TLX Schematic. Pin Configuration. Truth Table TOSHIBA PHOTOCOUPLER LED & PHOTO-IC. Unit: mm

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1 TOSHIBA PHOTOCOUPLER LED & PHOTO-IC TLX934 〇 Inverter control applications in Automotive Equipment 〇 Interface of IPM (Intelligent Power Module) 〇 HEV (Hybrid Electric Vehicle) and EV (Electric Vehicle) Applications Unit: mm The Toshiba TLX934 consists of an infrared light emitting diode and integrated high gain, high-speed photodetectors. The TLX934 is housed in the SO6 package. The output stage is an open collector type. The photodetector has an internal Faraday shield that provides a common-mode transient immunity of kv/μs. TLX934 realizes minimum and maximum of propagation delay time, switching speed dispersion, and high common mode transient immunity. Therefore TLX934 is suitable for isolation interface between IPM (Intelligent Power Module) in motor control application. Isolation voltage : 37 Vrms (min) Common mode transient immunity : kv/μs = V Propagation delay time (tphl/tplh): tphl = 4 ns (max) tplh = ns (max) Switching Time Dispersion( tplh-tphl ): 4 ns (max) JEDEC JEITA TOSHIBA -4L Weight:.8 g (typ.) It becomes TTL compatible by connecting the resistance. AEC-Q qualified Pin Configuration Schematic 3 Truth Table : ANODE 3: CATHODE 4: GND : VO (Output) 6: VCC Input LED Output IF SHIELD I CC IO A ceramic capacitor (. μf) should be connected from pin 6 (VCC) to pin 4 (GND) to stabilize the operation of the high gain linear amplifier. The total lead length between capacitor and coupler should not exceed cm. 6 V CC V O GND 4 H ON L L OFF H

2 Absolute Maximum Ratings (Note) (Ta = 2 C, unless otherwise specified) Characteristic Symbol Rating Unit DC Forward Current IF 2 ma DC Forward Current (Ta=2 C) IF ma LED DC Forward Current Derating (Ta 8 C) ΔIF / C -.2 ma/ C Peak Transient Forward Current (Note ) IFPT A Input Power Dissipation P D mw DC Reverse Voltage VR V Output Current IO ma DETECTOR Peak Output Current IOP 3 ma Output Voltage VO -. to 3 V Supply Voltage VCC -. to 3 V Output Power Dissipation PO mw Output Power Dissipation Derating (Ta 8 C) ΔPO / C -.83 mw/ C Operating Temperature Range Topr -4 to 2 C Storage Temperature Range Tstg - to C Lead Soldering Temperature ( s) Tsol 26 C Isolation Voltage (R.H. 6%, AC, 6 s.) (Note 2) BVs 37 Vrms Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ( Handling Precautions / Derating Concept and Methods ) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note : Pulse width μs, 3 pps Note 2: This device is considered as two-terminal device: Pins and 3 are shorted together, and pins 4, and 6 are shorted together. Recommended Operating Conditions (Note) Characteristic Symbol Min Typ. Max Unit Supply Voltage VCC V Output Voltage VO - - VCC V Forward Current IF - ma Operating Temperature (Note ) Topr -4-2 C Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the device. Additionally, each item is an independent guideline respectively. In developing designs using this product, please confirm specified characteristics shown in this document. Note : Denotes the operating range, not the recommended operating condition. 2

3 Electrical Characteristics (Note) (Unless otherwise specified, Ta = -4 to 2 C, VCC = 4. to 2 V) Characteristic Symbol Test Condition Min Typ. Max Unit I F = ma, Ta = 2 C Input Forward voltage V F I F = ma.3.9 V Input Reverse current I R V R = V, Ta = 2 C μa Input Capacitance between terminals C T V F = V, f = MHz, Ta = 2 C 4 pf High level output current I OH I F = ma, V O = 2 V μa Low level output voltage V OL I F = ma, I O = 2.4mA.3.6 V High level supply current I CCH I F = ma.3 ma Low level supply current I CCL I F = ma.3 ma Input current logic LOW output I FHL I O =.7mA, V O <.8 V ma Input voltage logic HIGH output V FLH I O =.7mA, V O > 2. V.8 V Output current I O I F = ma, V O =.6V 4. ma Note: All typical values at V CC = V and Ta = 2 C. Isolation Characteristics (Ta = 2 C) Characteristic Symbol Test Condition Min Typ. Max Unit Stray Capacitance (input to output) (Note ) C S V S = V, f = MHz. pf Isolation resistance (Note ) R S V S = V, R.H. 6% 2 4 Ω Isolation voltage (Note ) BV S AC, s, in oil AC, 6 s 37 Vrms DC, 6 s, in oil Vdc Note : This device is considered as two-terminal device: Pins and 3 are shorted together, and pins 4, and 6 are shorted together. 3

