An introduction to e2v High Reliability Semiconductor Solutions for Space. The 26th Microelectronics Workshop. Atsushi Oda e2v Japan

Transcription

1 An introduction to e2v High Reliability Semiconductor Solutions for Space The 26th Microelectronics Workshop Atsushi Oda e2v Japan +81 (0)

2 Agenda e2v corporate introduction Hi-rel semiconductor overview Data Converters Microprocessors Courtesy for SAO, NASA, JAXA, NAOJ Slide 2

3 Our vision is to be the company most trusted to deliver advanced technology and vital services for critical systems

4 WHEN PERFORMANCE COUNTS Enabling discovery e2v imaging sensors are on-board NASA s Curiosity Rover, helping it to detect the elements which would support life on Mars e2v scientific sensors can detect a single photon, enabling inspection of lightsensitive samples Image courtesy NASA Slide 4

5 WHEN PERFORMANCE COUNTS Connecting the world Our high performance and energy-efficient data converters are enabling a new generation of smaller and more costeffective telecoms satellites e2v s hi-reliability microprocessors control the avionics systems of the Boeing 787 Dreamliner and the Airbus A350 Image courtesy Boeing Slide 5

6 WHEN PERFORMANCE COUNTS Seeing the big picture Earth observation satellites take detailed pictures, captured by e2v imaging sensors, to help scientists monitor environmental change e2v s power tubes and microwave systems power radar on land, ships and planes Uluru (Ayres Rock) Australia Image courtesy CNES PleiadesSlide 6

7 Our capabilities RF power High performance imaging Hi-rel semiconductors RF generators based on high power magnetrons and modulators Microwave Power Modules based on Travelling Wave Tubes Electron devices, subsystems, microwave and ordnance technologies Space qualified focal plane arrays & cameras based on CCD and CMOS sensors High speed industrial cameras based on line & area scan CMOS sensors Thermal imaging cameras High-reliability microprocessors, memories and data converters SLiM service for proactive obsolescence management & counterfeit avoidance Slide 7

8 e2v about us Founded in 1947 Annual sales of over $300m 1600 employees 500+ engineers & scientists Operational facilities in Europe, the US and Asia FY12/13 revenue ($m) by region EMEA Americas Asia Pac Slide 8

9 Hi-Rel Semiconductor overview Slide 9

10 High Reliability Semiconductor Solutions for Space Applications Data Converters Microprocessors ADCs and DACs for Microwave frequencies Analog to Digital Conversion up to 1.5GSPS, Digitises signals up to L-Band frequency without frequency down-conversion. Digital to Analog conversion up to 3GSPS sampling rate, generates signals in L, S and C- Band without frequency up-conversion. Allows for Significant frequency hops >1GHz in F.H. Encrypted RF Data Links. Adopted in the following types of payloads: SAR Radar Based Earth Observation. High Speed and Highly encrypted downlink-modems. Telecommunication Payloads. Navigation Satellites. Proved useful for MPA and TWTA compensation. ASIC Assembly&Test Up-converter $100K+ Down-converter $100K+ SLiM Design, IP, Assembly & Test. Silicon technology. Freq. Up-conv. are optional in L-, S- and C-Band when choosing e2v data converters. 6-figure B.O.M. savings. Freq. Down-conv. are optional in L-Band when choosing e2v data converters. 6-figure B.O.M. savings. ITAR Free Technologies and Facilities Slide 10

11 High Reliability Semiconductor Solutions for Space Applications Data Converters Microprocessors ASIC Assembly&Test SLiM Large Portfolio of Microprocessors Official High Reliability Partner of Motorola/Freescale since Product Coverage spans from legacy series to latest QorIQ families of Multi-core processors, also includes Everspin MRAM memories and IDT bridges. Space Customers can: Select a microprocessor with appropriate computation power for the application. Assess radiation tolerance of the chosen processor for the intended mission. Define with e2v the appropriate re-packaging and screening flows for the mission. GHz Multi-Core Computing Power e2v s Multi-decade Product Availability e2v s High Reliability Guarantee Slide 11

