SGM W Audio Power Amplifier with Shutdown Mode

Transcription

1 SGM487 GENERAL DESCRIPTION The SGM487 is a mono bridged audio power amplifier that is designed for portable communication device applications and demanding applications in mobile phones. SGM487YPS8 is capable of delivering.4w of continuous average power to an 4Ω load with less than % distortion (THD) from a 5V battery voltage. It operates from.5v to 5.5V power supply. The SGM487 s micro-power shutdown mode (I SD =.7µA TYP) is activated when V + is applied to the SHDN pin. Since the SGM487 does not require output coupling capacitors, bootstrap capacitors, or snubber networks, it is ideally suited for low-power portable systems that require minimum volume and weight. The SGM487 is unity-gain stable and can be configured by external gain-setting resistors. Additionally, the SGM487 features an internal thermal shutdown protection mechanism. The SGM487 is available in SO-8 and SO-8(PP) packages. It operates over an ambient temperature range of -4 C to +85 C. FEATURES PO at % THD+N, khz SGM487YPS8:.4W (TYP) to 4Ω Load All other SGM487 Packages:.5W (TYP) to 8Ω Load Unity Gain Stable.5V to 5.5V Operation Shutdown Current:.7µA (TYP) Thermal Overload Protection Circuitry No Output Coupling Capacitors, Bootstrap Capacitors or Snubber Networks Required External Gain Configuration Capability -4 to +85 Operating Temperature Range Small SO-8 and SO-8(PP) Packages APPLICATIONS Portable System Wireless Handset Mobile Phone PDAs REV. A

2 SGM487 PACKAGE/ORDERING INFORMATION MODEL SGM487 ORDER NUMBER PACKAGE DESCRIPTION PACKAGE OPTION MARKING INFORMATION SGM487YPS8/TR SO-8(PP) Tape and Reel, 5 SGM487YPS8 SGM487YS8/TR SO-8 Tape and Reel, 5 SGM487YS8 ABSOLUTE MAXIMUM RATINGS Supply Voltage 5.5V Input Voltage -.V to (V +) +.V Storage Temperature Range - 65 to +5 Junction Temperature 5 Operating Temperature Range - 4 to +85 Lead Temperature Range (Soldering sec) 6 ESD Susceptibility HBM.. V MM... V CAUTION This integrated circuit can be damaged by ESD if you don t pay attention to ESD protection. SGMICRO recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. NOTE. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. PIN CONFIGURATION (Top View) SGM487 SHDN 8 V O Bypass 7 GND +IN 3 6 V+ -IN 4 5 V O SO-8 / SO-8(PP)

3 SGM487 ELECTRICAL CHARACTERISTICS The following specifications apply for T A = 5 C, V + = 5V and, unless otherwise specified. PARAMETER SYMBOL CONDITIONS SGM487 MIN TYP MAX UNITS Supply Voltage V V Output Offset Voltage V OS mv Quiescent Power Supply Current I Q V SHDN = GND No Load ma Shutdown Current I SD V + = 5.V, V SHDN = 5.V, I O = ma.7 µa Shutdown Voltage Input High V SDIH. Shutdown Voltage Input Low V SDIL.4 V Output Power (4Ω) Output Power (8Ω) P O P O f = khz, THD+N = %.9 W f = khz, THD+N = %.4 W f = khz, THD+N = %. W f = khz, THD+N = %.5 W Total Harmonic Distortion + Noise THD+N Hz < f < khz, R L = 8 Ω, P O = W. % Power Supply Rejection Ratio PSRR V SHDN = GND, V + = 4.9V to 5.V 7 db Specifications subject to changes without notice. 3

4 SGM487 TYPICAL APPLICATION R F kω V + Audio Input R I kω -IN 4 + C S.μF 6 C I.39μF +IN V O R L 8Ω V + C B.μF Bypass V + / A V = V O R PU Bias SHDN NC 7 GND 4

