Process Change Notice #

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1 User Registration Register today to create your account on Silabs.com. Your personalized profile allows you to receive technical document updates, new product announcements, how-to and design documents, product change notices (PCN) and other valuable content available only to registered users. PCN Date: 21Apr11 Effective Date: 26Jul11 Title: Si4702/03-C19 Family 3x3mm QFN Change to Copper Wire Bond Material - ASEKR Originator: Sheila Alvarez Phone: Dept: Operations Customer Contact: Kathy Haggar Phone: Dept: Inside Sales PCN Type: Assembly Discontinuance Package Test Datasheet Fabrication Product Revision Packing Labeling Location Other Last Order Date: 26Jul11 PCN Details Description of Change: Silicon Laboratories, Inc (Silicon Labs) is pleased to announce the adoption of copper wire used as the wire bond material for the Si4702/03-C19 product family 3x3mm QFN packages at Advanced Semiconductor Engineering in Korea (ASEKR). ASEKR is an existing assembly site for Silicon Laboratories and is certified for ISO9001, ISO14001, ISO/TS and is a Sony Green Partner. Supplier ASEKR (Au wire) ASEKR (Cu wire) SPIL Unisem Leadframe Half Etched, Cu C7025, Ring Ag- Plating Half Etched, Cu C7025, Ring Ag-Plating Etched, EFTEC 64T Pre-Plating Cu C194, Half Etched, Ring-Ag Plating Die Attach Hitachi EN4900GC Hitachi EN4900GC Sumitomo 1033BF Ablebond 8290 Wire bond 1.0 mil Au wire 0.9mil CuPd wire 1.0 mil Au wire 1.0 mil Au wire Mold Sumitomo EME- Compound Sumitomo EME- G700 Sumitomo EME- G700 Sumitomo EME- G770 G7700HCD Lead finish Sn 100 (Matte Tin) Sn 100 (Matte Tin) Sn 100 (Matte Tin) Sn 100 (Matte Sn) Reason for Change: This change provides equivalent electrical performance and minimizes the effect of cost increases from gold. Impact on Form, Fit, Function, Quality, Reliability: There is no impact on form, fit, function, quality or reliability. Devices assembled at ASEKR using copper wire as the bond material are identical to existing products in form, fit and function. There is no change required for board layout or soldering profiles. The devices meet all of the same Moisture Sensitivity Level (MSL) specifications and are a direct drop-in replacement for existing packages. There are no changes to the mechanical specifications or drawing. The devices continue to meet all RoHS requirements where applicable. part or whole without Silicon Laboratories written consent. The document is uncontrolled if printed or electronically saved. Pg 1

2 Product Identification: This PCN applies to devices using the following ordering part numbers: Affected Order Part Numbers (OPN) SI4702-C19-GM SI4703-C19-GM SI4702-C19-GMR SI4703-C19-GMR The part number is marked on the device as shown in the example/s below: Line 1 Mark: Product ID 0219 for Si4702-C19-GM 0319 for Si4703-C19-GM Line 2 Mark: TTTT = Trace Code Line 2 of the Assembly Purchase Order form Line 3 Mark: YWW = Date Code Last digit of the current year (Y) and the work week (WW) of the assembly date Last Date of Unchanged Product: 26Jul11 Following the Effective Date of this PCN, Silicon Labs will utilize both copper wire and/or gold wire as the bond material for Si4702/03-C19 product family 3x3mm QFN packages assembled at ASEKR. Qualification Samples: Available upon request. Please contact your local Silicon Laboratories sales representative to order samples. A list of Silicon Laboratories sales representatives may be found at Customer Early Acceptance Sign Off: Customers may approve early PCN acceptance by completing the information below: Early Acceptance Date: Name: Company: your early Acceptance approval to: katherine.haggar@silabs.com Qualification Data: See Appendix A for the Qualification Report of all approved assembly materials. The Qualification result is PASSED. ICP and MDDS reports are available upon request. A list of Silicon Laboratories sales representatives is available at part or whole without Silicon Laboratories written consent. The document is uncontrolled if printed or electronically saved. Pg 2

