12500 TI Boulevard, MS 8640, Dallas, Texas 75243
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1 12500 TI Boulevard, MS 8640, Dallas, Texas PCN# Qualification of FFAB/MIHO8/RFAB as additional Fab site option for select devices Change Notification / Sample Request Date: 7/16/2014 To: Newark/Farnell PCN Dear Customer: This is an announcement of a change to a device that is currently offered by Texas Instruments. The details of this change are on the following pages. We request you acknowledge receipt of this notification within 30 days of the date of this notice. Lack of acknowledgement of this notice within 30 days constitutes acceptance of the change. If you require samples or additional data to support your evaluation, please request within 30 days. The changes discussed within this PCN will not take effect any earlier than 90 days from the date of this notification, unless customer agreement has been reached on an earlier implementation of the change. This notification period is per TI s standard process. This notice does not change the end-of-life status of any product. Should product affected be on a previously issued product withdrawal/discontinuance notice, this notification does not extend the life of that product or change the life time buy offering/discontinuance plan. For questions regarding this notice, contact your local Field Sales Representative or the PCN Manager (PCN_ww_admin_team@list.ti.com). PCN Team SC Business Services Phone: +1(214) Fax: +1(214)
2 Attachment: 1 Products Affected: The devices listed on this page are a subset of the complete list of affected devices. According to our records, these are the devices that you have purchased within the past twenty-four (24) months. The corresponding customer part number is also listed, if available. DEVICE BQ24295RGET BQ24296RGET BQ24297RGET TPS54427DDA TPS54427DRCT TPS54428DDA TPS54428DRCT TPS54625PWP TPS54626PWP CUSTOMER PART NUMBER Technical details of this Product Change follow on the next page(s).
3 PCN Number: PCN Date: 07/16/2014 Title: Qualification of FFAB/MIHO/RFAB as additional Fab site options for select devices Customer Contact: PCN Manager Phone: +1(214) Dept: Quality Services *Proposed 1 st Estimated Sample Date provided at Ship Date: 10/16/2014 Availability: sample request. Change Type: Assembly Site Assembly Process Assembly Materials Design Electrical Specification Mechanical Specification Test Site Packing/Shipping/Labeling Test Process Wafer Bump Site Wafer Bump Material Wafer Bump Process Wafer Fab Site Wafer Fab Materials Wafer Fab Process Part number change PCN Details Description of Change: This change notification is to announce the addition of FFAB, MIHO8, and RFAB as additional Fab site options for select devices as shown below: Device Groups: (Affected devices in Product Affected Section) Group 1 MIHO8: Adding FFAB MIHO8, LBC7, 200mm Group 2 RFAB: Adding FFAB RFAB, LBC7, 300mm Group 3 RFAB: Adding MIHO8 RFAB, LBC7, 300mm Group 4 MIHO6: Adding MIHO8 MIH, 50A12, 150mm Group 5 MIHO8: Adding RFAB MIHO8, LBC7, 200mm FFAB, LBC7, 200mm FFAB, LBC7, 200mm MIHO8, LBC7, 200mm MIHO8, 50A12, 200mm RFAB, LBC7, 300mm The LBC7 process was previously qualified at FFAB on 10/31/2007 and at MIHO on 1/14/2005. Qualification details are shown in the Qual Data Section of this document. Reason for Change: Continuity of Supply Anticipated impact on Form, Fit, Function, Quality or Reliability (positive / negative): None
