36V System Power Supply with Watchdog Timer for Automotive Applications

Transcription

1 Series AEC-Q1 Compliant 36V System Power Supply with Watchdog Timer for Automotive Applications OUTLINE R511S is the system power supply and supervisor IC based on the high-voltage CMOS process technology, and has high accuracy and ultra low supply current voltage. R511S consists of a voltage regulator (VR), a voltage detector (VD), and a normal / window type of watchdog timer (WDT) in a chip, and can provide three functions of the system power supply, the supply voltage supervisor, and the supervision of system s misoperation. Voltage Regulator allows the output current of 5mA. And, VR has the inrush current protection circuit for rising pulse (Typ.4mA or less). Voltage Detector outputs a reset signal when a reduction of supply voltage (SENSE / VOUT) is detected, and the reset signal is used as system reset. The detection voltage is internally fixed in an IC. And, the delay time is adjustable with an external capacitor because VD has the built-in release delay circuit (the power-on reset circuit). When the supply voltage is higher than the release output voltage, VD maintains the reset state during the delay time. The output type of RESETB and DOUT are Nch open-drain. In addition, R511Sxx2C and R511Sxx2D (Detector with SENSE pin) have a manual reset (MR) pin. Watchdog Timer detects the microprocessor output pulse. In addition to the normal type of WDT (R511Sxx1A / R511Sxx2C) that outputs a reset signal when the detected pulse period is longer than normal, R511S supports the window type of WDT (R511Sxx1B / R511Sxx2D) that outputs a reset signal when the detected pulse period is shorter or longer. RESETB outputs the reset signal when using R511Sxx1A / R511Sxx1B, and the WDO pin outputs L as the reset signal when using R511Sxx2C / R511Sxx2D. The output type of WDO is Nch open-drain. In addition, R511Sxx2C and R511Sxx2D have an inhibiting (INH) pin to stop the watchdog timer s monitoring function. The time out period of Watchdog Timer is also adjustable with an external capacitor. R511S supports the packages of HSOP-8E and HSOP-18. FEATURES Operating Voltage Range (Maximum Rating) 3.5V to 36.V (5.V) Operating Temperature Range 4 C to 125 C Supply Current Typ. 25µA Supply Current (On standby) Typ..2µA <Voltage Regulator (VR)> Output Voltage Range 1.8V to 5.V Dropout Voltage Typ..5V (VOUT = 5.V, 5mA) Output Voltage Accuracy ±1.5% ( 4 C Ta 125 C) Output Voltage Temperature Coefficient Typ. ±1ppm/ C Built-in Short Current Limit Circuit Typ. 8mA Built-in Overcurrent Protection Circuit Min. 5mA 1

2 Built-in Thermal Shutdown Circuit Typ.165 C Recommended Ceramic Capacitor.1µF or more <Voltage Detector (VD)> Detector Threshold Range 1.6V ~ 5.5V Detector Threshold Accuracy ±1.8% ( 4 C Ta 125 C) Release Delay Accuracy ±2% ( 4 C Ta 125 C) Release Delay Time Typ. 242ms (CD =.22 µf) Delay Time is adjustable with an external capacitor. <Watchdog Timer (WDT)> Open Window Accuracy ±2% ( 4 C Ta 125 C) Open Window Time Typ.18ms (CTW = 1nF) Closed Window Time Typ.18ms (CTW = 1nF) Long Open Window Time Typ.72ms (CTW = 1nF) Ignoring Time Typ.18ms (CTW = 1nF) Monitoring Time Typ.18ms (CTW = 1nF) Reset Time Typ.9.5ms (CTW = 1nF) Each time is adjustable with an external capacitor. APPLICATIONS Power source for car accessories including car audio equipment, car navigation system, and ETC system. Power source for control units including EV inverter and charge control. 2

3 SELECTION GUIDE R511S user selectable options (Watchdog Timer type, Detector type, and additional functions with using MR / INH / WDO pins) are as follows: Product Name Package Quantity per Reel Pb Free Halogen Free R511Sxx1 -E2-#E HSOP-8E 1, pcs Yes Yes R511Sxx2 -E2-#E HSOP-18 1, pcs Yes Yes xx: Specify the set output voltage (VSET) and the set detector threshold (-VSET) by using serial numbers starting from 1. : Detector Monitoring Voltage Package Watchdog Timer Type MR / INH / WDO pins RESETB/ D OUT pins A VOUT HSOP-8E Normal RESETB B VOUT HSOP-8E Window RESETB C SENSE HSOP-18 Normal Yes DOUT D SENSE HSOP-18 Window Yes DOUT #: Quality Class # Operating Temperature Range Test Temperature AEC-Q1 A -4 C to 125 C 25 C, High Grade 1 K -4 C to 125 C Low, 25 C, High Grade 1 3

4 BLOCK DIAGRAMS R511Sxx1A / R511Sxx1B VDD CE Thermal shut down ON/OFF Circuit VOUT Internal Supply Voltage Current Limit GND VOUT CD RESETB SCK CLOCK DETECTOR WATCHDOG TIMER (R511xx1A) WINDOW WATCHDOG TIMER (R511xx1B) TW R511Sxx2C / R511Sxx2D VDD CE Thermal shut down ON/OFF Circuit VOUT Internal Supply Voltage Current Limit GND MR CD SENSE DOUT INH TW SCK CLOCK DETECTOR WATCHDOG TIMER (R511Sxx2C) WINDOW WATCHDOG TIMER (R511Sxx2D) WDO 4

5 PIN DESCRIPTION HSOP-8E HSOP-18 Top View Bottom View Top View Bottom View (1) (1) HSOP-8E (R511Sxx1A / R511Sxx1B) Pin No. Symbol Description 1 VDD Supply Voltage pin 2 CE Chip Enable pin (Active "H") 3 GND GND pin 4 CD VD Release Delay Time Set pin 5 TW WDT Monitoring Time Set pin 6 SCK WDT Pulse Input pin 7 RESETB (2) Reset Output pin (Active "L"), Nch Open Drain Output type 8 VOUT VR Output pin (1) The tab on the bottom of the package enhances thermal performance and is electrically connected to GND (substrate level). It is recommended that the tab be connected to the ground plane on the board, or otherwise be left open. (2) RESETB pin is required to pull up to a suitable voltage with an external capacitor. 5

6 HSOP-18 (R511Sxx2C / R511Sxx2D) Pin No. Symbol Description 1 VDD Supply Voltage pin 2 CE Chip Enable pin (Active "H") 3 NC No Connection 4 NC No Connection 5 GND GND pin 6 NC No Connection 7 NC No Connection 8 CD VD Release Delay Time Set pin 9 MR Manual Reset pin (Active "L") 1 TW WDT Monitoring Time Set pin 11 INH Inhibition pin (Active "L") 12 SCK WDT Pulse Input pin 13 WDO (1) WDT Output pin, Nch Open Drain Output type 14 DOUT (2) Reset Output pin (Active "L"), Nch Open Drain Output type 15 SENSE VD Voltage SENSE pin 16 NC No Connection 17 NC No Connection 18 VOUT VR Output pin (1) WDO pin is required to pull up to a suitable voltage with an external capacitor. (2) DOUT pin is required to pull up to a suitable voltage with an external capacitor. 6

