APW7075. Features. General Description. Pin Configuration. Applications. Step-Up Converter and LDO Combo

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1 Step-Up Converter and LDO Combo Features General Description Built-In a 5mA LDO and Synchronous Step-Up DC-DC Converter Built-In PWM/PFM Operating Mode Provided Dual Input Power Sources Connect FB to OUT for 3.3V Output Voltage or GND for 2.5V Output Voltage or an External Resistor Divider for Adjustable Output Voltage. Fixed 3kHz Operating Frequency High Efficiency Up to 94% at 2mA Output Current.6V to 4.5V Operating Voltage 1V Start-Up Input Voltage Low Battery Voltage Detection Reverse Voltage Protection Internal Synchronous Rectifier Automatic Detection Input Voltage Compact SOP-8P and TSSOP-8 Packages Lead Free and Green Devices Available (RoHS Compliant) The APW775 is a PWM/PFM, high-efficiency, and stepup DC-DC converter with an integrated LDO input switch for dual mode application. During battery mode operation, the APW775 acts as synchronous rectifier and step-up DC-DC converter with a fixed or adjustable output voltage. When the VIN pin sense 5V input voltage, the APW775 is switched to LDO operation mode, maintaining the constant output voltage. The input voltage ranges from.6 V to 4.5V for step-up DC-DC converter. The start-up is guaranteed at 1V and the device operates down to.6v. When the device is at LDO operating mode, the suitable output voltage 3.3V and loading current 5mA for maximum power consumption are guaranteed. The APW775 is suited for dual mode and portable battery powered appliance with low-battery detector. In dualmode applications, the APW775 draws power from any available 5V USB connection and reverts to battery power when the USB power is removed. Pin Configuration TSSOP-8 Top View SOP-8P Top View Applications Dual Mode Power System USB Peripheral Camcorders and Digital Camera Hand-Held Instrument PDAs VIN FB SHDN LBI OUT VIN LX GND LBO FB SHDN LBI = Thermal Pad (connected to GND plane for better heat dissipation) OUT LX GND LBO ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. 1

2 Ordering and Marking Information APW775 Package Code KA : SOP-8P O : TSSOP-8 Temperature Range Assembly Material C : to 7 C I : -4 C to 85 C Handling Code Handling Code TR : Tape & Reel Temperature Range Assembly Material L : Lead Free Device Package Code G : Halogen and Lead Free Device APW775 KA : APW775 XXXXX XXXXX - Date Code APW775 O : Note: ANPEC lead-free products contain molding compounds/die attach materials and 1% matte tin plate termination finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-2C for MSL classification at lead-free peak reflow temperature. ANPEC defines Green to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 9ppm by weight in homogeneous material and total of Br and Cl does not exceed 15ppm by weight). APW775 XXXXX Absolute Maximum Ratings XXXXX - Date Code Symbol Parameter Value Unit V OUT Supply Voltage (OUT to GND) -.3 to 6. V V IO Input / Output Pins -.3 to 6. V T A Operating Ambient Temperature Range to 85 C T J Junction Temperature Range to 15 C T STG Storage Temperature Range -65 to +15 C T S Soldering Temperature, 1 Seconds 26 C Thermal Characteristics Symbol Parameter Typical Value Unit R θja Thermal Resistance Junction to Ambient SOP-8 SOP-8-P TSSOP C/W 2

3 Electrical Characteristics V BAT = 2V, FB = OUT (V OUT = 3.3V), R L =, T A = C to +85 C, unless otherwise noted. Typical values are at T A = +25 C. Symbol Parameter Test Conditions STEP-UP SECTION APW775 Min. Typ. Max. Unit V BAT Minimum Operating Input Voltage (Note1) V Operating Voltage V Start-up Voltage R L = 3kΩ V F SW Operating Frequency V OUT = 3.3VX96% khz D MAX Maximum PWM Duty Cycle V OUT = 3.3VX96% % POWER MOSFET R DS(on)-N Active Switch ON Resistance I LX = 1mA Ω R DS(ON)-P Synchronous Switch on Resistance I LX = 1mA Ω CONTROL V OUT Output Voltage FB = OUT, I LOAD = ma V FB = GND, I LOAD = ma V Output Voltage Range External divider V V OUT(drop) V OUT Dropping Voltage (Note 2) V OUT = 3.3V, C OUT = 1µF mv T SS Soft-Start Time V OUT = 3.3V ms V REF FB Input Threshold I LOAD = ma V I FB FB Input Current V FB = 1.4V na I DD Operating Current (Note3) V OUT = 3.3VX96%, I LOAD = ma µa Shutdown Current V SHDN = µa I SHDN SHDN Input Current V SHDN = or V OUT na SHDN Logic LOW (V IL) V Logic HIGH(V IH) V LBI Input Hysteresis mv V LBI LBI Threshold V I LBI LBI Input Current V LBI =.8V na V LBO LBO Logic Low V LBI =, I SINk = 1mA V I LBO LBO Off Leakage Current V LBO = 5.5V, V LBI = 5.5V µa 3

