Parameter Symbol Rating Unit. Reverse voltage V R 5 V *1 *2Power dissipation P 40 mw. P C 60 mw

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1 PC9D PC9D Ultra-high Speed Response, -channel OPIC Photocoupler Features. Built-in -channel. Ultra-high speed response ( tphl, t PLH : TYP. ns at R L= Ω ). Isolation voltage between input and output ( VISO : Vrms ). Low input current drive ( IFHL : MAX. ma ). Instantaneous common mode rejection voltage (CMH : TYP. V/ µ s). Recognized by UL. file No. Outline Dimensions Primary side mark (Sunken place). ±.. ±. PC9D. ±.. ±. 9. ±.. ±. ( Unit : mm) Internal connection diagram. ±. Applications. Computer perpherals high speed interface for microcomputer systems. High speed line recievers. Digital audio equipment. Interface with various data transfer equipment. ±.. ±. Anode Cathode GND. ±.. TYP.. ±. θ : to V V V CC θ *Output sides are open collector. * OPIC ( Optical IC ) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and signalprocessing circuit integrated onto a single chip. Absoulte Maximum Ratings (Ta = C) Parameter Symbol Rating Unit * * Forward current IF ma Input * Reverse voltage V R V * *Power dissipation P mw * Supply voltage V CC V * High level output voltage H V Output *Low level output current IOL ma Collector power dissipation P C mw * Isolation voltage V iso V rms Operating temperature T opr to + C Storage temperature T stg - to + C * Soldering temperature T sol C * Ta = to C * Each channel * For minute max. * AC for minute, to % RH. Apply the specified voltage between the whole of the electrode pins on the input side and the whole of the electrode pins on the output side. * mm or more away from the lead base for seconds or less In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that occur in equipment using any of SHARP's devices, shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest version of the device specification sheets before using any SHARP's device.

2 Electro-optical Characteristics Transfer characteristics Input Output Response time CMR PC9D ( Unless otherwise specified, Ta = to + C) Parameter Symbol Conditions MIN. TYP. MAX. Unit Forward voltage V F Ta = C, = ma -.. V Reverse current IR Ta = C, V R =V - - µa Terminal capacitance Ct Ta = C, V =, f = MHZ - PF High level output current IOH VCC = VO=.V, = µ A - µ A Low level output voltage L VCC =.V, = ma, I OL = ma -.. V High level supply current I CCH V CC =.V, = - ma Low level supply current ICCL V CC =.V, = ma - ma High Low threshold V CC = V, HL input current =.V, R L = Ω -. ma Isolation resistance R ISO Ta = C, DCV, to % RH x - Ω Floating capacitance Cf Ta= C, V=, f= MHZ -. - PF High Low propagation delay time t PHL Ta = C, V CC =V Fig. - ns Low High propagation delay time t PLH RL= Ω, C L =PF - ns Rise time, Fall time tr, t f IF=.mA - ns Instantaneous common mode rejection voltage CMH Ta = C, V Fig. CC = V, (MIN) =V High level output VCM = V, R L = Ω, = - V/ µ s Instantaneous common mode rejection voltage CML Ta = C, V CC = V, (MAX) =.V Fig. Low level output V CM = V, R L = Ω, = ma V/ µ s All typical values : at Ta = C, VCC =V Recommended Operating Conditions Parameter Symbol MIN. MAX. Unit Low level input current L µ A High level input current H ma Supply voltage V CC.. V Fanout ( TTL load ) N - - Operating temperature Topr C Connect a ceramic by-pass capacitor (. to.µ F) between V CC and GND at the position within cm from pin. Fig. Test Circuit for t PHL, t PLH, and t f.ma Ω.µ F V Ω C L 9% % t PHL tplh.ma ma V.V L *C L includes the probe and wiring capacitance. t f

3 PC9D Fig. Test Circuit for CM H and CM L V.µ F Ω C L V V CM ( = ma) V V (MIN.) + - V CM ( = ma) (MAX.) L Fig. Collector Power Dissipation vs. Fig. Forward Current vs. Forward Voltage Collector power dissipation P C ( mw ) Forward current IF ( ma ). T a = C C C C Fig. High Level Output Current vs. High level output current I OH ( µ A ) = µa V CC =.V =.V Fig. Low Level Output Voltage vs. Low level output voltage VOL (V) Forward voltage V F (V) = ma V CC =.V I O = ma.ma 9.mA.mA.

4 PC9D Fig. -a Output Voltage vs. Forward Current V CC =V T a = C Fig. -b Output Voltage vs. Forward Current (Ambient Temp. Characteristics ) V CC =V T a = to C Output current VO (V) R L = Ω k Ω k Ω Output Voltage VO (V) R L = Ω R L =kω Forward current ( ma ) Forward current ( ma ) Fig. Propagation Delay Time vs. Forward Current V CC = V, T a = C Fig. 9 Propagation Delay Time vs. =.ma, V CC =V Propagation delay time t PHL, t PLH (ns) t PLH R L =kω t PLH R L =kω t PHL R L = Ω k Ω k Ω R L = Ω Propagation delay time tphl, t PLH (ns) R L =kω k Ω Ω R L = Ω k Ω k Ω t PLH t PHL Fig. Rise Time, Fall Time vs. Rise time, fall time, t f (ns ) Forward current ( ma ) t f R L =kω R L =kω R L = Ω =.ma V CC =V R L = Ω k Ω k Ω Precautions for Use ( ) Handle this product the same as with other integrated circuits against static electricity. ( ) As for other general cautions, refer to the chapter Precautions for Use

5 Application Circuits NOTICE The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii)measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment thaequires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii)sharp devices shall not be used for or in connection with equipment thaequires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). Contact a SHARP representative in advance when intending to use SHARP devices for any "specific" applications other than those recommended by SHARP or when it is unclear which category mentioned above controls the intended use. If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Control Law of Japan, it is necessary to obtain approval to export such SHARP devices. This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. Contact and consult with a SHARP representative if there are any questions about the contents of this publication.