7 PIN EQUIVALENT CIRCUIT DIAGRAMS <V OUT pin> <CE pin> Driver CE VOUT <C D pin> <RESETB pin(r511sxx1x) / D OUT pin(r511sxx2x)> Internal Supply Voltage RESETB/D OUT Driver C D Driver <SENSE pin (R511Sxx2x)> SENSE <MR pin (R511Sxx2x)> Internal Supply Voltage MR <SCK pin> Internal SupplyVoltage <TW pin> Internal Supply Voltage SCK TW Driver <INH pin (R511Sxx2x)> Internal Supply Voltage <WDO pin (R511Sxx2x)> WDO Driver INH 7

8 ABSOLUTE MAXIMUM RATINGS Symbol Item Rating Unit VIN Input Voltage.3 to 5 V Peak Voltage (1) 6 V VCE CE Pin Input Voltage.3 to 5 V VOUT Output Voltage.3 to VIN V VCD CD Pin Output Voltage -.3 to 7. V VTW TW Pin Output Voltage -.3 to 7. V VRESETB RESETB Pin Output Voltage -.3 to 7. V VDOUT DOUT Pin Output Voltage -.3 to 7. V VWDO WDO Pin Output Voltage -.3 to 7. V VSCK SCK Pin Input Voltage -.3 to 7. V VINH INH Pin Input Voltage -.3 to 7. V VMR MR Pin Input Voltage -.3 to 7. V VSENSE SENSE Pin Input Voltage -.3 to 7. V PD Power HSOP-8E (JEDEC STD.51-7 Test Land Pattern) 36 Dissipation (2) HSOP-18 (JEDEC STD.51-7 Test Land Pattern) 39 mw Tj Junction Temperature 4 to 15 C Tstg Storage Temperature 55 to 15 C ABSOLUTE MAXIMUM RATINGS Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause the permanent damages and may degrade the life time and safety for both device and system using the device in the field. The functional operation at or over these absolute maximum ratings are not assured. RECOMMENDED OPERATING CONDITIONS Symbol Item Rating Unit VIN Input Voltage 3.5 to 36. V VCE CE Pin Input Voltage to 36. V VSCK SCKINH Pin Input Voltage to 5.5 V VINH INH Pin Input Voltage to 5.5 V VMR MR Pin Input Voltage to 5.5 V VSENSE SENSE Pin Input Voltage to 5.5 V Ta Operating Temperature Range 4 to 125 C RECOMMENDED OPERATING CONDITONS All of electronic equipment should be designed that the mounted semiconductor devices operate within the recommended operating conditions. The semiconductor devices cannot operate normally over the recommended operating conditions, even if when they are used over such ratings by momentary electronic noise or surge. And the semiconductor devices may receive serious damage when they continue to operate over the recommended operating conditions. (1) Within application time of 2ms (2) Refer to POWER DISSIPATION for detailed information. 8

9 ELECTRICAL CHARACTERISTICS CIN = COUT =.1µF, VIN = 14V, unless otherwise noted. The specification in is checked and guaranteed by design engineering at 4 C Ta 125 C. R511Sxxxx-AE ( Ta = 25 C) Symbol Item Conditions Min. Typ. Max. Unit ISS Supply Current IOUT = ma µa Istandby IPD Power Consumption (on standby) CE Pull-downConstant Current VIN = 36V, VCE = V.2 4. µa VCE = 5V.2.6 µa VCE = 36V µa VCEH CE Input Voltage «H» V VCEL CE Input Voltage «L» 1. V VR Part ( Ta = 25 C) Symbol Item Conditions Min. Typ. Max. Unit VOUT Output Voltage IOUT = 1mA V VOUT/ IOUT Load Regulation VIN = VSET + 2.V 1mA IOUT 5mA -2 3 mv VSET = V VDIF Dropout Voltage IOUT = 5mA VSET = V VSET = V VSET = V VOUT/ VIN Line Regulation 3.5V VSET +.5V VIN 36V IOUT = 1mA.1.2 %/V ILIM Output Current Limit VIN = VSET + 3.V ma ISC Short current Limit VIN = 5V, VOUT = V ma TTSD TTSR RLOW Thermal Shutdown Temperature Thermal Shutdown Release Temperature VOUT Low Output Nch Tr.ON Resistance Junction Temperature C Junction Temperature C VCE = V, VOUT =.1V kω 9

10 CIN = COUT =.1µF, VIN = 14V, unless otherwise noted. The specification in is checked and guaranteed by design engineering at 4 C Ta 125 C. VD Part ( Ta = 25 C) Symbol Item Conditions Min. Typ. Max. Unit -VDET Detector Threshold VOUT Set Detector Threshold x.982 x1.18 V VHYS Detector Threshold Hysteresis (-VDET) x.1 (-VDET) x.2 (-VDET) x.3 V tdelay Release Output Delay Time (Power-On Reset) CD =.22µF ms VRESETB RESETB Pull-up Voltage R511Sxx1A / R511Sxx1B 5.5 V VDOUT DOUT Pull-up Voltage R511Sxx2C / R511Sxx2D 5.5 V IOUTNRSTB Nch. Output Current R511Sxx1A / R511Sxx1B (RESETB Output Pin) VIN = 3.5V, VRESETB =.1V ma ILEAKRSTB Nch. Leakage Current R511Sxx1A / R511Sxx1B (RESETB Output Pin) VRESETB = 5.5V.3 µa IOUTDOUT Nch. Output Current R511Sxx2C / R511Sxx2D (DOUT Output Pin) VIN = 3.5V, VDOUT =.1V ma ILEAKDOUT Nch. Leakage Current R511Sxx2C / R511Sxx2D (DOUT Output Pin) VDOUT = 5.5V.3 µa VMRH MR Input H V VMRL MR Input L.6 V MRW MR Input Pulse Width 2 µs RMR MR Pull-up Resistance kω RLCD CD Pin Discharge Nch Tr.ON Resistance VCE = V, VCD =.1V kω 1

11 CIN = COUT =.1µF, VIN = 14V, unless otherwise noted. The specification in is checked and guaranteed by design engineering at 4 C Ta 125 C. WDT Part ( Ta = 25 C) Symbol Item Conditions Min. Typ. Max. Unit tow Open Window Time ms tcw Closed Window Time R511Sxx1B/ R511Sxx2D CTW = 1nF ms towl Long Open Window Time ms tign Ignoring Time CTW = 1nF ms twd Monitoring Time R511Sxx1A/ R511Sxx2C CTW = 1nF ms twr Reset Time CTW = 1nF ms VSCKH SCK Input H V VSCKL SCK Input L.65 V VINHH INH Input H V VINHL INH Input L.6 V RINH INH Pull-up Resistance kω tsckwh tsckwl SCK Minimum Input Pulse Width H SCK Minimum Input Pulse Width L VSCKL =.5, VSCKH = ns VSCKL =.5, VSCKH = ns VWDO WDO Pull-up Voltage 5.5 V IOUTNWDO ILEAKWDO RLTW Nch. Output Current (WDO Output Pin) Nch. Leakage Current (WDO Output Pin) CTW Discharge Nch Tr.ON Resistance R511Sxx2C / R511Sxx2D VIN = 3.5V, VDS =.1V R511Sxx2C / R511Sxx2D VWDO = 5.5V ma.3 µa VCE = V, VCTW =.1V kω All test items listed under Electrical Characteristics are done under the pulse load condition (Tj Ta = 25 C). 11

