PhotoIC Coupler (AlGaAs LED & PhotoIC)

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1 0 Mbps type PhotoIC Coupler (AlGaAs LED & PhotoIC) (APS) New Vcc Vout GND mm inch 3 FEATURES. High speed Photo Coupler with receiver circuit IC. Capable of high speed communication (Transfer rate Typ. 0 Mbps) 3. High noise immunity (CMTI Min. kv/μs). Guaranteed performance at high temperature (-0 to + C -0 to + F). Isolation voltage: 3,70 Vrms 6. Totem pole output type TYPICAL APPLICATIONS. Measuring equipment. FA (Factory Automation) network 3. I/O of high speed communication *Does not support automotive application Truth table LED ON OFF Output L H RoHS compliant TYPES Figure of output Transfer rate Supply voltage Tube packing style Part No. Tape and reel packing style Picked from the /-pin side Picked from the 3//-pin side Totem pole output Typ. 0 Mbps V DC APSS APSSX APSSZ Tube tube contains: 0 pcs. batch contains:,000 pcs. Packing quantity Tape and reel,000 pcs. ASCTB367E 0703-T

2 RATING. Absolute maximum ratings (Ta = C 77 F) Input Item Symbol APSS Remarks LED forward current IF ma LED reverse voltage VR V Peak forward current IFP A f = 0 Hz, Duty factor = 0.%, shot Supply voltage 6 V Output Output voltage VO 6 V Output current IO ma Power dissipation Pout 0 mw I/O isolation voltage Viso 3,70 V rms Ambient Operating Topr 0 to + C 0 to + F (Non-icing at low temperatures) temperature Storage Tstg 0 to + C 0 to +7 F. Electrical characteristics (Unless otherwise specified, Ta = -0 to C -0 to F, =. to.v) Input Output Item Symbol APSS Condition Threshold input current Max. IFHL ma = V, VO < 0.6 V Min.. V LED dropout voltage Typ. VF.6 V IF = ma, Ta = C 77 F Max..8 V Input capacitance Typ. Ct 0 pf f = MHz, VB = 0 V, Ta = C 77 F Low level supply current Max. ICCL ma IF = ma High level supply current Max. ICCH ma IF = 0 ma Low level output voltage Max. VOL 0.6 V IF = ma, IO = ma, = V High level output voltage Min. VOH. V IF = 0 ma, IO = - ma, = V Transfer characteristics Item Symbol APSS Condition Propagation delay time (H L) Propagation delay time (L H) Max. tphl 30 ns Max. tplh 30 ns VIN = 0 V, RIN = 300 Ω CIN = pf, CO = pf VIN = 0 V, RIN = 300 Ω CIN = pf, CO = pf Propagation delay skew Max. tpsk 6 ns Pulse width distortion Max. tphl-tplh ns Output fall time Typ. tf ns Output rise time Typ. tr ns Common mode transient immunity at low level output Common mode transient immunity at high level output Min. CML kv/μs Min. CMH kv/μs VIN = V/ MHz, RIN = 300 Ω CIN = pf, CO = pf VIN = 0 V, RIN = 300Ω CIN = pf, CO = pf VIN = 0 V, RIN = 300 Ω CIN = pf, CO = pf VCM = 00 Vp-p, IF = ma, = V VO(MAX) = 0. V, Ta = C 77 F VCM = 00 Vp-p, IF = 0 ma, = V VO(MIN) = V, Ta = C 77 F I/O capacitance Typ. Ciso 0. pf f = MHz, VB = 0 V, Ta = C 77 F Initial I/O isolation resistance Min. Riso,000 MΩ DC 00V, RH 60 %, Ta = C 77 F ASCTB367E 0703-T

3 Test circuit for I CCL Test circuit for I CCH IF 0. μf A ICCL 0.μF A ICCH Test circuit for V OL Test circuit for V OH IF 0.μF V VOL IO 0.μF V VOH IO Test circuit for propagation delay time VIN = 0 V f = MHz Duty factor = 0% 0.μF CO VIN VOUT tr=.ns 0V tf VOH tf=.ns 90% 0% % tr 90% 0% % CIN RIN tphl tplh Test circuit for common mode transient immunity tr kv tf 90% VCM 0.μF VO VCM VO CMH= 800(V) tr(μs) % V V 0.V 0V CML= -800(V) tf(μs) IF=0mA IF=mA RECOMMENDED OPERATING CONDITIONS Item Symbol Min. Typ. Max. Unit LED forward current IF 6 ma Supply voltage.. V LED off voltage VF(OFF) V Please use under recommended operating conditions to obtain expected characteristics. Additionally, please check other conditions in this specification sheets because they are affected by the actual usage. 3 ASCTB367E 0703-T