4 Changes to product identification resulting from this PCN: Chip Site: Current Chip Site Chip site code (20L) Chip country code (21L) RFAB RFB USA MIHO6 MIH JPN MIHO8 MH8 JPN New Chip Site Chip site code (20L) Chip country code (21L) FR-BIP-1 TID DEU MIHO8 MH8 JPN RFAB RFB USA Sample product shipping label (not actual product label) Product Affected: Group 1 MIHO8: Adding FFAB (LBC7) FX026 HPA02240RVER TPS51363RVER TPS51367RVET FX033 TPS51362RVER TPS51363RVET TPS59367RVER FX033Z TPS51362RVET TPS51367RVER TPS59367RVET Group 2 RFAB: Adding FFAB (LBC7) TPS65132A0YFFR TPS65132B0YFFR TPS65132B5YFFR TPS65132LYFFR TPS65132AYFFR TPS65132B2YFFR TPS65132BYFFR TPS65132YFFR Group 3 RFAB: Adding MIHO8 (LBC7) BQ24295RGER SN2807RGER TPS54427DRCR TPS54626PWP BQ24295RGET SN2807RGET TPS54427DRCT TPS54626PWPR BQ24296RGER SN2808RGER TPS54428DDA TPS54627DDA BQ24296RGET SN2808RGET TPS54428DDAR TPS54627DDAR BQ24297RGER SN2910RGER TPS54428DRCR TPS54628DDA BQ24297RGET SN2910RGET TPS54428DRCT TPS54628DDAR SN2800RGER TPS54427DDA TPS54625PWP TPS56628DDA SN2800RGET TPS54427DDAR TPS54625PWPR TPS56628DDAR Group 4 MIHO6: Adding MIHO8 (50A12) TPA6013A4PWP TPA6013A4PWPR Group 5 MIHO8: Adding RFAB (LBC7) TPS22993PRLWR TPS22993PRLWT
5 Reference Qualification Data: LBC7 Process at FFAB Qualification Data: (Approved: 10/31/2007) This qualification has been developed for the validation of this change. The qualification data will validate that the proposed change meets the applicable released technical specifications. Qualification Device: TCA6416PW Wafer Fab Site: FFAB Metallization: TiN/AlCu.5/TiN Wafer Fab Process: LBC7 Wafer diameter: 200mm Sample Size /Fail ** Steady-State Life Test 150C 300 Hrs 116/0 116/0 116/0 **Biased HAST, 130C/85%RH 96 hours 77/0 77/0 77/0 **Autoclave 121C 96 Hrs 77/0 77/0 77/0 **Temp Cycle -65C/+150C 1000 Cycles 77/0 77/0 77/0 **High Temp. Storage Bake 150C 1000 Hours 77/0 77/0 77/0 ESD HBM 1000V 3/0 - - ESD CDM 250V 3/0 - - Latch-up (per JESD78, Class II) 9/0 - - Electrical Char Per datasheet spec Pass Pass Pass Manufacturability (approved by mfg. site) Pass Pass Pass ***Preconditioning: MSL 1@260C Reference Qualification Data: LBC7 Process at MIHO8 Qualification Data: (Approved 01/14/2005) This qualification has been developed for the validation of this change. The qualification data will validate that the proposed change meets the applicable released technical specifications. Qual Vehicle: TPS62110RSA Wafer Fab Site: MIHO8 Metallization: TiN/AlCu.5/TiN Wafer Fab Process: LBC7 Die Protective Coating: Oxynitride 8000A Sample Size /Fail **Life Test, 140C 480 Hours 130/0 130/0 130/0 **HAST 130C/85%RH 96 Hours 77/0 77/0 77/0 **Autoclave, 121C 240 Hours 77/0 77/0 77/0 **Thermal Shock, -65/150C 1000 Cycles 77/0 77/0 77/0 **Temp Cycle, -65/+150C 1000 Cycles 77/0 77/0 77/0 **High-Temp Storage, 170C 420 hours 77/0 77/0 77/0 ESD HBM 1000V 3/0 3/0 3/0 ESD CDM 250V 3/0 3/0 3/0 70C (per JESD78) 5/0 5/0 5/0 Electrical Characterization Per datasheet spec PASS PASS PASS Manufacturability Wafer Fab Approved PASS PASS PASS Manufacturability Assembly Site Approved PASS PASS PASS **Preconditioning: MSL 2@260C
