SGM8631/2/3 6MHz, Rail-to-Rail I/O CMOS Operational Amplifiers
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1 /2/3 6MHz, Rail-to-Rail I/O PRODUCT DESCRIPTION The (single), SGM8632 (dual) and SGM8633 (single with shutdown) are low noise, low voltage, and low power operational amplifiers that can be designed into a wide range of applications. The /2/3 have a high gain-bandwidth product of 6MHz and a slew rate of 3.7V/μs. The SGM8633 has a power-down disable feature that reduces the supply current to less than 1μA. The /2/3 are designed to provide optimal performance in low voltage and low noise systems. They provide rail-to-rail output swing into heavy loads. The input common mode voltage range includes ground, and the maximum input offset voltage is 3.5mV for /2/3. They are specified over the extended industrial temperature range (-4 to +125 ). The operating supply range is from 2V to 5.5V. The single is available in Green SC7-5, SOT-23-5 and SOIC-8 packages. The SGM8632 dual is available in Green SOIC-8 and MSOP-8 packages. The SGM8633 single with shutdown is available in Green SOT-23-6 and SOIC-8 packages. FEATURES Rail-to-Rail Input and Output 3.5mV Maximum V OS High Gain-Bandwidth Product: 6MHz High Slew Rate: 3.7V/μs Settling Time to.1% with 2V Step:.5μs Overload Recovery Time:.9μs Low Noise: 13nV/ Hz at 1kHz Supply Voltage Range: 2V to 5.5V Input Voltage Range: -.1V to +5.6V with V S = 5.5V Low Supply Current /3: 57μA (TYP) SGM8632: 48μA/Amplifier (TYP) Less than 1μA Shutdown Current for SGM8633 Small Packaging Available in Green SC7-5, SOT-23-5 and SOIC-8 SGM8632 Available in Green MSOP-8 and SOIC-8 SGM8633 Available in Green SOT-23-6 and SOIC-8 APPLICATIONS Sensors Audio Active Filters A/D Converters Communications Test Equipment Cellular and Cordless Phones Laptops and PDAs Photodiode Amplification Battery-Powered Instrumentation REV. C. 3
2 /2/3 PACKAGE/ORDERING INFORMATION 6MHz, Rail-to-Rail I/O MODEL PACKAGE DESCRIPTION SPECIFIED TEMPERATURE RANGE ORDERING NUMBER PACKAGE MARKING PACKING OPTION SC to +125 XC5/TR 8631 Tape and Reel, 3 SOT to +125 XN5/TR 8631 Tape and Reel, 3 SGM8632 SOIC-8-4 to +125 XS/TR MSOP-8-4 to +125 SGM8632XMS/TR SOIC-8-4 to +125 SGM8632XS/TR XS XXXXX SGM8632 XMS XXXXX SGM8632XS XXXXX Tape and Reel, 25 Tape and Reel, 3 Tape and Reel, 25 SGM8633 SOT to +125 SGM8633XN6/TR 8633 Tape and Reel, 3 SOIC-8-4 to +125 SGM8633XS/TR SGM8633XS XXXXX Tape and Reel, 25 NOTE: XXXXX = Date Code and Vendor Code. Green (RoHS & HSF): defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If you have additional comments or questions, please contact your SGMICRO representative directly. ABSOLUTE MAXIMUM RATINGS Supply Voltage, +V S to -V S... 6V Input Common Mode Voltage Range... (-V S ) -.3V to (+V S ) +.3V Storage Temperature Range to +15 Junction Temperature Package Thermal T A = 25 SC7-5, θ JA /W SOT-23-5, θ JA /W SOT-23-6, θ JA /W SOIC-8, θ JA /W MSOP-8, θ JA /W Lead Temperature (Soldering 1sec) ESD Susceptibility HBM (/2)... 8V HBM (SGM8633)... 4V MM... 4V CDM... 1V RECOMMENDED OPERATING CONDITIONS Operating Temperature Range to +125 OVERSTRESS CAUTION Stresses beyond those listed may cause permanent damage to the device. Functional operation of the device at these or any other conditions beyond those indicated in the operational section of the specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. ESD SENSITIVITY CAUTION This integrated circuit can be damaged by ESD if you don t pay attention to ESD protection. SGMICRO recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. DISCLAIMER reserves the right to make any change in circuit design, specification or other related things if necessary without notice at any time. 2
