RF (Radio Frequency) C R 10 SSOP Type

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1 UL pending CSA pending RF (Radio Frequency) C R SSOP Type (by) PhotoMOS RELAYS FEATURES mm inch. Reduced package size Lower surface has been reduced 6% and mounting space % compared to conventional -pin SOP type.. Two types are available: A type with greatly reduced ON resistance, and a type with even lower output capacitance between terminals. capacitance (C) ON resistance (R) (R Type).pF (C Type).pF.7Ω 9.Ω. Mounting space has been reduced and output signals have been improved by using new flat lead terminals.. High speed switching (Part No.: ) Turn on time:.ms Turn off time:.ms TYPICAL APPLICATIONS Measuring and testing equipment. Test equipment IC tester, Liquid crystal driver tester, semiconductor performance tester. Board tester Bare board tester, In-circuit tester, function tester. Medical equipment Ultrasonic wave diagnostic machine. Multi-point recorder Strainmeter, thermo couple Conventional SOP type SSOP Flat lead TYPES AC/DC type Type rating* Part No. (Tape and reel packing style) voltage current Picked from the /-pin side Picked from the /-pin side Packing quantity Low on resistance (R Type) V ma Y W Tape and reel: Low capacitance (C Type) V ma Y W, pcs. * Indicate the peak AC and DC values. Notes: () Tape package is the standard packing style. () For space reasons, the initial letters of the product number AQY, the package type indicator Y and W are omitted from the seal. (Ex. the label for product number is N) RATING. Absolute maximum ratings () Input Item Symbol Remarks LED forward current IF ma LED reverse voltage VR V Peak forward current IFP A f= Hz, Duty factor=.% Power dissipation Pin 7mW voltage (peak AC) VL V See CAUTIONS FOR USE on page 6 Continuous load current (peak AC) IL.A.A Peak AC, DC Peak load current Ipeak.7A.A ms ( shot), VL= DC Power dissipation Pout mw Total power dissipation PT mw I/O isolation voltage Viso,V AC Temperature Operating Topr C to +8 C F to +8 F Non-condensing at low temperatures limits Storage Tstg C to + C F to + F

2 . Electrical () Item Symbol Condition* LED operate.9 ma. ma C type (IL = 8 ma) IFon current. ma R type (IL = ma) LED turn off Minimum. ma. ma C type (IL = 8 ma) Input IFoff current.8 ma.9 ma R type (IL = ma) LED dropout. V (. V at IF = ma) C type (IF = ma) VF voltage. V R type (IF = ma) Transfer Notes:. For type of connection, see Page 6. Variation possible through combinations of output capacitance and ON resistance. * Turn on/turn off time On resistance capacitance Off state leakage current Switching speed Turn on time* Turn off time* I/O capacitance Initial I/O isolation resistance Ron.7Ω 9.Ω.Ω.Ω AQY C type (IF = ma, IL = 8 ma Within s on time) R type (IF = ma, IL = ma Within s on time). pf. pf IF = ma Cout VB = V 8 pf. pf f = MHz. na. na C type (IF = ma, VL = Max.) ILeak na R type (IF = ma, VL = Max.) Ton Toff. ms. ms.ms.ms.8 ms. ms Ciso C type (IF = ma, VL = V RL = Ω) R type (IF = ma, VL = V RL = Ω) C type (IF = ma, VL = V RL = Ω) R type (IF = ma, VL = V RL = Ω).8 pf C type (f = MHz, VB = V). pf R type (f = MHz, VB = V) Minimum Riso,MΩ V DC Input 9% % Ton Toff * Low on resistance (R type) Low capacitance (C type) REFERENCE DATA. current vs. ambient temperature Allowable ambient temperature: C to +8 C F to +8 F current, ma current vs. voltage current, ma voltage, V. On resistance vs. ambient temperature LED current: ma; voltage: Max. (DC); current: ma (DC) R type, 8mA (DC) C type On resistance, Ω