12 Product-specific Electrical Characteristics The specification in is checked and guaranteed by design engineering at 4 C Ta 125 C. R511Sxxxx-AE Product-specific Electrical Characteristics VR Part ( Ta = 25 C) Product Name V OUT [V] V DIF [V] Min. Typ. Max. Typ. Max. R511S1xx R511S2xx R511S3xx R511S4xx R511S5xx R511S6xx R511S7xx R511S8xx R511S9xx R511S1xx R511S11xx R511S12xx R511S13xx VD Part ( Ta = 25 C) Product Name -V DET [V] V HYS [V] Min. Typ. Max. Min. Typ. Max. R511S1xx R511S2xx R511S3xx R511S4xx R511S5xx R511S6xx R511S7xx R511S8xx R511S9xx R511S1xx R511S11xx R511S12xx R511S13xx

13 CIN = COUT =.1µF, VIN = 14V, unless otherwise noted. R511Sxxxx-KE ( 4 C Ta 125 C) Symbol Item Conditions Min. Typ. Max. Unit ISS Supply Current IOUT = ma µa Istandby IPD Power Consumption (on standby) CE Pull-down Constant Current VIN = 36V,VCE = V.2 4. µa VCE = 5V.2.6 µa VCE = 36V µa VCEH CE Input Voltage «H» V VCEL CE Input Voltage «L» 1. V VR Part ( 4 C Ta 125 C) Symbol Item Conditions Min. Typ. Max. Unit VOUT Output Voltage IOUT =1mA V VOUT/ IOUT Load Regulation VIN = VSET + 2.V 1mA IOUT 5mA -2 3 mv VSET = V VDIF Dropout Voltage IOUT = 5mA VSET = V VSET = V VSET = V VOUT/ VIN Line Regulation 3.5V VSET +.5V VIN 36V IOUT = 1mA.1.2 %/V ILIM Output Current Limit VIN = VSET + 3.V ma ISC Short current Limit VIN = 5V, VOUT = V ma TTSD TTSR RLOW Thermal Shutdown Temperature Thermal Shutdown Release Temperature VOUT Low Output Nch Tr.ON Resistance Junction Temperature C Junction Temperature C VCE = V, VOUT =.1V kω 13

14 CIN = COUT =.1µF, VIN = 14V, unless otherwise noted. VD Part ( 4 C Ta 125 C) Symbol Item Conditions Min. Typ. Max. Unit -VDET Detector Threshold VOUT Set Detector Threshold x.982 x1.18 V VHYS Detector Threshold (-VDET) (-VDET) (-VDET) Hysteresis x.1 x.2 x.3 V tdelay Release Output Delay Time (Power-On Reset) CD =.22µF ms VRESETB RESETB Pull-up Voltage R511Sxx1A / R511Sxx1B 5.5 V VDOUT DOUT Pull-up Voltage R511Sxx2C / R511Sxx2D 5.5 V IOUTNRSTB Output Current R511Sxx1A / R511Sxx1B (RESETB Output Pin) Nch, VDD = 3.5V, VDS =.1V ma ILEAKRSTB Nch Leakage Current R511Sxx1A / R511Sxx1B (RESETB Output Pin) VRESETB = 5.5V.3 µa IOUTDOUT Output Current R511Sxx2C / R511Sxx2D (DOUT Output Pin) Nch, VDD = 3.5V, VDS =.1V ma ILEAKDOUT Nch Leakage Current R511Sxx2C / R511Sxx2D (DOUT Output Pin) VDOUT = 5.5V.3 µa VMRH MR Input H V VMRL MR Input L.6 V MRW MR Input Pulse Width 2 µs RMR MR Pull-up Resistance kω RLCD CD Pin Discharge VCE = V, VCD =.1V Nch Tr.ON Resistance kω 14

15 CIN = COUT =.1µF, VIN = 14V, unless otherwise noted. WDT Part ( 4 C Ta 125 C) Symbol Item Conditions Min. Typ. Max. Unit tow Open Window Time ms tcw Closed Window Time R511Sxx1B/ R511Sxx2D CTW = 1nF ms towl Long Open Window Time ms tign Ignoring Time CTW = 1nF ms twd Monitoring Time R511Sxx1A/ R511Sxx2C CTW = 1nF ms twr Reset Time CTW = 1nF ms VSCKH SCK Input H V VSCKL SCK Input L.65 V VINHH INH Input H V VINHL INH Input L.6 V RINH INH Pull-up Resistance kω tsckwh SCK Minimum Input Pulse VSCKL =.5, VSCKH =1.6 Width H 5 ns tsckwl SCK Minimum Input Pulse VSCKL =.5, VSCKH =1.6 Width L 15 ns VWDO WDO Pull-up Voltage 5.5 V IOUTNWDO Output Current R511Sxx2C / R511Sxx2D (WDO Output Pin) VDD = 3.5V, VDS =.1V ma ILEAKWDO Nch Leakage Current R511Sxx2C / R511Sxx2D (WDO Output Pin) VWDO = 5.5V.3 µa RLTW CTW Discharge Nch Tr.ON Resistance VCE = V, VCTW =.1V kω 15

16 Product-specific Electrical Characteristics R511Sxxxx-KE Product-specific Electrical Characteristics VR Part ( 4 C Ta 125 C) Product Name V OUT [V] V DIF [V] Min. Typ. Max. Typ. Max. R511S1xx R511S2xx R511S3xx R511S4xx R511S5xx R511S6xx R511S7xx R511S8xx R511S9xx R511S1xx R511S11xx R511S12xx R511S13xx VD Part ( 4 C Ta 125 C) Product Name -V DET [V] V HYS [V] Min. Typ. Max. Min. Typ. Max. R511S1xx R511S2xx R511S3xx R511S4xx R511S5xx R511S6xx R511S7xx R511S8xx R511S9xx R511S1xx R511S11xx R511S12xx R511S1xx

17 OPERATION DESCRIPTION Timing Chart R511Sxx1A / R511Sxx1B Voltage Detector V IN V DDL +V DET V OUT -V DET V TCD tdelay (2) tdelay V CD V RESETB Undefined (1) (3) (4) (3) R511Sxx1A / R511Sxx1B VD Timing Chart Undefined (1) When the VOUT pin voltage (VOUT) becomes more than the release voltage (+VDET), the RESETB pin voltage (VRESETB) becomes H after the release output delay time (tdelay). (2) When the detect output delay time is less than 3 µs (Typ.) even if VOUT becomes lower than the detector threshold (-VDET), the voltage detector (VD) does not go into the detecting state. (3) When VOUT becomes lower than VDET, VRESETB becomes L after the detect output delay time (Typ.3µs) and the VD goes into the detecting state. (4) When VOUT becomes more than +VDET. VRESETB becomes H after the release output delay time. (VTCD = Typ.1V) 17