5 SGM487 TYPICAL PERFORMANCE CHARACTERISTICS (SGM487YS8). P O =.W A V = No Filters THD+N vs. Frequency.5.5 Output Power vs. Supply Voltage f = khz BW < 8kHz % THD+N % THD+N... Frequency (khz) Supply Voltage (V). THD+N vs. Output Power A V = f = khz BW < 8kHz Supply Current (ma) Supply Current vs. Supply Voltage V IN = V No Load Supply Voltage (V) 9 PSRR vs. Frequency.7 Power Dissipation vs. Output Power PSRR (db) C B =.µf Vripple = mvrms.. Frequency (khz) Power Dissipation (W) , f = khz, THD + N %, BW < 8kHz.5.5 5

6 SGM487 TYPICAL PERFORMANCE CHARACTERISTICS (SGM487YPS8). P O =.W A V = No Filters THD+N vs. Frequency. P O =.6W R L = 4Ω A V = No Filters THD+N vs. Frequency... Frequency (khz)... Frequency (khz). THD+N vs. Output Power A V = f = khz BW < 8kHz. THD+N vs. Output Power A V = f = khz R L = 4Ω BW < 8kHz Power Dissipation vs. Output Power.4 Power Dissipation vs. Output Power Power Dissipation (W) , f = khz, THD + N %, BW < 8kHz.5.5 Power Dissipation (W) , f = khz, R L = 4Ω THD + N %, BW < 8kHz

7 SGM487 TYPICAL PERFORMANCE CHARACTERISTICS (SGM487YPS8) Cont. PSRR (db) PSRR vs. Frequency C B =.µf Vripple = mvrms.. Frequency (khz) Output Power vs. Supply Voltage f = khz BW < 8kHz % THD+N % THD+N Supply Voltage (V).5.5 Output Power vs. Load Resistance % THD+N % THD+N f = khz BW < 8kHz Dropout Voltage (V) Clipping Voltage vs. Supply Voltage 8Ω Top Side 8Ω Bottom Side 3 4 Load Resistance (Ω) Supply Voltage (V) Supply Current (ma) V IN = V No Load Supply Current vs. Supply Voltage Supply Voltage (V) 7

8 SGM487 APPLICATION NOTES PCB Design Recommendations (Thermal Design Considerations) SGM487YPS8 is capable of delivering.4w of continuous average power to an 4Ω load when provide a thermal design considerations Thermal Land The SO-8(PP) thermal land is a metal (normally copper) region centrally located under the package and on top of the PCB. It has a rectangular or square shape and should match the dimensions of the exposed pad on the bottom of the package (: ratio). For certain high power applications, the PCB land may be modified to a "dog bone" shape that enhances thermal performance. The packages used with the "dog bone" lands will be a dual inline configuration. (See Figure ). Top View Thermal Vias Figure. Dog Bone Thermal vias are necessary. They conduct heat from the exposed pad of the package to the ground plane. The number of vias is application specific and is dependent upon electrical requirements and power dissipation. The via diameter should be. mm to.33 mm with oz. copper via barrel plating. It is important to plug the via to avoid any solder wicking inside the via during the soldering process. The thermal vias can be tented with solder mask on the top surface of the PCB. The solder mask diameter should be at least 75 microns (or 3 mils) larger than the via diameter. The solder mask thickness should be the same across the entire PCB. A package thermal performance may be improved by increasing the number of vias. 8

9 SGM487 PACKAGE OUTLINE DIMENSIONS SO-8 D e θ L E E b c A A A Dimensions In Millimeters Dimensions In Inches Symbol Min Max Min Max A A A b c D E E e.7 BSC.5 BSC L θ 8 8 9

10 SGM487 PACKAGE OUTLINE DIMENSIONS SO-8(PP) D e θ L E E E b c D A A A Dimensions In Millimeters Dimensions In Inches Symbol Min Max Min Max A A A b c D D E E E e.7 BSC.5 BSC L θ 8 8

11 SGM487 /9 REV. A SGMICRO is dedicated to provide high quality and high performance analog IC products to customers. All SGMICRO products meet the highest industry standards with strict and comprehensive test and quality control systems to achieve world-class consistency and reliability. For more information regarding SGMICRO Corporation and its products, please visit