FMM5820X Ka-Band Power Amplifier MMIC

Transcription

1 FEATURES High Output Power; = 35.5 dbm (Typ.) High Linear Gain; GL = db(typ.) Frequency Band ; GHz Impedance Matched Zin/Zout = 5Ω FMM582X DESCRIPTION The FMM582X is a power amplifier MMIC that contains a fourstages amplifier, internally matched, for standard communications band in the 29.5 to.ghz frequency range. This product is well suited for Ka-band V-SAT applications. Eudyna s stringent Quality Assurance Program assures the highest reliability and consistent performance. ABSOLUTE MAXIMUM RATING Item Symbol Rating Unit Drain-Source Voltage VDD 1 V Gate-Source Voltage VGG -3 V Input Power Pin 21 dbm Storage Temperature Tstg to +125 RECOMMENDED OPERATING CONDITIONS Item Symbol Condition Unit Drain-Source Voltage VDD 7 V Input Power Pin 18 dbm Operating Backside Temperature Top -4 to +85 This product should be hermetically packaged. ELECTRICAL CHARACTERISTICS (Ambient Temperature Ta=25 ) Item Symbol Test Conditions Limits Min. Typ. Max. Unit Frequency Range f VDD=7.V GHz Output Power at Pin=15dBm IDD(DC)=15mA typ dbm Output Power at 1dB G.C.P. P1dB Zs=Zl=5ohm dbm Linear Gain Gl 2 db Power Added Efficiency at Pin=15dBm Nadd % at Pin=15dBm Iddrf - ma Input Return Loss at Pin=dBm RLin db Output Return Loss at Pin=dBm RLout db Note : RF parameter sample size 1ps. Criteria (accept/reject)=(/1) G.C.P. : Gain Compression Point ESD Class Note : Based on EIAJ ED-471 C-111A(C=1pF, R=1.5kΩ) ~ 199V Edition 1.1 January

2 Output Power vs. IDD(DC)=15mA Output Power, vs. Input IDD(DC)=15mA Pin=16dBm P1dB Pin=12dBm Pin=8dBm Pin=4dBm f=29.5ghz 29.75GHz.GHz 2 18 Pin=dBm Frequency [GHz] Power Added Efficiency vs. IDD(DC)=15mA Power Added Effciency [%] Pin=16dBm P1dB Pin=12dBm Pin=8dBm Pin=4dBm Pin=dBm Frequency [GHz] f=29.5ghz 29.75GHz.GHz tone Total 2

3 Output Power, vs. Input Power by Drain IDD(DC)=15mA Output Power, vs. Input Power by Drain IDD(DC)=15mA VDD=5V 6V 7V 8V 2 18 VDD=5V 6V 7V 8V Output Power, vs. Input Power by Drain Voltage Output Power, Gain vs. Drain VDD=5V 6V 7V 8V f=29.5ghz 29.75GHz GHz P1dB [dbm] P1dB G1dB G1dB [db] Drain Voltage VDD [V] 3

4 Output Power, vs. Input Power VDD=7V Output Power, vs. Input Power VDD=7V IDD(DC)=1mA 15mA 17mA 19mA 42 IDD(DC)=1mA 15mA 17mA 19mA Output Power, vs. Input Power by Output Power, Gain IDD(DC)=1mA 15mA 17mA 19mA P1dB [dbm] f=29.5ghz 29.75GHz GHz P1dB G1dB G1dB [db] DC IDD(DC) [ma] 4

5 by Drain IDD(DC)=15mA by Drain IDD(DC)=15mA VDD=5V 6V 7V 8V VDD=5V 6V 7V 8V tone Total tone Total by Drain IDD(DC)=15mA VDD=5V 6V 7V 8V tone Total 5

6 VDD=7V VDD=7V IDD(DC)=1mA 15mA 17mA 19mA IDD(DC)=1mA 15mA 17mA 19mA tone Total tone Total VDD=7V IDD(DC)=1mA 15mA 17mA 19mA tone Total 6