4 REFERENCE DATA. LED forward current vs. ambient Permissible ambient temperature: 0 to + C 0 to + F 0. LED forward current vs. LED drop out voltage characteristics Permissible ambient temperature: 0 to + C 0 to + F 0 3. Threshold input current vs. ambient Output voltage: < 0.6 V LED forward current, ma LED forward current, ma Ta= C 8 C 0 C C 0 C - C -0 C Threshold input current, ma LED drop out voltage, V. Low level/high level supply current vs. ambient. Low level output voltage vs. ambient LED current: ma Output current: ma 6. High level output voltage vs. ambient LED current: 0 ma Output current: ma Low level/high level supply current, ma 3 ICCL (IF= ma) ICCH (IF=0 ma) Low level output voltage, V High level output voltage, V Propagation delay time (H L/L H) vs. ambient LED current: ma Pulse width distortion vs. ambient LED current: ma 9. Propagation delay time(h L/L H) vs. LED forward current characteristics Ambient temperature: C 77 F 30 Propagation delay time, ns 0 tphl tplh Pulse width distortion, ns 8 6 Propagation delay time, ns 0 tphl tplh LED forward current, ma ASCTB367E 0703-T

5 . Pulse width distortion vs. LED forward current characteristics Ambient temperature: C 77 F Pulse width distortion, ns LED forward current, ma DIMENSIONS (mm inch) The CAD data of the products with a External dimensions mark can be downloaded from: Recommended mounting pad (Top view) ±0..73 ± ±0..68 ± ± ± ±0..69 ± Tolerance: ±0. ± Terminal thickness = ±0. ±.006 General tolerance: ±0. ±.00 ASCTB367E 0703-T

6 CAUTIONS FOR USE SAFETY WARNINGS Do not use the product under conditions that exceed the range of its specifications. It may cause overheating, smoke, or fire. Do not touch the recharging unit while the power is on. There is a danger of electrical shock. Be sure to turn off the power when performing mounting, maintenance, or repair operations on the device (including connecting parts such as the terminal board and socket). Check the connection diagrams in the catalog and be sure to connect the terminals correctly. Erroneous connections could lead to unexpected operating errors, overheating, or fire.. Please visit our Automation Controls Products web site and refer to the caution for use and the explanations of technical terms.. About derating design Derating is significant factor concerning on reliable design (product life). When the coupler is used continuously at upper limit of absolute maximum ratings (high temperature, high humidity, high current, high voltage, etc.), reliability may be lower significantly. Therefore, please derate sufficiently below the absolute maximum ratings and evaluate the coupler under the actual condition. 3. Wire connection Please check the internal connection diagram in the catalog or specification, and connect the terminals correctly. If device is energized with short-circuit or any wrong connection, it may cause circuit damage by inner parts destruction, unexpected malfunction, abnormal heat, fire, and so on. 6. Ripple in the input power supply If ripple is present in the input power supply, please keep the LED forward current from (at Emin) to 6 ma(at Emax). E min. E max. 7. Caution for applying supply voltage Just after supplying voltage, please note that current in the coupler will be not constant until circuit stability. 8. Soldering () IR (Infrared reflow) soldering method In case of automatic soldering, following conditions should be observed. (recommended condition reflow: Max. times, measurement point: soldering lead). Bypass capacitor Bypass capacitor of 0.μF is used between Vcc and GND near the coupler. Also, ensure that the distance between the leads of the coupler and capacitor is no more than mm. Failure to provide the bypass may impair the switching property. T3 T T t3 T = 0 to 80 C 30 to 36 F T = 30 C 6 F T3 = 0 to 0 C 6 to 8 F t = 60 to 0 s t = Within 30 s t3 = Within s. Deterioration and destruction caused by discharge of static electricity This phenomenon is generally called static electricity destruction, and occurs when static electricity generated by various factors is discharged while the coupler terminals are in contact, producing internal destruction of the element. To prevent problems from static electricity, the following precautions and measures should be taken when using your device. () Employees handling the coupler should wear anti-static clothing and should be grounded through protective resistance of 00 kω to MΩ. () A conductive metal sheet should be placed over the worktable. Measuring instruments and jigs should be grounded. (3) When using soldering irons, either use irons with low leakage current, or ground the tip of the soldering iron. (Use of low-voltage soldering irons is also recommended.) () Devices and equipment used in assembly should also be grounded. () When packing printed circuit boards and equipment, avoid using high-polymer materials such as foam styrene, plastic, and other materials which carry an electrostatic charge. (6) When storing or transporting the coupler, the environment should not be conducive to generating static electricity (for instance, the humidity should be between and 60 %), and the coupler should be protected using conductive packing materials. t t () Others soldering methods Other soldering methods (VPS, hot-air, hot plate, laser heating, pulse heater, etc.) affect the coupler characteristics differently, please evaluate the coupler under the actual usage. (3) Manual soldering method Soldering: Max. 30 C 66 F, within 3 s, electrical power 30 to 60 W 9. Notes for mounting () When different kinds of packages are mounted on PCB, the temperature rise at soldering lead is highly dependent on package size. Therefore, please set the lower temperature soldering condition than above condition, and confirm the temperature condition of actual usage before soldering. () When soldering condition is out of recommendation, the coupler characteristics may be adversely affected. It may occur package crack or bonding wire breaking because of thermal expansion unconformity and resin strength reduction. Please contact us about the propriety of the condition. (3) Please confirm the heat stress by using actual board because it may be changed by board condition or manufacturing process condition. () Solder creepage, wettability, or soldering strength will be affected by the soldering condition or used solder type. Please check them under the actual production condition in detail. () Please apply coating when the coupler returns to the room temperature. 6 ASCTB367E 0703-T