18 R511Sxx2C / R511Sxx2D Voltage Detector V IN V DDL +V DET V SENSE -V DET (2) V MR V CD V TCD tdelay tdelay tdelay V DOUT Undefined (1) (3) (4) (5) (6) (3) Undefined R511Sxx2C / R511Sxx2D VD Timing Chart (1) When the SENSE pin voltage (VSENSE) becomes more than the release voltage (+VDET), the DOUT pin voltage (VDOUT) becomes H after the release output delay time (tdelay). (2) When the detect output delay time is 3µs (Typ.) or less even if VSENSE becomes lower than the detector threshold (-VDET), the voltage detector (VD) does not go into the detecting state. (3) When VSENSE becomes lower than VDET, VDOUT becomes L after the detect output delay time (Typ. 3µs) and the VD goes into the detecting state. (4) When VSENSE becomes more than +VDET, VDOUT becomes H after the release output delay time. (VTCD = Typ.1V) (5) When the MR pin voltage (VMR) becomes L, VDOUT is fixed to L. (6) When VMR becomes L to H, VDOUT becomes H after the release output delay time. 18

19 R511Sxx1A Watchdog Timer (Normal Type) V IN V DDL +V DET V OUT -V DET V RESETB V TW Undefined tdelay TWVREFH t IGN t WD t WR t IGN <t WD t WD t WR t IGN Undefined TWVREFL IGN WD RST IGN WD WD RST IGN WD (1) (3) (4) (5) V SCK (2) (6) R511Sxx1A WDT Timing Chart (1) When the VOUT pin voltage (VOUT) becomes more than the release voltage (+VDET), the RESETB pin voltage (VRESETB) becomes H after the release output delay time (tdelay) and the watchdog timer (WDT) starts monitoring a pulse. After that, the TW pin voltage (VTW) repeats charge and discharge. As a result, a sawtooth wave is generated. The WDT has three states: Ignoring, Reset, and Monitoring. In each state, the TW pin is charged from V or TWFREFL (Typ..8V). (2) After the WDT starts, the WDT is in an ignoring state until VTW is charged up to TWVREFH (Typ.2V). So, a pulse to the SCK pin is ignored during the ignoring state. (3) When charging VTW up to TWVREFH has completed, the TW pin starts discharging and the WDT goes into a monitoring state. (4) When a pulse is not sent to the SCK pin before VTW reaches TWVREFH during the monitoring state, the TW pin starts discharging and the WDT goes into a reset state. During the reset state, VRESETB becomes L. (5) When VTW is charged up to TWVREFH during the reset state, the TW pin starts discharging and the WDT goes into the ignoring state. (6) When a pulse is sent to the SCK pin before VTW reaches TWVREFH during the monitoring state, the TW pin start discharging and the WDT goes into the next open window state. 19

20 R511Sxx1B Watchdog Timer (Window Type) V IN V DDL +V DET V OUT -V DET V RESETB V TW Undefined tdelay TWVREFH t IGN <t OWL <t CW t WR t IGN <t OWL t CW t OW t WR t IGN Undefined TWVREFL IGN LOW CW RST IGN LOW CW OW RST IGN LOW (1) (3) (6) (7) (8) V SCK (2) (4) (5) R511Sxx1B WDT Timing Chart (1) When the VOUT pin voltage (VOUT) becomes more than the release voltage (+VDET), the RESETB pin voltage (VRESETB) becomes H after the release output delay time (tdelaly) and the watchdog timer (WDT) starts monitoring a pulse. After that, the TW pin voltage (VTW) repeats charge and discharge. As a result, a sawtooth wave is generated. The WDT has four states: Ignoring, Reset, Open Window, and Closed Window. In each state, the TW pin is charged from V or TWVREFL (Typ..8V). (2) After WDT starts, the WDT is in an ignoring state until VTW is charged up to TWVREFH (Typ.2V). So, a pulse to the SCK pin is ignored during the ignoring state. (3) When VTW is charged up to TWVREFH during the ignoring state, the TW pin starts discharging and the WDT goes into an open window state. This open window state is four times longer than the normal open window state. (4) When a pulse is sent to the SCK pin before VTW reaches TWVREFH during the open window state, the TW pin starts discharging and the WDT goes into a closed window state. (5) When a pulse is sent to the SCK pin before VTW reaches TWVREF during the closed window state, the TW pin starts discharging and the WDT goes into a reset state. During the reset state, VRESETB becomes L. 2

21 (6) When VTW reaches TWVREFH during the reset state, the TW pin starts discharging and the WDT goes into the ignoring state. (7) When a pulse is not sent to the SCK pin before VTW reaches TWVREFH during the closed window state, the TW pin starts discharging and the WDT goes into the open window state. (8) When a pulse is not sent to the SCK pin before VTW reaches TWVREFH during the open window state, the TW pin starts discharging and the WDT goes into the reset state. R511Sxx2C Watchdog Timer (Normal Type) V IN V DDL +V DET V SENSE -V DET V INH V DOUT Undefined Undefined V WDO Undefined Undefined V TW TWVREFH tdelay t IGN t WD t WR t IGN <t WD t WD t IGN TWVREFL IGN WD RST IGN WD WD RST IGN WD (1) (3) (4) (5) (7) (8) V SCK (2) (6) R511Sxx2C WDT Timing Chart 21

22 (1) When the SENSE pin voltage (VSENSE) becomes more than the release voltage (+VDET), the DOUT pin voltage (VDOUT) becomes H after the release output delay time (tdelay) and the watchdog timer (WDT) starts monitoring a pulse. After that, the TW pin voltage (VTW) repeats charge and discharge. As a result, a sawtooth wave is generated. The WDT has three states: Ignoring, Reset, and Monitoring. In each state, the TW pin is charged from V or TWVREFL (Typ..8V). (2) After the WDT starts, the WDT is in an ignoring state until VTW is charged up to TWVREFH. So, a pulse to the SCK pin is ignored during the ignoring state. (3) When VTW is charged up to TWVREFH during the ignoring state, the TW pin starts discharging and the WDT goes into a monitoring state. (4) When a pulse is not sent to the SCK pin before VTW reaches TWVREFH during the monitoring state, the TW pin starts discharging and the WDT goes into a reset state. During the reset state, the WDO pin voltage (VWDO) becomes L. (5) When VTW reaches TWVREFH during the reset state, the TW pin starts discharging and the WDT goes into an ignoring state. (6) When a pulse is sent to the SCK pin before VTW reaches TWVREFH during the monitoring, the TW pin starts discharging and the WDT goes into the next monitoring state. (7) The WDT stops monitoring by setting the INH pin voltage (VINH) to L. Then, VWDO is fixed to H and VTW is fixed to L. (8) When changed VINH from L to H, the WDT goes into the ignoring state and restarts monitoring. 22