6 Reference Qualification Data: 50A12 Process at MIHO8 Qualification Data: (1/08/2010) This qualification has been developed for the validation of this change. The qualification data validates that the proposed change meets the applicable released technical specifications. Qual Vehicle 1: TLV5630IDW Wafer Fab Site: MIHO 8 (MIHO) Wafer Size 200 mm Wafer Fab Process: 50A12 Sample Size (PASS/FAIL) Life Test 125C, 1000 Hrs 112/0 112/0 112/0 Biased Temp Humidity 85C/85%RH(500 Hrs) 77/0 77/0 77/0 Autoclave* +121C, 240 Hrs. 77/0 77/0 77/0 Temp Cycle* -65/+150C, 1000 cycles 77/0 77/0 77/0 Thermal Shock* -65/150C, 1000 Cycles 77/0 77/0 77/0 High Temp Storage Bake +150C, 1000 Hrs. 77/0 77/0 77/0 ESD HBM (3 Units/level) 500V, 1kV, 1.5kV, 2kV 12/0 12/0 12/0 ESD CDM (3 Units/level) 500V 3/0 3/0 3/0 *Preconditioning: Level 260C Qual Vehicle 2: TPA6203A1DRB Wafer Fab Site: MIHO 8 (MIHO) Wafer Size 200 mm Wafer Fab Process: 50A12 Manufacturability (Wafer Fab) Sample Size (PASS/FAIL) Per mfg. site spec Pass - - Electrical Characterization Side by side comparison 30/0 - - Qual Vehicle 3: TPA6205A1DRB Wafer Fab Site: MIHO 8 (MIHO) Wafer Size 200 mm Wafer Fab Process: 50A12 Manufacturability (Wafer Fab) Sample Size (PASS/FAIL) Per mfg. site spec Pass - - Electrical Characterization Side by side comparison 30/0 - -
7 Reference Qualification Data: LBC7 Process at RFAB Qualification Data (Approved 06/03/2014) Attributes Qual Device: TPS22993PRLW QBS Process: TPS54620RGYR QBS Process: CD3230A0YFF Wafer Fab Site RFAB RFAB RFAB Wafer Fab Process LBC7 LBC7 LBC7 Wafer Diameter 200mm 200mm 200mm Type HAST Data Displayed as: Number of lots / Total sample size / Total failed Test Name / Condition Duration QBS Product: TPS22993PRLW QBS Process: TPS54620RGYR QBS Process: CD3230A0YFF Biased HAST, 130C/85%RH 96 Hours 3/231/0-3/250/0 AC Autoclave 121C 96 Hours 3/267/0 6/230/0 - UHAST TC TC HTSL HTSL Unbiased HAST 130C/85%RH 96 Hours - - 2/169/0 Temperature Cycle, -55/125C 700 cycles - - 2/164/0 Temperature Cycle, -65/150C 500 Cycles 3/269/0 6/231/0 - High Temp Storage Bake 150C 1000 Hours 3/273/0 - - High Temp Storage Bake 170C 420 Hours - 6/231/0 3/239/0 HTOL Life Test, 125C 1000 Hours - - 3/240/0 HTOL Life Test, 150C 300 Hours 1/79/0 - - HTOL Life Test, 155C 240 Hours - 6/228/0 - HBM ESD - HBM 1000 V 1/3/2000 3/9/2000 3/9/2000 CDM ESD - CDM 250 V 1/3/2000 3/9/2000 3/9/2000 LU Latch-up (per JESD78) 1/6/2000 6/18/2000 3/36/0 ED Electrical Characterization. Per Datasheet Parameters 1/Pass - 3/Pass For questions regarding this notice, s can be sent to the regional contacts shown below, or you can contact your local Field Sales Representative. Location USA Europe Asia Pacific Japan PCNAmericasContact@list.ti.com PCNEuropeContact@list.ti.com PCNAsiaContact@list.ti.com PCNJapanContact@list.ti.com
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