12 High Reliability Semiconductor Solutions for Space Applications Data Converters Microprocessors Space Grade Assembly and Test Capabilities Expertise in Large Hermetic Packages. Expertise of high frequency mixed signals. Custom Package Design Capability with advanced thermal and EM modelisation. e2v builds > Space grade parts per year. Advanced test capabilities on Teradyne ATE platforms High pin count High frequency. mixed signals. Multi-Chip Module capabilities. Lower-than-Space-Grade options are available. ASIC Assembly&Test SLiM ITAR Free Technologies and Facilities Certified Operations Management Skills Slide 12

13 High Reliability Semiconductor Solutions for Space Applications Data Converters Microprocessors SLiM Semiconductor Lifecycle Management ASIC Assembly&Test SLiM Flow of Obsolescence Notifications e2v SLiM protection Protected Project e2v SLiM service secures continuity of supply of the strategic components of your project. e2v SLiM - Multi-decade coverage. - High Reliability grades. - Formal commitment through a SLiM contract. Slide 13

14 Data Converters for Space Slide 14

15 e2v Data Converters Highlights. DAC 12b S 3G DAC 10b S 3G EV12DS130A EV10DS130A Software Defined Microwave DAC < 50ps full scale rise time and fall time > 7GHz Analog Output BW Very Flat response See DAC perf. Charts for details ADC 12b S 1.5G ADC 10b S 2.6G ADC 10b S 1.5G EV12AS200 EV10AS150 EV10AS180 < 150ps Step Response Time 500mVp-p input V. Range means this is the only 12bit GSPS ADC driveable by an amplifier < 70ps Step Response Time 5GHz input Bandwidth. Highest bandwidth at 10bit. Taking the Digital world closer to the antenna RF designers can use L-Band frequencies as the IF frequency. ADC 10b Q 1.25G EV10AQ190 4 channels, 2 Channels or 1 channels on 1 device Microwave Frequencies Cross-Point Switch. Slide 15

16 Succeeding in Space BDC Value Proposition to the Space industry Available Now Up-converter $100K+ Freq. Up-conv. are optional in L-, S- and C-Band when choosing e2v data converters. 6-figure B.O.M. savings. EV10DS130A 10B 3Gsps MuxDAC ESCC Evaluation completed soon on EPPL Down-converter $100K+ Freq. Down-conv. are optional in L-Band when choosing e2v data converters. 6-figure B.O.M. savings. EV10AS180A 10B 1.5Gsps L band ADC ESCC Evaluation completed soon on EPPL Design, IP, Assembly & Test. Silicon technology. ITAR Free Technologies and Facilities Slide 16

17 Telecom applications e2v makes it possible: Use the L-Band as the IF band to save on weight, power and size. Receiver Down-converter Up-converter Transmitter $100K+ $100K+ RF pre-amp. Filtering Down-converter (optional) Digital Processing Microwave power amp. Filtering Up-converter (optional) L-Band input ADC EV10AS180 Signal Processing Unit L/S/C-Band DAC EV10DS130 Efficient L-Band in / L-Band out Generic Transceiver System. L-Band payload need No-freq. Converters. Other payloads only need Freq conversion to convert to L-Band. Slide 17

18 Available Dynamic Range Rx side Multi-Nyquist Coverage with EV10AS180 Wider Nyquist and Higher Fin Means More FDMA channels and wider bandwidths / port.. Means Less Freq. down conversion Width of Nyquist Zones 750MHz! Spurs free! Accomodates 700MHz of useful bandwidth 1st Nyquist 2 nd Nyquist 3rd Nyquist Down-converter Down-converter Down-converter $100K+ $100K+ $100K+ Fs/2 Fs 750MHz 1.5GHz See references for more details : EV10AS180A datasheet - 10bit 1.5GSPS L-Band ITAR-Free ADC developped under ESA ITT. 1.5xFs 2.25GHz Slide 18

