QUALIFICATION PLAN PCN #: IIRA-05BPMD768. Date: Dec 18, Qualification of 132L DQFN package at ANAC assembly site. A.

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1 QUALIFICATION PLAN PCN #: IIRA-05BPMD768 Date: Dec 18, 2013 Qualification of 132L DQFN package at ANAC assembly site. Distribution Surasit P. Rangsun K A. Navarro Irina K Wichai K. Fernando C Chaweng W. Gerry O Chalermpon P. Arnel M Mitch R Ponpitug Y Sunisa K Peter B Maitree Y Fannie Lin Jeffrey J Vassilis Marco Ho Microchip Technology (Thailand) Co., Ltd. 14 Moo 1 T. Wangtakien A. Muangchacherngsao, Chacherngsao, Thailand, Tel. (6638) , ext Fax (6638)

2 Purpose: Qualification of 132L DQFN package at ANAC assembly site. 1 st lot 2 nd lot MP code: SG0011NBXAB0 T08011NBXA1C Part No.: MEC1322-LZY MEC5075 Fab/Node: GF-65nm GSMC-180nm Die size: 3.45X3.436 mm 2.3x2.3mm BD No: BDM A_eng A CCB No: Package code: NB Type: 132 DQFN Width or Size: 11x11x0.85mm Die thickness: 0.200mm MSL: 3 Lead frame: Paddle size: 5.2x5.2mm Manufacturer: STW Material: C194 Surface: roughened Paddle plating: Ag Ring Process: Etched Lead Lock: no Part Number: Strip dimensions: 170x130mm Strip size: 64 units (VHDLF) Wire: Material: PdCu Die Attach Epoxy: Part Number: 8290 Manufacturer: Ablestik Conductive: Yes SID number: Mold Compound: Part Number: G700 Manufacturer: Sumitomo SID number: Lead finish: Matte tin_ Chemistry: Handok Anode manufacturer: Handok Reliability Test plan: STD Package Reliability Test plan on each package.

3 Test Name Conditions Standard Pb-free Solderability JESD22B-102E; Perform 8 hour steam aging for Matte tin finish and 1 hour steam aging for NiPdAu finish prior to testing. Standard Pb-free: Matte tin/ NiPdAu finish, SAC solder, wetting temp 245 C for both SMD & through hole packages. N/A > 95% lead coverage Standard Pb-free solderability is the requirement. SnPb solderability (backward solderability SMD reflow soldering) is required for any plating related changes and highly recommended for other package BOM changes. Wire bond DOE for the 65nm and 0,7 mil Cu wire Sawn DOE 65nm Low-k With 60um Scribe Line Wafer Wire Bond Pull - WBP Wire Bond Shear - WBS XRAY / Wire Sweep No Cratering, IMC coverage > 85%, wire pull and ball shear. No peeling damages scribe lane / cell ring Completed and Pass Completed and Pass MIL-STD-883 (Test method 2011) wires per qual JESD22-B wires per qual MIL-STD-883 (Test method ) 4 units Required for any reduction in wire bond thickness. Physical Dimensions Measure per JESD22 B100 and B108 JEDEC MO fails Cratering Test JESD22-B116 Die/bonding pad cracking fails IMC Inspection >85% coverage fails Photos and actual coverage per wire

4 Test Name Conditions Loop height MIL-STD-883 (Test method ) wires from 3 different units per lot INTERNAL/ EXTERNAL VISUAL JESD22:B101 / MIL-STD-883, Test Method /0 Package Structure analysis CUP Cross section JEDEC MO / 0 No CUP damage fails 1 unit before wire pull and 1 units after wire pull per lot Moisture Absorption / Desorption Studies MSL1, MSL2, MSL3 Preconditioning - Required for surface mount devices As per JEDEC J-STD-020D bake time at 125 C to meet the condition that after the bake the package contains < 0.05% weight increase in comparison with its dry n/a J-STD-020D / MSL fails 15 CSAM before and after Pre-Condition no delam or ATE fails uhast with Pre- Con HTST (High Temp Storage Life) with Pre- Con +130 C/85% RH for hours. Electrical test pre and post stress at +25 C and hot temp. Test 1 lot at 85 C. JESD22-A130C, 1000 hrs / 1500 hrs, 150 C /1 10 Csam inspection after uhast (96 hrs) / Csam inspection after 1000 hrs

5 Test Name Conditions Temperature Humidity WITHOUT BIAS JESD22-A101B 1000 hrs / 1500 hrs, 150 C Temp Cycle MIL-STD-883D or JEDEC 22-A118, 1000 / 1500 cycles (condition C) / Csam inspection after 1000 hrs / Csam inspection after 1000x