4 Electrical Characteristics (Cont.) Unless otherwise noted these specifications apply over full temperature, 3.9V VIN<5.5V, C OUT 1µF, SHDN=V IN, Typical values are at T A =+25 C.) Symbol Parameter Test Conditions (Note 4) LDO SECTION APW775 Min. Typ. Max. Unit V IN(upper) Upper V IN Threshold Voltage V IN increasing V V IN(lower) Lower V IN Threshold Voltage V IN decreasing V V TH VIN Threshold Hysteresis mv V OUT Output Voltage V OUT-2 V OUT V OUT+2 V I LIM Current Limit V IN = 5V A I SHORT Short Current V OUT = V ma I OUT Load Current ma V DROP Dropout Voltage I LOAD = 5mA V Iq Quiescent Current No load ua I LOAD = 5mA ma REG LINE Line Regulation 4V<V IN<5.5V, I LOAD = ma mv REG LOAD Load Regulation V IN = 5V, ma<i LOAD <5mA mv Note1: The min. operating voltage is dependent on the duty cycle. Note2: The dropped output voltage is that the input power (VIN pin) is switched to battery power (LX pin), when the VIN power is removed. Note3: Device is boostrapped ( power to the IC comes from OUT). This correlates directly with the actual battery supply. Note4: If the LDO mode is used, the output voltage should be under 3.8V. 4

5 Function Pin Description VIN (Pin 1) Input supply voltage for dual-mode application. Connect a schokkty diode (current rating >5mA) to USB port or 5V adapter. If the LDO mode is not used, ties the VIN pin to the ground. FB (pin 2) Internal 1.2V reference voltage. Connect to OUT for 3.3V output. Connect to the GND for 2.5V output. Use a resistor divider to set the output voltage from 2.5V to 5.5V. SHDN (pin 3) Shutdown input. High = operating mode; Low = shutdown mode. LBI (Pin 4) Low-battery comparator input. Internally set to trip at.6v. LBO (pin 5) Open-drain low battery comparator output. Connect LBO to OUT through a 1kΩ resistor. Output is low as V LBI <.6V. Open-drain device is turned on during shutdown. OUT (pin 8) Power output. OUT provides bootstrap power to the IC. GND (Pin 6) Ground pins of the circuitry and all ground pins must be soldered to PCB with proper power dissipation. LX (pin 7) N-channel and P-channel power MOSFET drain connection. 5

6 Application Schematic VBAT 1N5817 C1 1µF L1 22UH Adapter C3 5V 1µF ON OFF R6 R VIN FB SHDN LBI OUT LX GND LBO R5 1kΩ C4 1µF VOUT 3.3V C2 1µF APW775 R4 Low Battery Output Connect the R6=5Ω to 1kΩ to GND Figure 1. Dual Model : 3.3V Output Voltage VBAT 1N5817 C1 1µF L1 22UH Adapter C3 5V 1µF ON OFF R6 R VIN FB SHDN LBI OUT LX GND LBO R5 1kΩ C4 1µF VOUT 2.5V C2 1µF APW775 R4 Low Battery Output Connect the R6=5Ω to 1kΩ to GND Figure 2. Dual Model : 2.5V Output Voltage 6