3 AQY. Turn on time vs. ambient temperature LED current: ma; voltage: V (DC); Continuous load current: ma (DC) R type, 8mA (DC) C type.. Turn off time vs. ambient temperature LED current: ma; voltage: V (DC); Continuous load current: ma (DC) R type, 8mA (DC) C type. 6. LED operate current vs. ambient temperature LED current: ma; voltage: Max. (DC); Continuous load current: ma (DC) R type, 8mA (DC) C type Turn on time, ms.... Turn off time, ms.... LED operate current, ma LED turn off current vs. ambient temperature LED current: ma; voltage: Max. (DC); Continuous load current: ma (DC) R type, 8mA (DC) C type 8. LED dropout voltage vs. ambient temperature LED current: to ma 9. Voltage vs. current of output at MOS portion LED turn off current, ma LED dropout voltage, V.... ma ma ma Current, ma Voltage, V ma ma - -. Off state leakage current -. LED forward current vs. turn on time voltage: V (DC); Continuous load current: ma (DC) R type, 8mA (DC) C type;.. LED forward current vs. turn off time voltage: V (DC); Continuous load current: ma (DC) R type, 8mA (DC) C type;. Off state leakage current, A Turn on time, µs.... Turn off time, µs.... voltage, V 6 LED forward current, ma 6 LED forward current, ma

4 . Applied voltage vs. output capacitance Frequency: MHz, m Vrms;. Isolation (Ω impedance). Insertion loss (Ω impedance) AQY capacitance, pf Applied voltage, V Isolation, db Frequency, Hz Insertion loss, db Frequency, Hz 6-(). On resistance distribution (R type) Continuous load current: ma (DC) 6-(). On resistance distribution (C type) Continuous load current: 8mA (DC) 7-(). Turn on time distribution (R type) voltage: V (DC) Continuous load current: ma (DC) On resistance, Ω On resistance, Ω Turn on time, ms 7-(). Turn on time distribution (C type) voltage: V (DC) Continuous load current: 8mA (DC) 8-(). Turn off time distribution (R type) voltage: V (DC) Continuous load current: ma (DC) 8-(). Turn off time distribution (C type) voltage: V (DC) Continuous load current: 8mA (DC) Turn on time, ms Turn off time, ms Turn off time, ms 9-(). LED operate current distribution (R type) voltage: V (DC) Continuous load current: ma (DC) 9-(). LED operate current distribution (C type) voltage: V (DC) Continuous load current: 8mA (DC) LED operate current, ma LED operate current, ma

5 AQY DIMENSIONS mm inch Recommended mounting pad (TOP VIEW) Tolerance:±. ±...8 (.8) (.9) Terminal thickness =..6 General tolerance: ±. ±. SCHEMATIC AND WIRING DIAGRAMS E: Power source at input side; VIN: Input voltage; IF: LED forward current; IIN: Input current; VL: voltage; IL: current Schematic configuration Wiring diagram a AC/DC E IF IL VL (AC,DC) IL VL (AC,DC) CAUTIONS FOR USE. Applying stress that exceeds the absolute maximum rating If the voltage or current value for any of the terminals exceeds the absolute maximum rating, internal elements will deteriorate because of the excessive voltage or current. In extreme cases, wiring may melt, or silicon P/N junctions may be destroyed. As a result, the design should ensure that the absolute maximum ratings will never be exceeded, even momentarily. (Use at V DC or lower and 9V AC or lower is recommended.). Deterioration and destruction caused by discharge of static electricity This phenomenon is generally called static electricity destruction. This occurs when static electricity generated by various factors is discharged while the relay terminals are in contact. The result can produce internal destruction of the element. To prevent problems from static electricity, the following precautions and measures should be taken when using your device. ) Employees handling relays should 6 wear anti-static clothing and should be grounded through protective resistance of kω to MΩ. ) A conductive metal sheet should be placed over the work table. Measuring instruments and jigs should be grounded. ) When using soldering irons, either use irons with low leakage current, or ground the tip of the soldering iron. (Use of lowvoltage soldering irons is also recommended.) ) Devices and equipment used in assembly should also be grounded. ) When packing printed circuit boards and equipment, avoid using high-polymer materials such as foam styrene, plastic, and other materials which carry an electrostatic charge. 6) When storing or transporting relays, the environment should not be conducive to generating static electricity (for instance, the humidity should be between and 6%). Relay should always be protected by using non-conductive packing materials.. Short across terminals Do not short circuit between terminals when relay is energized. There is possibility of breaking the internal IC.. Surge voltages at the input If reverse surge voltages are present at the input terminals, connect a diode in reverse parallel across the input terminals and keep the reverse voltages below the reverse breakdown voltage.. Recommended LED forward current (IF) It is recommended that the LED forward current (IF) be kept at ma. 6. Ripple in the input power supply If ripple is present in the input power supply, observe the following: ) For LED operate current at Emin, maintain the min. ma. ) Keep the LED operate current at ma or less at Emax. Emin. Emax.