19 Available Dynamic Range Tx side Multi-Nyquist Coverage with EV10DS130A Wider Nyquist and Higher Fin Means More FDMA channels. Means Less Freq. down conversion Width of Nyquist Zones 1.5GHz! Spurs free! Accomodates 1.4GHz of useful Bandwidth 1st Nyquist 2nd Nyquist 3rd Nyquist 4th Nyquist 5th Nyquist Up-converter Up-converter Up-converter Up-converter For Ground Equipment Only $100K+ $100K+ $100K+ $100K+ Fs/2 1.5GHz Fs 3.0GHz 1.5 x Fs 4.5GHz See references for more details : EV10DS130A datasheet [5] + IEEE ComCas 2011 Paper [3]. 2 x Fs 6.0GHz 2.5xFs 7.5GHz Slide 19

20 Downlink Modem Possibilities with EV10DS130A 10bit 3GSPS DAC operating at Microwave frequencies. 20+Gbps Data flow Channelisation L1 Sub-flow 1 Sub-flow 2 Sub-flow 3 Sub-flow 4 Sub-flow 5 Encryption Switch Matrix 200! Combinations Modulation 10b 3GSPS DAC Data Flow Generation 10bits 3GSps Data flow Sub-flow 200 Signal Processing Unit RF Microwave Unit EV10DS130 DAC 12b S 3G More than 200 FDMA channels can fit inside 1 Nyquist zone Slide 20

21 Downlink Modem Possibilities with EV10DS130A 10bit 3GSPS DAC operating at Microwave frequencies. Up-converter $100K+ With Freq. converters K-Band, X-Band Direct DAC ouput No Freq. converters L-Band IF S-Band C-Band Up-converter $100K+ More than 200 FDMA channels can fit inside 1 Nyquist zone Slide 21

22 DAC 10b/3GSps EV10DS130A radiation test summary Parameter Symbol Results Unit Comments Radiation total dose TID 110 Krad No issue Device is ELDRS free Latch up free SEL > 80 MeV-cm²/mg No SEL at 200 MeV with protons SEFI (Single event Functional Interrupt) - Recoverable with SEFI Reset HEAVY IONS (DACOUT & DSPCLK) NO SEFI LET threshold LETth MeV Saturated cross-section Xsat 7.50 E-05 Cm² W W 20 MeV-cm²/mg S S 1.2 Worst case long SET duration on DSPCLK Long SET < 20 ns < 20 ns Value deduced from proton tests Corresponds to ~2 clock periods at 2760Msps Corresponds to ~55 consecutive data at 2760Msps Worst case long SET duration on DACOUT Long SET < 100 ns With amplitude modulation by halffull-scale. Corresponds to ~275 consecutive data at 2760Msps PROTONS (DACOUT & DSPCLK) Energy threshold Eth 1 MeV Saturated cross-section Xsat 3.00 E-10 Cm² W W 1 MeV S S 1 Worst case long SET duration on DSPCLK Long SET < 3 ns Worst case long SET duration on DACOUT Long SET < 3 ns Worst case as test was done for Eth > 10 MeV Corresponds to duty cycle variations at 2770Msps Corresponds to ~8 wrong consecutive data at 2770Msps Slide 22

23 ADC EV10AS180AGS radiation test summary Parameter Symbol Results Unit Comments Radiation total dose TID 104 Krad No issue Latch up free SEL > 84.8 MeV-cm²/mg SEE performance (geosynchronous orbit) SEFI (Single event Functional Interrupt) - Recoverable with Reset SEE 1.2E-03 to 6.8E-03 SEU/device.day SEFI NO SEFI MTBF Worst case obtained for static tests Better results with dynamic tests at 600Msps: 1.2 E-03 Permanent conversion errors - Recoverable with Reset No permanent error MTBF Multi conversion errors (self recovering) 1.2E-03 / Device.day (>2.2 years) Long SEU duration Long SEU Maximum 62 Single conversion errors (self recovering) 6.8 E -03 (147 days) MTBF consecutive conversion clock periods MTBF Worst case obtained for static tests at 600Msps Better results with dynamic tests at 600Msps: 4.5 E-04 MTBF (including Long SEU) is twice as long as specified 62 clock periods for dynamic tests 58 clock periods for static tests Worst case obtained for static tests at 600Msps Better results with dynamic tests at 600Msps: 1.2 E-03 (833 days) Slide 23

