MOSA. Class AB Stereo Headphone Driver. Low Distortion, Excellent PSRR MS6308 FEATURES APPLICATIONS DESCRIPTION BLOCK DIAGRAM PIN CONFIGURATION MS6308

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1 Low Distortion, Excellent PSRR FEATURES Low supply voltage. to.v No switch-on/off clicks Excellent power supply ripple rejection Low power consumption Short-circuit resistant High performance : - high SNR - high slew rate - low distortion Large output voltage swing APPLICATIONS CD-RWDVD-RW CD-ROMDVD-ROM MPPDA Portable Digital Audio Cross-reference : TDA0T DESCRIPTION BLOCK DIAGRAM The is an integrated class AB stereo headphone driver contained in an SO package. The device is fabricated in a CMOS process and has been primarily developed for portable digital audio applications. is pin and function compatible with the Philips, TDA0T. OutA -INA +INA OutB -INB V SS +INB PIN CONFIGURATION Symbol Pin Description OUTA Output A -INA Inverting input A +INA Non-inverting input A V SS Negative supply +INB Non-inverting input B -INB Inverting input B OUTB Output B Positive supply OUTA -INA +INA V SS OUTB -INB +INB REV

2 ORDERING INFORMATION Package Part number Packaging Marking Transport Media -Pin SOP TR.k Units Tape and Reel -Pin SOP U 00 Units Tube -Pin SOP (lead free) GTR G.k Units Tape and Reel -Pin SOP (lead free) GU G 00 Units Tube ABSOLUTE MAXIMUM RATINGS Symbol Parameter Rating Unit VDD Supply Voltage V V ESD Electrostatic Handling -000 to 000 V T STG Storage Temperature Range - to 0 T A Operating Ambient Temperature Range -0 to T J Maximum Junction Temperature 0 T S Soldering Temperature, 0 seconds 0 R THJA Thermal Resistance from Junction to Ambient in Free Air SOP 0 /W OPERATING RATINGS Symbol Parameter Min Typ Max Unit Supply Voltage. -. V REV

3 V ELECTRICAL CHARACTERISTICS (Ta=, =V, V SS =0V, V O =.Vpp, f=khz, R L =Ω; unless otherwise specified) Symbol Parameter Conditions Min Typ Max Unit DC Characteristics I Q Quiescent current Vo=0Vpp, channels -. ma V O Maximum output voltage swing (THD+N)/S<0.%. - Vpp PSRR Power supply rejection ratio Vripple = -0dBV, 00Hz db CS Cannel separation db AC Characteristics THD+N Total harmonic distortion plus noise (THD+N)/S<0.% db % S/N Signal-to-noise ratio db SR Slew rate Unity gain inverting - - V/µs Po Maximum output power (THD+N)/S<0.%, ch - - mw.v ELECTRICAL CHARACTERISTICS (Ta=, =.V, V SS =0V, V O =Vpp, f=khz, R L =Ω; unless otherwise specified) Symbol Parameter Conditions Min Typ Max Unit DC Characteristics I Q Quiescent current Vo=0Vpp, channels -. ma V O Maximum output voltage swing (THD+N)/S<0.%. - Vpp PSRR Power supply rejection ratio Vripple = -0dBV, 00Hz - - db CS Cannel separation db AC Characteristics THD+N Total harmonic distortion plus noise (THD+N)/S<0.% db % S/N Signal-to-noise ratio db Po Maximum output power (THD+N)/S<0.%, ch - - mw REV

4 TYPICAL PERFORMANCE CHARACTERISTICS (Ta=, R L =Ω; unless otherwise specified) f=0khz f=0khz f=0khz THD+N (%) f=0hz f=khz THD+N (%) f=0hz f=khz THD+N (%) f=0hz f=khz VDD=V VDD=.V VDD=.V OUTPUT VOLTAGE (dbv) THD+N vs. output voltage OUTPUT VOLTAGE (dbv) THD+N vs. output voltage OUTPUT VOLTAGE (dbv) THD+N vs. output voltage VDD=V VO=.Vpp VDD=.V THD+N (%) VDD=.V VO=Vpp VDD=V VO=.Vpp VDD=.V VO=Vpp CHANNEL SEPARATION (db) VDD=.V VO=Vpp VDD=.V VO=Vpp PSRR (db) VRR=-0dBV Vref=/VDD VDD=.V VDD=V FREQUENCY (Hz) THD+N vs. frequency FREQUENCY (Hz) Channel separation vs. frequency FREQUENCY (Hz) PSRR vs. frequency QUIESCENT CURRENT (ma) SUPPLY VOLTAGE (V) Quiescent current vs. supply voltage REV

5 APPLICATION INFORMATION Inverting application.9k 00uF V OA V ia 0uF.9k R L V REF (typ..v) 00uF V ib 0uF.9k.9k 00uF V OB R L Fig. Measurement circuit, inverting application Example of CD application with MS MS k BCK WS DATA GND VoR n.c VoL uf k.nf k nf k pf 00uF Headphone () Supply 0 00k V REF uf 0.uF 00k uf f -db =.khz DC gain =. V DAC out p-p =.V V out p-p =.9V For =.V Fig. Example of a multiple feedback third order lowpass filter application. REV

6 MP digital to analog converting solution. Fig., Fig MP DECODER DAC Headphone Driver 0pF SUNPLUS SPCA STMicroelectronics STA0 Supply MP DECODER 0 BCK WS DATA MS VoR CAP VoL GND Fig. uf V 0.uF A.V 0.uF k P-P uf.v P-P 0k V RE 0uF F 0k 0.uF 0uF k 0k 0k 0pF A first order lowpass filter for DAC output with MS DAC Headphone Driver uf PHONE JACK Headphone () 0pF SUNPLUS SPCA STMicroelectronics STA0 Supply 0 BCK WS DATA MS VoR CAP VoL GND Fig. uf.v 0.uF A.V 0.uF 0k PP uf.v PP 0k V RE uf F REV 0k 0.uF 0uF 0k 0k 0k 0pF A first order lowpass filter for DAC output with MS uf PHONE JACK Headphone ()

7 Example of application with MS0 (current output) 0uF 0.uF nf.9k 00uF k V OA BCK 0k WS MS0 k V RE F 00uF DATA uf.9k 00uF V OB nf 0k REV

8 EXTERNAL DIMENSIONS SOP H E D Symbol Dimension in mm Dimension in inch Min Max Min Max A A B C D H E e. BSC 0.00 BSC L MSOP (Thermal Pad) A A e B C L Thermal Pad H E Symbol Dimension in mm Dimension in inch Min Max Min Max A A A B C D H E e L D A A A e B L C Note : Die pad exposure size is according to lead frame design. REV

9 TAPE AND REEL (Unit : mm) /-0.0 DIA R MAX MIN 0. Radius Typical.0. REV 9