3 /2/3 6MHz, Rail-to-Rail I/O PIN CONFIGURATIONS (TOP VIEW) /8633 (TOP VIEW) OUT 1 5 +V S NC 1 8 DISABLE (SGM8633 ONLY) -IN 2 7 +V S -V S 2 +IN 3 6 OUT +IN 3 4 -IN -V S 4 NC = NO CONNECT 5 NC SC7-5/SOT-23-5 SOIC-8 SGM8633 (TOP VIEW) SGM8632 (TOP VIEW) OUT 1 6 +V S OUTA 1 8 +V S -INA 2 7 OUTB -V S 2 5 DISABLE +INA 3 6 -INB +IN 3 4 -IN -V S 4 5 +INB SOT-23-6 SOIC-8/MSOP-8 3
4 /2/3 ELECTRICAL CHARACTERISTICS (At T A = +25, V S = +5V, V CM = V S /2, R L = 6Ω, unless otherwise noted.) 6MHz, Rail-to-Rail I/O PARAMETER INPUT CHARACTERISTICS CONDITIONS TYP /2/3 MIN/MAX OVER TEMPERATURE -4 to to +125 Input Offset Voltage (V OS ) mv MAX Input Bias Current (I B ) 1 pa TYP Input Offset Current (I OS ) 1 pa TYP Input Common Mode Voltage Range (V CM ) Common Mode Rejection Ratio (CMRR) Open-Loop Voltage Gain (A OL ) UNITS MIN/ MAX V S = 5.5V -.1 to 5.6 V TYP V S = 5.5V, V CM = -.1V to 4V db MIN V S = 5.5V, V CM = -.1V to 5.6V 76 db MIN R L = 6Ω, V O =.15V to 4.85V db MIN R L = 1kΩ, V O =.5V to 4.95V 13 db MIN Input Offset Voltage Drift (ΔV OS /ΔT) 2.4 μv/ TYP OUTPUT CHARACTERISTICS Output Voltage Swing from Rail R L = 6Ω.79 V TYP R L = 1kΩ.7 V TYP Output Current (I OUT ) ma MIN Closed-Loop Output Impedance f = 2kHz, 5.4 Ω TYP POWER-DOMN DISABLE (SGM8633 ONLY) Turn-On Time 1.3 μs TYP Turn-Off Time.4 μs TYP DISABLE Voltage-Off.8 V MAX DISABLE Voltage-On 2 V MIN POWER SUPPLY Operating Voltage Range Power Supply Rejection Ratio (PSRR) Quiescent Current/ Amplifier (I Q ) Supply Current when Disabled (SGM8633 only) DYNAMIC PERFORMANCE V MIN V MAX to 5.5V, V CM = (-V S ) +.5V db MIN SGM8632 I OUT = μa MAX /3 I OUT = μa MAX μa MAX Gain-Bandwidth Product (GBP) 6 MHz TYP Phase Margin (φ O ) 63 TYP Full Power Bandwidth (BW P ) <1% distortion 25 khz TYP Slew Rate (SR) G=1, 2V output step 3.7 V/μs TYP Settling Time to.1% (t S ) G=1, 2V output step.5 μs TYP Overload Recovery Time V IN Gain = V S.9 μs TYP NOISE PERFORMANCE Voltage Noise Density (e n ) f = 1kHz 13 nv/ Hz TYP 4
5 6MHz, Rail-to-Rail I/O /2/3 TYPICAL PERFORMANCE CHARACTERISTICS At T A = +25, V CM = V S /2, R L = 6Ω, unless otherwise noted CMRR vs. Frequency 12 1 PSRR vs. Frequency CMRR (db) PSRR (db) PSRR+ PSRR Frequency (khz) Frequency (khz) Channel Separation (db) R L = 62Ω Channel Separation vs. Frequency Channel A to B Channel B to A T A = Frequency (khz) Channel Separation (db) R L = 62Ω T A = +25 Channel Separation vs. Frequency Channel B to A Channel A to B Frequency (khz) 2.5 Closed-Loop Output Voltage Swing 6 Closed-Loop Output Voltage Swing 2 5 Output Voltage (V P-P ) V IN = 2V P-P T A = +25 R L = 1kΩ Frequency (khz) Output Voltage (V P-P ) V IN = 4.9V P-P T A = +25 R L = 1kΩ Frequency (khz) 5