7 IDD(DC)=15mA Sxx [db] S11 S21 S Frequency [GHz] Sxx [db] S11 S21 S Frequency [GHz] 7

8 S-Parameter VDD=7V, IDD=15mA Freq. S11 S21 S12 S21 GHz Mag. Ang. Mag. Ang. Mag. Ang. Mag. Ang

9 Tch vs. Drain Voltage (Reference) 8 IDD=15mA Monunted on Cu-Plate(t=.5mm) with AuSn soldering. 7 6 ΔTch [ ] VDD [V] MTTF vs. Tch 1.E+12 1.E+11 1.E+1 Ea=1.56eV MTTF (hrs) 1.E+9 1.E+8 1.E+7 1.E+6 1.E+5 1.E+4 1.E+3 1.E+2 1.E Tch ( ) 9

10 Chip Outline and Bonding Pad Locations (Dimension in Micro-Meters) VGG1 VDD1 VDD3 VDD5 VDD (VGG2) VDD2 VDD4 VDD6 VDD8 Chip Size : 45±um x 2±um Chip Thickness : 6±2um Bonding Pad Size : 16um x 8um NOTE: Gate voltage is required from either or both bonding pad( VGG1 or/and VGG2). 1

11 Assembly Diagrams Recommended assembly VGG 1 uf 1 pf 1 pf 1 pf 1 pf 1 uf VDD RF_in RF_Out VDD 1 pf 1 pf 1 pf 1 pf 1 uf Copper is the recommended material for the package or carrier. 11

12 DIE ATTACH 1) The die-attach station must have accurate temperature control, and an inert forming gas should be used. 2) Chips should be kept at room temperature except during die-attach. 3) Place package or carrier on the heated stage. 4) Lightly grasp the chip edges by the longer side using tweezers. Die attach conditions Stage Temperature: to 31 Time : less than 15 seconds AuSn Preform Volume : per next Figure 25 Volume of Au-Sn Perform (1-3 /mm 3 ) FMM582X Area of Chip Bach Surface (mm^2) WIRE BONDING The bonding equipment must be properly grounded. The following or equivalent equipment, tools, materials, and conditions are recommended. 1) Bonding Equipment and Bonding Tool. Bonding Equipment : West Bond Model 74 (Manual Bonder) Bonding Tool : CCOD-1/16-S F1-MP (Deweyl) 2) Bonding Wire Material : Hard or Half hard gold Diameter :.7 to 1. mil 3) Bonding Conditions Method : Thermal Compression Bonding with Ultrasonic Power Tool Force :.196 N ±.196 N Stage Temperature : 215 ± 5 Tool Heater : None Ultrasonic Power Transmitter : West Bond Model 14 Duration : 15 ms/bond 12

13 For further information please contact : Eudyna Devices USA Inc Zanker Rd. San Jose, CA , U.S.A. TEL: FAX: Eudyna Devices Europe Ltd. Network House Norreys Drive Maidenhead, Berkshire SL6 4FJ United Kingdom TEL: +44 () FAX: +44 () Eudyna Devices International Srl Via Teglio 8/ Milano, Italy TEL: Eudyna Devices Asia Pte. Ltd. Hong Kong Branch Suite 196B, Tower 6, China Hong Kong City 33 Canton Road, Tsimshatsui, Kowloon Hong Kong TEL: FAX: CAUTION Eudyna Devices Inc. products contain gallium arsenide (GaAs) which can be hazardous to the human body and the environment. For safety, observe the following procedures: Do not put these products into the mouth. Do not alter the form of this product into a gas, powder, or liquid through burning, crushing, or chemical processing as these byproducts are dangerous to the human body if inhaled, ingested, or swallowed. Observe government laws and company regulations when discarding this product. This product must be discarded in accordance with methods specified by applicable hazardous waste procedures. Eudyna Devices Inc. reserves the right to change products and specifications without notice.the information does not convey any license under rights of Eudyna Devices Inc. or others. 26 Eudyna Devices Inc. Eudyna Devices Inc. 1 Kamisukiahara, showa-cho Nakakomagun, Yamanashi 49-83, Japan (Kokubo Industrial Park) TEL FAX Sales Division 1, Kanai-cho, Sakae-ku Yokohama, 4-845, Japan TEL FAX