parameter Specification Min. Typ. Max. Unit Condition Compliance and Nominal VCC =5.V,ICC=3mA,Temp=+5 C, Conditions Freq=5.GHz to 5.8GHz Frequency Range GHz Output Power dbm VCC=5.V@5.5 GHz Gain db VCC=5.V@5.5 GHz 3. % Pout=+7dBm, VCC =5.V@5.5 GHz 8.16d, 6QAM EVM 3. % Pout=+dBm, VCC =5.V@5.5 GHz 8.11a, 5 Mbps, 6QAM 3.3 % Pout=+dBm, VCC =5.V@5.5 GHz 8.11n, 81 Mbps, QPSK Power Supply Operating Voltage 5. V Bias Voltage 3. V Quiescent Current (Total) 3 ma (VCC1, VCC = 3.3 V,Temp = +5 C) Parameter Specification Min. Typ. Max. Unit Condition Compliance and Nominal VCC =3.3V,ICC=3mA,Temp=+5 C, Conditions Freq=5.GHz to 5.8GHz Frequency Range GHz Output Power dbm VCC=3.3V, ICC=3mA@5.5 GHz Gain 1 db VCC=3.3V@5.5 GHz.6 % Pout=+3dBm, VCC =3.3V@5.5 GHz 8.16d, 6QAM EVM.3 % Pout=+18dBm, VCC =3.3V@5.5 GHz 8.11a, 5 Mbps, 6QAM. % Pout=+17dBm, VCC =3.3V@5.5 GHz 8.11n, 81 Mbps, QPSK Power Supply Operating Voltage 3.3 V Bias Voltage 3. V Quiescent Current (Total) 3 ma

5 Typical Performance Data Test Frequency: 5.6 to 5.9GHz (Test Condition: VCC=5.5V,ICC=mA, T=5 C) Small Signal Parameters Power Gain vs. Input Power S11 S GHz 5.7GHz 5.8GHz 5.9GHz S-Parameter(dB) Gain(dB) Frequency(GHz) Pin(dBm) 8.11a EVM vs. Output 9 8 IEEE 8.11a 5Mbps OFDM 6QAM BW MHz 7 6 EVM(%)

6 (Test Condition: VCC=5.V,ICC=mA, T=5 C) Small Signal Parameters Power Gain vs. Input Power S-Parameter(dB) S11 S1 Gain(dB) GHz 5.7GHz 5.8GHz 5.9GHz Frequency(GHz) Pin(dBm) 8.11a EVM vs. Output 8 IEEE 8.11a 5Mbps OFDM 6QAM BW MHz 6 EVM(%)

7 Typical Performance Data Test Frequency: 5. GHz to 5.8GHz (Test Condition: VCC=5.V,ICC=3mA, T=5 C) Small Signal Parameters Power Gain vs. Input Power S-Parameter(dB) Frequency(GHz) S11 S1 S Gain(dB) Pin(dBm) 5.GHz 5.5GHz 5.8GHz 8.16dEVM vs. OutputPower@5.5GHz 8.16dACPRvs. OutputPower@5.5GHz 8 6 IEEE 8.16d 6QAM BW MHz IEEE 8.16d 6QAM +/- MHzOffset EVM(%) ACPR(dBc) a EVM vs. Output 8.11n EVM vs. Output IEEE 8.11a 5Mbps OFDM 6QAM BW MHz IEEE 8.11n 81Mbps OFDMQPSK BW MHz EVM(%) EVM(%)

8 (Test Condition: VCC=3.3V,ICC=3mA, T=5 C) Small Signal Parameters Power Gain vs. Input Power S-Parameter(dB) Frequency(GHz) S11 S1 S Gain(dB) Pin(dBm) 5.GHz 5.5GHz 5.8GHz 8.16dEVM vs. OutputPower@5.5GHz 8.16dACPRvs. OutputPower@5.5GHz 1 8 IEEE 8.16d 6QAM BW MHz IEEE 8.16d 6QAM +/- MHzOffset EVM(%) 6 ACPR(dBc) a EVM vs. Output 8.11n EVM vs. Output IEEE 8.11a 5Mbps OFDM 6QAM BW MHz IEEE 8.11n 81Mbps OFDM QPSK BW MHz EVM(%) EVM(%)

9 Evaluation Board Schematic Test Frequency: 5.6 to 5.9GHz (Supply Voltage Value refer to Table 1)

10 Evaluation Board Layout Test Frequency: 5.6 to 5.9GHz Board Size: 33mm 3mm Board Thickness:. mm, Board Material: FR- (.5) Table : Circuit Component Designations and Values Component Description Manufacturer C1.5pF Chip Capacitor ATC C.pF Chip Capacitor ATC C3,C,C5,C1,C13 1nF Chip Capacitor TDK C6,C7,C8,C9 5pF Chip Capacitor TDK C,C11 uf Chip Capacitor TDK R1 5 Chip Resistor YAGEO R 1k Chip Resistor YAGEO R3 Chip Resistor YAGEO U1 AC558 INNOGRATION

11 Evaluation Board Schematic Test Frequency: 5. to 5.8GHz (Supply Voltage Value refer to Table )

12 Evaluation Board Layout Test Frequency: 5. to 5.8GHz Board Size: 33mm 3mm Board Thickness:.mm, BoardMaterial: FR- (.5) Table 5: Circuit Component Designations andvalues Component Description Manufacturer C1.6pFChip Capacitor ATC C.3pFChip Capacitor ATC C3,C,C5,C1,C13 1nFChip Capacitor TDK C6,C7,C8,C9 5pFChip Capacitor TDK C,C11 uf Chip Capacitor TDK R1 5 Chip Resistor YAGEO R 1k Chip Resistor YAGEO R3 Chip Resistor YAGEO U1 AC558 Innogration

13 Packaging Diagram A1 (A3) A e E E L

14 PCB Land Pattern and Stencil Outline (Units: millimeters) PCB Land Pattern (Top View) Stencil Outline Combined PCB Land Pattern and Stencil Outline

15 Recommended Solder Temperature

16 Tape dimensions and Orientation Reel dimensions and Orientation

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