6 6MHz, Rail-to-Rail I/O /2/3 TYPICAL PERFORMANCE CHARACTERISTICS At T A = +25, V CM = V S /2, R L = 6Ω, unless otherwise noted. Small-Signal Overshoot (%) Small-Signal Overshoot vs. Load Capacitance R L = 1kΩ T A = +25 Small-Signal Overshoot (%) Small-Signal Overshoot vs. Load Capacitance R L = 1kΩ T A = Load Capacitance (pf) Load Capacitance (pf) 1 Output Impedance vs. Frequency 1 Output Impedance vs. Frequency 8 8 Output Impedance (Ω) Output Impedance (Ω) Frequency (khz) Frequency (khz) Large-Signal Step Response Large-Signal Step Response Voltage (1V/div) C L = 1pF R L = 1kΩ Voltage (1V/div) C L = 1pF R L = 1kΩ Time (4ns/div) Time (4ns/div) 6
7 6MHz, Rail-to-Rail I/O /2/3 TYPICAL PERFORMANCE CHARACTERISTICS At T A = +25, V CM = V S /2, R L = 6Ω, unless otherwise noted. Small-Signal Step Response Small-Signal Step Response Voltage (5mV/div) C L = 1pF R L = 1kΩ Voltage (5mV/div) C L = 1pF R L = 1kΩ Time (1μs/div) Time ((1μs/div) Positive overload Recovery Negative Overload Recovery V V IN V OUT V IN = 5mV R L = 62Ω G = -1 5mV/div 1V/div V IN V V V IN = 5mV R L = 62Ω G = -1 5mV/div 1V/div V V OUT Time (1µs/div) Time (1µs/div).8 Supply Current vs. Temperature 75 Shutdown Current vs. Temperature Supply Current (ma) V S = 3V Shutdown Current (na) V S = 3V Temperature ( ) Temperature ( ) 7
8 6MHz, Rail-to-Rail I/O /2/3 TYPICAL PERFORMANCE CHARACTERISTICS At T A = +25, V CM = V S /2, R L = 6Ω, unless otherwise noted. 11 V S = 5.5V CMRR vs. Temperature 11 to 5.5V PSRR vs. Temperature V CM = -.1V to 4V 9 CMRR (db) 8 7 V CM = -.1V to 5.6V PSRR (db) Temperature ( ) Temperature ( ) Open Loop Voltage Gain (db) Open-Loop Voltage Gain vs. Temperature R L = 1kΩ Open Loop Voltage Gain (db) Open-Loop Voltage Gain vs. Temperature R L = 6Ω Temperature ( ) Temperature ( ) 5 Output Voltage Swing vs. Output Current Sourcing Current 2 Output Voltage Swing vs. Output Current Sourcing Current Output Voltage (V) Output Voltage (V) Sinking Current Sinking Current Output Current (ma) Output Current (ma) 8
9 6MHz, Rail-to-Rail I/O /2/3 TYPICAL PERFORMANCE CHARACTERISTICS At T A = +25, V CM = V S /2, R L = 6Ω, unless otherwise noted. Voltage Noise (nv/ Hz) Input Voltage Noise Spectral Density vs. Frequency Percentage of Amplifiers (%) Offset Voltage Production Distribution 23 Samples 1 Production Lot Frequency (Hz) Offset Voltage (mv) 9
10 /2/3 APPLICATION NOTES Driving Capacitive Loads The /2/3 can directly drive 1pF in unity-gain without oscillation. The unity-gain follower (buffer) is the most sensitive configuration to capacitive loading. Direct capacitive loading reduces the phase margin of amplifiers and this results in ringing or even oscillation. Applications that require greater capacitive driving capability should use an isolation resistor between the output and the capacitive load like the circuit in Figure 1. The isolation resistor R ISO and the load capacitor C L form a zero to increase stability. The bigger the R ISO resistor value, the more stable V OUT will be. Note that this method results in a loss of gain accuracy because R ISO forms a voltage divider with the R LOAD. VIN RISO CL VOUT Figure 1. Indirectly Driving Heavy Capacitive Load 6MHz, Rail-to-Rail I/O Power-Supply Bypassing and Layout The /2/3 family operates from either a single +2V to +5.5V supply or dual ±1V to ±2.75V supplies. For single-supply operation, bypass the power supply +V S with a.1µf ceramic capacitor which should be placed close to the +V S pin. For dual-supply operation, both the +V S and the -V S supplies should be bypassed to ground with separate.1µf ceramic capacitors. 