7 . Cleaning solvents compatibility Cleaning the solder flux should use the immersion washing with an cleaning solvent (Asahiklin AK-). If you have to use ultrasonic cleaning, please adopt the following conditions and check that there are no problems in the actual usage. Frequency: 7 to 9 khz Ultrasonic output: No greater than 0. W/cm * Cleaning time: 30 s or less Others: Float PCB and the device in cleaning solvent to prevent from contacting the ultrasonic vibrator. *Note: Applies to unit area of ultrasonic output for ultrasonic baths.. Transportation and storage () Extreme vibration during transport may deform the lead or damage the coupler. Please handle the outer and inner boxes with care. () Inadequate storage condition may degrade soldering, appearance and characteristics. The following storage conditions are recommended: Temperature: 0 to C 3 to 3 F Humidity: Max. 70 %RH Atmosphere: No harmful gasses such as sulfurous acid gas and not dusty. (3) In case the heat stress of soldering is applied to the coupler which absorb moisture inside of its package, the evaporation of the moisture increases the pressure inside the package and it may cause the package blister or crack. This coupler is sensitive to moisture and it is packed in the sealed moisture-proof package. Please make sure the following condition after unsealing. *Please use the coupler immediately after unsealing. (within 30 days at 0 to 30 C 3 to 86 F and Max. 70%RH) *If the coupler will be kept for a long time after unsealing, please pack in the another moisture-proof package containing silica gel and store. (Please use within 90days) 3. Coupler packaging format ) Tape and reel (Unit: mm inch) Tape dimensions. Water condensation Water condensation occurs when the ambient temperature changes suddenly from a high temperature to low temperature at high humidity, or the coupler is suddenly transferred from a low ambient temperature to a high temperature and humidity. Condensation causes the failures such as insulation deterioration. Panasonic Corporation does not guarantee the failures caused by water condensation. The heat conduction by the equipment the coupler is mounted may accelerate inside equipment water condensation. Please confirm no that there are condensation in the worst condition of the actual usage. (Special attention should be paid when high temperature heating parts are close to the coupler.) Dimensions of tape reel Direction of picking Tractor feed holes. ±0.0 dia. ±0. 7. ± ± ±.00 dia..7 ± ±.00.0 ±.00 Device mounted on tape.8 ±0.3. ±.0 ±0. ± ±.00.7 ± ±.00. ±0..7 ±.00.7 ±0..8 ±.00. ±0. dia..7 ± ±.00 dia. ±0.3.7 ±.0 ± ±.00 3 ±0. dia.. ±.00 dia. ± ± ± dia. 3.0 ±.039 dia. ± dia..000 ±.079 dia. () When picked from /-pin side: Part No. APSSX (Shown above) () When picked from 3//-pin side: Part No. APSSZ 3. ±.8 ±.079 ± ±.00 7 ASCTB367E 0703-T

9 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Panasonic: APSSX APSSZ APSS

PhotoIC Coupler (AlGaAs LED & PhotoIC)

Mbps type PhotoIC Coupler (AlGaAs LED & PhotoIC) (APS, APS) New...87.3.69.73 mm inch Totem pole output Open drain output Vcc Vcc 5 Vout Vout 5 GND 3 GND 3 Truth table Truth table LED Output LED Output