23 R511Sxx2D Watchdog Timer (Window Type) V IN V DDL +V DET V SENSE -V DET V INH V DOUT Undefined Undefined V WDO TWVREFH Undefined tdelay t IGN <t OWL <t CW t WR t IGN <t OWL t CW t OW t IGN Undefined V TW TWVREFL IGN LOW CW RST IGN LOW CW OW RST IGN LOW (1) (3) (6) (7) (8)(9) (1) V SCK (2) (4) (5) R511Sxx2D WDT Timing Chart 23

24 (1) When the SENSE pin voltage (VSENSE) becomes more than the release voltage (+VDET), the DOUT pin voltage (VDOUT) becomes H after the release output delay time (tdelay) and the watchdog timer (WDT) starts monitoring a pulse. After that, the TW pin voltage (VTW) repeats charge and discharge. As a result, a sawtooth wave is generated. The WDT has four states: Ignoring, Reset, Open Window, and Closed Window. In each state, the TW pin is charged from V or TWVREFL (Typ..8V). (2) After WDT starts, the WDT is in an ignoring state until VTW is charged up to TWVREFH. So, a pulse to the SCK pin is ignored during the ignoring state. (3) When VTW is charged up to TWVREFH during the ignoring state, the TW pin starts discharging and the WDT goes into an open window state. This open window state is four times longer than the normal open window state. (4) When a pulse is sent to the SCK pin before VTW reaches TWVREFH during the open window state, the TW pin starts discharging and the WDT goes into a closed window state. (5) When a pulse is sent to the SCK pin before VTW reaches TWVREFH during the close window state, the TW pin starts discharging and the WDT goes into a reset state. During the reset state, VDOUT becomes L. (6) When VTW reaches TWVREFH during the reset state, the TW pin starts discharging and the WDT goes into an ignoring state. (7) When a pulse is not sent to the SCK pin before VTW reaches TWVREFH during a closed window state, the TW pin starts discharging and the WDT goes into an open window state. (8) When a pulse is not sent to the SCK pin before VTW reaches TWVREFH during the open window state, the TW pin starts discharging and the WDT goes into a reset state. (9) The WDT stops monitoring by setting the INH pin voltage (VINH) to L. Then, VWDO is fixed to H and VTW is fixed to L. (1) When changed VINH from L to H. the WDT goes into the ignoring state and restarts monitoring. 24

25 Delay Operation and Released Output Delay Time (tdelay) V OUT / SENSE Pin Released Voltage (+V DET ) Detector Voltage (-V DET ) C D Pin Voltage C D Pin Threshold Voltage (V TCD ) GND RESETB / D OUT Pin Release Output Delay Time (tdelay) GND Detect Output Delay Time (t PHL ) Released Output Delay Timing Diagram When the operating voltage higher than the released voltage is applied to VOUT pin (R511Sxx1A/R511Sxx1B) or SENSE pin (R511Sxx2C/R511Sxx2D), charge to an external capacitor starts, then CD pin voltage (VCD) increases. RESETB pin (R511Sxx1A/R511Sxx1B) or DOUT pin (R511Sxx2C/R511Sxx2D) maintains the released output until VCD reaches the threshold voltage of the release output delay pin (VTCD). And when VCD is over VTCD, RESETB pin or DOUT pin is inverted from L to H. That is, the charged external capacitor starts discharging. When the operating voltage lower than the detector threshold is applied to VDD pin, the detect output delay time, which is the time until the output voltage is inverted from H to L, remains constant independent of the external capacitor. V OUT / SENSE -V DET +2.V RESETB / D OUT 1.5V GND 5.V 2.5V GND t PHL Released Output Delay Time tdelay Released Output Delay Time (tdelay) indicates the time between the instance when VOUT pin (R511Sxx1A / R511Sxx1B) or SENSE pin (R511Sxx2C / R511Sxx2D) shifts from 1.5 V to VDET + 2. V by the application of a pulse voltage and the instance when the output voltage reaches 2.5 V after pulled up RESETB pin (R511Sxx1A / R511Sxx1B) or DOUT pin (R511Sxx2C/ R511Sxx2D) to 5. V with a resistor of 1 kω. This is given by the expression tdelay (s) = 1.1 CD (F) / ( ), where CD (F) represents capacitance of the external capacitor. If VOUT / SENSE pin goes up at a mild pace of.1v/s or less, connect a capacitor of 1 pf or more to CD pin. 25

26 WDT State Transition Diagram Input Clock Time Out (1)R511SxxxA/C V OUT <Detector Threshold(R511Sxx1A) SENSE<Detector hreshold(r511sxx2c) or INH=Low(R511Sxx2C) V OUT >Released Output Voltage(R511Sxx1A) SENSE>Released Output Voltage(R511Sxx2C) and INH=High or OPEN(R511Sxx2C) (2)R511SxxxB/D V OUT <Detector Threshold(R511Sxx1B) SENSE<Detector Threshold(R511Sxx2D) or INH=Low(R511Sxx2D) V OUT >Released Output Voltage(R511Sxx1B) SENSE>Released Output Voltage(R511Sxx2D) and INH=High or OPEN(R511Sxx2D) Ignoring Ignoring Monitoring Long Open Window Reset Open Window Closed Window Reset Time Setting for Watchdog Timer The following time of WDT is dependent on a capacitor connecting to the TW pin. Relationship between the value of capacitor and time can be expressed by the following equations. TOW (s) = 1.8 x C(F) / (1. x 1-6 ) tcw (s) = 1.8 x C(F) / (1. x 1-6 ) towl (s) = 1.8 x C(F) / (.25 x 1-6 ) tign (s) = 1.8 x C(F) / (1. x 1-6 ) twd (s) = 1.8 x C(F) / (1. x 1-6 ) twr (s) = 1.9 x C(F) / (2. x 1-6 ) 26

27 Inrush Current Prevention at Rising Characteristics R511S has the inrush current preventing circuit to control the inrush current within about 4mA limited. This circuit works during the rising periods. Therefore, the load current must be increased after rising up the output voltage (at typ.1µs after being out of the inrush current limited condition) by the sequence control. When the load current is increased during the rising periods, the inrush current must be controlled within 25mA. VSET VOUT 4mA (TYP) 1us (TYP) IOUT IRUSH IOUT<25mA 25mA<IOUT Likewise, on the thermal shutdown and the foldback characteristic, the inrush current preventing circuit works when the output voltage re-rises after the output voltage fall down to a guideline (VSET x.4) or less. VOUT VSET.4 IOUT 27

