APL3570. General Description. Features. Applications. Pin Configuration. Simplified Application Circuit. Single Channel Power-Load Switch VOUT 4 5 VIN

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1 Single Channel Power-Load Switch Features Low On-resistance at VIN =3.3V : 35mΩ(typ.) 40mΩ(max.) Low Quiescent Current: 40mA (max.) VIN Supply Voltage Range:.7V to 4V Current Limit Protection Over-Temperature Protection Under Voltage Lockout Protection Reverse Current Blocking when Disabled Deglitched Fault IndicationOutput Internal Soft Start Control Output Discharge when Switch Disabled (AP- L3570A/C) No Output Discharge Function (APL3570B/D) Logic Level Enable Input Lead Free and Green Devices Available (RoHS Compliant) UL Approved-File No. E38191 UL IEC/EN CB Scheme Certified, No. DK UL TUV IEC/EN Certified, No General Description The APL3570 series are 35mΩ(3.3V input) high side load switches with an EN logic input and an OCB fault indication output. The protection features include current-limit protection and over-temperature protection. The current-limit protection can protect down stream devices from catastrophic failure by limiting the output current at current limit threshold during over-load or short-circuit events. The over temperature protection function shuts down the N-channel MOS- FET power switch when the junction temperature rises beyond 150 o C and will automatically turns on the power switch when the temperature drops by 30 o C. The device is available in lead free TDFNX-8 and SOT- 3-5 packages. Applications Notebook and Desktop Computers High-Side Power Protection Switchs Pin Configuration Simplified Application Circuit VOUT 1 GND OCB 3 SOT-3-5 (Top View) 5 VIN 4 EN VIN VIN VOUT Load Controller APL3570 OCB EN GND OCB 1 GND VOUT 3 VOUT 4 TDFNX-8 (Top View) 8 NC 7 EN 6 VIN 5 VIN = Exposed Pad (connected to ground plane for better heat dissipation) ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. 1

2 Ordering and Marking Information APL3570 Assembly Material Handling Code Temperature Range Package Code Function Code Function Code A : Output Current 1A / Built in VOUT discharge function B : Output Current 1A / VOUT discharge function is disabled C : Output Current A / Built in VOUT discharge function D : Output Current A / VOUT discharge function is disabled Package Code B : SOT3-5 Operating Junction Temperature I : - 40 to 85 o C Handling Code TR : Tape & Reel Assembly Material QB : TDFNx-8 G : Halogen and Lead Free Device APL3570A B: 70AX X - Date Code APL3570B B: 70BX X - Date Code APL3570C B: 70CX X - Date Code APL3570D B: 70DX X - Date Code APL3570A QB: L70A X X - Date Code APL3570B QB: L70B X X - Date Code APL3570C QB: L70C X X - Date Code APL3570D QB: L70D X X - Date Code Note : ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-00C for MSL classification at lead-free peak reflow temperature. ANPEC defines Green to mean lead-free (RoHS compliant)and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight).

3 Absolute Maximum Ratings (Note 1) Symbol Parameter Rating Unit V IN VIN to GND Voltage -0.3 ~ 4.5 V V OUT VOUT to GND Voltage -0.3 ~ 4.5 V V EN EN to GND Voltage -0.3 ~ 4.5 V V OCB OCB to GND Voltage -0.3 ~ 4.5 V T J Maximum Junction Temperature -40 ~ 150 o C T STG Storage Temperature -65 ~ 150 o C T SDR Maximum Lead Soldering Temperature (10 Seconds) 60 o C Note 1: Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Thermal Characteristics (Note) Symbol Parameter Typical Value Unit q JA q JC (Note ) Junction-to-Ambient Resistance in free air Junction-to-Case Resistance in free air SOT-3-5 TDFNx-8 SOT-3-5 TDFNx-8 Note : θ JA is measured with the component mounted on a high effective thermal conductivity test board in free air o C/W o C/W Recommended Operating Conditions (Note3) Symbol Parameter Range Unit V IN VIN Input Voltage.7 ~ 4 V VOUT Output Current I OUT APL3570A/B 0 ~ 1 A APL3570C/D 0 ~ V EN_H EN Logic High Input Voltage 1. ~ V IN V V EN_L EN Logic Low Input Voltage 0 ~ 0.4 V C IN Input Capacitor 10 ~ 330 mf C OUT Output Capacitor 10 ~ 330 mf T A Ambient Temperature -40 ~ 85 T J Junction Temperature -40 ~ 15 Note 3: Refer to the typical application circuit. o C o C 3