7 Application Schematic (Cont.) VBAT 1N5817 C1 1µF L1 22UH 2.5V VOUT 3.8V Adapter C3 5V 1µF ON OFF R6 R1 3kΩ VIN FB SHDN LBI OUT LX GND LBO R5 C4 1µF VOUT 3.6V C2 1µF 1kΩ R4 R2 15kΩ APW775 Low Battery Output Connect the R6=5Ω to 1kΩ to GND Figure 3. Dual Model: Adjustable Output Voltage.6V VBAT 4.5V VBAT C1 1µF L1 22UH 2.5V VOUT 5V R1 VOUT 3.6V ON OFF R3 3kΩ VIN FB SHDN LBI OUT LX GND LBO kΩ C4 1µF C2 1µF R4 R2 15kΩ APW775 Low Battery Output Figure 4. Single Boost Converter 7

8 Block Diagram SHDN VDD FB VOUT GND R1,R2 Y A B C VDD Vref Current Limit Vref VDD P-MOS VDD P-MOS Q1 Q2 VIN OUT A B C Y VDD PWM/ PFM controller Drive LX FB phase compensation Oscillator N-MOS Q3 GND LBI voltage reference soft-start Vref 2 N-MOS Q4 LBO SHDN Typical Operating Characteristics Power Up (VBATTERY=2.4V) Power Up (VBATTERY=1.2V) IOUT=1mA VBAT(1V/div) IOUT=1mA VBAT(1V/div) VOUT(1V/div) VOUT(1V/div) LX(2V/div) LX(2V/div) Time(1ms/div) Time(1ms/div) 8

9 Typical Operating Characteristics (Cont.) Power Down Enable IOUT=1mA IOUT=1mA VBAT(2V/div) SHDN(1V/div) VOUT(1V/div) VOUT(1V/div) LX(2V/div) LX(2V/div) Time(5ms/div) Time(1ms/div) Shutdown Heavy Load Operating Waveforms IOUT=1mA SHDN(1V/div) VOUT(1V/div) IL(2mA/div) IOUT=1mA, VOUT=3.3V VBAT=2.4V, CBAT=1µF COUT=1µF, L=22µH LX(2V/div) LX(2V/div) LOUT(1mV/div) Time(1ms/div) Time(1µs/div) 9

10 Typical Operating Characteristics (Cont.) Light Load Operating Waveforms Output Current vs. Start-up Voltage IL(2mA/div) LX(2V/div) IOUT=3mA, VOUT=3.3V VBAT=2.4V, CBAT=1µF COUT=1µF, L=22µH Start-up Voltage(V) LOUT(1mV/div) Time(5µs/div) Output Current(mA) Effciency vs. Output Current Effciency vs. Output Current VIN=2.4V Effciency(%) VIN=1.2V Effciency(%) VOUT=2.5V, L=22µH VIN=1.2V VOUT=3.3V, L=22µH Output Current(mA) Output Current(mA) 1

11 Typical Operating Characteristics (Cont.) Efficiency(%) Efficiency vs. Output Current 1 9 VIN=2.4V VIN=1.2V VOUT=3.3V, L=1µH Output Current(mA) Efficiency(%) Efficiency vs. Output Current VOUT=2.5V, L=1µH VIN=1.2V Output Current(mA) Maximum Output Current (ma) Maximum Output Current vs.input Voltage 1 L=22µH VOUT=3.3V VOUT=3.6V 75 VOUT=2.5V 5 25 VOUT=5V Operating Current into OUT(mA) Operating Curretnt into OUT vs. Output Voltage.5 FB=1.4V Input Voltage(V) Output Voltage(V) 11

12 Typical Operating Characteristics (Cont.) Transition from PFM to PWM vs. Input Voltage Transition from PFM to PWM vs. Input Voltage The transition from PFM to PWM(mA) VOUT=3.3V VOUT=2.5V L=1µH VOUT=3.6V VOUT=5V The transition from PFM to PWM(mA) VOUT=2.5V VOUT=3.3V L=22µH VOUT=3.6V VOUT=5V Input Voltage(V) Input Voltage(V) Input Battery Current vs. Input Battery Voltage Line Transient Response 3 25 VBAT(2V/div) Input Battery Current(µA) VOUT=2.4V VOUT=3.3V VOUT(2mV/div) IOUT=1mA, VOUT=3.3V VBAT=2V~3V Input Battery Voltage(V) Time(2ms/div) 12