28 Standby Function When CE turns to low, the R511S goes into the standby mode. During this mode, the voltage regulator (VR) stops the output, the watchdog timer (WDT) stops the pulse monitoring, and the voltage detector (VD) stops the voltage monitoring. Even if VIN < 3.5 V (Minimum Operating Voltage VMOV), VR stops the output, WDT stops the pulse monitoring, and VD stops the voltage monitoring. When CE = low or VIN < 3.5 V (Minimum Operating Voltage), the output of WDT and VD become as follows regardless of SENSE voltage. R511Sxx1A/ R511Sxx1B: The RESETB output is fixed to L. R511Sxx2C/ R511Sxx2D: The DOUT is fixed to L, and WDO output is fixed to the pull-up voltage. When VIN is under 1.52 V, values of RESETB output (R511Sxx1A/ R511Sxx1B) and DOUT output (R511Sxx2C/ R511Sxx2D) become indefinite,.1 V or more (pull-up voltage 5 V, pull-up resistance 1 kω). CE standby V OUT (or SENSE) > -V DET V OUT (or SENSE) > -V DET at V MOV CE V IN V DIF Voltage Voltage WDO RESETB (DOUT) Voltage Voltage V OUT WDO RESETB (D OUT ) V MOV Max. 1.52V undefined Voltage Setting (R511Sxx1A / R511Sxx1B) VD detects the drop of the VR output voltage (VOUT). When the VD release voltage (+VDET) is set to a voltage above the VR output voltage, the reset signal of VD is not released even if VD monitors the VR output voltage returns to the normal value after detecting the drop of VR. To prevent this issue, the following condition is required between VOUT and +VDET. (VR Set Output Voltage) x.985 3mV > (VD Set Detector Threshold) x 1.18 x 1.3 When using a device with the above conditions of VOUT and +VDET, careful consideration must be given to the system operation before use. 28

29 Manual Reset (MR) Function (R511Sxx2C, R511Sxx2D) Setting the MR pin to L forcefully sets DOUT to L. The maximum value of the delay time (tmr), which is until DOUT outputs L, is 1µs as an index of the performance. The MR pin is pulled-up by an internal resistor (Typ.11kΩ). Current is passed to the MR pin when the voltage of MR > VDD. But, this current has no effect to the operation because the current is limited with a pull-up resistor. When setting the MR pin from L to H, DOUT is changed from L to H after the released output delay time and the WDT starts from the ignoring state. When the MR pin is L, the WDO pin outputs H. SENSE Function (R511Sxx2C, R511Sxx2D) The internal voltage detector monitors the input voltage to the SENSE pin. To measure the proper detector threshold, setting of VIN 3.5V is required. Inhibition (INH) Function (R511Sxx2C, R511Sxx2D) Setting the INH pin to L stops the WDT pulse monitoring function and the WDO pin is fixed to H. The INH pin is pulled up with an internal resistor (Typ.11kΩ). 29

30 APPLICATION INFORMATION Typical Application Circuits VIN Microprocessor VDD VOUT VCC C1 CE Control R511Sxx1A/B CE RESETB GND C2 R1 RESET C D C D SCK I/O TW C TW R511Sxx1A/B Typical Application VIN Microprocessor VDD VOUT VCC C1 CE Control R511Sxx2C/D CE SENSE GND DOUT C2 R1 RESET WDO C D C D SCK I/O INH MR TW C TW R511Sxx2C/D Typical Application 3

31 External Components Symbol C1 (CIN) C2 (COUT) CTW CD R1.1µF, Ceramic Capacitor.1µF, Ceramic Capacitor Description A capacitor corresponding to time setting for Watchdog Timer is required. Refer to Time Setting for WDT in Operation Description for details. A capacitor corresponding to setting for Release Output Delay Time is required. Refer to Delay Operation and Release Output Delay Time (tdelay) in Operation Description for details. A resistor is required to set with consideration of the output current and the leakage current. Refer to Electrical Characteristic for details. TECHNICAL NOTES Phase Compensation In the Ics, phase compensation is made for securing stable operation even if the load current is varied. For this purpose, use a capacitor C2 with.1 µf or more. If a tantalum capacitor is used, and its ESR (Equivalent Series Resistance) of C2 is large, the loop oscillation may result. Because of this, select C2 carefully considering its frequency characteristics. PCB Layout Make VDD and GND lines sufficient. If their impedance is too high, noise pickup or unstable operation may result. Connect.1 µf or more of the capacitor C1 between the VDD and GND, and as close as possible to the pins. In addition, connect the capacitor C2 between VOUT and GND, and as close as possible to the pins. 31

32 Prohibited Area for Fluctuations in Input Voltage Please take note that miss-detection or miss-release might be invited when changing an input voltage abruptly in the following prohibited area. 15. Input Voltage peak Vp-p (V) Prohibited Area V IN Vp-p tf Input Voltage Falling Time tf (μs) GND Prohibited Area of Fluctuation at Falling of V IN 15 Prohibited Area Input Voltage peak Vp-p (V) 1 5 V IN tr Vp-p Input Voltage Rising Time tr (μs) GND Prohibited Area of Fluctuation at Rising of V IN 32

33 Typical Application for IC Chip Breakdown Prevention VIN Microprocessor C1 CE Control VDD VOUT R511Sxx1A/B CE GND RESETB C2 D1 R1 VCC RESET CD CD SCK I/O TW CTW C1 = Ceramic.1μF C2 = Ceramic.1μF R511Sxxxx Typical Application When a sudden surge of electrical current travels along the VOUT pin and GND due to a short-circuit, electrical resonance of a circuit involving an output capacitor (C2) and a short circuit inductor generates a negative voltage and may damage the device or the load devices. Connecting a schottky diode (D1) between the VOUT pin and GND has the effect of preventing damage to them. 33

34 TYPICAL CHARACTERISTICS Note: Typical Characteristics are intended to be used as reference data; they are not guaranteed. 1) Power Consumption vs. Input Voltage (Ta = 25 C) VR=1.8V VR=3.3V Supply Current IIN (μa) Input Voltage V IN (V) Supply Current IIN (μa) Input Voltage V IN (V) Supply Current IIN (μa) VR=5.V Input Voltage V IN (V) 2) CE Pin Current vs. CE Pin Voltage (Ta = 25 C, V IN=14V) VR=5.V CE Crrent ICE (μa) CE Input Voltage V CE (V) 34

35 3) GND Pin Current vs. Output Current (Ta = 25 C) I GND (μa) Output Current I OUT (ma) 4) Output Voltage vs. Output Current (Ta = 25 C) VR=1.8V VR=3.3V Output Voltage VOUT (V) VIN=3.5V VIN=4.8V Output Current I OUT (ma) Output Voltage VOUT (V) VIN=3.8V VIN=4.3V VIN=6.3V Output Current I OUT (ma) VR=5.V Output Voltage VOUT (V) VIN=5.5V VIN=6.V VIN=8.V Output Current I OUT (ma) 35

36 5) Output Voltage vs. Input Voltage (Ta = 25 C) VR=1.8V VR=3.3V Output Voltage VOUT (V) Iout=1mA Iout=3mA Iout=15mA Output Voltage VOUT (V) Iout=1mA Iout=3mA Iout=15mA Input Voltage V IN (V) Input Voltage V IN (V) VR=5.V Output Voltage VOUT (V) Iout=1mA Iout=3mA Iout=15mA Input Voltage V IN (V) 6) Output Voltage vs. Temperature (V IN=14V, I OUT=1mA) VR=1.8V VR=3.3V Output Voltage V OUT (V) Output Voltage V OUT (V) Ta ( ) Ta ( ) 36