2.2µF tantalum capacitor can be added for better performance. Good PC board layout techniques optimize performance by decreasing the amount of stray capacitance at the op amp s inputs and output. To decrease stray capacitance, minimize trace lengths and widths by placing external components as close to the device as possible. Use surface-mount components whenever possible. For the operational amplifier, soldering the part to the board directly is strongly recommended. Try to keep the high frequency current loop area small to minimize the EMI (electromagnetic interfacing). An improved circuit is shown in Figure 2. It provides DC accuracy as well as AC stability. R F provides the DC accuracy by connecting the inverting input with the output. C F and R ISO serve to counteract the loss of phase margin by feeding the high frequency component of the output signal back to the amplifier s inverting input, thereby preserving phase margin in the overall feedback loop. Vn Vp +VS 1µF.1µF VOUT Vn Vp +VS 1µF.1µF 1µF VOUT CF RF -VS (GND).1µF RISO VOUT VIN CL RL -VS Figure 2. Indirectly Driving Heavy Capacitive Load with DC Accuracy For non-buffer configuration, there are two other ways to increase the phase margin: (a) by increasing the amplifier s closed-loop gain or (b) by placing a capacitor in parallel with the feedback resistor to counteract the parasitic capacitance associated with inverting node. Figure 3. Amplifier with Bypass Capacitors Grounding A ground plane layer is important for /2/3 circuit design. The length of the current path in an inductive ground return will create an unwanted voltage noise. Broad ground plane areas will reduce the parasitic inductance. Input-to-Output Coupling To minimize capacitive coupling, the input and output signal traces should not be in parallel. This helps reduce unwanted positive feedback. 1
11 /2/3 TYPICAL APPLICATION CIRCUITS Differential Amplifier The circuit shown in Figure 4 performs the difference function. If the resistor ratios are equal (R 4 /R 3 = R 2 /R 1 ), then V OUT = (V p - V n ) R 2 /R 1 + V REF. V n V p R 1 R 2 V OUT 6MHz, Rail-to-Rail I/O Low-Pass Active Filter The low-pass filter shown in Figure 6 has a DC gain of (-R 2 /R 1 ) and the -3dB corner frequency is 1/2πR 2 C. Make sure the filter bandwidth is within the bandwidth of the amplifier. The large values of feedback resistors can couple with parasitic capacitance and cause undesired effects such as ringing or oscillation in high-speed amplifiers. Keep resistor values as low as possible and consistent with output loading consideration. R 3 C R 4 V REF R 1 R 2 V IN Figure 4. Differential Amplifier Instrumentation Amplifier The circuit in Figure 5 performs the same function as that in Figure 4 but with a high input impedance. R 3 = R 1 // R 2 V OUT R1 R2 Figure 6. Low-Pass Active Filter Vn VOUT Vp R3 R4 VREF Figure 5. Instrumentation Amplifier 11
12 PACKAGE INFORMATION PACKAGE OUTLINE DIMENSIONS SC7-5 D e e1.65 E1 E 1.9 b RECOMMENDED LAND PATTERN (Unit: mm) L L1 A A1 A2 θ.2 c Symbol In Millimeters In Inches MIN MAX MIN MAX A A A b c D E E e.65 TYP.26 TYP e1 1.3 BSC.51 BSC L.525 REF.21 REF L θ 8 8 TX43.