13 Typical Operating Characteristics (Cont.) Load Transient Response PWM to LDO VIN(2V/div) VOUT(2mV/div) VBAT=2.4V, VOUT=3.3V L=22µH IOUT=1mA, VOUT=3.3V CIN=1µF, VBAT=2.4V VOUT(1mV/div) IOUT=1~3mA LX(2V/div) Time(.5ms/div) Time(5µs/div) LDO to PWM LDO Power Up VIN(2V/div) IOUT=1mA, VOUT=3.3V CIN=1µF, VBAT=2.4V VIN(2V/div) IOUT=1mA VOUT(1mV/div) VOUT(2V/div) LX(2V/div) IIN(1A/div) Time(.2ms/div) Time(1ms/div) 13

14 Typical Operating Characteristics (Cont.) LDO Power Down LDO Load Transient Response VIN(2V/div) IOUT=1mA VOUT(5mV/div) VOUT(2V/div) VIN=5V, VOUT=3. IOUT=1mA~5mA IN(1A/div) Time(1ms/div) Time(5µs/div) LDO Load Transient Response LBO Rising Delay Time VOUT(5mV/div) VIN=5V, VOUT=3. LBI(.5V/div) VBAT=2.4V, VOUT=3.3V IOUT=1mA~5mA LBO(2V/div) Time(5µs/div) Time(5µs/div) 14

15 Typical Operating Characteristics (Cont.) LBO Falling Delay Time LBO Output Sink Current vs. LBO Low Voltage LBI(.5V/div) 3 25 VOUT=3.3V LBO(2V/div) VBAT=2.4V, VOUT=3.3V LBO Sink Current(mA) Time(5µs/div) LBO Output Low Voltage(V) LDO Current Limit vs. LDO Input Voltage LDO Quiescent Current vs. LDO Input Voltage LDO Current Limit(A) LDO Quiescent Current (A) IOUT=1mA IOUT=mA LDO Input Voltage(V) LDO Input Voltage(V) 15

16 Typical Operating Characteristics (Cont.) Quiescent Current vs. LDO Output Current Dropout Voltage vs. LDO Output Current VOUT=4.2V 1 VIN=5V 6 Quiescent Current (ma) Dropout Voltage (mv) LDO Output Current(mA) LDO Output Current(mA) Output Voltage vs. LDO Input Voltage Output Voltage vs. Temperature Iout=mA IOUT=mA Output Voltage (V) Output Voltage (V) LDO Input Voltage(V) Temperature ( o C ) 16

17 Function Description PFM Control Scheme The APW775 features the PFM control scheme to improve the efficiency during light load. In PFM mode, the inductor stores the energy during internal N-channel MOSFET turns on, and the energy is transferred to output capacitors and load during internal P-channel MOSFET turns on. If the energy which is charged to output capacitors exceeds the requirement of load, the current will reverse from output capacitors to inductor and input capacitors. The PFM comparator compares the source (OUT) and drain (LX) of the internal P-channel MOSFET. When the current that flows through the internal P-channel MOSFET is backward (from OUT to LX), the internal P- channel MOSFET will be turned off, and the output capacitor supplies the load and maintains the output voltage. During PFM mode, the IC switches only as need to serve the load, reduce the switching frequency and associate losses in the internal switches and the external inductor. Some jitter are normal during transition from PFM to PWM mode; the transition of the PFM to PWM is dependent on the inductance values, VIN and VOUT. The output ripple is higher during PFM operation, a larger output capacitor can be used to minimize the output ripple. Synchronous Rectification The APW775 has an internal N-channel and a P-channel MOSFET, it is no need for external components, the internal low RDS(ON) P-channel MOSFET replaces the discrete Schottky diode, and it reduces cost and board space. During the cycle off time, the P-channel MOSFET turns on, and the power dissipation on the P-channel MOSFET is lower than discrete Schottky diode, thus, the conversion efficiency can be improved. Shutdown The APW775 has an active high enable function. Force SHDN high (>1.4V) to enable the step-up converter, SHDN low (<.3V) to disable the step-up converter and the device enters shutdown mode. In shutdown mode, the converter stops switching and all internal control circuits are turned off, but the output is still applied by input voltage through the body diode of P-channel MOSFET, it is about Vin-.6V. Note that when the output is applied from the VIN (LDO mode), the shutdown function is disabled. 17 Soft-Start The APW775 provides the soft-start function to get the controlled output voltage rise. When the battery voltage (<1.8V) is supplied to the device and exceeds the start-up voltage, the internal N-channel and P-channel MOSFETs start to switch and pump up the output voltage to 1.8V( if the battery voltage is over 1.8V, the output voltage will equal battery voltage during this time ), which control circuitry can operate normally. The soft-start controls the rise of internal reference voltage. When the internal reference voltage exceeds the feedback voltage which is divided by the resistor from the output voltage, the soft-start circuit will control the output voltage until the output voltage is in regulation. The soft-start interval is approximately 3ms. LDO The output voltage has two operation modes. When VIN exceeds 3.9V, the output will become the LDO regulator and the step-up converter will be disabled. The LDO output is a P-channel low dropout regulator with 1A current limit. When the VIN is below 3.8V, the output will return to the step-up converter, and the LDO mode will be disabled. Note that when LDO mode is used, the output voltage should be under 3.8V. Low Battery Detection The low battery detection is used to monitor the battery voltage and to generate a signal. This function includes two pins, LBI is the inverting input of the comparator and LBO is an open drain output (See Block Diagram). When the LBI voltage drops below the threshold voltage.6v, the open drain device will turn on and LBO becomes low. The Low battery threshold voltage can be programmed with a resistive divider from battery to LBI pin to the ground. Since the LBO is an open drain output, it usually requires an external pull-up resistor.