37 VR=5.V 5.1 Output Voltage V OUT (V) Ta ( ) 7) Dropout Voltage vs. Output Current Dropout Voltage VDIF (mv) VR=1.8V C 6 25 C C 2 (VIN=3.5V) Output Current I OUT (ma) Dropout Voltage VDIF (mv) VR=3.3V C 8 25 C C 6 (VIN=3.5V) Output Current I OUT (ma) VR=5.V Dropout Voltage VDIF (mv) C 25 C 125 C Output Current I OUT (ma) 37

38 8) Dropout Voltage vs. Output Voltage (Ta=25 ) Dropout Voltage VDIF (mv) IOUT=1mA IOUT=1mA IOUT=1mA IOUT=5mA (VIN=3.5V) Output Voltage V OUT (V) 9) Ripple Rejection vs. Input Voltage (Ta=25, Ripple =.2 Vpp) VR=1.8V, I OUT=1mA VR=1.8V, I OUT=3mA Ripple Rejection RR (db) Hz 1kHz 1kHz 1kHz I OUT = 1mA Ripple Rejection RR (db) Hz 1kHz 1kHz 1kHz I OUT = 3mA Input Voltage VIN (V) Input Voltage VIN (V) VR=3.3V, I OUT=1mA VR=3.3V, I OUT=3mA Ripple Rejection RR (db) Hz 1kHz 1kHz 1kHz I OUT = 1mA Ripple Rejection RR (db) Hz 1kHz 1kHz 1kHz I OUT = 3mA Input Voltage VIN (V) Input Voltage VIN (V) 38

39 VR=5.V, I OUT=1mA VR=5.V, I OUT=3mA Ripple Rejection RR (db) Hz 1kHz 1kHz 1kHz I OUT = 1mA Ripple Rejection RR (db) Hz 1kHz 1kHz 1kHz I OUT = 3mA Input Voltage VIN (V) Input Voltage VIN (V) 1) Ripple Rejection vs. Frequency (Ta=25, Ripple=.2 Vpp) VR=1.8V VR=3.3V 1 9 V IN = 4.V 1 9 V IN = 5.3V 8 8 Ripple Rejection RR(dB) IOUT=1mA IOUT=3mA IOUT=15mA Ripple Rejection RR(dB) IOUT=1mA IOUT=3mA IOUT=15mA Frequency [khz] Frequency [khz] VR=5.V 1 9 V IN = 7.V Ripple Rejection RR(dB) IOUT=1mA IOUT=3mA IOUT=15mA Frequency [khz] 39

40 11) Input Transient Respon (Ta=25 C) VR=1.8V, I OUT=3mA, C OUT=.1μF VR=1.8V, I OUT=3mA, C OUT=1μF C OUT =.1μF 5. C OUT = 1μF 5. Output Voltage VOUT (V) Input Voltage 3.5 <=> 4.5V (tr=tf=5usec) Outut Voltage Input Voltage VIN (V) Output Voltage VOUT (V) Input Voltage 3.5 <=> 4.5V (tr=tf=5usec) Outut Voltage Input Voltage VIN (V) Time (μs) Time (μs) VR=3.3V, I OUT=3mA, C OUT=.1μF VR=3.3V, I OUT=3mA, C OUT=1μF C OUT =.1μF 5.8 C OUT = 1μF 5.8 Output Voltage VOUT (V) Input Voltage 4.3 <=> 5.3V (tr=tf=5usec) Outut Voltage Input Voltage VIN (V) Output Voltage VOUT (V) Input Voltage 4.3 <=> 5.3V (tr=tf=5usec) Outut Voltage Input Voltage VIN (V) Time (μs) Time (μs) VR=5.V, I OUT=3mA, C OUT=.1μF VR=5.V, I OUT=3mA, C OUT=1μF C OUT =.1μF 7.5 C OUT = 1μF 7.5 Output Voltage VOUT (V) Input Voltage 6. <=> 7.V (tr=tf=5usec) Outut Voltage Input Voltage VIN (V) Output Voltage VOUT (V) Input Voltage 6. <=> 7.V (tr=tf=5usec) Outut Voltage Input Voltage VIN (V) Time (μs) Time (μs) 4

41 12) Load Transient Response (Ta=25 C) VR=1.8V, C OUT=.1μF VR=1.8V, C OUT=1μF Output Current IOUT (ma) 3 15 Output Current 1mA <=>15mA (tr=tf=.5usec) Output Voltage VOUT (V) Output Current IOUT (ma) 3 15 Output Current 1mA <=>15mA (tr=tf=.5usec) Output Voltage VOUT (V) Output Voltage.8 Output Voltage Time (μs) Time (ms) VR=3.3V, C OUT=.1μF VR=3.3V, C OUT=1μF 3 15 Output Current 1mA <=>15mA (tr=tf=.5usec) 3 15 Output Current 1mA <=>15mA (tr=tf=.5usec) Output Current IOUT (ma) Output Voltage VOUT (V) Output Current IOUT (ma) Output Voltage VOUT (V) Output Voltage 2.3 Output Voltage Time (μs) Time (ms) VR=5.V, C OUT=.1μF VR=5.V, C OUT=1μF 3 15 Output Current 1mA <=>15mA (tr=tf=.5usec) 3 15 Output Current 1mA <=>15mA (tr=tf=.5usec) Output Current IOUT (ma) Output Voltage VOUT (V) Output Current IOUT (ma) Output Voltage VOUT (V) Output Voltage 4. Output Voltage Time (μs) Time (ms) 41

42 13) CE Transient Response (Ta=25, V IN=14V, I OUT=1mA, C OUT=.1μ~47μF) VR=1.8V, CE at rising VR=1.8V, CE at falling CE Input Voltage VCE (V) Output Voltage VOUT (V) Output Voltage Inrush Crurent Time (ms) CE Input Voltage VCE.1uF 1.uF 4.7uF 1uF 47uF Inrush Current (ma) CE Input Voltage V CE (V) Output Voltage V OUT (V) CE Input Voltage Output Voltage Time (ms) VCE.1uF 1.uF 4.7uF 1uF 47uF VR=3.3V, CE at rising VR=3.3V, CE at falling CE Input Voltage V CE (V) Output Voltage V OUT (V) Output Voltage CE Input Voltage VCE.1uF 1.uF 4.7uF 1uF 47uF Inrush Current (ma) CE Input Voltage V CE (V) Output Voltage V OUT (V) CE Input Voltage Output Voltage VCE.1uF 1.uF 4.7uF 1uF 47uF Inrush Crurent Time (ms) Time (ms) VR=5.V, CE at rising VR=5.V, CE at falling CE Input Voltage V CE (V) Output Voltage V OUT (V) Output Voltage CE Input Voltage VCE.1uF 1.uF 4.7uF 1uF 47uF Inrush Current (ma) CE Input Voltage V CE (V) Output Voltage V OUT (V) CE Input Voltage Output Voltage VCE.1uF 1.uF 4.7uF 1uF 47uF Inrush Crurent Time (ms) Time (ms) 42