4 Electrical Characteristics Unless otherwise specified, these specifications apply over V IN =3.3V, V EN =3.3V or and T A = -40 to 85 o C. Typical values are at T A =5 o C. APL3570 Symbol Parameter Test Conditions Min Typ Max Unit SUPPLY CURRENT I IN I SD I RV POWER SWITCH R DS(ON) VIN Supply Current VIN Off-State Supply Current VOUT Leakage Current Reverse Leakage Current Power Switch On Resistance UNDER-VOLTAGE LOCKOUT (UVLO) V IN =3.3V, No load ma V IN =4V, No load ma V IN =.7V to 4V, V EN =0V, T A = 5 o C ma V IN =.7V to 4V, V EN =0V ma V IN =.7V to 4V, V EN =0V, V OUT =0V, T A = 5 o C ma V IN =.7V to 4V, V EN =0V, V OUT =0V ma V IN =0V, V EN =0V, V OUT =.7V to 4V, T A = 5 o C ma V IN =0V, V EN =0V, V OUT =.7V to 4V ma V IN =.7V to 4V, I OUT =1A, T A = 5 o C mw V IN =3.3V, I OUT =1A mw V IN =4V, I OUT =1A mw VIN UVLO Threshold Voltage V IN rising, T A =5 o C..4 V VIN UVLO Hysteresis V CURRENT LIMIT AND SHORT CIRCUIT PROTECTIONS I LIM I SC t B Current Limit Threshold (APL3570A/B) Current Limit Threshold (APL3570C/D) Fold-back Current Limit Threshold (APL3570A/B) Fold-back Current Limit Threshold (APL3570C/D) Fold-back Current Limit Blanking Time OCB OUTPUT PIN V IN =.7V to 4V A V IN =.7V to 4V A V OUT < V IN -1.3V, V IN =.7V to 4V A V OUT < V IN -1.3V, V IN =.7V to 4V A From beginning of soft-start, V IN =.7V to 4V ms OCB Output Low Voltage I OCB =5mA V OCB Input Leakage Current V OCB =4V ma t D(OCB) OCB Deglitch Time OCB assertion ms EN INPUT PIN V EN_H EN Input Logic High V IN =.7V to 4V V V EN_L EN Input Logic Low V IN =.7V to 4V V t D(ON) t D(OFF) t SS EN Input Current ma VOUT Discharge Resistance (APL3570A/C) Turn on Delay Time Turn off Delay Time (APL3570 A/C ) Soft-Start Time OVERT-TEMPERATURE PROTECTION (OTP) V EN =0V, VOUT force 1V W V IN =3.3V, from EN rising edge to V OUT =0.1V ms V IN =4V, from EN rising edge to V OUT =0.1V ms ms No load, C OUT =1mF, V IN =3.3V ms No load, C OUT =1mF, V IN =4V ms T OTP Over-Temperature Threshold (Note 4) T J rising C Over-Temperature Hysteresis (Note 4) C 4

5 Typical Operating Characteristics 8 VIN Supply Current vs. VIN Input Voltage 30 VIN supply current vs. Junction Temperature VIN Supply Current, IIN(μA) RLOAD=OPEN CIN=10μF COUT=10μF TA=5 C VIN Input Voltage, VIN(V) VIN Supply Current, IIN(μA) VIN=3.3V 14 RLOAD=OPEN 1 CIN=10μF COUT=10μF Junction Temperature, TJ ( C) VIN off-state supply current, ISD (μa) VIN off_state supply current vs. Junction Temperature VIN=3.3V RLOAD=OPEN CIN=10μF COUT=10μF Junction Temperature, TJ ( C) EN Logic Threshold Voltage, VEN (V) EN Logic Threshold Voltage vs. Junction Temperature VEN_rising VEN_falling VIN=3.3V RLOAD=OPEN CIN=10μF COUT=10μF Junction Temperature, TJ ( C) Power Switch On Resistance, RDS(on) (mω) Power Switch On Resistance vs. VIN Input Voltage IOUT=1A CIN=10μF COUT=10μF TA=5 C Power Switch On Resistance, RDS(on) (mω) Power Switch On Resistance vs. Junction Temperature VIN=3.3V IOUT=1A CIN=10μF COUT=10μF VIN Input Voltage, VIN(V) Junction Temperature, TJ ( C) 5

6 Typical Operating Characteristics (Cont.) Current Limit Threshold, ILIM (A) Current Limit Threshold vs. VIN Input Voltage APL3570 C/D APL3570 A/B CIN=330μF COUT=10μF TA=5 C VIN Input Voltage, VIN(V) Current Limit Threshold, ILIM (A) Current Limit Threshold vs. Junction Temperature APL3570 A/B APL3570 C/D VIN=3.3V CIN=330μF COUT=10μF Junction Temperature, TJ ( C) Current-Limit Response Time, tcl (ms) Current Limit Response Time vs. Output Peak Current VIN=3.3V CIN=330μF COUT=OPEN TA=5 C Output Peak Current,IOUT (A) 6