18 Application Information Output Voltage Selection The output voltage of APW775 can be adjusted by an external resistor divider, or connect FB pin to OUT for 3.3V and to the ground for 2.5V (see Application Schematic). The internal reference voltage is 1.2V and the allowed output voltage is from 2.5V to 5.5V. The following equation can be used to calculate the output voltage: Programming Low Battery Threshold Voltage The low battery threshold voltage can be programmed with a resistive divider from battery to LBI pin to the ground (see Application Schematic). The internal reference voltage is.6v, and the low battery threshold voltage must be below the battery voltage. The following equation can be used to calculate the low battery threshold voltage: V Inductor Selection R1 = 1+ R2 VOUT R3 = 1+ R4 BAT - TH.6V The APW775 works well with a 22µH inductor in most applications. The inductance values determine the inductor ripple current and affect the output current. Higher inductance values reduce ripple and improve efficiency. Lower inductance values have fast response but increase the ripple and reduce the efficiency. The maximum allowed LX current is 1A (the maximun output current shows in Typical Characteristics), therefore, the peak inductor current cannot exceed it. The following equations calculate the inductor current, and output current. IOUT = IL x (1-D) IL = (VOUT VIN ) Where: D = VOUT VIN V OUT 1.2V ( 1 D) L f The inductor s DC resistance affects the efficiency; larger resistance dissipates more power, it should be as small as possible. It is important to choose the inductor s saturation current rating greater than the peak current which the inductor will flow in the application. Boost Converter Input Capacitor Selection At least a 1µF input capacitor is recommended to stabilize the battery voltage and minimizes the peak current ripple from the battery. LDO Input Capacitor Selection The LDO input capacitor with larger values and lower ESRs provides better PSRR and line transient response. At least a 1µF capacitor is recommended. Output Capacitor Selection The output capacitor is used for supplying the output during internal N-channel MOSFET turns on time. Larger capacitance and lower ESR reduce the output voltage ripple. The output voltage supplies the power to the IC and so the output voltage ripple must be as small as possible to provide better PSRR. In general, a 1µF to 22µF low ESR Tantalum capacitor is recommended, a 1µF ceramic capacitor in parallel for bypassing the noise is also recommended. The following equation calculates the output ripple. VOUT VBAT Voripple= I ( COUT FSW V OUT + OUT ESR) Layout Consideration The correct PCB layout is important for all switching converters. If the layout is not carefully done, the regulator could show stability problems as well as EMI problems. Figure 5 illustrates the layout guidelines, the bold lines indicate the high current paths; these traces must be short and wide. The input capacitors, output capacitors, and the inductor should be as close to the IC as possible. Use a common ground plane for power ground and a different one for control ground to minimize the effects of the ground noise. Connect these ground planes at a node close to the GND pin of IC. The feedback and LBI resistor dividers should be placed as close to the IC as possible. 18