43 14) Detector Threshold vs. Temperature VD=1.6V VD=3.V Detector Threshold V DET (V) Detector Threshold V DET (V) Ta ( ) Ta ( ) VD=4.6V Detector Threshold V DET (V) Ta ( ) 15) D OUT Pin Voltage vs. SENSE Pin Input Voltage (D OUT pulled-up to 5V with 1kΩ) VD=1.6V VD=3.V Output Voltage DOUT (V) Output Voltage D OUT (V) Input Voltage V SENSE (V) Input Voltage V SENSE (V) 43

44 VD=4.6V 6 5 Output Voltage D OUT (V) Input Voltage V SENSE (V) 16) Release Output Delay Time vs. Input Voltage 17) Release Output Delay Time vs. Temperature Output Delay Time for Release t PLH (ms) C D =.22μF Output Delay Time for Reset tdelay (ms) 26 C D =.22μF Input Voltage V IN (V) Ta ( ) 17) Detect Output Delay Time vs. Temperature 19) Release Output Delay Time External Capacitor and Detect Delay Time vs. for C D Pin 6 1 Output Delay Time for Release tdelay (μs) Output Delay Time for Release [tdelay (ms)] Output Delay Time for Reset [tdelay (ms)] 1 1 tdelay 1 t PHL Ta ( ) External Capacitance C D (nf) 44

45 2) WDT t WD / t OW / t CW / t IGN vs. Input Voltage Monitoring Time t WD / Open Window Time t OW / Closed Window Time t CW / Ignore Time t IGN (ms) t WD / t OW / t CW / t IGN C TW = 1nF Input Voltage V IN (V) 21) Reset Time vs. Input Voltage 22) Long Open Window Time vs. Input Voltage Reset Time twr (ms) C TW = 1nF Input Voltage V IN (V) Long Term Open Window Time towl (ms) R511SxxxB/D C TW = 1nF Input Voltage V IN (V) 23) WDT t WD / t OW / t CW / t IGN vs. Temperature Monitoring Time twd / Open Window Time tow / Closed Window Time t CW / Ignore Time tign (ms) 2 C TW = 1nF 19 t WD / t OW / t CW / t IGN Ta ( ) 45

46 24) Reset Time vs. Temperature 25) Long Open Window Time vs. Temperature Reset Time twr (ms) 1.4 C 1.2 TW = 1nF Ta ( ) Long Term Open Window Time t OWL (ms) R511SxxxB/D 82 C TW = 1nF Ta ( ) 26) WDT t WD / t OW / t CW / t IGN /t OWL / t RST Vs. External Capacitor for C TW Pin 1 1 t OWL Window Time (ms) t WD / t OW / t CW / t IGN t RST External Capacitance C TW (nf) 27) Nch. Driver Output Current vs. V DS 28) Nch. Driver Output Current vs. Input Voltage 46

47 ESR vs. Output Current The IC is recommended to use a ceramic type capacitor, but the IC can be used other capacitors of the lower ESR type. The relation between the output current (IOUT) and the ESR of output capacitor is shown below. C1 V DD V OUT CE R511x GND C2 I OUT ESR C1 = Ceramic.1 μf, C2 = Ceramic.1 μf Measurement conditions: Frequency Band: 1 Hz to 2 MHz Measurement Temperature: 4 C to 125 C Hatched area: Noise level is 4 μv (average) or below Ceramic Capacitor: C1 = C2 = Ceramic.1 μf VR = 1.8V, 3.3V VR = 5.V 47

48 POWER DISSIPATION HSOP-8E Ver. B The power dissipation of the package is dependent on PCB material, layout, and environmental conditions. The following measurement conditions are based on JEDEC STD Measurement Conditions Item Environment Board Material Board Dimensions Copper Ratio Through-holes Measurement Conditions Mounting on Board (Wind Velocity = m/s) Glass Cloth Epoxy Plastic (Four-Layer Board) 76.2 mm mm.8 mm Outer Layer (First Layer): Less than 95% of 5 mm Square Inner Layers (Second and Third Layers): Approx. 1% of 5 mm Square Outer Layer (Fourth Layer): Approx. 1% of 5 mm Square φ.3 mm 21 pcs Measurement Result Item Power Dissipation Thermal Resistance (θja) Thermal Characterization Parameter (ψjt) θja: Junction-to-Ambient Thermal Resistance ψjt: Junction-to-Top Thermal Characterization Parameter (Ta = 25 C, Tjmax = 15 C) Measurement Result 36 mw θja = 34.5 C/W ψjt = 1 C/W Power Dissipation (mw) Ambient Temperature ( C) Power Dissipation vs. Ambient Temperature Measurement Board Pattern i

49 PACKAGE DIMENSIONS HSOP-8E HSOP-8E Package Dimensions The tab on the bottom of the package shown by blue circle is substrate potential (GND/VDD). It is recommended that this tab be connected to the ground plane/vdd pin on the board but it is possible to leave the tab floating. i

50 POWER DISSIPATION HSOP-18 Ver. B The power dissipation of the package is dependent on PCB material, layout, and environmental conditions. The following measurement conditions are based on JEDEC STD Measurement Conditions Item Environment Board Material Board Dimensions Copper Ratio Through-holes Measurement Conditions Mounting on Board (Wind Velocity = m/s) Glass Cloth Epoxy Plastic (Four-Layer Board) 76.2 mm mm.8 mm Outer Layer (First Layer): Less than 95% of 5 mm Square Inner Layers (Second and Third Layers): Approx. 1% of 5 mm Square Outer Layer (Fourth Layer): Approx. 1% of 5 mm Square φ.3 mm 21 pcs Measurement Result Item Power Dissipation Thermal Resistance (θja) Thermal Characterization Parameter (ψjt) θja: Junction-to-Ambient Thermal Resistance ψjt: Junction-to-Top Thermal Characterization Parameter (Ta = 25 C, Tjmax = 15 C) Measurement Result 39 mw θja = 32 C/W ψjt = 8 C/W Power Dissipation P D (mw) Ambient Temperature ( C) Power Dissipation vs. Ambient Temperature Measurement Board Pattern i

51 PACKAGE DIMENSIONS HSOP-18 Ver. A HSOP-18 Package Dimensions The tab on the bottom of the package shown by blue circle is substrate potential (GND/VDD). It is recommended that this tab be connected to the ground plane/vdd pin on the board but it is possible to leave the tab floating. i

52 Halogen Free Ricoh is committed to reducing the environmental loading materials in electrical devices with a view to contributing to the protection of human health and the environment. Ricoh has been providing RoHS compliant products since April 1, 26 and Halogen-free products since April 1,

53 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Ricoh Electronics: R511S41A-E2-KE R511S32C-E2-KE R511S132C-E2-KE R511S82D-E2-KE R511S11A-E2-KE R511S62D-E2-KE R511S111A-E2-KE R511S82C-E2-KE R511S12C-E2-KE R511S122D-E2-KE R511S72D-E2-KE R511S112C-E2-KE R511S71B-E2-KE R511S52C-E2-KE