24 e2v s Microprocessors for Space Slide 24

25 3 Step Process to sourcing powerful and qualified microprocessors for Space Programmes 1. Selection of appropriate Microprocessor Depending on the computational task to be performed, select the most appropriate Microprocessor within e2v portfolio. e2v offer a broad range of processors from PowerPC to Multi-core QorIQ processors 2. Radiation Tolerance Assessment - Approx 6 months Perform tests to assess whether the chosen processor has sufficient radiation tolerance for the intended mission: - Ionising radiation. - Heavy ions (SEE; SEL, SEU). 3. Creation of the Space version of the selected Microprocessor Approx. 1.5 year Hermetic Package design. Creation of full space grade assembly and screening flow as per ESA ESCC9000 or QMLV standards Slide 25

26 HiRel Microprocessors Portfolio e500 QorIQ 8xx PowerQUICC I PC860SR 66MHz 603e PowerQUICC II PC8240 PC8245 PC8260/65A PC8270/ MHz e300 PowerQUICC II Pro PC8349 PC8378/ MHz e500 PowerQUICC III G2 PC8540 PC8548 PC MHz e600 PC8610 PC8640/D PC8641/D MHz G3 PC745 PC MHz P2020 P4080 Multicore MHz G4 PC7410 PC7457 PC7447A PC MHz PC603R 300MHz Slide 26

27 Microprocessors Comparison Core and PC7457 PC7448 PC8548 e600 1 GHz / 600MHz e600 1,3 GHz / 600MHz e500 1,3 GHz / 600MHz Technology 130nm SOI 90nm SOI 90nm SOI Power Consumption 8.3W typical at max frequency 8.4W typical at max frequency 7.9W typical at max frequency Die Size 10.8 x 9.1 mm 8.0 x 7.3 mm 10.6 x 6.1 mm Package 483-ball HiTCE CBGA 360-ball HiTCE CBGA 783-ball HiTCE CBGA with lid Slide 27

28 Radiation Tolerance Assessment. Case of PC7447A and PC7448 PC7447A and PC7448 have been tested under heavy ions as part of the SCADRI project. The SCADRI project was executed with the joint cooperation of e2v, French Space Agency CNES and the TIMA Laboratory of Grenoble France. Observed SEE rates and neutron FIT makes theses CPUs suitable for a wide range of aerospace applications : No Latchup confirmed (SOI process). Upset rates of SOI Power PCs are low enough to allow their use in space applications where occasional upsets can be tolerated or mitigated. PC7447A and PC7448 are useful candidates for non-critical, highly computational tasks in space. Sensitivity to neutrons (FIT rates) are low enough to allow their use in avionics applications. Refer to full test report for details of test methods and results. Slide 28

29 Radiation Tolerance Assessment. Processors on similar technology e2v offers PCI Bridge and memory controller device PC109 which is recommended for use with PC7447A and PC7448. PC109 is built on a 130nm technology, thus radiation can be expected to be similar to PC7447A although not specifically tested to date. e2v offers Multi-core microprocessors built on the same or similar 90nm technology as PC7448 for which the SCADRI project demonstrated sufficient radiation tolerance for compute intensive space programmes. Similar radiation performance as PC7448 can be expected on the following processors. PC8640D Dual 32bit e600 cores 1.25GHz each. PC8641D Dual 32bit e600 cores 1.25GHz each. Slide 29

30 About QML-Y and Hi-TCE package QML-Y QML-Y is new standard currently being defined not yet released. It applies to non-hermetic integrated circuits intended for Space applications Hi-TCE package of PC7448 The Hi-TCE package of PC7448 is a ceramic non-hermetic package. It is a Flip-Chip technology. It features high thermal expansion coefficient, thus requires no CCGA columns and features good thermo-mecanical reliability with BGA balls. Slide 30

31 Summery Radar based Earth Observation HRS DAC Speed-of-Fiber Encrypted Data Link to the ground Optical Earth Observation HRS DAC Speed-of-Fiber Encrypted Data Link to the ground HRS Microprocessor On-board Computation HRS Microprocessor On-board Computation HRS ADC + DAC Radar Sensor HPI Optical Sensor Slide 31