13 PACKAGE INFORMATION PACKAGE OUTLINE DIMENSIONS SOT-23-5 D 1.9 e1 E1 E b e RECOMMENDED LAND PATTERN (Unit: mm) L A A1 A2 θ.2 c In Millimeters In Inches Symbol MIN MAX MIN MAX A A A b c D E E e.95 BSC.37 BSC e1 1.9 BSC.75 BSC L θ 8 8 TX33.
14 PACKAGE INFORMATION PACKAGE OUTLINE DIMENSIONS SOIC-8 D e E1 E 5.2 b 1.27 RECOMMENDED LAND PATTERN (Unit: mm) L A A1 θ c A2 In Millimeters In Inches Symbol MIN MAX MIN MAX A A A b c D E E e 1.27 BSC.5 BSC L θ 8 8 TX1.
15 PACKAGE INFORMATION PACKAGE OUTLINE DIMENSIONS MSOP-8 b E1 E 4.8 e RECOMMENDED LAND PATTERN (Unit: mm) D L A A1 A2 c θ Symbol In Millimeters In Inches MIN MAX MIN MAX A A A b c D E E e.65 BSC.26 BSC L θ 6 6 TX14.
16 PACKAGE INFORMATION PACKAGE OUTLINE DIMENSIONS SOT-23-6 D e1 e E1 E b RECOMMENDED LAND PATTERN (Unit: mm) L A A1 A2 θ.2 c Symbol In Millimeters In Inches MIN MAX MIN MAX A A A b c D E E e.95 BSC.37 BSC e1 1.9 BSC.75 BSC L θ 8 8 TX34.
17 PACKAGE INFORMATION TAPE AND REEL INFORMATION REEL DIMENSIONS TAPE DIMENSIONS P2 P W Q1 Q2 Q1 Q2 Q1 Q2 B Q3 Q4 Q3 Q4 Q3 Q4 Reel Diameter P1 A K Reel Width (W1) DIRECTION OF FEED NOTE: The picture is only for reference. Please make the object as the standard. KEY PARAMETER LIST OF TAPE AND REEL Package Type Reel Diameter Reel Width W1 A B K P P1 P2 W Pin1 Quadrant SC Q3 SOT Q3 SOT Q3 SOIC Q1 MSOP Q1 DD1 TX1.
18 PACKAGE INFORMATION CARTON BOX DIMENSIONS NOTE: The picture is only for reference. Please make the object as the standard. KEY PARAMETER LIST OF CARTON BOX Reel Type Length Width Height Pizza/Carton 7 (Option) DD2 TX2.
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More informationTABLE OF CONTENTS Features... Applications... Pin Configurations... General Description... Revision History... 2 Specifications... 3 Absolute Maximum
FEATURES Offset voltage: 2.5 mv maximum Single-supply operation: 2.7 V to 5.5 V Low noise: 8 nv/ Hz Wide bandwidth: 24 MHz Slew rate: V/μs Short-circuit output current: 2 ma No phase reversal Low input
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