4 Switching Characteristics (Note) (Unless otherwise specified, Ta = -4 to 2 C) Characteristic Symbol Test Circuit Test Condition Min Typ. Max Unit Propagation delay time (H L) t phl () CL = pf 3 4 CL = pf 9 Propagation delay time (L H) t plh () Switching Time Dispersion t plh t phl () between ON and OFF I F = ma, R L = 4.7 kω V CC = V CL = pf 2 3 CL = pf C L = pf ns Propagation Delay Skew (Note ) t psk () Propagation delay time (H L) t phl (2) Fig. CL = pf 3 4 CL = pf Propagation delay time (L H) t plh (2) Switching Time Dispersion t plh t phl (2) between ON and OFF I F = ma, R L = 2 kω V CC = V CL = pf 2 3 CL = pf 2 4 C L = pf ns Propagation Delay Skew (Note ) t psk (2) Common mode transient immunity at high output level (Note 2) Common mode transient Immunity at low output level (Note 2) CM H CM L Fig.2 V CC = V, CL= pf, V CM = V p p, I F = ma, R L = 2 kω, Ta=2 C V CC = V, CL = pf, V CM = V p p, I F = ma, R L = 2 kω, Ta=2 C kv/μs - kv/μs Note: All typical values at V CC = V and Ta = 2 C. Note : The propagation delay skew, t psk, is equal to the magnitude of the worst-case difference in t phl and/or t plh that will be seen between units at the same given conditions (supply voltage, input current, temperature, etc). Note 2: CMH is the maximum rate of rise of the common mode voltage that can be sustained with the output voltage in the logic high state (V O > V) CML is the maximum rate of fall of the common mode voltage that can be sustained with the output voltage in the logic low state (V O <. V). 4

5 Fig. : tphl, tplh IF=mA(P.G) (f=khz, duty=%, tr=tf=ns) P.G..μF VCC R L =2kΩ VO IF VO tr tf 9% 9% % % tphl tplh % IF Monitor SHIELD RIN=Ω CL VCC VOL VTHHL=. V VTHLH=2. V C L includes probe and stray capacitance. P.G.: Pulse generator Fig. 2: CMH, CML 9% V A SW B IF. μf R L =2kΩ VO VCM tr tf % CL SW B: IF = ma VCC VO SW A: IF = ma V CMH V. V CML + - VCM CMH= 2(V) tr(μs) CML=- 2(V) tf(μs)

6 Characteristics Curves (Note) 3 _IF-Ta I F T a _IF-VF I F V F Input forward current I F (ma) 2 2 This curve shows the maximum limit to the input forward current. Input forward current I F (ma) T a = -4 T a = 2 T a = Input forward voltage V F (V) High level output current I OH (na) I F = ma V CC =V O =2 V _IOH-Ta I OH T a Output current I O (ma) V CC = 2 V _IO-Ta I O T a V CC = 4. V I F = ma V O =.6 V Output current I O (ma) _IO-IF I O I F T a = 2 T a = 2 T a = -4 V O =.6 V V CC = 2 V Low level output voltage V OL (V) V CC = 4. V _VOL-Ta V OL T a V CC = 2 V I F = ma I O = 2.4 ma 2 Input forward current I F (ma)

7 Input current logic low output I FHL (ma) _IFHL-Ta I FHL T a I O = 2.4 ma V CC = 4. V, 2 V Propagation delay time t phl, t plh (ns) I F = ma C L = pf x_tphl,tplh-ta t phl, t plh T a t plh V CC = V, R L = 4.7 kω V CC = V, R L = 2 kω t phl Propagation delay time t phl, t plh (ns) I F = ma, T a = 2, C L = pf x_tphl,tplh-rl t phl, t plh R L V CC = V V CC = V t plh t phl Propagation delay time t phl, t plh (ns) T a = 2, C L = pf x_tphl,tplh-if t phl, t plh I F t plh V CC = V, R L = 4.7 kω V CC = V, R L = 2 kω t phl 2 Load resistance R L (kω) Input forward current I F (ma) Note: The above characteristics curves are presented for reference only and not guaranteed by production test, unless otherwise noted. 7

8 RESTRICTIONS ON PRODUCT USE Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as TOSHIBA. Hardware, software and systems described in this document are collectively referred to as Product. TOSHIBA reserves the right to make changes to the information in this document and related Product without notice. This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS. PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT ("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your TOSHIBA sales representative. Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part. Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA () ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product. Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS. 8

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