3 Appendix A: Si4702/03-C19-GM Copper Wire Qualification Report Lot ID or Start Test Group A Accelerated Environment Stress Tests - ASEKR JA110 Q /78 1 HAST 130 C, 85%RH 3 lots, N=>25 Q / lots Vcc=3.6V, 96 hours Q /78 1 0/234 JA104 Q /80 1 Cond C: -65 C to 150 C 3 lots, N=>25 Q /78 1 Temp Cycle 500 cycles Q /78 1 Q /80 1 Q / lots Q /76 1 0/471 JA103 Q /78 1 HTSL 150 C, 1000hr 3 lots, N=>25 Q / lots Q /78 1 0/234 Test Group A Accelerated Environment Stress Tests - ASEKR - Copper Wire JA110 Q /29 1 HAST 130 C, 85%RH 3 lots, N=>25 Q / lots Vcc=5.5V, 192 hours Q /28 1 0/87 JA104 Q /26 1 Temp Cycle Cond C: -65 C to 150 C 3 lots, N=>25 Q / lots 2000 cycles Q /26 1 0/78 JA103 Q /28 1 HTSL 150 C, 2000 hours 3 lots, N=>25 Q / lots Q /28 1 0/84 Test Group A Accelerated Environment Stress Tests - Unisem JA110 Q /80 1 HAST 130 C, 85%RH 3 lots, N=>25 Q / lots Vcc=3.6V, 96 hours Q /80 1 0/240 JA104 Q /80 1 Temp Cycle Cond C: -65 C to 150 C 3 lots, N=>25 Q / lots 500 cycles Q /80 1 0/240 JA103 Q /80 1 HTSL 150 C, 1000hr 3 lots, N=>25 Q / lots Q /80 1 0/240 part or whole without Silicon Laboratories written consent. The document is uncontrolled if printed or electronically saved. Pg 3

4 Appendix A: Si4702/03-C19-GM Copper Wire Qualification Report (cont) Lot ID or Start Test Group A Accelerated Environment Stress Tests - SPIL JA /25 1 HAST 130 C, 85%RH 3 lots, N=> / lots Vcc=3.6V, 96 hours /25 1 0/75 JA /25 1 Temp Cycle Cond C: -65 C to 150 C 3 lots, N=> / lots 500 cycles /25 1 0/75 JA /25 1 HTSL 150 C, 1000hr 3 lots, N=> / lots /25 1 0/75 Test Group B Accelerated Lifetime Simulation Tests JA108 Q /80 HTOL 125 C, Dynamic 3 lots, N=>77 Q /125 3 lots Vcc=3.6V, 1000 hours Q /130 0/335 JA108 Q /80 LTOL -10 C, Dynamic 1 lot, N=>32 1 lot Vcc=3.6V, 1000 hours 0/80 JA108 Q / C, Dynamic 3 lots, N=>500 Q /502 ELFR Vcc=3.6V, 1000 hours Q /502 Q /502 Q / lots Q / /4003 part or whole without Silicon Laboratories written consent. The document is uncontrolled if printed or electronically saved. Pg 4

5 Appendix A: Si4702/03-C19-GM Copper Wire Qualification Report (cont) Lot ID or Start Test Group E Electrical Verification ESD-HBM ESD-MM ESD-CDM Latch Up JA114 Q /3 ±1kV 1 lot, N=>3 Q /3 2 ±2kV JA115 Q /3 ±40V 1 lot, N=>3 Q /3 2 ±125V JC101 Q /3 ASEKR ±750V 1 lot, N=>3 Q /3 ASEKR, Cu ±1000V Q /3 SPIL ±1250V JESD78 Q /6 2 25C ±200mA 1 lot, N=>6 Q /6 2 85C Overvoltage = 5.8V part or whole without Silicon Laboratories written consent. The document is uncontrolled if printed or electronically saved. Pg 5

If you have any questions concerning this change, please contact: NAME: Hank Chou PHONE:

If you have any questions concerning this change, please contact: NAME: Hank Chou PHONE: April 17, 2015 PPCN #150003 PROCESS/ PRODUCT CHANGE NOTIFICATION This is to inform you that Micrel has qualified Silver wire bonding process for certain SOIC-8L products at STARS, Thailand. Micrel will