19 Application Information (Cont.) Layout Consideration (Cont.) USB 5V C3 1uF C4 1uF C2 1uF VIN FB SHDN LBI OUT LX GND LBO VOUT C1 1uF 22UH VBAT APW775 Figure 5. Recommended Layout Diagram 19

20 Package Information SOP-8P D D1 SEE VIEW A THERMAL PAD E2 E1 E h X 45 e b c A1 A2 A L.25 GAUGE PLANE SEATING PLANE VIEW A S Y M SOP-8P MILLIMETERS INCHES B O L A A1 A2 b c D MIN. MAX. MIN D E E E e 1.27 BSC h L BSC MAX o 8 o o 8 o Note : 1. Follow JEDEC MS-12 BA. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension "E" does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 1 mil per side. 2

21 Package Information TSSOP-8 D SEE VIEW A E1 E e b C A2 A.25 A1 L S Y M TSSOP-8 MILLIMETERS A B O L MIN. MAX. INCHES 1.2 MIN. MAX..47 A1 A b.19.3 c D E E1 e L BSC Note : 1. Follow JEDEC MO-153 AA 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not BSC exceed 6 mil per side. 3. Dimension "E1" does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 1 mil per side. 21

22 Carrier Tape & Reel Dimensions OD P P2 P1 A E1 OD1 B A T B W F K B A SECTION A-A SECTION B-B d H A T1 Application A H T1 C d D W E1 F MIN MIN. 2.2 MIN SOP-8P P P1 P2 D D1 T A B K MIN Application A H T1 C d D W E1 F MIN MIN. 2.2 MIN TSSOP-8 Devices Per Unit P P1 P2 D D1 T A B K MIN Package Type Unit Quantity SOP-8P Tape & Reel 25 TSSOP-8 Tape & Reel 25 (mm) 22

23 Taping Direction Information SOP-8P t USER DIRECTION OF FEED TSSOP-8 USER DIRECTION OF FEED 23

24 Reflow Condition (IR/Convection or VPR Reflow) T P Ramp-up tp Critical Zone T L to T P T L t L Temperature Tsmax Tsmin Ramp-down ts Preheat 25 t 25 C to Peak Reliability Test Program Time Test item Method Description SOLDERABILITY MIL-STD-883D C, 5 sec HOLT MIL-STD-883D Hrs C PCT JESD-22-B, A Hrs, 1%RH, 121 C TST MIL-STD-883D C~15 C, 2 Cycles ESD MIL-STD-883D VHBM > 2KV, VMM > 2V Latch-Up JESD 78 1ms, 1 tr > 1mA Classification Reflow Profiles Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (T L to T P ) 3 C/second max. 3 C/second max. Preheat 1 C 15 C - Temperature Min (Tsmin) 15 C 2 C - Temperature Max (Tsmax) 6-12 seconds 6-18 seconds - Time (min to max) (ts) Time maintained above: - Temperature (T L ) - Time (t L ) 183 C 6-15 seconds 217 C 6-15 seconds Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5 C of actual Peak Temperature (tp) 1-3 seconds 2-4 seconds Ramp-down Rate 6 C/second max. 6 C/second max. Time 25 C to Peak Temperature 6 minutes max. 8 minutes max. Notes: All temperatures refer to topside of the package. Measured on the body surface. 24

25 Classification Reflow Profiles (Cont.) Table 1. SnPb Eutectic Process Package Peak Reflow Temperatures Package Thickness Table 2. Pb-free Process Package Classification Reflow Temperatures Package Thickness Volume mm 3 <35 Volume mm Volume mm 3 >2 <1.6 mm 26 + C* 26 + C* 26 + C* 1.6 mm 2.5 mm 26 + C* 25 + C* C* 2.5 mm 25 + C* C* C* * Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature + C. For example 26 C+ C) at the rated MSL level. Customer Service Anpec Electronics Corp. Head Office : No.6, Dusing 1st Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : Fax : Volume mm 3 <35 Taipei Branch : 2F, No. 11, Lane 218, Sec 2 Jhongsing Rd., Sindian City, Taipei County 23146, Taiwan Tel : Fax : Volume mm 3 35 <2.5 mm 24 +/-5 C 225 +/-5 C 2.5 mm 225 +/-5 C 225 +/-5 C 25