7 OperatingWaveforms Refer to the typical application circuit. The test condition is V IN =3.3V, T A = 5 o C unless otherwise specified. VIN Power ON VIN Power OFF V IN 1 V IN 1 V OUT V OUT I OUT 3 I OUT 3 VIN=3.3V, VEN=3.3V, RLOAD=1.65Ω CIN=10μF, COUT=10μF CH1: VIN, V/Div, DC CH: VOUT, V/Div, DC CH3: IOUT, 1A/Div, DC TIME: 1ms/Div VIN=3.3V, VEN=3.3V, RLOAD=1.65Ω CIN=10μF, COUT=10μF CH1: VIN, V/Div, DC CH: VOUT, V/Div, DC CH3: IOUT, 1A/Div, DC TIME: 00ms/Div Enable Power ON Enable Shutdown V EN 1 V EN 1 V OUT V OUT I OUT 3 I OUT 3 VIN=3.3V, VEN=3.3V, RLOAD=1.65Ω CIN=10μF, COUT=10μF CH1: VEN, 5V/Div, DC CH: VOUT, V/Div, DC CH3: IOUT, 1A/Div, DC TIME: 100ms/Div VIN=3.3V, VEN=3.3V, RLOAD=1.65Ω CIN=10μF, COUT=10μF CH1: VEN, 5V/Div, DC CH: VOUT, V/Div, DC CH3: IOUT, 1A/Div, DC TIME: 10ms/Div 7

8 OperatingWaveforms (Cont.) Refer to the typical application circuit. The test condition is V IN =3.3V, T A = 5 o C unless otherwise specified. OCB Response During Short Circuit OCB Response with Ramped Load V OCB V OCB 1 1 V OUT V OUT 3 I OUT 3 I OUT VIN=3.3V, VEN=3.3V, RLOAD=0Ω CIN=330μF, COUT=330μF CH1: VOCB, V/Div, DC CH: VOUT, V/Div, DC CH3: IOUT, A/Div, DC TIME: 1ms/Div VIN=3.3V, VEN=3.3V CIN=330μF, COUT=330μF CH1: VOCB, V/Div, DC CH: VOUT, V/Div, DC CH3: IOUT, 1A/Div, DC TIME: 1ms/Div 8

9 Pin Descriptions PIN SOT-3-5 TDFNx-8 NAME FUNCTION NO. NO. 1 3, 4 VOUT Output Voltage Pin. The output voltage follows the input voltage. When EN is low, the output voltage is discharged by an internal resistor (for APL3570A/C only). GND Ground. 3 1 OCB 4 7 EN Fault Indication Pin. This pin goes low when a current limit, or an over-temperature condition is detected after a 3.ms deglitch time. Enable Input. Pull this pin to high to enable the device and pull this pin to low to disable device. The EN pin cannot be left floating. 5 5, 6 VIN Power Supply Input. Connect this pin to external DC supply. - 8 NC No Connection. - 9 Exposed Pad Connect this pad to system ground plane for good thermal conductivity. Block Diagram Bulk Select VIN VOUT UVLO Charge Pump Current Limit and Fold-back Current Limit EN Gate Driver and Control Logic OCB OTP GND 9

10 Typical Application Circuit V IN R OCB 50kΩ C BULK optional C IN 10mF VIN VOUT APL3570A/B/C/D C OUT 10mF C LOAD Load Controller OCB EN GND 10

11 Function Descriptions VIN Under-voltage Lockout (UVLO) The APL3570 series of power switches are built-in an under-voltage lockout circuit to keep the output shut off until internal circuitry is operating properly. The UVLO circuit has hysteresis and a de-glitch feature so that it will typically ignore undershoot transients on the input. When input voltage exceeds the UVLO threshold, the output voltage starts a soft-start to reduce the inrush current. Reverse Current Blocking Circuit The APL3570 series has a built-in reverse current blocking circuit to prevent a reverse current flowing through the body diode of power switch from the VOUT back VIN pin when power switch disabled. Current Limit Protection The APL3570 series of power switches provide the current limit protection function. During current limit, the devices limit output current at current limit threshold. For reliable operation, the device should not be operated in current limit for extended period time. Fold-back Current Limit Protection When the output voltage drops below VIN-1.3V, which is caused by the over load or short circuit, the devices limit the output current down to a safe level. The short circuit current limit is used to reduce the power dissipation during short circuit condition. If the junction temperature is over the thermal shutdown temperature the device will enter the thermal shutdown. OCBOutput The APL3570 series of power switches provide an opendrain output to indicate that a fault has occurred. When any of current limit or over-temperature protection occurs for a deglitch time of t D(OCB), the OCB goes low. Since the OCB pin is an open-drain output, connecting a resistor to a pull high voltage is necessary. Enable/Disable Pull the EN below 0.4V to disable the device and pull EN above 1.V to enable the device. When the IC is disabled the supply current is reduced to less than 1mA. The enable input is compatible with both TTL and CMOS logic levels. The EN pins cannot be left floating. Over-temperature Protection When the junction temperature exceeds 150 o C, the internal thermal sense circuit turns off the power FET and allows the device to cool down. When the device s junction temperature cools by 30 o C, the internal thermal sense circuit will enable the device, resulting in a pulsed output during continuous thermal protection. Thermal protection is designed to protect the IC in the event of over temperature conditions. For normal operation, the junction temperature cannot exceed T J =+15 o C. 11