6 7. spike voltages ) In the case of inductive load, suppress voltage spikes occurring in the load to no more than the absolute maximum rated load voltage. circuits are shown below. Add a clamp diode to the load Add a CR snubber circuit to the load ) If spike voltages generated at the load are limited with a clamp diode or CR snubber circuit and the circuit wires are long, spike voltages will occur by inductance. Keep wires as short as possible to minimize inductance. VL VL (AC, DC) 8. Cleaning solvents compatibility Dip cleaning with an organic solvent is recommended for removal of solder flux, dust, etc. Select a cleaning solvent from the following table. If ultrasonic cleaning is used, the severity of factors such as frequency, output power and cleaning solvent selected may cause loose wires and other defects. Make sure these conditions are correct before use. For details, please consult us. Chlorine base Adueous Alcohol base Others Cleaning solvent Trichlene Chloroethlene Indusco Hollis Lonco Terg IPA Ethanol Thinner Gasoline Compatibility ( : Yes : No) AQY 9. Soldering When soldering this terminals, the following conditions are recommended. () IR (Infrared reflow) soldering method () Vapor phase soldering method () Double wave soldering method T T T T T T T t T = to 6 C to 9 F T = 8 C C 6 to 9 F T = C 7 F or less t = s or less t = s or less () Soldering iron method Tip temperature: 8 to C 6 to 7 F Wattage: to 6 W Soldering time: within s t t T = 8 to C 66 to 9 F T = C 9 F or less t = s t = s or less () Others Check mounting conditions before using other soldering methods (hot-air, hot plate, pulse heater, etc.) The temperature profile indicates the temperature of the soldered terminal on the surface of the PC board. The ambient t t t t T = to 6 C to 9 F T = 6 C F or less t = 6 s or less t+t = s or less temperature may increase excessively. Check the temperature under mounting conditions. The conditions for the infrared reflow soldering apply when preheating using the VPS method.. The following shows the packaging format ) Tape and reel Type Tape dimensions Dimensions of paper tape reel mm inch SSOP -pin type Tractor feed holes. +. dia dia.. ±.. ±.. ±..8. ±. ±.. ±.8 Device mounted on tape.7 ±..6 ±.. ±..7 ±. Direction of picking. ±..7 ±..7 ±.. ±.. +. dia dia.. ±..7 ±.. ±..7 ±. ±..79 ±. ±.8.87 ±. 8 ± dia.. ±.9 dia. ± dia. 9.8 ±.79 dia. 8 ± dia.. ±.9 dia. () When picked from and -pin side: Part No. AQY VY (Shown adove) () When picked from and -pin side: Part No. AQY VW ±. dia.. ±. dia. ±.. ±.9 ±..79 ±. 7

7 AQY ) Storage PhotoMOS relays implemented in SSOP types are sensitive to moisture and come in sealed moisture-proof packages. Observe the following cautions on storage. After the moisture-proof package is unsealed, take the devices out of storage as soon as possible (within month at the most). If the devices are to be left in storage for a considerable period after the moisture-proof package has been unsealed, it is recommended to keep them in another moisture-proof bag containing silica gel (within months at the most). When heat stress is applied during solder mounting under conditions of humidity absorption, the moisture vaporizes and expands, which could increase package-internal responsiveness and cause cracking on the package surface. For this reason, be sure to stay within the solder parameters of item 9.. Transportation and storage ) Extreme vibration during transport will warp the lead or damage the relay. Handle the outer and inner boxes with care. ) Storage under extreme conditions will cause soldering degradation, external appearance defects, and deterioration of the. The following storage conditions are recommended: Temperature: to C to F Humidity: Less than 7% R.H. Atomosphere: No harmful gasses such as sulfurous acid gas, minimal dust.. Notes for mounting ) If many different packages are combined on a single substrate, then lead temperature rise is highly dependent on package size. For this reason, please make sure that the temperature of the terminal solder area of the PhotoMOS relay falls within the temperature conditions of item 9 before mounting. ) If the mounting conditions exceed the recommended solder conditions in item 9, resin strength will fall and the nonconformity of the heat expansion coefficient of each constituent material will increase markedly, possibly causing cracks in the package, severed bonding wires, and the like. For this reason, please inquire with us about whether this use is possible. These materials are printed on ECF pulp. These materials are printed with earth-friendly vegetable-based (soybean oil) ink. Please contact... Matsushita Electric Works, Ltd. Automation Controls Company Head Office: 8, Kadoma, Kadoma-shi, Osaka , Japan Telephone: Japan (8) Osaka (6) 698- Facsimile: Japan (8) Osaka (6) COPYRIGHT All Rights Reserved ASCTB9E -YT Specifications are subject to change without notice. Printed in Japan.

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