12 Package Information TDFNx-8 D A D Pin 1 Corner E L K b E A1 A3 NX aaa c SEATING PLANE e S Y M TDFN*-8 B O L MIN. MAX. MIN. MAX. MILLIMETERS INCHES A A A3 b 0.0 REF REF D D E E e L BSC 0.00 BSC K aaa

13 Package Information SOT-3-5 D e SEE VIEW A e1 b c A A 0.5 A1 E1 E L 0 GAUGE PLANE SEATING PLANE VIEW A S Y M B O L A A1 A b c D E E1 e e1 L MIN MILLIMETERS 0.95 BSC 1.90 BSC MAX SOT-3-5 MIN INCHES BSC BSC MAX Note : 1. Follow JEDEC TO-178 AA.. Dimension D and E1 do not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side. 13

14 Carrier Tape & Reel Dimensions OD0 P0 P P1 A W F E1 K0 B A0 OD1 B A T B0 SECTION A-A SECTION B-B d H A T1 Application A H T1 C d D W E1 F TDFNx ± MIN. Devices Per Unit MIN. 0. MIN. 8.0± ± ±0.05 P0 P1 P D0 D1 T A0 B0 K0 4.0± ±0.10.0± MIN ±0.0.35± ±0.0 Application A H T1 C d D W E1 F SOT ± MIN MIN. 0. MIN. 8.0± ± ±0.05 P0 P1 P D0 D1 T A0 B0 K0 4.0± ±0.10.0± MIN. Package Type Unit Quantity TDFNx-8 Tape & Reel 3000 SOT-3-5 Tape & Reel ± ± ±0.0 (mm) 14

15 Taping Direction Information TDFNx-8 USER DIRECTION OF FEED SOT-3-5 USER DIRECTION OF FEED 15

16 Classification Profile 16

17 Classification Reflow Profiles Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Preheat & Soak Temperature min (T smin ) Temperature max (T smax ) Time (T smin to T smax ) (t s ) Average ramp-up rate (T smax to T P ) Liquidous temperature (T L ) Time at liquidous (t L ) 100 C 150 C seconds 150 C 00 C seconds 3 C/second max. 3 C/second max. 183 C seconds 17 C seconds Peak package body Temperature (T p )* See Classification Temp in table 1 See Classification Temp in table Time (t P )** within 5 C of the specified classification temperature (T c ) 0** seconds 30** seconds Average ramp-down rate (T p to T smax ) 6 C/second max. 6 C/second max. Time 5 C to peak temperature 6 minutes max. 8 minutes max. * Tolerance for peak profile Temperature (T p ) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (t p ) is defined as a supplier minimum and a user maximum. Table 1. SnPb Eutectic Process Classification Temperatures (Tc) Package Thickness Volume mm 3 <350 Volume mm 3 >350 <.5 mm 35 C 0 C >.5 mm 0 C 0 C Table. Pb-free Process Classification Temperatures (Tc) Package Thickness Volume mm 3 <350 Volume mm Volume mm 3 >000 <1.6 mm 60 C 60 C 60 C 1.6 mm.5 mm 60 C 50 C 45 C >.5 mm 50 C 45 C 45 C Reliability Test Program Test item Method Description SOLDERABILITY JESD-, B10 5 Sec, 45 C HOLT JESD-, A Hrs, T j =15 C PCT JESD-, A Hrs, 100%RH, atm, 11 C TCT JESD-, A Cycles, -65 C~150 C HBM MIL-STD VHBM KV MM JESD-, A115 VMM 00V Latch-Up JESD 78 10ms, 1 tr 100mA 17

18 Customer Service Anpec Electronics Corp. Head Office : No.6, Dusing 1st Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : Fax : Taipei Branch : F, No. 11, Lane 18, Sec Jhongsing Rd., Sindian City, Taipei County 3146, Taiwan Tel : Fax :